CN107863685A - A kind of temperature control system and laser module - Google Patents
A kind of temperature control system and laser module Download PDFInfo
- Publication number
- CN107863685A CN107863685A CN201711220514.8A CN201711220514A CN107863685A CN 107863685 A CN107863685 A CN 107863685A CN 201711220514 A CN201711220514 A CN 201711220514A CN 107863685 A CN107863685 A CN 107863685A
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- China
- Prior art keywords
- heat sink
- temperature
- shell fragment
- temperature control
- control system
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention proposes a kind of temperature control system and employs the laser module of the structure, it is heat sink and second is heat sink that the temperature control system includes first, and it is arranged at the first heat sink temperature sensitive shell fragment with second between heat sink so that temperature sensitive shell fragment produces corresponding deformation and flicks or connected that first is heat sink and second is heat sink under different temperature environments.The present invention is by the control to heat sink folding of temperature sensitive shell fragment, cooling efficiency during heating efficiency and high temperature when effectively increasing low temperature；The overall power of Optical Maser System is reduced, accordingly, reduces the volume of Optical Maser System and the volume of supporting power supply.
Description
Technical field
The invention belongs to field of laser device technology, specially a kind of temperature control system and the laser for employing the structure
Module.
Background technology
In the pump applications of high-power semiconductor laser, the stability of optical maser wavelength is that very important parameter refers to
Mark.The wavelength stimulated light junction temperature of chip of semiconductor laser influences, and junction temperature temperature change can cause wave length shift.Therefore control and swash
The junction temperature temperature of optical chip is the important method for realizing that semiconductor laser wavelength is stable.At present generally using TEC temperature controls or
The method that person's heating element heater heats to laser chip, to adjust the temperature of laser chip, to reach the effect of wavelength stabilization.
Fig. 1 is the typical structure that currently employed temperature control scheme carries out wavelength regulation, and semiconductor laser 1 is arranged on the
On one heat sink 2, the first heat sink another side sets temperature control element 6, such as TEC or heating element heater, optionally, in TEC or
Second heat sink 3 is set under heating element heater.
, it is necessary to be rapidly reached stable working condition when semiconductor laser works at different ambient temperatures, therefore need
Semiconductor laser total system is wanted to have preferable heating rate and rate of temperature fall.Shown in Fig. 1 in the prior art, semiconductor swashs
Light device is when hot environment works, in order to improve the overall rate of temperature fall of laser, it usually needs larger second it is heat sink with up to
To higher radiating efficiency.However, semiconductor laser is in low-temperature working, because the second heat sink volume is big, it is necessary to using very
Big heating power carries out overall heating to laser, to reach the overall heating rate of Suitable laser, therefore caused disadvantage
End is that system overall power is bigger than normal, and power supply volume is bigger than normal.
Therefore, these existing temperature control schemes have weak point in terms of power consumption and the temperature control speed of response,
Low power consumption, the high-power semiconductor laser of small size are still the study hotspot of this area.
The content of the invention
The present invention proposes a kind of temperature control system and laser module, can be according to low temperature environment and hot environment
Change automatic regulating system thermal resistance, cooling efficiency during heating efficiency and high temperature during so as to improve low temperature simultaneously.Specifically
Technical scheme be：
A kind of temperature control system, including first is heat sink and second is heat sink, and be arranged at first it is heat sink with second it is heat sink between
Temperature sensitive shell fragment so that temperature sensitive shell fragment produces that corresponding deformation flicks or to have connected first heat sink under different temperature environments
It is heat sink with second.
Described first it is heat sink and second it is heat sink between installed by Flexible Connector.The Flexible Connector is increase
The assembling screw of spring washer.The spring washer is specially metal spring or rubber spring or memorial alloy bullet
Spring or bimetallic spring.
The temperature sensitive shell fragment be arranged at first it is heat sink with the second groove between heat sink.Described first heat sink and the second heat
Groove between heavy be specifically arranged at first it is heat sink on, either second it is heat sink on or to be respectively arranged at first heat sink and second
The correspondence position of heat sink junction.
The temperature sensitive shell fragment is bimetal leaf or memorial alloy.
Described first heat sink is additionally provided with temperature control element, specially heater element or refrigerator between temperature sensitive shell fragment
Part.
A kind of laser module, apply said temperature control structure, it is characterised in that：Including be arranged on first it is heat sink on
The semiconductor laser on surface, be arranged on the first heat sink lower surface second it is heat sink and be arranged at first it is heat sink with it is second heat sink
Between temperature sensitive shell fragment so that temperature sensitive shell fragment produces corresponding deformation and flicks or connected first under different temperature environments
It is heat sink and second is heat sink.
The semiconductor laser is specially laser chip, or for by chip of laser and conductive and heat-conductive substrate alignment and
Into bar bar group.
The invention has the advantages that：
The temperature control system of the present invention effectively increases heating during low temperature by the control to heat sink folding of temperature sensitive shell fragment
Cooling efficiency when efficiency and high temperature；The overall power of Optical Maser System is reduced, accordingly, reduces Optical Maser System
The volume of volume and supporting power supply.In addition, semiconductor laser is improved in the range of wide temperature environment（Such as -50 ° -70 °
Environment temperature）Temperature control adjustment speed, improve the stability of output spectrum.
Brief description of the drawings
Fig. 1 is the typical structure for carrying out wavelength regulation using temperature control scheme in the prior art.
Fig. 2 is first heat sink and the second heat sink connection status in temperature control system of the invention.
Fig. 3 be the present invention temperature control system in it is first heat sink and second heat sink flicks state.
Fig. 4 and Fig. 5 is respectively a kind of connection status of embodiment of the temperature control system of the present invention and flicks state.
Fig. 6 is the embodiment for adding temperature control element.
Fig. 7 is laser die block structure proposed by the present invention.
Drawing reference numeral explanation：1- semiconductor lasers, 2- first is heat sink, and 3- second is heat sink, the temperature sensitive shell fragments of 4-, and 5- elasticity is even
Fitting, 501- spring washers, 502- assembling screws, 6- temperature control elements, 101- laser chips, 102- conductive and heat-conductive substrates, 103-
Dielectric substrate.
Embodiment
Technical scheme is clearly and completely described below in conjunction with accompanying drawing, it is clear that described implementation
Example is part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
The present invention proposes a kind of temperature control system, as shown in Fig. 2 first heat sink 2 and second heat sink 3 are specifically included,
And it is arranged at the temperature sensitive shell fragment 4 between first heat sink 2 and second heat sink 3 so that the temperature sensitive shell fragment 4 under different temperature environments
Produce corresponding deformation and flick or connected first heat sink 2 and second heat sink 3.
Connection between described first heat sink 2 and second heat sink 3 refers to that temperature sensitive shell fragment as shown in Figure 2 is in straight state,
So that first heat sink and the second heat sink surface both produces the transmission of heat, it is necessary to explanation by straight temperature sensitive shell fragment fitting
Be, now temperature sensitive shell fragment itself as with first heat sink and the second heat sink transition conducting-heat elements, three is collectively as radiating part
Part.Flicking between described first heat sink 2 and second heat sink 3 refers to that temperature sensitive shell fragment as shown in Figure 3 is in bending status so that
First is heat sink and the second heat sink surface is flicked, and does not produce the transmission of heat mutually.
Installed between first heat sink 2 and second heat sink 3 by Flexible Connector 5 so that first heat sink and the second heat
It is heavy both closely to be connected under the fixation of Flexible Connector, or first is heat sink and second heat sink flicks separation
Retain enough elastic spaces.Specifically, the Flexible Connector 5 is preferably the assembling screw for adding spring washer 501
502, assembling screw 502 mechanically fixes first heat sink 2 and second heat sink 3, and spring washer 501 is arranged at assembling screw
502 and first heat sink 2 junction（As shown in Fig. 2 the connection of specially first heat sink 2 upper surface and assembling screw 502
Place）, the elasticity of spring washer 501 is the preset sufficiently deformation space of Bending Deformation of temperature sensitive shell fragment 4, when temperature sensitive shell fragment 4 is in
During bending status deformation, first heat sink 2 produces away from second heat sink 3 displacement, spring washer 501 under the elastic force of temperature sensitive shell fragment 4
Forced compression；When temperature sensitive shell fragment 4 recovers straight state, first heat sink 2 produces opposite second heat under the elastic force of spring washer 501
Heavy 3 displacement, recover the connection with second heat sink 3.
The spring washer is specially metal spring or rubber spring or memory alloy spring or bimetallic bullet
Spring, metal spring include helical spring, wavy spring, stacking spring etc..
As shown for example in fig. 2, first heat sink 2, second heat sink 3 and temperature sensitive shell fragment 4 be provided with what is be mutually matched
Screw, above-mentioned assembling screw 502 insert foregoing screw connection first heat sink 2, second heat sink 3 and temperature sensitive shell fragment 4, it is necessary to illustrate
, first heat sink 2 and temperature sensitive shell fragment 4 screw in be preferably not provided with screw thread or screwhole diameter more than second heat sink 3
Screw so that assembling screw 502 be tightly fastened with second heat sink 3, assembling screw 502 and first heat sink 2 and temperature sensitive shell fragment 4 it
Between upper and lower displacement caused when leaving movable space to realize temperature sensitive 4 deformation of shell fragment.
The temperature sensitive shell fragment 4 can be to be bent under low temperature under straight, high temperature；Or bent under low temperature, straight, root under high temperature
Depending on the selected material of temperature sensitive shell fragment.The temperature sensitive shell fragment is specially bimetal leaf or memorial alloy.
One kind that the bimetal leaf is made up of two or more metals with suitable performance or other materials is answered
Condensation material.Bimetal leaf is also referred to as thrermostatic bimetal-plate, because the thermal coefficient of expansion of each constituent element layer is different, when the temperature is changed, actively
Layer（Thermal coefficient of expansion is larger）Deformation be greater than passive layer（Thermal coefficient of expansion is smaller）Deformation, so as to bimetal leaf entirety
Will be to passive layer curving, then the curvature of this composite changes so as to produce deformation.The memorial alloy is
Marmem（Shape Memory Alloys）, it is that a kind of it can be completely eliminated after heat temperature raising in relatively low temperature
The deformation of lower generation, recover the alloy material of original-shape before its deformation.
Preferably, as shown in figure 4, the temperature sensitive shell fragment 4 be arranged at first it is heat sink with the second groove between heat sink.Tool
Body, between first heat sink 2 and second heat sink 3 groove can specifically be arranged at first it is heat sink on, can also be arranged at second heat
On heavy, or the first heat sink and the second heat sink junction correspondence position is respectively arranged at, for example groove is divided into two parts difference
It is arranged at first heat sink and the second heat sink joint face and is spliced into groove entirety.
The now connection between first heat sink 2 and second heat sink 3 refer to temperature sensitive shell fragment as shown in Figure 4 be in straight state and
Temperature sensitive shell fragment is completely embedded into groove so that the first heat sink 2 and second heat sink 3 surface is directly bonded generation heat transfer；First
Flicking between heat sink 2 and second heat sink 3 refers to that temperature sensitive shell fragment as shown in Figure 5 is in bending status so that first it is heat sink and
Second heat sink surface is flicked, and does not produce the transmission of heat mutually.
Optionally, described first it is heat sink and second it is heat sink between be set side by side with the temperature sensitive shell fragments of multiple same types, jointly
Control first heat sink and the second heat sink connection and flick.
Specifically, as shown in the embodiment of Figure 6, described first it is heat sink be additionally provided with temperature control element between temperature sensitive shell fragment,
Temperature control element is used for the first heat sink heating or refrigeration.Temperature control element is specially heater element or refrigeration device, such as TEC
Device, adding thermal resistance etc..
The laser module of said temperature control structure is applied the invention also provides a kind of, including is arranged on the first heat
The semiconductor laser 1 of heavy 2 upper surfaces, be arranged on the second heat sink 3 of the first heat sink 2 lower surface and be arranged at first it is heat sink with
Second it is heat sink between temperature sensitive shell fragment 4 so that under different temperature environments temperature sensitive shell fragment produce corresponding deformation flick or
Connect that first is heat sink and second is heat sink.
The temperature sensitive shell fragment 4 be preferably provided at first it is heat sink with the second groove between heat sink so that at temperature sensitive shell fragment
It can be completely embedded into when straight state in groove, the first heat sink 2 and second heat sink 3 surface is directly bonded generation heat transfer；It is temperature sensitive
When shell fragment is in bending status, flicking between first heat sink 2 and second heat sink 3 causes first heat sink and the second heat sink surface quilt
Flick, do not produce the transmission of heat mutually.
The present invention the laser module for using temperature control system operation principle for：It is higher or half in environment temperature
When heat is larger caused by conductor laser, it is necessary to improve noise spectra of semiconductor lasers radiating and rate of temperature fall with stabilized lasers
The output wavelength of device, now temperature sensitive shell fragment be in straight state, first heat sink and the second heat sink surface both fitting, both make jointly
For the heat dissipation element of semiconductor laser；It is relatively low or to realize that semiconductor laser stable output wavelength needs in environment temperature
When being heated to it（Such as Fig. 6 embodiment, the first heat sink heating element heater that is arranged with heats to it）, temperature sensitive shell fragment, which is in, to be bent
State, flicks that first is heat sink and second is heat sink, now the only first heat sink heat abstractor as semiconductor laser, reduces half-and-half
The heat-sinking capability of conductor laser, improve the heating speed of response under low-temperature condition.
The semiconductor laser 1 can be laser chip, specially single bar of bar chip of laser Direct Bonding or indirectly
It is heat sink to be bonded to first；Or as shown in fig. 7, semiconductor laser is to be arranged by laser chip 101 and conductive and heat-conductive substrate 102
Bar bar group formed.
Described first it is heat sink and/or second it is heat sink be highly heat-conductive material, specially metal heat sink or ceramic heat sink；When
First is heat sink when being metal material, bar bar group and first it is heat sink between set dielectric substrate 103 to be insulated.According to heat sink system
Cold classification of type, the described second heat sink preferably fin radiator or liquid chiller or freezing by change of state radiator.Such as Fig. 5
It is shown, in order to strengthen heat-sinking capability, the fin radiator or metal water flowing block of the second heat sink specially metal material so that high
Semiconductor laser under temperature state possesses stronger heat-sinking capability and rate of temperature fall.
Claims (10)
- A kind of 1. temperature control system, it is characterised in that：It is heat sink and second is heat sink including first, and be arranged at first it is heat sink with Second it is heat sink between temperature sensitive shell fragment so that temperature sensitive shell fragment produces corresponding deformation and flicked or even under different temperature environments Pick up that first is heat sink and second is heat sink.
- 2. temperature control system according to claim 1, it is characterised in that：Described first it is heat sink and second it is heat sink between lead to Flexible Connector is crossed to be installed.
- 3. temperature control system according to claim 2, it is characterised in that：The Flexible Connector is to add spring pad The assembling screw of circle.
- 4. temperature control system according to claim 3, it is characterised in that：The spring washer be specially metal spring, Or rubber spring or memory alloy spring or bimetallic spring.
- 5. temperature control system according to claim 1, it is characterised in that：The temperature sensitive shell fragment be arranged at first it is heat sink with Second it is heat sink between groove in.
- 6. temperature control system according to claim 5, it is characterised in that：Described first it is heat sink with second it is heat sink between Groove be specifically arranged at first it is heat sink on, either second it is heat sink on or be respectively arranged at first heat sink and the second heat sink connection The correspondence position at place.
- 7. according to the temperature control system described in one of claim 1-6, it is characterised in that：The temperature sensitive shell fragment is bimetal leaf Or memorial alloy.
- 8. according to the temperature control system described in one of claim 1-6, it is characterised in that：Described first heat sink and temperature sensitive shell fragment Between be additionally provided with temperature control element, specially heater element or refrigeration device.
- 9. a kind of laser module, apply temperature control system as claimed in claim 1, it is characterised in that：Including setting Semiconductor laser in the first heat sink upper surface, be arranged on the first heat sink lower surface second it is heat sink and be arranged at first heat It is heavy with the second temperature sensitive shell fragment between heat sink so that under different temperature environments the corresponding deformation of temperature sensitive shell fragment generation flick or Person has connected that first is heat sink and second is heat sink.
- 10. laser module according to claim 9, it is characterised in that：The semiconductor laser is specially laser core Piece, or bar bar group to be formed by chip of laser and conductive and heat-conductive substrate alignment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711220514.8A CN107863685A (en) | 2017-11-29 | 2017-11-29 | A kind of temperature control system and laser module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711220514.8A CN107863685A (en) | 2017-11-29 | 2017-11-29 | A kind of temperature control system and laser module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107863685A true CN107863685A (en) | 2018-03-30 |
Family
ID=61702721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711220514.8A Pending CN107863685A (en) | 2017-11-29 | 2017-11-29 | A kind of temperature control system and laser module |
Country Status (1)
| Country | Link |
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| CN (1) | CN107863685A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110058371A (en) * | 2019-04-08 | 2019-07-26 | 武汉光迅科技股份有限公司 | A kind of optical module |
| CN112636163A (en) * | 2020-10-09 | 2021-04-09 | 金雷 | Temperature control device of electronic device |
| CN113851923A (en) * | 2021-10-19 | 2021-12-28 | 北京大学东莞光电研究院 | Laser TO packaging structure |
| JP2022508764A (en) * | 2018-10-15 | 2022-01-19 | パナソニックＩｐマネジメント株式会社 | Systems and Methods for Dealing with Pumping of Thermal Interface Materials in High Power Laser Systems |
| EP4206768A4 (en) * | 2020-12-29 | 2024-03-27 | Huawei Technologies Co., Ltd. | Optical cage assembly, optical module connector, and fabrication method for optical cage assembly |
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| CN1187103A (en) * | 1997-01-02 | 1998-07-08 | 美国电报电话公司 | Apparatus for heating and cooling electronic device |
| US6829145B1 (en) * | 2003-09-25 | 2004-12-07 | International Business Machines Corporation | Separable hybrid cold plate and heat sink device and method |
| WO2006070121A1 (en) * | 2004-12-23 | 2006-07-06 | Sagem Defense Securite | Two-state system for thermal regulation of an electronic device |
| CN103429051A (en) * | 2012-05-22 | 2013-12-04 | 波音公司 | Heat dissipation switch |
| CN105547024A (en) * | 2016-01-27 | 2016-05-04 | 北方工业大学 | Energy-saving device capable of automatically utilizing cold and heat sources of environment |
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2017
- 2017-11-29 CN CN201711220514.8A patent/CN107863685A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1187103A (en) * | 1997-01-02 | 1998-07-08 | 美国电报电话公司 | Apparatus for heating and cooling electronic device |
| US6829145B1 (en) * | 2003-09-25 | 2004-12-07 | International Business Machines Corporation | Separable hybrid cold plate and heat sink device and method |
| WO2006070121A1 (en) * | 2004-12-23 | 2006-07-06 | Sagem Defense Securite | Two-state system for thermal regulation of an electronic device |
| CN103429051A (en) * | 2012-05-22 | 2013-12-04 | 波音公司 | Heat dissipation switch |
| CN105547024A (en) * | 2016-01-27 | 2016-05-04 | 北方工业大学 | Energy-saving device capable of automatically utilizing cold and heat sources of environment |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022508764A (en) * | 2018-10-15 | 2022-01-19 | パナソニックＩｐマネジメント株式会社 | Systems and Methods for Dealing with Pumping of Thermal Interface Materials in High Power Laser Systems |
| JP7228856B2 (en) | 2018-10-15 | 2023-02-27 | パナソニックＩｐマネジメント株式会社 | Systems and methods for addressing pumping of thermal interface materials in high power laser systems |
| CN110058371A (en) * | 2019-04-08 | 2019-07-26 | 武汉光迅科技股份有限公司 | A kind of optical module |
| CN110058371B (en) * | 2019-04-08 | 2021-05-11 | 武汉光迅科技股份有限公司 | Optical module |
| CN112636163A (en) * | 2020-10-09 | 2021-04-09 | 金雷 | Temperature control device of electronic device |
| EP4206768A4 (en) * | 2020-12-29 | 2024-03-27 | Huawei Technologies Co., Ltd. | Optical cage assembly, optical module connector, and fabrication method for optical cage assembly |
| CN113851923A (en) * | 2021-10-19 | 2021-12-28 | 北京大学东莞光电研究院 | Laser TO packaging structure |
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Application publication date: 20180330 |