CN101242729A - Thermal control method and system based on capillary slot group and thermal power combination - Google Patents
Thermal control method and system based on capillary slot group and thermal power combination Download PDFInfo
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- CN101242729A CN101242729A CNA200710063701XA CN200710063701A CN101242729A CN 101242729 A CN101242729 A CN 101242729A CN A200710063701X A CNA200710063701X A CN A200710063701XA CN 200710063701 A CN200710063701 A CN 200710063701A CN 101242729 A CN101242729 A CN 101242729A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention is a capillary microgrooves and thermoelectric combined heat control method and system, relates to a heat dissipation and heat controlling method and device used in laser, electronic and electric apparatus. Liquid are heated for evaporation and boiling in capillary microgroove evaporator by heat member, steam flows into condensator through heat preservation flexible pipe, coagulates and heat releases in coagulating microgrooves in condensator under function of thermoelectric cooler on exine of condensator, and meanwhile thermoelectric cooler transmit heat from heat surface to heat dissipation elements (heat dissipation board or water-cooling heat radiator), and finally dissipate heat by air-cooling or water-cooling; coagulated liquid flows back to capillary microgroove evaporator through liquid return flexible pipe and connector to drain microgrooves, so that a circulation of heat extracting and releasing is completed, and components are cooled and heat controlled. Device adopting the inventive method includes a vacuum capillary microgroove evaporator, heat preservation flexible pipe, condensator, thermoelectric cooler, heat dissipation element, liquid return flexible pipe, connector to drain microgrooves.
Description
Technical field
The present invention relates to the heat radiation and the thermal control system of a kind of laser device, electric components and parts and other opto-electronic device, particularly be applied to based on capillary slot group and the heat radiation of thermoelectric cooling module (TEC) composite type and the thermal control system of various undersized, powerful laser devices, electric components and parts and other opto-electronic device.
Background technology
High power laser is a high-accuracy mechanical processing imperative equipment, is important weaponry, has in fields such as laser processing, information and military affairs extensively and great application value.Yet the raising of the laser output power of laser is subjected to the serious restriction of laser heat dispersion and thermal control performance quality.General flash of light pumping source laser has only 5% intake can change laser output into, and surplus person will be changed heat energy and other forms of energy into, as the electric energy of input 1kw, have only the output of 50w laser, and heat radiation will reach about 900w.The heating density of heat flow rate of present many high-performance high power laser devices is all greater than 10
6W/m
2More than, can therefore resolve heat radiation be one of key technology of high power laser development.In addition on the one hand, the power that improves laser also must be realized the temperature control to parts except heat dissipation problem.Avoid the thermal effect of laser working medium to cause beam quality and decrease in efficiency.For example, the temperature of laser crystal will raise during owing to laser works, if do not control, can cause that the operation material characteristics of luminescence changes, and optical maser wavelength is offset, and cause laser threshold to raise, and efficient and laser quality reduce.In addition, when laser works, laser device Temperature Distribution inhomogeneous, with the formation temperature gradient, the existence of temperature gradient can make inner refractive index gradient and the stress distribution of forming of laser medium, cause that laser beam produce to focus on P birefringence and depolarization thermal effect such as shake, thereby reduce the beam quality and the power level of laser.Thereby it is most important equally on the basis that guarantees radiating effect laser to be implemented reliable thermal control means.The heat radiation of above-described laser and thermal control problem can reduce the thermal management technology problem in the laser technology, are the bottlenecks of high power laser development, must solve.Conventional at present method is that device is carried out air or liquid cools, but these conventional cooling technologies can't solve the problem that proposes above at all, must adopt new cooling technology just can meet the demands.
In addition, along with the development of large scale integrated circuit (LSI), the increase tendency of the volume of the electric components and parts of high integration heating density of heat flow rate is very swift and violent.The accumulation of heat will cause device temperature to raise rapidly, gently then make electric components and parts afunction, and heavy then device is burnt, the whole electric equipment collapse.Therefore, it is also most important to the normal operation of keeping electric components and parts to dispose strong heat radiation and thermal control system.
At present, heat radiation and the heat control method that is applied to laser device, electric components and parts and other opto-electronic device mainly contains following several.
(1) directly air blast cooling
Utilize fan to carry out the radiating mode that direct forced air cooling is present most popular laser device, electric components and parts and other opto-electronic device.Usually utilize aluminium or copper fin to increase, carry out forced convertion air cooling with fan again and reach the effect of heat radiation flow area.The design of fin and the quality that has determined this mode radiating effect cooperating of fan.Characteristics: device is simple, and cost is lower.Its heat exchange coefficient is roughly at 20 ~ 100W/ (m
2℃) between.This kind radiating mode efficient is low, noise is big, power consumption is high, need take bigger space, thermal control poor performance, the heat-sinking capability deficiency of this mode when being applied to undersized high power device separately.As being used for the pressure cooling air mode that PC CPU dispels the heat, at present multipotency is handled the cpu chip heat of 60W.The combination of its fin and fan is near the state of limit load.
(2) the single-phase direct forced convertion cooling of the liquid of stock size
The single-phase forced convertion of the liquid of stock size cooling is a kind of reliable traditional cooling technology that has been proved to be.This type of cooling is utilized the circulation line of cooling fluid, conducting-heat elements, pump, valve and connection, the heat that single-phase forced-convection heat transfer mode by liquid produces heater members, by the liquid that circulates in the pipeline, carry to transfer in the external environment condition and go, to reach the effect that reduces the heater members temperature.The approximate range of its convection transfer rate is 1000 ~ 15000W/ (m
2℃).Cool off more powerful laser device, electric components and parts and other opto-electronic device its to consume pump power also bigger.Its major defect is the thermal control poor-performing, and device is complicated, the pressure drop in the time of must overcoming boiler water circulation, and pipeline easily leaks, and easily causes accidents such as reduction of the circuit class of insulation even short circuit, and sealing requirements is very high.
(3) heat pipe cooling
Heat pipe is a kind of newer heat dissipation technology that has been applied at present in some lasers, electric and other photoelectronic device.The heat that the heating components and parts produce makes the heated liquid of heat pipe evaporator section flash to steam, and steam carries the condensation segment condensation that heat flows to heat pipe, forces liquid cooling or air-cooled to take away heat with cooling water or fan opposite heat tube condensation segment again.Its major advantage is: the thermal control performance is good, heat-transfer capability is strong, isothermal is high, have density of heat flow rate ability to transform etc.But general heat pipe easily produces the phenomenon of carrying under one's arms because steam and liquid are in the same space, and the condensation water backflow is reduced, and causes evaporation section tube wall temperature to rise suddenly, makes heat pipe damage or inefficacy.In general, the heat-sinking capability of ammoniacal liquor heat pipe is lower than 6W/cm
2, the heat-sinking capability of hydro-thermal pipe is at 25～100W/cm
2Between.In addition, because the heat pipe caliber is less, the heat pipe condenser section condensation area is limited, total condensation heat transfer amount is very little, thereby, although be furnished with a large amount of radiated ribs on the outer tube wall of heat pipe condenser section, total heat dissipation capacity of heat pipe is very limited, is difficult to satisfy the heat radiation and the thermal control requirement of small size, powerful electronics, photoelectron and electric components.
(4) thermoelectric cooling (Thermoelectric Cooling)
The thermoelectric cooling utilization be thermoelectric effect (Peltier effect).Promptly when electric current was flowed through the contact that two different conductors form, the contact place can produce heat release and heat absorption phenomenon.The thermoelectric material of using is many based on doping Bi, Te semiconductor alloy material now.Thereby the thermoelectric-cooled technology is also referred to as the semiconductor cooling technology.The advantage of thermoelectric cooling module is not have slide unit, is applied in some spaces and is restricted, and the reliability requirement height, the occasion that cryogen-free pollutes can realize high-precision temperature control, and thermal inertia is very little, and the refrigeration time is fast.But owing to be subjected to the restriction of material, the size of present conventional semiconductor cooler is still inadequately little, and freezing capacity is not high enough, and the heat radiation density of heat flow rate is lower than 10W/cm
2The order of magnitude.As independent use, then can't satisfy the heat radiation and the thermal control requirement of small size, powerful laser device, electric components and parts and other opto-electronic device.
Summary of the invention
The objective of the invention is to: solve that the efficient that existing heat dissipation technology exists is low, the technological deficiency of the limited function space that need take bigger laser, electric and other photonics, heat-sinking capability deficiency, thermal control poor performance; Thereby provide a kind of heat-obtaining pattern power consumption, small area, high heat flux of not having, simultaneously, the working temperature that is lower than ambient temperature that satisfies the heating components and parts requires, can the based on capillary slot group that the heating components and parts carry out high-precision temperature control and have a strong heat-sinking capability be dispelled the heat and thermal control system with thermoelectric cooling module (TEC) composite type.
The object of the present invention is achieved like this:
A kind of based on capillary slot group and thermoelectric cooling module combined hot control method, use contains the system of micro capillary groove evaporator, pipeline, long-range cartridge element, thermoelectric cooling module, heat dissipation element combination, and the caloric value of the high heat flux that high power laser device, electric components and parts or other opto-electronic device that size in the narrow space is small produced is lost in time in the extraneous large environmental space in strange land and goes; It is characterized in that, utilize the minute yardstick phase-change heat-exchange characteristic of micro capillary groove evaporator isothermal ability and the accurate temperature control characteristic realization of thermoelectric cooling module that the temperature of laser device, electric components and parts or other opto-electronic device of heating is controlled; Comprise:
A) the heat absorption outer surface with micro capillary groove evaporator closely is connected with the heating face of high power laser device, electric components and parts or other opto-electronic device;
B) in heat absorption in the micro capillary groove evaporator, gasification: be exactly to utilize the caloric value of the high heat flux that minute yardstick phase-change heat-exchange characteristic high power laser device, electric components and parts or other opto-electronic device that the size in the narrow space is small of the power-actuated flow behavior of capillary in the open based on capillary slot group of liquid working substance in micro capillary groove evaporator with latent heat of vaporization and thin liquid film evaporation and boiling produced to take out, make the liquid working substance vaporization;
C) utilize heat and fluid transport pipeline that steam is sent into long-range cartridge element: the steam that carries heat is flowed in the long-range cartridge element by the steam insulation flexible pipe;
D) utilize thermoelectric cooling module to make steam condensation heat in long-range cartridge element become liquid: after steam enters condenser, under the refrigeration of the thermoelectric cooling module of being close to the condenser outer walls face, steam carries out condensation heat at the open place, microflute groove top of condensing of condenser inwall, and thermoelectric cooling module is carrying out the temperature controlled while, the heat that heat that vapor condenses discharged and thermoelectric cooling module self are produced is transmitted on the heat dissipation element by the hot side of thermoelectric cooling module, carry out exchange heat between heat dissipation element and the external environment, heat dissipation is in external environment the most at last;
E) cryogenic liquid that gathers of long-range cartridge element is sent micro capillary groove evaporator back to through the fluid transport pipeline and recycled: the condensation water in the condenser passes through return flexible hose, in time be back in the micro capillary groove evaporator by means of gravity with by the formed continuous capillary attraction effect of the open based on capillary slot group in return flexible hose, drain microflute connector and the micro capillary groove evaporator, thereby finish the circulation of a heat-obtaining and heat release;
F) regulate the refrigeration temperature and the power of thermoelectric cooling module, reach and make the heater members cooling and it is carried out the purpose of thermal control.
Described method, its described long-range cartridge element is condenser.
Described method, its described d) heat dissipation element in the step is wherein a kind of of water-cooling element or wind-cooling heat dissipating element;
If use the water-cooled heat dissipation element, being the heat that produces of heat that vapor condenses is discharged and thermoelectric cooling module self is transmitted in the water-filled radiator by the hot side of thermoelectric cooling module, by with water-filled radiator in the cooling water that flows through carry out heat convection, finally these heats are taken away by cooling water;
If use the wind-cooling heat dissipating element, being the heat that produces of heat that vapor condenses is discharged and thermoelectric cooling module self is transmitted on the fin group of heating panel by the hot side of thermoelectric cooling module, makes with fan and carries out exchange heat between cross-ventilated heat transfer boundary condition and the external environment.
The combined hot control system that a kind of described method is used comprises: micro capillary groove evaporator (3), flexible pipe, condenser (6), thermoelectric cooling module (7), heat dissipation element, drain microflute connector (12); Wherein, evaporator (3) is a cavity that vacuumizes, and perfusion fluid working medium in it, one outer surface of micro capillary groove evaporator (3) is close to the appearance heating face of high power laser device, electric components and parts or other opto-electronic device (1) and is linked to each other, on the heated inner surface of micro capillary groove evaporator (3) acceptance heating components and parts caloric value, be provided with most open based on capillary slot roads, form evaporation microflute group (2), in order to be drawn into liquid working substance in the microflute and to make its generation high strength evaporation and boiling become steam; Its end face that also is included in micro capillary groove evaporator (3) is provided with at least one steam (vapor) outlet (16), the inwall of the micro capillary groove evaporator (3) at steam (vapor) outlet (16) place is provided with crisscross microflute (4), and the lower end of evaporator (3) is communicated with the upper end of drain microflute connector (10); One end of at least one heat-preserving hose (5) links to each other with the steam (vapor) outlet (16) of micro capillary groove evaporator (3), the steam inlet of the other end and condenser (6) joins, steam flows out from the steam (vapor) outlet (15) of micro capillary groove evaporator (3), and the steam inlet place by condenser (6) flows in the condenser (6) by heat-preserving hose (5); Condenser (6) is a cavity that vacuumizes, there is at least one steam inlet its upper end, the cavity inner wall of this condenser (6) most the open microflutes that condense (15) that vertically distribute, the cavity inner bottom part is provided with slope (14), slope (14) slope, upper edge length direction is furnished with most water conservancy diversion microflutes (13), and there is at least one condensation water outlet slope (14) bottom; On the both sides outside wall surface of condenser (6), be respectively provided to a few thermoelectric cooling module (7), the huyashi-chuuka (cold chinese-style noodles) of each thermoelectric cooling module (7) contacts with condenser (6) intimate by welding or with the adhesive or the heat-conducting silicone grease of good heat conductivity, and the hot side of thermoelectric cooling module (7) is then by welding or closely contacting with heat dissipation element with the adhesive or the heat-conducting silicone grease of good heat conductivity; The condensation water outlet of condenser (6) links to each other with an end of at least one return flexible hose (10), the other end of return flexible hose (10) with have at least the inlet of the drain microflute connector (12) of an inlet to join, drain microflute connector (12) is banded, be provided with the parallel compact arranged microtubule of most roots in it, microtubule upper end is connected with evaporation microflute group (2) in the micro capillary groove evaporator (3), and the lower end is connected with return flexible hose (10);
Intrasystem absolute pressure is in 0.1～50kPa scope.
Described combined hot control system, its described micro capillary groove evaporator (3) is made by thermal conductive metallic material, evaporation micro-channel (2) cross section that is provided with on its inner heated wall surface is a rectangle, triangle or trapezoidal, this micro-channel is vertically arranged evenly, the width of conduit and the degree of depth are all in the 0.01-1mm scope, spacing between the micro-channel is in the 0.01-1mm scope, crisscross microflute (4) gathers on the wall of steam (vapor) outlet (16) place of micro capillary groove evaporator (3), its cross section is a rectangle, triangle, trapezoidal, the U-shaped geometry, the width of vertical and horizontal microflute (4) and the degree of depth are in the 0.01-1mm scope, and the spacing between the micro-channel is in the 0.01-1mm scope.
Described combined hot control system, its described condenser (6) is made by thermal conductive metallic material; Condenser (6) inwall vertically is densely covered with many open microflutes that condense (15), the cross section of microflute (15) of condensing is trapezoidal, triangle or waveform, condense the width of microflute (15) and the degree of depth in the 0.01-10mm scope, the spacing between the microflute that condenses (15) is in the 0.01-20mm scope; The outer surface of condenser (6) is the smooth planar surface.
Described combined hot control system, all in the 0.01-1mm scope, the spacing between the micro-channel (13) is in the 0.01-1mm scope for the width of the rectangle water conservancy diversion micro-channel (13) on its described condenser (6) cavity inner bottom part slope (14) and the degree of depth.
The parallel compact arranged microtubule of most roots in the described combined hot control system, its described drain microflute connector (12), its single microtubule diameter size are made by the material of plastic flexible pipe or soft metal or bending arbitrarily in the scope of 0.01-2mm.
Described combined hot control system, its described steam insulation flexible pipe (5) is by making by crooked arbitrarily material, and its internal diameter is in the scope of 1-20mm.
Described combined hot control system, its described return flexible hose (10) is by making by crooked arbitrarily material, and its internal diameter is in the scope of 0.1-10mm.
Described combined hot control system installs capillary wick additional along tube axial direction in its described return flexible hose (10), and this capillary wick is 2 layer of 250 purpose stainless steel wire or copper wire web-roll core.
Described combined hot control system, its described thermoelectric cooling module (7) is for utilizing a kind of flaky semiconductor chiller of thermoelectric effect, the length of single thermoelectric cooling module (7) is in the 1-500mm scope, width is in the 1-500mm scope, thickness is in the 0.5-100mm scope, and the maximum cooling power of single thermoelectric cooling module is in the 0-500W scope.
Described combined hot control system, its described heat dissipation element, be water-filled radiator (11), it is block, the hot side size of outer surface size and thermoelectric cooling module (7) is complementary, internal placement has serpentine channel, and cooling water is arranged in the serpentine channel, and serpentine channel constitutes the loop by pipeline, pump and external refrigeration water source; Water-filled radiator (11) is made by thermal conductive metallic material, and the channel cross-section that its inner serpentine bend is arranged is a rectangle, and the height of channel cross-section is in the 0.1-50mm scope, and width is in the 0.1-20mm scope.
Described combined hot control system, its described heat dissipation element is air-cooled radiator, comprises heating panel (8) and fan (9); The hot side of the size of heating panel (8) and thermoelectric cooling module (7) is suitable, the hot side of thermoelectric cooling module (7) closely contacts with the heating panel that the fin group is arranged (8) by welding or with the adhesive or the heat-conducting silicone grease of good heat conductivity, is provided with fan (9) at the top of heating panel (8); The height of the single fin on the heating panel (8) is in the scope of 0.1-60mm, fin thickness is in the scope of 0.1-10mm, spacing of fins is in the scope of 0.1-10mm, the size of the described fan (9) that is installed in heating panel (8) top and the overall dimension of heating panel are complementary, and fan power is between 0.5-200W.
Technique effect of the present invention:
Domestic and international research shows, overall characteristic that flows and conduct heat in the microchannel and the result in the large scale passage have a great difference, the evaporation and the boiling of working medium have high intensity in the micro-channel, the extraordinary phenomenon that belongs to the heat and mass under the yardstick between microvoid, for example the highest heating density of heat flow rate of high-performance calculation machine chip is taller goes out about two orders of magnitude than present great-power electronic electric components for the theoretical limit of its phase transformation heat of evaporation current density, and diabatic process has good isothermal, is a kind of high performance cooling heat dissipation mode.In addition, thermoelectric cooling module has the characteristics of accurate temperature controlling, calculates by electric current input feedback, its cold junction temperature can accurately be controlled at ± 0.1 ℃ in.Local heat-obtaining element (micro capillary groove evaporator 3) among the present invention has been owing to adopted the evaporation and the boiling heat transfer principle of working medium in the micro-channel, and the heating face size that its size may diminish to very little laser device, electric components and parts and other opto-electronic device is complementary; Heat among the present invention and fluid transport device have adopted capillary pump two-phase aspiration circuit principle, and the heat of the high heat flux that local heat-obtaining element can be got in time is transported to far.Simultaneously, the condenser among the present invention is arranged in away from the space beyond the function system of laser, electric and other photoelectronic device, and is pasting the temperature that thermoelectric cooling module is accurately controlled the condenser outer surface in the intimate of condenser.Therefore, the present invention is by local heat-obtaining element (micro capillary groove evaporator), heat and fluid transport device, long-range cartridge element (condenser), thermoelectric cooling module, the combination of heating panel and fan or water-filled radiator can size in the narrow space is small the high power laser device, the caloric value of the high heat flux that electric components and parts and other opto-electronic device are produced is lost in time in the extraneous large environmental space in strange land and goes, and utilizes the high strength of micro capillary groove evaporator, the minute yardstick phase-change heat-exchange characteristic of high isothermal ability and the high-precision temperature control characteristic of thermoelectric cooling module realize the laser device to heating, the temperature control of electric components and parts and other opto-electronic device.The present invention need not as some traditional heat-dissipating types of cooling, must be for strengthening the heat convection cooling at the laser device of heating, electric components and parts and the residing confined space lining of other opto-electronic device are put the bigger fin of volume, electric fan and relevant heat radiation and thermal control parts, thereby can save laser significantly, the functional space of electric and other photoelectronic device system is realized the no power consumption heat-obtaining of entire heat dissipation system, remote thermotransport, quiet operation, high-intensity heat radiation cooling and laser to generating heat, electric and other photoelectronic device carries out the purpose of high-precision remote thermal control.
The evaporation microflute that is provided with on the inner heated wall surface of micro capillary groove evaporator is a rectangular duct, this micro-channel is vertically arranged evenly, all in the 0.1-0.8mm scope, the spacing between the micro-channel is in the 0.1-0.8mm scope for the width of conduit and the degree of depth, and the heat-obtaining ability of micro capillary groove evaporator is stronger.
Densely covered crisscross microflute on the steam (vapor) outlet place wall of evaporator inside, the width of vertical and horizontal microflute and the degree of depth are in the 0.01-1mm scope, and the spacing between the micro-channel is in the 0.01-1mm scope.Crisscross microflute is like this formed the perforation conduit with evaporation microflute (the microflute group is heat sink), can form well capillary attraction effect continuously, can avoid in the steam pipe along the obstruction of journey condensate liquid to venthole.
Cooling system is the sealing system with certain vacuum degree.The heat radiation cooling capacity of entire heat dissipation system was stronger when intrasystem absolute pressure was in 0.1～50kPa scope.
The internal diameter of steam insulation flexible pipe is in the scope of 1-20mm, and pipe is outer when being with preferably insulation material, and there is better radiating effect in the entire heat dissipation system.
Drain microflute connector is banded, closely rearranges by many microtubules are parallel.Microtubule can be made by crooked arbitrarily material by plastic flexible pipe or soft metal or other.Single microtubule diameter size is in the scope of 0.01-2mm the time, and it is strong that drain microflute connector stably is transported to the effect sedan-chair that goes in the evaporation microflute in the evaporator with the condensate liquid in the return flexible hose.
One end of return flexible hose links to each other with the condensate outlet place of condenser, and the inlet of the other end and drain microflute connector joins.The internal diameter of return flexible hose by making by crooked arbitrarily material, can form the capillary force effect in the scope of 0.1-10mm.Return flexible hose can utilize the effect of gravity and capillary force that the condensate liquid that condenses in the long-range condenser is transported in the drain microflute connector.And can increase this REFRIGERATION SYSTEM DRIVEN BY CAPILLARY FORCE ability by in return flexible hose, installing capillary wick additional.
Single fin height on the heating panel 8 is in the scope of 1-50mm, fin thickness is in the scope of 0.5-2mm, and spacing of fins is in the scope of 1-5mm, and the overall dimension of the size of fan 9 and heating panel is complementary, the power of fan 9 is between 0.5-200W the time, and the radiating effect of system is better.
Water-filled radiator 11 is made by the higher metal material of conductive coefficient, for example metallic copper.The outer surface size of water-filled radiator 11 is complementary with thermoelectric cooling module hot side size.The rectangular channel that internal placement has serpentine bend to arrange, the height of channel cross-section are in the 1-15mm scope, and width is in the 1-10mm scope time, and the radiating effect of system is better.
Description of drawings:
Fig. 1 is the structural representation of the evaporation microflute group in the micro capillary groove evaporator of the present invention; Wherein:
Fig. 1 (a) is evaporation microflute group surface;
Fig. 1 (b) is evaporation microflute group's microflute group's micro-channel section;
Fig. 2 is the crisscross micro groove structure schematic diagram on the micro capillary groove evaporator steam inside outlet wall of the present invention;
Fig. 3 is the micro groove structure schematic diagram that condenses on condenser of the present invention and the inwall thereof; Wherein:
Fig. 3 (a) is the internal view of condenser;
Fig. 3 (b) is the vertical open trapezoidal microflute that condenses;
Fig. 3 (c) is the vertical open trapezoidal micro-channel section that condenses;
Fig. 4 is a drain microflute connector construction schematic diagram of the present invention;
Fig. 5 adopts the based on capillary slot group of the inventive method and the embodiment of a kind of water-cooling of heat radiation of thermoelectric cooling module (TEC) composite type and thermal control system;
Fig. 6 is a water-filled radiator internal structure schematic diagram of the present invention;
Fig. 7 adopts the based on capillary slot group of the inventive method and the embodiment of the another kind of wind-cooling heat dissipating of heat radiation of thermoelectric cooling module (TEC) composite type and thermal control system.
Embodiment
Heat radiation of based on capillary slot group provided by the invention and thermoelectric cooling module (TEC) composite type and thermal control system, comprise: the evaporator 3 that a cavity that vacuumizes forms, the open micro-channel of this evaporator 3 is arranged on the heated inner surface of inferior heat sink 1 the heat of accepting heater members itself or heater members in the evaporator cavities, forms evaporation microflute group 2; Described evaporation microflute group's 2 size can be drawn into the liquid working substance on described micro-channel limit in the evaporation microflute group 2, as shown in Figure 1 to be fit to forming capillary force; It is characterized in that the steam (vapor) outlet 16 place walls that also are included in evaporator 3 are provided with crisscross microflute 4, as shown in Figure 2; The inlet of evaporator 3 links to each other with drain microflute connector 12, as shown in Figure 5; An and condenser 6 of making by thermal conductive metallic material, the inwall of this condenser 6 is the open microflute 15 that condenses of distribution vertically, with cavity arrangements the slope 14 of rapid collection condensation water is arranged, slope, slope 14 upper edge length direction is furnished with many water conservancy diversion microflutes 13, can utilize the effect of gravity and capillary force to quicken compiling of condensation water, as shown in Figure 3; One or more thermoelectric cooling modules 7 are set respectively on two outside wall surface of condenser 6, adhesive or heat-conducting silicone grease contact with the condenser intimate huyashi-chuuka (cold chinese-style noodles) of each thermoelectric cooling module preferably by welding or with heat conductivility, adhesive or heat-conducting silicone grease closely contact with the heating panel 8 that the fin group is arranged the hot side of thermoelectric cooling module preferably by welding or with heat conductivility, at the top of heating panel 8 fan 9 is installed, as shown in Figure 7.Perhaps the hot side of thermoelectric cooling module by welding or with heat conductivility preferably adhesive or heat-conducting silicone grease closely contact with the one side of water-filled radiator 11, as shown in Figure 5.Water-filled radiator is block, and the hot side size of outer surface size and thermoelectric cooling module is complementary, and internal placement has serpentine channel, as shown in Figure 6, has cooling water to flow through in the passage and makes the cooling of thermoelectric cooling module hot side; One end of one or one above heat-preserving hose 5 links to each other with the steam (vapor) outlet of evaporator 3, and the steam inlet of the other end and condenser 6 joins; One end of another root or an above return flexible hose 10 links to each other with the condensate outlet place of condenser 6, and the inlet of the other end and drain microflute connector 12 joins; Can install capillary wick additional in the return flexible hose 10 and be used for increasing the capillary force that makes condensate liquid flow back into evaporator 3 rapidly.
In above-mentioned technical scheme, described evaporator 3 is made by thermal conductive metallic material, metallic copper for example, the evaporation micro-channel that is provided with on the evaporator 3 inner heated wall surfaces is rectangle, triangle or trapezoidal conduit, this micro-channel is vertically arranged evenly, all in the 0.01-1mm scope, the spacing between the micro-channel is in the 0.01-1mm scope, as shown in Figure 1a for the width of conduit and the degree of depth; The size of described open micro-channel is fit to form capillary force, is drawn in the micro-channel with the liquid working substance with described micro-channel limit.As shown in Figure 2, described crisscross microflute forms the capillary attraction effect, the condensate liquid at place, gas outlet can be pulled away from the steam (vapor) outlet position rapidly, avoids in the steam pipe along the obstruction of journey condensate liquid to venthole.The width of described vertical and horizontal microflute and the degree of depth are in the 0.01-1mm scope, and the spacing between the micro-channel is in the 0.01-1mm scope.
In above-mentioned technical scheme, described condenser 6 is made by the higher metal material of conductive coefficient, for example metallic copper.The condenser inwall vertically is densely covered with many open microflutes that condense, and the geometry of the microflute that condenses is trapezoidal, triangle or waveform, and the width of the microflute that condenses and the degree of depth are condensed spacing between the microflute in the 0.01-20mm scope in the 0.01-10mm scope.The outer surface of condenser 6 is the smooth planar surface.
In above-mentioned technical scheme, all in the 0.01-1mm scope, the spacing between the micro-channel is in the 0.01-1mm scope for the width of the rectangle water conservancy diversion micro-channel 13 on the slope of described condenser inside and the degree of depth.
In above-mentioned technical scheme, described thermoelectric cooling module 7 is for utilizing a kind of flaky semiconductor chiller of thermoelectric effect (being the Peltier effect), the length of single thermoelectric cooling module 7 is in the 1-500mm scope, width is in the 1-500mm scope, thickness is in the 0.5-100mm scope, and the maximum cooling power of single thermoelectric cooling module is in the 0-500W scope.
In above-mentioned technical scheme, the height of the single fin on the described heating panel 8 that the fin group arranged is in the scope of 0.1-60mm, fin thickness is in the scope of 0.1-10mm, spacing of fins is in the scope of 0.1-10mm, the size of the described fan 9 that is installed in heating panel 8 tops and the overall dimension of heating panel are complementary, and fan power is between 0.5-200W.
In above-mentioned technical scheme, described water-filled radiator 11 is made by the higher metal material of conductive coefficient, for example metallic copper.The outer surface size of water-filled radiator 11 is complementary with thermoelectric cooling module hot side size.The rectangular channel that internal placement has serpentine bend to arrange, the height of channel cross-section is in the 0.1-50mm scope, and width is in the 0.1-20mm scope.
In above-mentioned technical scheme, described drain microflute connector 12 is banded, closely rearranges by many microtubules are parallel.Single microtubule diameter size can be made by crooked arbitrarily material by plastic flexible pipe or soft metal or other in the scope of 0.01-2mm.Described drain microflute connector plays a part the condensate liquid in the return flexible hose stably is transported in the evaporator in the evaporation microflute and goes.
In above-mentioned technical scheme, described steam insulation flexible pipe 5 can be made by polyurethane tube, and the internal diameter of this steam insulation flexible pipe is directly made by the less crooked arbitrarily material of energy of conductive coefficient in the scope of 1-20mm, or adopt softer metal material, and add thermal insulation casing at pipe and make.The steam that this heat-preserving hose plays a part to produce in the evaporator with this locality is transported in the long-range condenser and goes.
One end of above-mentioned return flexible hose 10 links to each other with the condensate outlet of condenser, and the inlet of the other end and drain microflute connector 12 joins, and plays a part the condensate liquid in the long-range condenser is transported in the drain microflute connector.
In above-mentioned technical scheme, the internal diameter of described return flexible hose 10 is in the scope of 0.1-10mm, and by any crooked material of energy for example: polyurethane material is made.Can install capillary wick in the return flexible hose additional and be used for increasing the capillary force that makes condensate liquid flow back into evaporator rapidly.Capillary wick is the solid material of porous, for example: stainless steel cloth.
Embodiment 1
Below in conjunction with drawings and Examples the present invention is described in detail:
Referring to Fig. 5, make a kind of based on capillary slot group and heat radiation of thermoelectric cooling module (TEC) composite type and thermal control system of water-cooling.It comprises that one is made the micro capillary groove evaporator 3 of a rectangle seal chamber with the good metallic copper of thermal conductivity, also can be called the heat-obtaining element.Have rectangle micro-channel 2 on the inwall of its micro capillary groove evaporator 3 cavity heating surfaces, form the microflute group, the spacing of this micro-channel 2 is that the width of 0.4mm, micro-channel 2 is that the 0.3mm and the conduit degree of depth are 0.8mm.The size of described rectangle micro-channel 2 is fit to form stronger capillary force, with with absolute ethyl alcohol in the micro capillary groove evaporator 3 or distilled water etc., liquid working substance with higher latent heat of vaporization, be drawn into high-intensity evaporation of formation and boiling in the heat affected zone in the micro-channel 2 by micro-channel 2, become steam to take away the heat that heater produces.The outer surface of present embodiment micro capillary groove evaporator 3 cavity heating surfaces is close together by heat conductive silica gel (silicone grease) and heater members or next heat sink 1 outer surface.
One end of the polyurethane heat-insulation flexible pipe 5 that diameter is 5mm links to each other with the steam (vapor) outlet of micro capillary groove evaporator 3, and the steam inlet of the other end and condenser joins; The polyurethane return flexible hose 10 that another root diameter is 3mm, the one end links to each other with the condensate outlet place of condenser, and the other end is connected with the inlet of drain microflute connector 12.Steam flow in the condenser 6 by the heat-preserving hose 5 that links to each other with micro capillary groove evaporator 3.
The condenser 6 of present embodiment is the rectangle seal chamber that the good metallic aluminium of a usefulness thermal conductivity is made.The inwall of condenser 6 is furnished with many vertically open trapezoidal microflutes that condense, and the width of the microflute that condenses and the degree of depth be all at 1.5mm, and the spacing between the microflute of condensing is at 0.5mm, as shown in Figure 3.Bottom section in condenser is done slope, and the angle on slope is 45 °, leaves rectangle water conservancy diversion micro-channel 13 on it, and the width of water conservancy diversion micro-channel 13 is 1.5mm, and the degree of depth is 2mm, and the spacing between the water conservancy diversion micro-channel 13 is 1.5mm.A thermoelectric cooling module 7 is set respectively on two outside wall surface of condenser 6, the huyashi-chuuka (cold chinese-style noodles) of each thermoelectric cooling module contacts with the condenser intimate by heat-conducting silicone grease, the hot side of thermoelectric cooling module closely contacts by the one side of heat-conducting silicone grease with water-filled radiator 11, water-filled radiator is block, the hot side size of outer surface size and thermoelectric cooling module is complementary, the rectangular channel that internal placement has serpentine bend to arrange, channel width is 10mm, highly be 8mm, as shown in Figure 6, there is cooling water to flow through in the passage and makes the cooling of thermoelectric cooling module hot side.
Condenser 6 vertically is placed on laser, electric or the cabinet of other photoelectronic device or the outside of rack, perhaps is embedded in cabinet or the rack wall.Steam is mainly at open trapezoidal place, the microflute groove top condensation heat that condenses of condenser 6 inwalls, under capillary effect, the condensation water along continuous straight runs flows to microflute trough valley zone, make the liquid film attenuate at place, groove top, condensate liquid then is excreted to the bottom of condenser 6 along the trough valley from top to down, the bottom of condenser 6 inside is furnished with the slope in order to rapid collection condensation water, slope, slope upper edge length direction is furnished with rectangle water conservancy diversion microflute, can utilize the effect of gravity and capillary force to quicken compiling of condensation water.The heat that vapor condenses discharged is transmitted on condenser 6 outer surfaces by condenser 6 inwalls, absorbed by the huyashi-chuuka (cold chinese-style noodles) of thermoelectric cooling module, thermoelectric cooling module is carrying out the temperature controlled while, the heat that these heats and thermoelectric cooling module self are produced the hot side of thermoelectric cooling module by with water-filled radiator in the cooling water that flows through carry out heat convection and finally take away by cooling water.The condensation water of condenser 6 bottoms is then by return flexible hose 10, in time be back in the evaporator 3 by means of gravity with by return flexible hose 10, drain microflute connector 12 and the formed stronger continuous capillary attraction effect of evaporation microflute 2 (the microflute group is heat sink), thereby finish the circulation of a heat-obtaining and heat release, reach and make heater members cooling and it is carried out the purpose of thermal control.
Referring to Fig. 6, make a kind of based on capillary slot group and heat radiation of thermoelectric cooling module (TEC) composite type and thermal control system of wind-cooling heat dissipating.Water-filled radiator among the embodiment 1 is replaced to fin group's heating panel 8.The hot side of thermoelectric cooling module is closely contacted by the bottom surface of heat-conducting silicone grease with the heating panel 8 that the fin group is arranged, fan 9 is installed at top at heating panel 8, the height of rectangle fin is 20mm, the thickness of fin is 1mm, spacing of fins is 1.5mm, the power of fan 9 is 30W, the heat that vapor condenses discharged is transmitted on condenser 6 outer surfaces by condenser 6 inwalls, absorbed by the huyashi-chuuka (cold chinese-style noodles) of thermoelectric cooling module, thermoelectric cooling module is carrying out the temperature controlled while, the heat that these heats and thermoelectric cooling module self are produced is transmitted on the fin of heating panel 8 by the hot side of thermoelectric cooling module, carry out exchange heat between Forced Air Convection heat transfer boundary condition of creating by fan and the external environment then, heat dissipation reaches the purpose of heater members being carried out thermal control in external environment the most at last.Other parts of present embodiment are with embodiment 1.
Embodiment 3: in the present embodiment, install capillary wick additional along tube axial direction in the return flexible hose 10 and be used for increasing the capillary force that makes condensate liquid flow back into evaporator rapidly.Capillary wick is 2 layer of 250 purpose stainless steel wire web-roll core.Other parts of present embodiment are with embodiment 1.
Embodiment 4: in the present embodiment, an end of the polyurethane heat-insulation flexible pipe 5 that four diameters are 4mm links to each other with the steam (vapor) outlet of micro capillary groove evaporator 3, and the steam inlet of the other end and condenser joins; Three polyurethane return flexible hoses 10 that diameter is 5mm in addition, the one end links to each other with the condensate outlet place of condenser, and the other end is connected with the inlet of drain microflute connector 12.Other parts of present embodiment are with embodiment 1.
Embodiment 5: the heating surface in the present embodiment heat-obtaining element (micro capillary groove evaporator) is heater members or next heat sink outer surface.Promptly directly with heater members or secondly heat sink outer surface be made of one with micro capillary groove evaporator, carve cloth rectangle micro-channel as the micro capillary groove evaporator internal heating surface and on its surface, formation microflute group.Other parts of present embodiment are with embodiment 1.
Claims (14)
1. a based on capillary slot group makes up heat control method with thermoelectricity, use contains the system of micro capillary groove evaporator, pipeline, long-range cartridge element, thermoelectric cooling module, heat dissipation element combination, and the caloric value of the high heat flux that high power laser device, electric components and parts or other opto-electronic device that size in the narrow space is small produced is lost in time in the extraneous large environmental space in strange land and goes; It is characterized in that, utilize the minute yardstick phase-change heat-exchange characteristic of micro capillary groove evaporator isothermal ability and the accurate temperature control characteristic realization of thermoelectric cooling module that the temperature of laser device, electric components and parts or other opto-electronic device of heating is controlled; Comprise:
A) the heat absorption outer surface with micro capillary groove evaporator closely is connected with the heating face of high power laser device, electric components and parts or other opto-electronic device;
B) in heat absorption in the micro capillary groove evaporator, gasification: be exactly to utilize the caloric value of the high heat flux that minute yardstick phase-change heat-exchange characteristic high power laser device, electric components and parts or other opto-electronic device that the size in the narrow space is small of the power-actuated flow behavior of capillary in the open based on capillary slot group of liquid working substance in micro capillary groove evaporator with latent heat of vaporization and thin liquid film evaporation and boiling produced to take out, make the liquid working substance vaporization;
C) utilize heat and fluid transport pipeline that steam is sent into long-range cartridge element: the steam that carries heat is flowed in the long-range cartridge element by the steam insulation flexible pipe;
D) utilize thermoelectric cooling module to make steam condensation heat in long-range cartridge element become liquid: after steam enters condenser, under the refrigeration of the thermoelectric cooling module of being close to the condenser outer walls face, steam carries out condensation heat at the open place, microflute groove top of condensing of condenser inwall, and thermoelectric cooling module is carrying out the temperature controlled while, the heat that heat that vapor condenses discharged and thermoelectric cooling module self are produced is transmitted on the heat dissipation element by the hot side of thermoelectric cooling module, carry out exchange heat between heat dissipation element and the external environment, heat dissipation is in external environment the most at last;
E) coagulating liq that gathers of long-range cartridge element is sent micro capillary groove evaporator back to through the fluid transport pipeline and recycled: the condensation water in the condenser passes through return flexible hose, in time be back in the micro capillary groove evaporator by means of gravity with by the formed continuous capillary attraction effect of the open based on capillary slot group in return flexible hose, drain microflute connector and the micro capillary groove evaporator, thereby finish the circulation of a heat-obtaining and heat release;
F) regulate the refrigeration temperature and the power of thermoelectric cooling module, reach and make the heater members cooling and it is carried out the purpose of thermal control.
2. the method for claim 1 is characterized in that, described long-range cartridge element is condenser.
3. the method for claim 1 is characterized in that, described d) heat dissipation element in the step, be wherein a kind of of water-cooling element or wind-cooling heat dissipating element;
If use the water-cooled heat dissipation element, being the heat that produces of heat that vapor condenses is discharged and thermoelectric cooling module self is transmitted in the water-filled radiator by the hot side of thermoelectric cooling module, by with water-filled radiator in the cooling water that flows through carry out heat convection, finally these heats are taken away by cooling water;
If use the wind-cooling heat dissipating element, being the heat that produces of heat that vapor condenses is discharged and thermoelectric cooling module self is transmitted on the fin group of heating panel by the hot side of thermoelectric cooling module, makes with fan and carries out exchange heat between cross-ventilated heat transfer boundary condition and the external environment.
4. the combined hot control system that the method for claim 1 is used comprises: micro capillary groove evaporator (3), flexible pipe, condenser (6), thermoelectric cooling module (7), heat dissipation element, drain microflute connector (12); Wherein, evaporator (3) is a cavity that vacuumizes, and perfusion fluid working medium in it, one outer surface of micro capillary groove evaporator (3) is close to the appearance heating face of high power laser device, electric components and parts or other opto-electronic device (1) and is linked to each other, on the heated inner surface of micro capillary groove evaporator (3) acceptance heating components and parts caloric value, be provided with most open based on capillary slot roads, form evaporation microflute group (2), in order to be drawn into liquid working substance in the microflute and to make its generation high strength evaporation and boiling become steam; It is characterized in that, the end face that also is included in micro capillary groove evaporator (3) is provided with at least one steam (vapor) outlet (16), the inwall of the micro capillary groove evaporator (3) at steam (vapor) outlet (16) place is provided with crisscross microflute (4), and the lower end of evaporator (3) is communicated with the upper end of drain microflute connector (10); One end of at least one heat-preserving hose (5) links to each other with the steam (vapor) outlet (16) of micro capillary groove evaporator (3), the steam inlet of the other end and condenser (6) joins, steam flows out from the steam (vapor) outlet (15) of micro capillary groove evaporator (3), and the steam inlet place by condenser (6) flows in the condenser (6) by heat-preserving hose (5); Condenser (6) is a cavity that vacuumizes, there is at least one steam inlet its upper end, the cavity inner wall of this condenser (6) most the open microflutes that condense (15) that vertically distribute, the cavity inner bottom part is provided with slope (14), slope (14) slope, upper edge length direction is furnished with most water conservancy diversion microflutes (13), and there is at least one condensation water outlet slope (14) bottom; On the both sides outside wall surface of condenser (6), be respectively provided to a few thermoelectric cooling module (7), the huyashi-chuuka (cold chinese-style noodles) of each thermoelectric cooling module (7) contacts with condenser (6) intimate by welding or with the adhesive or the heat-conducting silicone grease of good heat conductivity, and the hot side of thermoelectric cooling module (7) is then by welding or closely contacting with heat dissipation element with the adhesive or the heat-conducting silicone grease of good heat conductivity; The condensation water outlet of condenser (6) links to each other with an end of at least one return flexible hose (10), the other end of return flexible hose (10) with have at least the inlet of the drain microflute connector (12) of an inlet to join, drain microflute connector (12) is banded, be provided with the parallel compact arranged microtubule of most roots in it, microtubule upper end is connected with evaporation microflute group (2) in the micro capillary groove evaporator (3), and the lower end is connected with return flexible hose (10);
Intrasystem absolute pressure is in 0.1～50kPa scope.
5. combined hot control system as claimed in claim 4, it is characterized in that, described micro capillary groove evaporator (3) is made by thermal conductive metallic material, evaporation micro-channel (2) cross section that is provided with on its inner heated wall surface is a rectangle, triangle or trapezoidal, this micro-channel is vertically arranged evenly, the width of conduit and the degree of depth are all in the 0.01-1mm scope, spacing between the micro-channel is in the 0.01-1mm scope, crisscross microflute (4) gathers on the wall of steam (vapor) outlet (16) place of micro capillary groove evaporator (3), its cross section is a rectangle, triangle, trapezoidal, the U-shaped geometry, the width of vertical and horizontal microflute (4) and the degree of depth are in the 0.01-1mm scope, and the spacing between the micro-channel is in the 0.01-1mm scope.
6. combined hot control system as claimed in claim 4 is characterized in that, described condenser (6) is made by thermal conductive metallic material; Condenser (6) inwall vertically is densely covered with many open microflutes that condense (15), the cross section of microflute (15) of condensing is trapezoidal, triangle or waveform, condense the width of microflute (15) and the degree of depth in the 0.01-10mm scope, the spacing between the microflute that condenses (15) is in the 0.01-20mm scope; The outer surface of condenser (6) is the smooth planar surface.
7. combined hot control system as claimed in claim 4, it is characterized in that, all in the 0.01-1mm scope, the spacing between the micro-channel (13) is in the 0.01-1mm scope for the width of the rectangle water conservancy diversion micro-channel (13) on described condenser (6) the cavity inner bottom part slope (14) and the degree of depth.
8. combined hot control system as claimed in claim 4, it is characterized in that, the parallel compact arranged microtubule of most roots in the described drain microflute connector (12), its single microtubule diameter size are made by the material of plastic flexible pipe or soft metal or bending arbitrarily in the scope of 0.01-2mm.
9. combined hot control system as claimed in claim 4 is characterized in that, described steam insulation flexible pipe (5) is by making by crooked arbitrarily material, and its internal diameter is in the scope of 1-20mm.
10. combined hot control system as claimed in claim 4 is characterized in that, described return flexible hose (10) is by making by crooked arbitrarily material, and its internal diameter is in the scope of 0.1-10mm.
11., it is characterized in that install capillary wick additional along tube axial direction in the described return flexible hose (10), this capillary wick is stainless steel or the copper wire web-roll core of single or multiple lift order number between the 50-450 order as claim 4 or 10 described combined hot control system.
12. combined hot control system as claimed in claim 4, it is characterized in that, described thermoelectric cooling module (7) is for utilizing a kind of flaky semiconductor chiller of thermoelectric effect, the length of single thermoelectric cooling module (7) is in the 1-500mm scope, width is in the 1-500mm scope, thickness is in the 0.5-100mm scope, and the maximum cooling power of single thermoelectric cooling module is in the 0-500W scope.
13. combined hot control system as claimed in claim 4, it is characterized in that, described heat dissipation element, be water-filled radiator (11), it is block, and the hot side size of outer surface size and thermoelectric cooling module (7) is complementary, and internal placement has serpentine channel, cooling water is arranged in the serpentine channel, and serpentine channel constitutes the loop by pipeline, pump and external refrigeration water source; Water-filled radiator (11) is made by thermal conductive metallic material, and the channel cross-section that its inner serpentine bend is arranged is a rectangle, and the height of channel cross-section is in the 0.1-50mm scope, and width is in the 0.1-20mm scope.
14. combined hot control system as claimed in claim 4 is characterized in that, described heat dissipation element is air-cooled radiator, comprises heating panel (8) and fan (9); The hot side of the size of heating panel (8) and thermoelectric cooling module (7) is suitable, the hot side of thermoelectric cooling module (7) closely contacts with the heating panel that the fin group is arranged (8) by welding or with the adhesive or the heat-conducting silicone grease of good heat conductivity, is provided with fan (9) at the top of heating panel (8); The height of the single fin on the heating panel (8) is in the scope of 0.1-60mm, fin thickness is in the scope of 0.1-10mm, spacing of fins is in the scope of 0.1-10mm, the size of the described fan (9) that is installed in heating panel (8) top and the overall dimension of heating panel are complementary, and fan power is between 0.5-200W.
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- 2007-02-07 CN CNA200710063701XA patent/CN101242729A/en active Pending
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| CN101814464B (en) * | 2009-02-25 | 2011-06-01 | 中国科学院工程热物理研究所 | Composite phase change integrated cooling heat dissipation method and device for micro slot group of silicon controlled thyristor device |
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