CN106994754A - Shearing device - Google Patents
Shearing device Download PDFInfo
- Publication number
- CN106994754A CN106994754A CN201610765973.3A CN201610765973A CN106994754A CN 106994754 A CN106994754 A CN 106994754A CN 201610765973 A CN201610765973 A CN 201610765973A CN 106994754 A CN106994754 A CN 106994754A
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- China
- Prior art keywords
- ring
- cut
- workbench
- cut ring
- shearing device
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
The present invention relates to a kind of shearing device, various sizes of cut ring can be selected in the shearing device and it is fixed on the table.Workbench (47) is maintained on the basic ring (43,44) rotated freely by crossed roller bearing (41).The 1st cut ring (51) is installed across elastic plate (52) on workbench (47).In addition, instead of elastic plate (52) and the 1st cut ring (51), protection location-plate (53) being set on the table, sets up separately put elastic plate (54) in the central portion, the 2nd cut ring (55) is installed.Ring accepting unit (60) can change various sizes of by pressure arm (64,67), install by pressure arm the size selectivity of cooperation cut ring.
Description
Technical field
The present invention relates to a kind of cut-out cut off to the brittle substrate that cut ring is arranged on via adhesives
Device, the cut-out dress of more particularly to a kind of cut ring that the different multiple species of size can be optionally set on the table
Put.
Background technology
Show that portion is pressed on the table, from it by the cut ring holding provided with semiconductor wafer in patent document 1
Incision broken strip is come the shearing device that is cut off.In this shearing device, what cut ring on the table was kept partly leads
It is formed with score line to the advance clathrate of body chip.In the case of by substrate cutting into clathrate, cut along 1 score line pressure
Broken strip is cut off.Then workbench is moved in parallel on fixed-direction, cut off semiconductor die along a plurality of score line successively
Piece.Then make about 90 ° of worktable rotary, cut-out bar is depressed successively along the orthogonal score line of the score line with completing cut-out is same
Cut off, and workbench is moved in parallel on fixed-direction.So cut off semiconductor wafer along a plurality of score line successively.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2014-83821 publications.
The invention problem to be solved
Semiconductor wafer is current just constantly from 8 inches to 12 inches expansion sizes, handles large-sized cut ring and is loaded
The necessity of semiconductor wafer increase.In existing shearing device, in the case of the size of change cut ring, need
To use workbench corresponding with each size.Therefore in the presence of not only replacing workbench and its peripheral parts are pretty troublesome but also replacing
Precision adjustment afterwards needs the problem of many time and workload, cost are uprised.
The content of the invention
The present invention be in view of so the problem of and complete, its object is to provide one kind be used in conjunction with workbench and
The shearing device of the size of cut ring can easily be changed.
Scheme for solving problem
In order to solve the problem, shearing device of the invention has：Workbench, it is maintained as the fragility material of cutting object
Expect substrate；And rotating unit, it makes the worktable rotary, optionally installed on the workbench the 1st cut ring and
The smaller cut ring of at least one the 2nd of size, cuts off to the brittle substrate for being maintained at any one cut ring,
Wherein, the rotating unit has：The protection location-plate of ring-type, it has the external diameter bigger than the 2nd cut ring, in inner side tool
There is circular open；Ring accepting unit, the 1st or the 2nd cut ring is maintained at the work by it by rotating freely by pressure arm
Make on platform；1st elastic plate, it is used when using 1 cut ring, is arranged on the workbench and the described 1st and cuts
Cut between ring；And the 2nd elastic plate, it is used when using 2 cut ring, is maintained at the protection location-plate
Opening in and be arranged between the workbench and the 2nd cut ring.
Here, being installed by pressure arm for the ring accepting unit keeps the 1st of the 1st cut ring by pressure arm and holding
Press one kind in pressure arm in the 2nd of 2nd cut ring.
Invention effect
According to the present invention having the feature that, it can easily switch and be kept on the table across the 1st elastic plate
1st state of the 1st cut ring and remove the 1st cut ring and the 1st elastic plate, across protection location-plate and be arranged in its through hole
The 2nd elastic plate keep the 2nd cut ring the 2nd state.By the way that the arm of ring accepting unit is changed into pressing corresponding with size
Arm, so as to which easily various sizes of cut ring is maintained on cooperation platform.Therefore even in the different sizes of use
Cut ring in the case of, also can obtain the effect that need not change workbench and can be cut off with same shearing device.
Brief description of the drawings
Fig. 1 is the approximate three-dimensional map of the shearing device of embodiments of the present invention.
Fig. 2 is the top view of the workbench portion of the rotating mechanism of present embodiment.
Fig. 3 is the stereogram for the rotating mechanism for showing present embodiment.
Fig. 4 is by the upper panel of the rotating mechanism of present embodiment and the separately shown stereogram of bottom block.
Fig. 5 is the assembling assumption diagram of the bottom block of the rotating mechanism of present embodiment.
Fig. 6 is the assembling assumption diagram of the details of the upper panel for the rotating mechanism for showing present embodiment.
Fig. 7 is the side view of the rotating mechanism of present embodiment.
Fig. 8 is the sectional perspective for showing workbench being fixed on the state of the upper basic ring of the rotating mechanism of present embodiment
Figure.
Fig. 9 is the ring accepting unit for the rotating mechanism for showing present embodiment and the stereogram (its 1) of its peripheral part.
Figure 10 is the ring accepting unit for the rotating mechanism for showing present embodiment and the stereogram (its 2) of its peripheral part.
Figure 11 is the top view (its 1) for showing to change the process of cut ring in the shearing device of present embodiment.
Figure 12 is the top view (its 2) for showing to change the process of cut ring in the shearing device of present embodiment.
Figure 13 is the top view (its 3) for showing to change the process of cut ring in the shearing device of present embodiment.
Figure 14 is the top view (its 4) for showing to change the process of cut ring in the shearing device of present embodiment.
Figure 15 is the top view (its 5) for showing to change the process of cut ring in the shearing device of present embodiment.
Figure 16 is the side view of the skeleton diagram for the shearing device for showing present embodiment.
Figure 17 is the block diagram of the controller for the shearing device for showing present embodiment.
Embodiment
Then the shearing device 10 of embodiments of the present invention is illustrated.Shearing device 10 has can be to Fig. 1 institutes
The objective table 11 of positive direction and the negative direction movement for the y-axis shown.Y-axis moving mechanism 12, the Y-axis are provided with the lower section of objective table 11
Travel mechanism 12 makes objective table 11 be moved in the y-axis direction along its face, objective table 11 is rotated along its face.Objective table 11
Top be provided with "U" shape horizontal affixation member 13, its top maintains servomotor 14.In servomotor 14
Rotary shaft has been directly connected to ball-screw 15, and the lower end of ball-screw 15 is other in the way of ball-screw 15 can rotate
Horizontal affixation member 16 is supported.Upper mobile member 17 has the negative thread 18 that is screwed togather with ball-screw 15 in central portion, from moving up
The both ends of dynamic component 17 have downwards support shaft 19a, 19b.Support shaft 19a, 19b run through a pair of horizontal affixation member 16
Through hole simultaneously links with lower mobile member 20.The cut-out bar not shown in figure is installed in the lower surface of lower mobile member 20.Cut
Broken strip is elongated flat board and makes the sharp metal cutlery shape component in top, in the way of tip portion is below and load
The face of thing platform 11 is vertically installed at lower mobile member 20.Like this, revolve ball-screw 15 by servomotor 14
In the case of turning, upper mobile member 17 and lower mobile member 20 are integral and move up and down, and cut-out bar is also moved up and down simultaneously.
This, servomotor 14 and horizontal affixation member 13,16, mobile member 17,20 up and down constitute the lifting for lifting cut-out bar
Mechanism.
Then the rotating mechanism 30 for being arranged on objective table 11 is illustrated.Fig. 2 is the top view of rotating mechanism 30, Fig. 3
It is its stereogram, Fig. 4 is to represent the stereogram by its upper panel and the separated state of bottom block.In addition, Fig. 5 is lower region
The assembling assumption diagram of block.As shown in figure 5, the pedestal 31 in bottom is provided with the stepped through hole 31a of circle and lacking for side
Mouth 31b.As shown in figure 4, bracket 32 and cable chain 33 that the side of pedestal 31 is provided with arc-shaped (are also referred to as cable duct, bag
(cableveyor) containing cable drag chain (registration mark)).Cable chain 33 is soft component, for ring accepting unit described later
Power supply.In addition, being provided with driver element 34 in the breach 31b of pedestal 31, being provided with the driver element 34 is used to revolve workbench
Motor, the gear turned.
Then Fig. 6 is the exploded perspective view for the details for showing the upper panel shown in Fig. 4.Set in the foot of upper panel
There is the crossed roller bearing 41 as annular bearings, its top is provided with ring 42.Crossed roller bearing 41 is linked with interior via bearing
Wheel and foreign steamer, lubrication groove is rotated freely through by fixed foreign steamer so as to reduce friction.Crossed roller bearing 41 is inserted in
In the through hole 31a of pedestal 31, its underpart is maintained at stepped portion.Ring 42 from top by clamping crossed roller bearing 41
Simultaneously screw is fixed on pedestal 31 so as to the foreign steamer of fixed crossed roller bearing 41 to foreign steamer.Lower basic ring 43 is the ring and downwards of ring-type
The component of the slightly smaller protrusion loop section integration of prominent diameter, the protuberance of bottom is inserted in crossed roller bearing 41
The inner side of lubrication groove, lubrication groove is fixed on by top.In addition, fixing basic ring 44 on the top of lower basic ring 43.Upper basic ring 44
It is the ring 44a and the component to the small ring 44b integrations of its prominent diameter in top of ring-type, the protrusion ring 44b on top
Breach 44c~44f is provided with four directions.Gear 45 is installed in the protrusion ring 44b on the top of upper basic ring 44 outer peripheral portion.As schemed
Shown gear 45 is to form annular gear wheel with teeth all-round, is mutually engaged with the drive gear of driver element 34.In upper basic ring 44
Another ring 46 is installed.Ladder is formed with the inner side of ring 46, the workbench 47 of clear glass is embedded in and is maintained at this
The inner side of ladder.Workbench 47 is keeps the round member for the substrate to be cut off, with the diameter almost identical with cut ring,
Here using about 12 inches of diameter.
Then Fig. 7 is the side view for showing that the rotating mechanism is overall, shows to remove the state of bracket 32.As shown in this figure,
Cable chain 33 is provided with pedestal 31, the top of cable chain 33 is provided with gear 45.Pacify shown here as on workbench 47
State equipped with the cut ring for 8 inches.Here, being made up of lower basic ring 43 and upper basic ring 44 by workbench 47 and gear 45
It is kept as the upper surface also high basic ring than pedestal 31.
Fig. 8 is the state that workbench 47 is arranged on to upper basic ring 44 before showing the ring accepting unit 60 stated after mounting
Stereogram.As shown in fig. 6, being provided with 4 workbench fixed blocks 48 and 4 blocks 49 in the periphery of workbench 47.Workbench is fixed
Block 48 is the block for keeping the L-shaped of workbench 47, and upper basic ring 44 is fixed by bolts to across ring 46.Block 49 is cut for holding
The block of ring is cut, upper basic ring 44 is fixed by bolts to across ring 46.
As shown in fig. 6, in the case where the 1st cut ring 51 for 12 inches of substrate is arranged on workbench 47,
Cut ring 51 is directly fixed on to the upper surface of workbench 47 across the 1st elastic plate 52.8 inches of substrate will kept
In the case that 2nd cut ring is arranged on workbench 47, using protection location-plate 53.It is than the 2nd cut ring to protect location-plate 53
Big external diameter, it is about 12 inch of the ring-type thin flat plate almost equal with the size of workbench here, in middle body provided with inserting
Enter the opening of the 2nd elastic plate 54.In the case where installing the 2nd cut ring 55 of the substrate for being kept for 8 inches, location-plate 53 will be protected
It is maintained on workbench 47, inserts the 2nd elastic plate 54 in its opening, the cut ring 55 for 8 inches is installed in portion from it.1st
The cut ring 55 of cut ring 51 or the 2nd is placed in after the block 49 around workbench 47, is received with 4 rings being arranged at around workbench
Hold unit 60 to keep.1st, the 2nd elastic plate 52,54 be the flexible plectane of rubber system etc., in order to from the photography of downside
Function confirms the score line of substrate, using the transparent body.
Fig. 9, Figure 10 are the stereograms for showing ring accepting unit 60 and the details of its peripheral part.Ring accepting unit 60 is distinguished
Installed in 4 breach 44c~44f of upper basic ring 44, but one of them is illustrate only in Fig. 9, Figure 10.In Fig. 9, Figure 10 middle ring
Accepting unit 60 is arranged on the top loop 44b of upper basic ring 44 breach 44c.In ring accepting unit 60, cylinder 62 is installed on L-shaped
Bracket 61.Cylinder 62 is built-in with motor, for making its axle rotate 90 °.Arm 63 is located at the axle of cylinder 62.By pressure arm 64 or 67 every
Pressing plate 65 and arm 63 is arranged on by bolt 66.
As shown in figure 9, in order to which the 1st cut ring 51 for 12 inches is maintained at into workbench 47, across pressing plate 65
Arm 63 will be fixed on by bolt 66 by pressure arm 64.As shown in Figure 10, in order to the 2nd cut ring 55 for 8 inches is maintained at
On workbench 47, arm 63 will be fixed on by bolt 66 by pressure arm 67 across pressing plate 65.Arm is made by the motor in cylinder 62
63 and it is rotated by 90 ° clockwise or counterclockwise by pressure arm 64 or 67.Then the upper of block 49 is abutted by the top of pressure arm
Portion, clamps the end of the cut ring not shown in figure between them, thus fixes cut ring 51 or 55.Here, via described
Cable chain 33 is powered to 4 ring accepting units 60.
In the present embodiment, the brittle substrate as cut-out object is set to semiconductor wafer.In order to will partly lead
Body chip is separated into chip, and semiconductor wafer is kept by the cut ring 51 or 55 of the box-shaped body as annulus.In each cutting
The adhesive tape on top with adhesives is attached on the inside of ring, the circle of cutting object is maintained as in its upper face center
The semiconductor wafer of shape.It is formed with a plurality of score line to the advance clathrate of semiconductor wafer.
In the rotating mechanism 30 of present embodiment, in order that workbench 47 can rotate more than 180 °, using all-round
Gear 45 provided with tooth.In addition, as shown in fig. 7, the rotating mechanism of workbench is matched somebody with somebody in the way of positioned at the top of cable chain 33
Put, the length of cable chain 33 is long than ever, therefore do not increase the overall size of rotating mechanism to ensure more than 180 ° of the anglec of rotation
Degree.
Figure 11~Figure 15 is the process for showing to change from the cut ring 51 for 12 inches to the cut ring 55 for 8 inches
Figure.First in fig. 11,12 inches of cut ring 51 is arranged on workbench 47, is used for 12 inches by ring accepting unit 60
Short-press pressure arm 64 fix around cut ring 51.As the 1st state.Here, being replaced in the cut ring 51 from 12 inches
In the case of changing to the cut ring 55 for 8 inches, first as shown in figure 12, make 4 ring accepting units 60 by 64 turns of pressure arm
Dynamic 90 ° and upward.It is possible thereby to remove 12 inches of cut ring 51.Therefore the elastic plate of cut ring 51 and its underpart is removed simultaneously
52.Next as shown in figure 13, the protection location-plate 53 of ring-type is positioned in the top of glass table 47.And then, such as Figure 14
It is shown, by the arm of ring accepting unit 60 be replaced with the length for 8 inches by pressure arm 67.Then, in protection location-plate 53
The opening portion of centre loads the elastic plate 54 for 8 inches, as shown in figure 15 the configuration cuts ring 55 on block 49, by making pressing
Arm 67 is rotated and will fixed around cut ring 55.As the 2nd state.Like this, same shearing device can be used
Workbench 47 will be fixed on for 8 inches and for 12 inches of any cut ring 51 or 55.
In the present embodiment, shown in the overall skeleton diagram of shearing device as shown in Figure 16, in horizontal affixation member 13
Pillar 71 is flatly provided with, video camera 72 is provided with downward in the pillar 71.Partly leading in the video camera 72 detection cut ring
The state of the score line of body chip.In addition, as shown in phantom in FIG., what the cut-out bar in the lower section of horizontal affixation member 13 was depressed
The side lower position of position is provided with video camera 73, and the video camera 73 is taken the photograph to the semiconductor wafer on workbench from below
Picture, detects score line.
Then, the structure of the controller of the shearing device of present embodiment is illustrated using block diagram.Figure 17 is turned off
The block diagram of the controller 80 of device.Controller 80 is the control for controlling the rotation of workbench and moving in parallel and cut off the lifting of bar
Instrument.In detail in this figure, the output from video camera 72,73 is supplied to control unit 82 via the image processing part 81 of controller 80.
Data of the input pin of input unit 83 to the cut-out of brittle substrate.Monitor 84 is connected with control unit 82, for making cut-out
The cut-out bar drive division 85 that bar is moved up and down, worktable rotary drive division 86 and Y-axis drive division 87 for making worktable rotary.
Cut off bar drive division 85 and drive servomotor 14, move up and down cut-out bar.In addition, the driving of worktable rotary drive division 86 is set
Put the motor 88 in the driver element 34 of pedestal 31.The motor 89 of Y-axis drive division 87, the motor 89 is to objective table 11 in y-axis
It is driven on direction.
Here, worktable rotary drive division 86 and the structure of motor 88 shown in rotating mechanism 30 and Figure 17 shown in above-mentioned Fig. 2
Into the rotating unit for making workbench at least rotate 180 °.Y-axis moving mechanism 12 and Y-axis drive division 87 and motor 89, which are constituted, makes loading
What platform was moved in the y-axis direction moves in parallel unit.In addition, above-mentioned elevating mechanism and cut-out bar drive division 85, which are constituted, makes cut-out bar
The lifting unit lifted relative to score line.
Then the dividing method of semiconductor wafer is illustrated.First objective table 11 rotating mechanism workbench 47
It is upper that any cut ring is set, cut ring 51 is for example set.It is located at cut ring 51 and is placed with semiconductor wafer in advance.In this case
The score line of semiconductor wafer is detected with video camera 72 as shown in figure 16.Then with the score line of formation with cut-out bar into parallel
Mode, by the motor 88 of the drive control unit 34 of worktable rotary drive division 86, rotates workbench 47.
If cutting off bar and score line turns into parastate, driving Y-axis drive division 87 makes objective table 11 in y-axis direction
Upper movement, so that outermost score line is located at the underface of cut-out bar.If score line is in the underface of cut-out bar, with cutting
Broken strip drive division 85 drives servomotor 14, mobile member 17 and lower mobile member 20 is declined simultaneously, makes cut-out bar phase
Keep vertical for objective table 11 and decline at leisure, press blade along the score line of semiconductor wafer, thus cut off.This
If sample, elastic plate 52 is cut off bar pressing and V shape is slightly distorted into.Then by making cut-out bar fully decline, so that edge
Score line and complete segmentation.When splitting completion, rotating backward servomotor 14 rises cut-out bar.Then, temporarily make
Cut off bar to rise, workbench is only moved the length equivalent to adjacent score line interval, made any by driving Y-axis drive division 87
Score line is located at the underface of cut-out bar.If then adjacent score line and cut-out bar become parastate, with cut-out bar
Drive division 85 drives bar is cut off downwards, and presses blade along the score line of semiconductor wafer, is thus cut off.So pass through
The lifting and the movement to y-axis direction of cut-out bar is repeated, all cut-outs can be completed to the score line of fixed-direction.
Then, when completing the cut-out of the fixed-direction, objective table 11 is made from present by worktable rotary drive division 86
Position is rotated by 90 °, and turning into the mode parallel with cut-out bar again with the score line vertical with the score line after cut-out is set.
Then it can be cut off again by along score line pressure cut-out bar.Then objective table 11 is made only to move in the y-axis direction
The gap length of score line, equally declines cut-out bar 21.So by lifting that cut-out bar is repeated and to y-axis direction
It is mobile, whole segmentations can be completed, semiconductor wafer clathrate can be divided into.
Like this, set cut ring process in, it is not necessary to by score line and cut-out bar exactly it is parallel load, can obtain
To can significantly simplify the effect of flow chart.
In addition, in the present embodiment, brittle substrate using semiconductor wafer as cutting object is said
It is bright, but other brittle substrates are equally readily applicable to the present invention.
In addition, in the present embodiment, workbench can rotate more than 180 °, workbench is arranged on but as long as can change
2 kinds of cut ring on top, therefore workbench can not necessarily rotate 180 °, as long as the above can be rotated by 90 °.
In addition, can optionally set 8 inches and 12 in2 kind cut ring on the table herein, but do not limit
These fixed sizes.The cut ring of more species can be set, for example, 3 kinds of cut ring can be set.In this case, make
During with cut ring beyond maximum sized cut ring, multiple protections positioning that the openings of sizes of middle body is different can be used
Plate, and can make pressing arm use to should cut ring length.
Industrial applicability
The present invention being capable of the brittle substrate such as dividing semiconductor wafer, therefore suitable for essence exactly using shearing device
The shearing device of close dividing brittle material substrate.
Description of reference numerals
10：Shearing device；
11：Objective table；
12：Y-axis moving mechanism；
13、16：Horizontal affixation member；
14：Servomotor；
17：Upper mobile member；
20：Lower mobile member；
21：Cut off bar；
30：Rotating mechanism；
31：Pedestal；
32：Bracket；
33：Cable chain；
34：Driver element；
41：Crossed roller bearing；
42：Ring；
43：Lower basic ring；
44：Upper basic ring；
45：Gear；
46：Ring；
47：Workbench；
48：Workbench fixed block；
49：Block；
53：Protect location-plate；
51、55：Cut ring；
52、54：Elastic plate；
60：Ring accepting unit；
61：Bracket；
62：Cylinder；
63：Arm；
64,67：By pressure arm；
65：Pressing plate；
72,73：Video camera；
80：Controller；
81：Image processing part；
82：Control unit；
85：Cut off bar drive division；
86：Worktable rotary portion；
87：Y-axis drive division；
88、89：Motor.
Claims (2)
1. a kind of shearing device, has：
Workbench, it is maintained as the brittle substrate of cutting object；And
Rotating unit, it makes the worktable rotary,
1st cut ring and the smaller cut ring of at least one the 2nd of size are optionally installed on the workbench, to keeping
Cut off in the brittle substrate of any one cut ring, wherein,
The rotating unit has：
The protection location-plate of ring-type, it has the external diameter bigger than the 2nd cut ring, has circular open in inner side；
Ring accepting unit, the 1st or the 2nd cut ring is maintained on the workbench by it by rotating freely by pressure arm；
1st elastic plate, it is used when using 1 cut ring, is arranged on the workbench and the 1st cutting
Between ring；And
2nd elastic plate, it is used when using 2 cut ring, in the opening for being maintained at the protection location-plate
And be arranged between the workbench and the 2nd cut ring.
2. shearing device as claimed in claim 1, wherein,
The ring accepting unit is mounted with to keep the 1st of the 1st cut ring the by pressure arm and keeps the 2nd cutting by pressure arm
Press one kind in pressure arm in the 2nd of ring.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016010475A JP6668776B2 (en) | 2016-01-22 | 2016-01-22 | Break device |
| JP2016-010475 | 2016-01-22 |
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| Publication Number | Publication Date |
|---|---|
| CN106994754A true CN106994754A (en) | 2017-08-01 |
| CN106994754B CN106994754B (en) | 2019-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610765973.3A Active CN106994754B (en) | 2016-01-22 | 2016-08-29 | Disconnecting device |
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| Country | Link |
|---|---|
| JP (1) | JP6668776B2 (en) |
| KR (1) | KR101833769B1 (en) |
| CN (1) | CN106994754B (en) |
| TW (1) | TWI617408B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109624109A (en) * | 2019-02-20 | 2019-04-16 | 广州安特激光技术有限公司 | A kind of plummer of wafer cutter device |
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- 2016-01-22 JP JP2016010475A patent/JP6668776B2/en active Active
- 2016-08-05 TW TW105125053A patent/TWI617408B/en active
- 2016-08-10 KR KR1020160101554A patent/KR101833769B1/en active IP Right Grant
- 2016-08-29 CN CN201610765973.3A patent/CN106994754B/en active Active
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| US4227348A (en) * | 1978-12-26 | 1980-10-14 | Rca Corporation | Method of slicing a wafer |
| JPH10217094A (en) * | 1997-02-04 | 1998-08-18 | Sanken Electric Co Ltd | Semiconductor wafer assembly cutting method and wire saw cutting machine for semiconductor wafers |
| CN101193732A (en) * | 2005-06-13 | 2008-06-04 | 施密德技术系统有限公司 | Device and method for positioning and blocking thin substrates on a cut substrate block |
| CN101104213A (en) * | 2006-07-13 | 2008-01-16 | 硅电子股份公司 | Sawing strip and method for simultaneously cutting off a multiplicity of slices from a cylindrical workpiece using a sawing strip |
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| CN109624109A (en) * | 2019-02-20 | 2019-04-16 | 广州安特激光技术有限公司 | A kind of plummer of wafer cutter device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101833769B1 (en) | 2018-03-02 |
| KR20170088269A (en) | 2017-08-01 |
| TW201726342A (en) | 2017-08-01 |
| JP2017128081A (en) | 2017-07-27 |
| JP6668776B2 (en) | 2020-03-18 |
| CN106994754B (en) | 2019-03-12 |
| TWI617408B (en) | 2018-03-11 |
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