CN106954102B - Optical back plate sub-frame device - Google Patents
Optical back plate sub-frame device Download PDFInfo
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- CN106954102B CN106954102B CN201610013330.3A CN201610013330A CN106954102B CN 106954102 B CN106954102 B CN 106954102B CN 201610013330 A CN201610013330 A CN 201610013330A CN 106954102 B CN106954102 B CN 106954102B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/09—Frames or mounting racks not otherwise provided for
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
- G02B6/4439—Auxiliary devices
- G02B6/444—Systems or boxes with surplus lengths
- G02B6/4452—Distribution frames
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/15—Backplane arrangements
- H04Q1/155—Backplane arrangements characterised by connection features
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- Computer Networks & Wireless Communication (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Coupling Of Light Guides (AREA)
- Use Of Switch Circuits For Exchanges And Methods Of Control Of Multiplex Exchanges (AREA)
Abstract
The application provides a light back plate subrack device relates to the communication field, includes: one or more layers of subracks and P optical backplanes, each layer of subracks comprising M switch cards and L line cards, each switch card comprising one or more optical connectors or optical connectors and electrical connectors, each line card comprising one or more optical connectors or optical connectors and electrical connectors; each optical backplane comprises one or more optical connectors on both sides; connecting the M exchange cards of each layer with all the line cards of different layers through the optical connectors on the P optical backplanes, so that at least one optical connection channel is formed between all the optical connectors corresponding to the line cards of the subracks of different layers and all the optical connectors corresponding to the exchange cards; the convenience of optical signal connection is improved.
Description
Technical Field
The invention relates to communication equipment adopting a centralized switching/crossing (Central Switch) structure, such as an Optical Transport Network (OTN), a Packet Transport Network (PTN), a router and the like in the field of communication, in particular to an Optical backplane subframe device.
Background
As the demand for interconnection of things is becoming stronger and more rapid, a large amount of traffic is being transferred instantaneously between different sites, which puts increasing demands on the switching capacity of the switching devices in the network. The centralized switching equipment based on the field of OTN, PTN, IP (Internet Protocol ) mainly realizes high-speed interconnection between each service board and the switch board through backplane routing.
However, when the optical backplane technology is used to realize the high-speed interconnection of the centralized cross equipment at present, the high-speed optical signal interconnection is realized through a large optical backplane, for example, an optical waveguide board is used as the optical backplane, and a line card or a switch card is vertically connected with the optical backplane through a 90-degree reflector installed on the optical backplane, but the reflector is inconvenient to install, has large insertion loss, and is not beneficial to the realization of the large-capacity optical backplane.
In view of this, the optical backplane interconnection system and communication device of CN101882955A requires that the service board and the switch card are orthogonal in front and back, and directly connected through the waveguide connector, so that no optical signal is transmitted on the backplane. The backplane design is simple, but in a large-capacity subrack, the switch card behind the design requirement is too long, and the switch card needs to be covered from the low end to the top end of the subrack, which undoubtedly increases the design difficulty of the switch card and the difficulty of production and installation.
An Optical back plane for use with a communication and method of operation thermally, which is disclosed in US6823100B1, establishes a transceiving link based on a 3D (three dimensional) MEMS (micro electro Mechanical System) mirror by an angle-adjustable incidence mirror, a main mirror, and a mirror mounted on a chassis door, and realizes free space Optical interconnection. The optical interconnection realized by the optical backplane technology is unstable, and especially in a large-capacity cross subrack, thousands of optical interconnection lines are arranged, and the technology is difficult to realize stable optical interconnection.
Disclosure of Invention
The invention provides an optical backplane subframe device for solving the problems, which overcomes the defects that the optical insertion loss is large due to 90-degree optical signal turning required when the optical backplane is connected and the optical switch card is overlarge due to the fact that a line card and the switch card are directly connected in a vertical cross optical mode in the prior art.
In order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows:
an optical backplane subrack apparatus comprising: the optical backplane comprises a plurality of layers of subracks and P optical backplanes, wherein each layer of subrack comprises M exchange cards and L line cards, each exchange card comprises one or more optical connectors or optical connectors and electrical connectors, and each line card comprises one or more optical connectors or optical connectors and electrical connectors; each optical backplane comprises one or more optical connectors on both sides; connecting the M exchange cards of each layer with all the line cards of different layers through the optical connectors on the P optical backplanes, so that at least one optical connection channel is formed between all the optical connectors corresponding to the line cards of the subracks of different layers and all the optical connectors corresponding to the exchange cards; and the number of the first and second electrodes,
connecting the M exchange cards and the L line cards of each layer through the optical connectors on the P optical backplanes, the exchange cards and the optical connectors on the line cards, so that at least one optical connection channel is formed between all the optical connectors corresponding to the line cards of the same layer of the subrack and all the optical connectors corresponding to the exchange cards; or, the M switch cards and the L line cards in each layer are connected through the optical connectors or the electrical connectors on the switch cards and the optical connectors or the electrical connectors on the line cards, so that at least one optical connector channel or electrical connection channel exists between all the optical connectors or the electrical connectors corresponding to the line cards in the same layer of the subrack and all the optical connectors or the electrical connectors corresponding to the switch cards; wherein M, N, P is a positive integer.
Preferably, the number P of the optical backplanes is equal to the number M of switch cards per layer.
Preferably, all optical connectors corresponding to the line cards in the same layer of the subrack are connected with all optical connectors corresponding to the switch card.
Preferably, the M switch cards are vertically inserted into each layer of the subrack, and the L line cards are transversely inserted into each layer of the subrack.
Preferably, the optical connectors on each optical backplane are divided into the same number of layers as the subrack, the optical backplane connects L line cards of the current layer of the subrack via the optical connectors of each layer, and connects the switch cards of the current layer of the subrack via the optical connectors of each layer.
Preferably, the optical connector of each connection line card on the optical backplane is connected with the optical connector of all the layer-connected switch cards, or the optical connectors of the connection line cards at different layers on the optical backplane are connected with the optical connector of the connection switch card.
Preferably, the optical backplane comprises a fiber-optic flexible-board optical backplane and an optical waveguide optical backplane, and the optical connector comprises: the mechanical transfer MT optical fiber connector and/or the multi-core multi-channel plug-pull MPO optical fiber connector.
Preferably, the optical backplane and the line card are directly connected through a board edge, and the optical backplane and the switch card are connected through a board edge or the board edge of the optical backplane is connected into a board of the switch card.
Preferably, one line card is connected with the switch cards in the same column of all layers through an optical connector of one optical backplane; or one line card is connected with the exchange cards in the same column of all layers through the optical connector of the optical backplane and the electric connector or optical connector at the edge of the optical backplane; moreover, one line card is connected with all the exchange cards of all the layers through the optical connectors of all the optical backplanes; or one line card is connected with all the exchange cards of all the layers through the optical connectors of all the optical backplanes and the electric connectors or the optical connectors at the edges of the boards.
Preferably, one switch card is connected with the line cards of all layers through an optical connector of the optical backplane; or one line card is connected with the line cards of all layers through the optical connector of one optical backplane and the electric connector or optical connector at the edge of the optical backplane.
Compared with the prior art, the invention has the following beneficial effects:
the optical back plate sub-frame device of the invention is characterized in that one side of the sub-frame is provided with one layer or a plurality of layers of vertically inserted exchange cards, the optical back plate and the exchange cards are overlapped in parallel or are directly connected, the other side of the sub-frame is provided with all transversely inserted line cards, the same layer links of the line cards and the exchange cards are directly connected or the optical back plate is connected through an electric connector or an optical connector, the different layer links of the line cards and the exchange cards are connected through the optical back plate, the optical back plate is used for connecting the line cards and the exchange cards, at least one connecting channel is arranged between all the line cards and all the exchange cards, the data scheduling between any line card is realized, the high capacity of the sub-frame system can be realized, the integration level of the system can be improved, the capacity of the line cards and the exchange cards is not limited by the interconnection interface, and the effect of saving the depth of the sub-frame can be achieved, the convenience of optical signal connection is improved, the cost of the system can be reduced, and convenience is provided for the design of heat dissipation and the like of the system.
Drawings
Figure 1 is a diagram of signal connections between line cards and switch cards according to an embodiment of the present invention;
FIG. 2 is a perspective view of the inside of a subrack in embodiment 1 of the present invention;
fig. 3 is a schematic design diagram of front and rear sub-rack panels, optical backplanes, line cards, and switch cards according to embodiment 1 of the present invention;
FIG. 4 is a perspective view of the inside of a subrack in embodiment 2 of the present invention;
fig. 5 is a schematic design diagram of front and rear sub-chassis panels, optical backplanes, line cards, and switch cards according to embodiment 2 of the present invention;
FIG. 6 is a perspective view of the inside of a subrack in embodiment 3 of the present invention;
fig. 7 is a schematic design diagram of front and rear sub-rack panels, optical backplanes, line cards, and switch cards according to embodiment 3 of the present invention;
FIG. 8 is a perspective view of the inside of a subrack in embodiment 4 of the present invention;
fig. 9 is a schematic design diagram of front and rear sub-rack panels, optical backplanes, line cards, and switch cards according to embodiment 4 of the present invention;
FIG. 10 is a perspective view of the inside of a subrack in embodiment 5 of the present invention;
fig. 11 is a schematic design diagram of front and rear sub-chassis panels, optical backplanes, line cards, and switch cards according to embodiment 5 of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following description of the embodiments of the present invention with reference to the accompanying drawings is provided, and it should be noted that, in the case of conflict, features in the embodiments and the embodiments in the present application may be arbitrarily combined with each other.
As shown in fig. 1, an embodiment of the present invention provides an optical backplane subframe apparatus, including:
a multi-layer sub-frame and P optical back plates,
each layer of the sub-rack comprises M exchange cards and L line cards, each exchange card comprises one or more optical connectors or optical connectors and electrical connectors, and each line card comprises one or more optical connectors or optical connectors and electrical connectors; each optical backplane comprises one or more optical connectors on both sides;
connecting the M exchange cards of each layer with all the line cards of different layers through the optical connectors on the P optical backplanes, so that at least one optical connection channel is formed between all the optical connectors corresponding to the line cards of the subracks of different layers and all the optical connectors corresponding to the exchange cards; and the number of the first and second electrodes,
connecting the M exchange cards and the L line cards of each layer through the optical connectors on the P optical backplanes, the exchange cards and the optical connectors on the line cards, so that at least one optical connection channel is formed between all the optical connectors corresponding to the line cards of the same layer of the subrack and all the optical connectors corresponding to the exchange cards; or, the M switch cards and the L line cards in each layer are connected through the optical connectors or the electrical connectors on the switch cards and the optical connectors or the electrical connectors on the line cards, so that at least one optical connector channel or electrical connection channel exists between all the optical connectors or the electrical connectors corresponding to the line cards in the same layer of the subrack and all the optical connectors or the electrical connectors corresponding to the switch cards; wherein M, N, P is a positive integer.
In the embodiment of the present invention, M switch cards in each layer are connected to L line cards through the optical connectors on the P optical backplanes, so that at least one optical connection channel is formed between all the optical connectors corresponding to the line cards in the same layer of the subrack and all the optical connectors corresponding to the switch cards (or the M switch cards in each layer are connected to the L line cards through the optical connectors on the P optical backplanes, the optical connectors or the electrical connectors on the switch cards and the line cards, so that at least one electrical connection channel is formed between all the electrical connectors corresponding to the line cards in the same layer of the subrack and all the electrical connectors corresponding to the switch cards); and connecting the M switch cards and the L line cards of each layer through the optical connectors on the P optical backplanes, so that at least one optical connection channel is formed between all the optical connectors corresponding to the line cards of the different layers of the subracks and all the optical connectors corresponding to the switch cards, wherein M, N, P is a positive integer.
Fig. 1 is a diagram illustrating signal connections between line cards and switch cards according to an embodiment of the present invention. The line card splits the input service into multiple paths of signals, and the multiple paths of signals are respectively sent to each switch card, or the multiple paths of signals switched by each switch card are combined into one service to be output; the exchange card exchanges signals to a corresponding output line card according to a signal destination port sent by the input line card; the optical backplane realizes optical signal connection between the line card and the switch card.
The sub-frame is composed of one or more layers, the front surface is provided with a wire clip inserted horizontally, the back surface is provided with an exchange card inserted vertically, the optical backplane and the exchange card are overlapped in parallel or directly connected, and the number of the exchange cards in each layer is the same as that of the optical backplane. The line card, the switch card and the optical backplane are all provided with optical connectors, and the line card and the switch card realize optical connection through the optical backplane. Meanwhile, the line card and the switch card can also be provided with optical connectors to realize direct optical interconnection of the line card and the switch card on the same layer; or the line card and the switch card can also be provided with electric connectors to realize direct electric interconnection of the line card and the switch card on the same layer.
The number P of the optical backplanes is equal to the number M of the switch cards of each layer.
And all optical connectors corresponding to the line cards in the same layer of the subrack are connected with all optical connectors corresponding to the exchange card.
The M exchange cards are vertically inserted into each layer of the sub-frame, and the L line cards are transversely inserted into each layer of the sub-frame.
The optical connectors on each optical backplane are divided into the same number of layers as the subracks, the optical backplane is connected with L line cards on the current layer of the subrack through the optical connectors on each layer, and is connected with the exchange cards on the current layer of the subrack through the optical connectors on each layer.
Aiming at the layering of each optical backplane, the optical connectors on the optical backplane are divided according to the layer arrangement so as to connect the single boards in each layer.
The optical connectors of each connecting line card on the optical backplane are connected with the optical connectors of all the layer-connected switch cards, or the optical connectors of the connecting line cards on different layers on the optical backplane are connected with the optical connectors of the connected switch cards.
The optical backplane comprises a fiber-optic flexible printed circuit board optical backplane and an optical waveguide optical backplane, and the optical connector comprises: MT (Mechanical Transfer) fiber optic connectors and/or Multi-core Multi-fiber Push On (MPO) fiber optic connectors.
Preferably, the optical backplane and the line card are directly connected through a board edge, and the optical backplane and the switch card are connected through a board edge or the board edge of the optical backplane is connected into a board of the switch card.
One line card is connected with the exchange cards in the same column of all layers through an optical connector of an optical backplane; or one line card is connected with the exchange cards in the same column of all layers through the optical connector of the optical backplane and the electric connector or optical connector at the edge of the optical backplane; moreover, one line card is connected with all the exchange cards of all the layers through the optical connectors of all the optical backplanes; or one line card is connected with all the exchange cards of all the layers through the optical connectors of all the optical backplanes and the electric connectors or the optical connectors at the edges of the boards.
One exchange card is connected with the line cards of all layers through an optical connector of an optical backplane; or one line card is connected with the line cards of all layers through the optical connector of one optical backplane and the electric connector or optical connector at the edge of the optical backplane.
As shown in fig. 1, the optical backplane subframe apparatus provided in the embodiment of the present invention is mainly characterized as follows:
1) the sub-frame is divided into a front side and a back side or a back side, the two sides are inserted into the sub-frame and divided into N layers from top to bottom (N > is 1 and is an integer);
2) each layer of the back of the subrack is provided with a vertical exchange card, and each layer is provided with M exchange cards (M > -1, integer). The switching card is provided with one or more optical connectors (such as connectors of MT, MPO and the like) or electric connectors at the edge of the other side of the panel of the switching card, or one or more optical connectors (such as connectors of MT, MPO and the like) are arranged in the panel;
3) each layer in front of the subrack is all transversely inserted line cards, and each layer transversely inserts N line cards (N > ═ 1, integer). The board edge of the other side of the panel of the line card is provided with one or more optical connectors (such as connectors of MT, MPO and the like) or optical connectors (such as connectors of MT, MPO and the like) and electric connectors;
4) the sub-rack is internally provided with P optical backplanes, and the number P of the optical backplanes is equal to the number M of the exchange cards vertically inserted in each layer in the embodiment of the invention. The integrated height of the optical back plate is similar to that of all the service plates in the subrack, and the optical connectors on the optical back plate and the subrack are divided into the same number of layers; the optical backplane has several optical signal connectors (such as MT, MPO, etc.) at its two sides, one side of which is connected with all the line cards in front of the subrack through optical connectors, and the other side is connected with 1 exchange card in each layer of the same vertical direction at the back of the subrack through optical connectors.
5) Inside the optical backplane, the optical connectors on the side of the line card can be all cross-connected with the connectors on all layers on the side of the switch card (as shown in the optical backplane connection diagram in fig. 7); or the optical connectors of the same layer on the line card side and the optical connectors of the different layer on the switch card side are all cross-connected (as shown in the optical backplane connection diagram in fig. 3);
6) when the optical back plate and the exchange card are installed on the subrack, the optical back plate and the exchange card are in parallel overlapping or in the same direction and are directly connected;
7) the links of the line card and the exchange card in the same layer of the sub-rack are directly connected through the electric connector or the optical connector on the two board edges or connected through an optical back board;
8) and links of the line cards and the switch cards on different layers are connected through the optical backplane.
The optical back plate can be an optical back plate formed by an optical fiber soft plate or an optical back plate formed by optical waveguides, and comprises an optical port, or can be a small part which is formed by fixing the first two plates and a connector with optical fibers with a certain length on a structural member to realize the function of the optical back plate.
The method for link connection between the internal switch card of the sub-frame and the line card comprises the following steps:
(1) when only the optical backplane is interconnected between the line card and the switch card:
1) the optical connector of the exchange card can be arranged in the board, and the connection relationship between the optical backboard and the exchange card is parallel and overlapped; the optical connector of the exchange card can be arranged at the edge of the board, and the connection relationship between the optical backboard and the exchange card is directly connected in the same direction;
2) only the optical connector connected with the optical backplane is arranged on the line card;
3) in the optical backplane, at least one optical connection channel is arranged between all optical connectors on one side of the line card and all optical connectors on the same layer on one side of the exchange card;
(2) when an optical backplane and an electrical connector or an optical connector are arranged between the line card and the switch card:
1) the optical connector of the exchange card is arranged in the board, and the connection relationship between the optical backboard and the exchange card is parallel and overlapped; the exchange card is provided with an electric connector or an optical connector which is directly connected with the line card at the edge of the board;
2) the line card is provided with an optical connector connected with the optical backplane and a corresponding electric connector or optical connector directly connected with the edge of the exchange card;
3) in the optical backplane, at least one optical connection channel is arranged between all optical connectors of the same layer at one side of the line card and each layer of optical connectors of different layers at one side of the exchange card;
4) the links of the line card and the exchange card on the same layer are directly connected through an electric connector or an optical connector positioned at the edge of the board;
5) and links of the line cards and the switch cards on different layers are connected through the optical backplane.
The embodiment of the invention has the following beneficial effects:
1) the port integration of the optical backplane connector is high, one port can contain more than dozens of optical links, and the design of ports interconnected among single boards can be simplified;
2) the optical back plate and the exchange card are arranged in parallel in an overlapping mode, so that the depth space of the cabinet can be reduced, the space of a machine room can be saved, or the exchange capacity of the system can be increased in the same space;
3) the optical link has small loss and is insensitive to the speed of the transmitted optical signal, and the transmission of backboard signals with the speed of 25/28Gbps or above can be ensured;
4) the line card and the exchange card are arranged on different sub-frame equipment surfaces, and operation and maintenance personnel do not need to operate the surface where the exchange card is located when the line card and the exchange card work normally.
The following detailed description of the embodiments is made with reference to the accompanying drawings:
example 1:
the line cards and the exchange cards are connected through all light paths, the links at the same layer are directly connected through optical connection, and the links at different layers are connected through an optical backplane.
As shown in fig. 2, the sub-rack has one or more layers of vertically inserted switch cards on the back side, and all the transversely inserted line cards on the front side, the optical backplane and the switch cards are overlapped in parallel, the links at the same layer of the line cards and the switch cards are directly connected through optical connectors, and the links at different layers of the line cards and the switch cards are connected through the optical backplane.
In fig. 3, a is a sub-rack of 2 layers as an example, a is the front of the sub-rack, all horizontal plug-in cards, b is the back of the sub-rack, all vertical plug-in switch cards, wherein the dotted frame is an optical backplane installed inside the switch cards and overlapped with the switch cards in parallel, c is the optical backplane, d is a line card, and e is the switch cards. 32 line cards are respectively placed on the upper layer and the lower layer of the front surface of the sub-frame, 8 optical connectors are arranged on the line cards on the back plate side, 4 optical back plates are connected with 4 line cards, 4 exchange cards on the same layer are directly connected with the other line cards, and the optical connectors connected with the optical back plates and the optical connectors connected with the exchange cards are sequentially placed. The exchange card is provided with 2 rows of optical connectors, one row of the optical connectors is an optical connector of a direct connection line card positioned at the edge of the board, and the optical connectors are directly connected with each line card at the same layer of the exchange card, and the total number of the optical connectors is 32; one row is the optical connectors in the board that connect the optical backplane, which connects other line cards in different layers through the optical backplane, as shown in e in fig. 3, for a total of 16 optical connectors, each of which contains 2 times as many optical channels as the board edge optical connectors. And the optical backplane is also designed based on 2 layers, as shown in c in 3, the two sides of the optical backplane are respectively connected with the wire cards and the switch cards, optical signals on the optical connectors of the upper layer connecting wire cards are all connected to the optical connectors of the lower layer connecting switch cards, and optical signals on the optical connectors of the lower layer connecting wire cards are all connected to the optical connectors of the upper layer connecting switch cards. The optical backplane is approximately the entire height of the subrack and is mounted inside the switch card. When the optical backplane is installed, and then the switch card is inserted, so that the switch card and the optical backplane can be connected.
This design can reduce the number of optical channels on the optical backplane by half, and if the optical backplane is a 3-layer sub-rack, the number of optical channels of 1/3 can be reduced, which can simplify the design of the optical backplane and reduce the cost of the optical backplane.
Example 2:
the line cards and the switch cards are connected through an optical-electrical hybrid, the links of the same layer are directly connected through an electrical connector (black connector in fig. 4), and the links of the different layers are connected through an optical backplane (the optical connector is a white connector in fig. 4).
As shown in fig. 4, the back of the subrack is one or more layers of vertically inserted switch cards, the front is all the transversely inserted line cards, the optical backplane and the switch cards are overlapped in parallel, the links at the same layer of the line cards and the switch cards are directly connected through the electrical connectors, and the links at different layers of the line cards and the switch cards are connected through the optical backplane.
In fig. 5, taking a 2-layer subrack as an example, 32 line cards are respectively placed on the upper and lower layers of the front surface, and the line cards have 8 connectors on the backplane side, wherein 4 optical connectors are connected to 4 optical backplanes, 4 electrical connectors are connected to 4 switch cards, and the optical connectors connected to the optical backplanes and the electrical connectors connected to the switch cards are sequentially arranged. The exchange card is provided with 2 rows of connectors, one row is an electric connector of a direct connection line card positioned at the edge of the board and is directly connected with each line card at the same layer of the exchange card, and the other row is an optical connector positioned in the board and is connected with an optical backboard and is connected with other line cards at different layers through the optical backboard. The optical connectors on the optical backplane are also designed based on 2 layers, the two sides of the optical backplane are respectively connected with the line cards and the switch cards, optical signals on the optical connectors of the upper layer connecting line cards are all connected to the optical connectors of the lower layer connecting switch cards, and optical signals on the optical connectors of the lower layer connecting line cards are all connected to the optical connectors of the upper layer connecting switch cards. The optical backplane is the whole height of the subrack and is arranged inside the exchange card. When the optical backplane is installed, and then the switch card is inserted, so that the switch card and the optical backplane can be connected.
This design can reduce the number of optical channels on the optical backplane by half, and if the optical backplane is a 3-layer sub-rack, the number of optical channels of 1/3 can be reduced, which can simplify the design of the optical backplane and reduce the cost of the optical backplane. The line cards on the same layer are electrically connected with the switch card, so that data interaction at a certain speed can be ensured within a certain distance.
Example 3:
the line card and the switch card are all connected through an optical backplane in an optical path mode, and the optical backplane is overlapped with the switch card.
As shown in fig. 6, the sub-rack has one or more layers of vertically inserted switch cards on the back side, and all the transversely inserted line cards on the front side, the optical backplane and the switch cards are overlapped in parallel, and the links of the layer and different layers of the line cards and the switch cards are all connected through the optical backplane.
In fig. 7, taking a 2-layer subrack as an example, 32 line cards are respectively placed on the upper layer and the lower layer of the front surface, and the line cards have 4 optical connectors on the backplane side, and the 4 optical connectors are connected with 4 optical backplanes. There are 1 row of connectors on the switch card, this row being the optical connectors in the board that connect the optical backplane, which connects the line cards of all layers through the optical backplane. The optical backplane is also designed based on 2 layers, the two sides of the optical backplane are respectively connected with the line cards and the switch cards, and optical signals on the optical connectors of the line cards connected with the upper layer are connected with the optical connectors of the switch cards connected with the lower layer. The optical backplane is the whole height of the subrack and is arranged inside the exchange card. When the optical backplane is installed, and then the switch card is inserted, so that the switch card and the optical backplane can be connected.
Example 4:
the line card and the switch card are all connected through an optical backplane in an optical path, and the optical backplane is directly connected with the switch card.
As shown in fig. 8, the sub-rack has one or more layers of vertically inserted switch cards on the back side, and all the transversely inserted line cards on the front side, the optical backplane is directly connected with the switch cards, and the links of the layer and different layers of the line cards and the switch cards are all connected through the optical backplane.
In fig. 9, taking a 2-layer subrack as an example, 32 line cards are respectively placed on the upper layer and the lower layer of the front surface, and the line cards have 4 optical connectors on the backplane side, and the 4 optical connectors are connected with 4 optical backplanes. There are 1 row of connectors on the switch card, this row being the optical connectors at the edge of the board that connect to the optical backplane, which connects to other line cards in different layers through the optical backplane. The optical backplane is also designed based on 2 layers, the two sides of the optical backplane are respectively connected with the line cards and the switch cards, and optical signals on the optical connectors of the line cards connected with the upper layer are connected with the optical connectors of the switch cards connected with the lower layer. The optical backplane is the whole height of the subrack and is arranged inside the exchange card. When the optical backplane is installed, and then the switch card is inserted, so that the switch card and the optical backplane can be connected.
Example 5:
the line cards and the switch cards are all connected through an optical backplane in an optical path, the optical backplane is overlapped with the switch cards, and only one layer of the switch cards is provided.
As shown in fig. 10, the sub-rack has a layer of vertically inserted switch cards on the back side and all horizontally inserted line cards on the front side, the optical backplane and the switch cards are overlapped in parallel, and the links of the line cards and the switch cards are all connected through the optical backplane.
In fig. 11, 64 line cards are placed on the front side, and the line cards have 4 optical connectors on the backplane side, and the 4 optical connectors are connected with 4 optical backplanes. There are 1 row of connectors on the switch card, this row being the optical connectors located in the board that connect to the optical backplane, which connects all the line cards through the optical backplane. The optical backplane is also designed based on 1 layer, optical connectors on two sides of the optical backplane are respectively connected with the line cards and the switch cards, and optical links between the connectors on two sides are directly point-to-point interconnected. The optical backplane is the entire height of the subrack and is mounted inside the switch card, and the switch card can design the size and height of the backplane according to the capacity to be switched without being the entire subrack height. When the optical backplane is installed, and then the switch card is inserted, so that the switch card and the optical backplane can be connected. Thus, the connection of the optical path can be ensured, and the design difficulty and the manufacturing difficulty of the optical exchange plate can be reduced.
Although the embodiments of the present invention have been described above, the contents thereof are merely embodiments adopted to facilitate understanding of the technical aspects of the present invention, and are not intended to limit the present invention. It will be apparent to persons skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. An optical backplane subrack apparatus, comprising: the optical backplane comprises a plurality of layers of subracks and P optical backplanes, wherein each layer of subrack comprises M exchange cards and L line cards, each exchange card comprises one or more optical connectors or optical connectors and electrical connectors, and each line card comprises one or more optical connectors or optical connectors and electrical connectors; each optical backplane comprises one or more optical connectors on both sides; connecting the M exchange cards of each layer with all the line cards of different layers through the optical connectors on the P optical backplanes, so that at least one optical connection channel is formed between all the optical connectors corresponding to the line cards of the subracks of different layers and all the optical connectors corresponding to the exchange cards; and the number of the first and second electrodes,
connecting the M exchange cards and the L line cards of each layer through the optical connectors on the P optical backplanes, the exchange cards and the optical connectors on the line cards, so that at least one optical connection channel is formed between all the optical connectors corresponding to the line cards of the same layer of the subrack and all the optical connectors corresponding to the exchange cards; or, the M switch cards and the L line cards in each layer are connected through the optical connectors or the electrical connectors on the switch cards and the optical connectors or the electrical connectors on the line cards, so that at least one optical connector channel or electrical connection channel exists between all the optical connectors or the electrical connectors corresponding to the line cards in the same layer of the subrack and all the optical connectors or the electrical connectors corresponding to the switch cards; wherein M, N, P is a positive integer;
the M exchange cards are vertically inserted into each layer of the sub-frame, the L line cards are transversely inserted into each layer of the sub-frame, and the optical backplane and the exchange cards are overlapped in parallel or are directly connected.
2. The apparatus of claim 1, wherein: the number P of the optical backplanes is equal to the number M of the switch cards of each layer.
3. The apparatus of claim 1, wherein: and all optical connectors corresponding to the line cards in the same layer of the subrack are connected with all optical connectors corresponding to the exchange card.
4. The apparatus of claim 2, wherein the optical connectors on each optical backplane are divided into the same number of layers as the subrack, and the optical backplane connects the L line cards of the current layer of the subrack via the optical connectors of each layer, and connects the switch cards of the current layer of the subrack via the optical connectors of each layer.
5. The apparatus of claim 1, wherein the optical connector of each of the link cards on the optical backplane is connected to the optical connector of all layer-connected switch cards, or wherein the optical connectors of the link cards on different layers on the optical backplane are connected to the optical connectors of the layer-connected switch cards.
6. The apparatus of claim 1, wherein: the optical backplane comprises a fiber-optic flexible printed circuit board optical backplane and an optical waveguide optical backplane, and the optical connector comprises: the mechanical transfer MT optical fiber connector and/or the multi-core multi-channel plug-pull MPO optical fiber connector.
7. The apparatus of claim 1, wherein: the optical backplane is directly connected with the line card through the board edge, and the optical backplane is connected with the exchange card through the board edge or the board edge of the optical backplane is connected into the board of the exchange card.
8. The apparatus of claim 1, wherein: one line card is connected with the exchange cards in the same column of all layers through an optical connector of an optical backplane; or one line card is connected with the exchange cards in the same column of all layers through the optical connector of the optical backplane and the electric connector or optical connector at the edge of the optical backplane; moreover, one line card is connected with all the exchange cards of all the layers through the optical connectors of all the optical backplanes; or one line card is connected with all the exchange cards of all the layers through the optical connectors of all the optical backplanes and the electric connectors or the optical connectors at the edges of the boards.
9. The apparatus of claim 1, wherein: one exchange card is connected with the line cards of all layers through an optical connector of an optical backplane; or one line card is connected with the line cards of all layers through the optical connector of one optical backplane and the electric connector or optical connector at the edge of the optical backplane.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610013330.3A CN106954102B (en) | 2016-01-06 | 2016-01-06 | Optical back plate sub-frame device |
| PCT/CN2017/070172 WO2017118388A1 (en) | 2016-01-06 | 2017-01-04 | Optical backplane sub-rack device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610013330.3A CN106954102B (en) | 2016-01-06 | 2016-01-06 | Optical back plate sub-frame device |
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| CN106954102A CN106954102A (en) | 2017-07-14 |
| CN106954102B true CN106954102B (en) | 2021-05-07 |
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| CN201610013330.3A Active CN106954102B (en) | 2016-01-06 | 2016-01-06 | Optical back plate sub-frame device |
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| WO (1) | WO2017118388A1 (en) |
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| US10841246B2 (en) * | 2017-08-30 | 2020-11-17 | Arista Networks, Inc. | Distributed core switching with orthogonal fabric card and line cards |
| CN109842445B (en) * | 2017-11-29 | 2021-02-05 | 华为技术有限公司 | Optical backplane system, switching system and upgrading method thereof |
| CN108427162B (en) * | 2018-05-18 | 2019-09-17 | 烽火通信科技股份有限公司 | Optical back plate interconnection system |
| CN111371496A (en) * | 2018-12-26 | 2020-07-03 | 中兴通讯股份有限公司 | Optical backplane system and electric signal transmission method |
| US10986423B2 (en) | 2019-04-11 | 2021-04-20 | Arista Networks, Inc. | Network device with compact chassis |
| CN110212953A (en) * | 2019-06-03 | 2019-09-06 | 南京濠暻通讯科技有限公司 | A kind of double-layer back plate structure |
| US11266007B2 (en) | 2019-09-18 | 2022-03-01 | Arista Networks, Inc. | Linecard system using riser printed circuit boards (PCBS) |
| CN113572531A (en) * | 2020-04-29 | 2021-10-29 | 中兴通讯股份有限公司 | Optical interconnection system |
| CN114079211B (en) * | 2020-08-13 | 2023-02-28 | 华为技术有限公司 | Communication device |
| CN112636083B (en) * | 2020-12-14 | 2022-03-29 | 中航光电科技股份有限公司 | Integrated connector and socket for differential, radio frequency and optical composite board |
| CN112670750B (en) * | 2020-12-14 | 2022-03-29 | 中航光电科技股份有限公司 | Photoelectric integrated link and implementation device thereof |
| CN116131929A (en) * | 2021-11-12 | 2023-05-16 | 华为技术有限公司 | Optical backboard switching method and optical communication equipment |
| CN117097400A (en) * | 2022-05-13 | 2023-11-21 | 华为技术有限公司 | Optical communication method and related device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6823100B1 (en) * | 2001-08-27 | 2004-11-23 | Incucomm, Inc. | Optical backplane for use with a communications equipment chassis and method of operation therefor |
| CN100550880C (en) * | 2006-11-30 | 2009-10-14 | 杭州华三通信技术有限公司 | The middle backboard of communication equipment |
| CN101882955B (en) * | 2010-04-26 | 2013-04-17 | 华为技术有限公司 | Optical back plate interconnection system and communication equipment |
| CN102809784B (en) * | 2011-06-02 | 2014-08-27 | 富士康(昆山)电脑接插件有限公司 | Light back plate assembly |
| CN102307142B (en) * | 2011-08-19 | 2018-08-17 | 南京中兴新软件有限责任公司 | Back board system |
| TW201423191A (en) * | 2012-12-14 | 2014-06-16 | Hon Hai Prec Ind Co Ltd | Optical backplane assembly |
| CN103901549A (en) * | 2012-12-28 | 2014-07-02 | 富士康(昆山)电脑接插件有限公司 | Light backboard assembly |
| CN104902352A (en) * | 2015-05-14 | 2015-09-09 | 烽火通信科技股份有限公司 | Large-capacity cluster equipment with multiple business frames and exchange frames |
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| WO2017118388A1 (en) | 2017-07-13 |
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