The Large Copacity cluster device of a kind of multi-service frame, exchange frame
Technical field
The present invention relates to the cluster switching equipment field in OTN (Optical Transport Network, optical transfer network) and the POTN communication technology, be specifically related to the Large Copacity cluster device of a kind of multi-service frame, exchange frame.
Background technology
At OTN, POTN communication technical field, the machine frame of communication equipment generally adopts a frame to the Multi-layer design on top, and by the restriction of frame dimensions, the design space that utilizes of communication equipment service board reaches the limit.Along with the quick growth of data service bandwidth demand, because the exchanges data capacity of separate unit communication equipment has arrived 20T+ (TB, 1TB=1024GB), therefore the density of communication equipment service board increases, power consumption increases, and then make the design of highdensity business board in the confined space very complicated and difficult, be not only communication equipment complete machine and power, to dispel the heat and noise reduction brings huge pressure, and be difficult to the demand meeting the larger exchanges data capacity of user.
Summary of the invention
For the defect existed in prior art, the object of the present invention is to provide the Large Copacity cluster device of a kind of multi-service frame, exchange frame, the present invention can not only realize unifying clog-free and dispatching tens T flexibly to thousands of T business, and be distributed in the power supply of business frame and exchange frame in different frame, heat radiation and noise reduction all relatively flexibly, easily, be convenient to people and use.
For reaching above object, the Large Copacity cluster device of multi-service frame provided by the invention, exchange frame, comprise some business frames and some exchange frames, each business frame and exchange frame include some interconnect devices, and it is interconnected that business frame and exchange frame realize signal by interconnect device;
Each business frame includes some business boards, and business board is for realizing the I/O of business, Business Processing, time slot or cell segmentation; Each exchange frame includes switching processor part, and switching processor part is divided into some exchange planes, and each exchange plane is divided into some I/O levels and exchanges board and some intergrades exchange board; The interconnect device of exchange frame is positioned at I/O level and exchanges on board.
On the basis of technique scheme, the interconnect device of described business frame and exchange frame includes some interconnection elements, 1 interconnection element of business frame and 1 interconnection element of exchange frame interconnected.
On the basis of technique scheme, all interconnection elements of described business frame concentrate the interconnection region being placed on business frame.
On the basis of technique scheme, all interconnection element dispersions of described business frame are placed on multiple interconnected board.
On the basis of technique scheme, described interconnection element selects Multi-channel electric connector, optical connector or Multipath parallel optical module.
On the basis of technique scheme, 1 interconnection element of described business frame adopts multicore cable to connect or multi-core fiber, and 1 of exchange frame interconnection element is interconnected.
On the basis of technique scheme, the project organization of described business frame and exchange frame be one side 1 layer, one side 2 layers, one side 3 layers, two-sided 1 layer, two-sided 2 layers or two-sided 3 layers.
On the basis of technique scheme, described business board and interconnect device adopt electric backboard or light back board to be connected.
On the basis of technique scheme, the interconnected I/O level of described exchange frame exchanges board and adopts electric backboard or light back board to be connected with intergrade exchange board.
On the basis of technique scheme, described Large Copacity cluster device comprises 48 business frames and 36 exchange frames, business frame and exchange frame all adopt one side 1 Rotating fields, each business frame comprises 12 business boards and 4 interconnect devices, each business board comprises 2 time slots/cell segmentation device, each interconnect device comprises 18 interconnection elements, each time slot/cell segmentation device and 36 interconnection elements interconnected;
The switching processor part of each exchange frame is divided into 1 exchange plane, each exchange plane is divided into 8 I/O levels and exchanges board and 4 intergrades exchange boards, each I/O level exchanges board and 4 intergrades, and to exchange board interconnected, and it is interconnected that each intergrade exchange board and 8 I/O levels exchange board; Each I/O level exchanges board and is provided with 1 interconnect device, interconnect device comprises 12 interconnection elements, the interconnection element of all business frames and the interconnection element of all exchange frames are 3456, I/O level exchange 1 interconnection element on board and 1 interconnection element on business frame interconnected.
Compared with prior art, the invention has the advantages that:
(1) the present invention includes some business frames and exchange frame, some business frames and exchange frame according to the different demands of systems exchange capacity, can be carried out stacked combination by the present invention, and then are positioned in one or more frames by business frame and exchange frame; Under the prerequisite meeting interconnecting signal length requirement, business frame and exchange frame can be placed on different machine rooms, realize unifying clog-free and dispatching tens T flexibly to thousands of T business with this.Meanwhile, be distributed in the power supply of business frame and exchange frame in different frame, heat radiation and noise reduction all relatively flexibly, easily, be convenient to people and use.
(2) business frame of the present invention and exchange frame adopt single or multiple lift design, adopt single layer structure can solve multilayer machine frame heat cascade problem.More flexible.
Accompanying drawing explanation
Fig. 1 is the connection block diagram of the Large Copacity cluster device of multi-service frame, exchange frame in the embodiment of the present invention;
Fig. 2 is the structured flowchart of the exchange board of identical exchange plane in the embodiment of the present invention;
Fig. 3 concentrates the structured flowchart being positioned over the interconnection element of business frame in the embodiment of the present invention;
Fig. 4 is the structured flowchart that in the embodiment of the present invention, dispersion is positioned over the interconnection element of multiple interconnected board;
Fig. 5 be the Large Copacity cluster device of multi-service frame, exchange frame in the embodiment of the present invention realize theory diagram.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in further detail.
Shown in Figure 1, multi-service frame in the embodiment of the present invention, the Large Copacity cluster device of exchange frame, comprise some business frames and some exchange frames, each business frame and exchange frame include some interconnect devices, and it is interconnected that business frame and exchange frame realize signal by interconnect device.
Without the signal interconnecting relation in direct physical between business frame, each business frame includes some business boards, and business board is for realizing the I/O of business, Business Processing, time slot or cell segmentation; Business board and interconnect device adopt electric backboard or light back board to be connected.
Each exchange frame includes switching processor part, and switching processor part is divided into some exchange planes, without the signal interconnecting relation in direct physical between different exchange plane.Each exchange plane adopts the model split of 3 grades of CLOS (switching network) to be that some I/O levels exchange board and some intergrades exchange board, and I/O level exchanges board and intergrade exchanges board for completing the nonblocking switching of time slot or cell.The interconnected I/O level of exchange frame exchanges board and adopts electric backboard or light back board to be connected with intergrade exchange board, and the interconnect device of exchange frame is positioned at I/O level and exchanges on board.
The capacity intersected due to cluster is different, therefore the exchange board quantity needed for each exchange plane is also same, shown in Figure 2, the exchange board of identical exchange plane must in same exchange frame, different exchange plane can design in same exchange frame, also can be placed in different exchange frames respectively.
The interconnect device of business frame and exchange frame includes some interconnection elements, and interconnection element can select Multi-channel electric connector, optical connector or Multipath parallel optical module (such as CXP optical module); According to the difference of interconnection element type, 1 interconnection element of business frame adopts multicore cable to connect or multi-core fiber, and 1 of exchange frame interconnection element is interconnected.Shown in Figure 3, all interconnection elements of business frame can concentrate the interconnection region being placed on business frame; Shown in Figure 4, all interconnection elements of business frame can also disperse to be placed on multiple interconnected board.
The number of business frame and exchange frame all >=1, in complete machine structure design, the project organization of business frame and exchange frame can select one side 1 layer, one side 2 layers, one side 3 layers, two-sided 1 layer, two-sided 2 layers or two-sided 3 layers.
Shown in Figure 5, when the present invention uses, business board can be placed one or more time slots/cell segmentation device, each time slot/cell segmentation device is minimum has 1 serdes (serializer/de-serializers) to be connected to each exchange plane (such as this time slot/cell segmentation device has N number of serdes, then attachable exchange plane is to the maximum N number of); The signal interleaving of time slot/cell segmentation device completes in business frame, corresponding N number of exchange plane, and the interconnection element in every business frame is the integral multiple of N, and in same exchange frame, every interconnection element needed for exchange plane is the integral multiple of business frame quantity.
Empirical tests draws, the present invention has been used successfully to OTN, POTN communication technical field, under 25Gbps backboard transmission rate, set up for realizing the limit that 50T+ has reached stand-alone device, after adopting the Large Copacity cluster device of multi-service frame of the present invention, exchange frame, by business frame and the exchange frame combination of varying number, the unified switching equipment of tens T to thousands of T exchange capacity can be realized.
Below, the Large Copacity cluster device of multi-service frame of the present invention, exchange frame is described by 1 embodiment.
Embodiment 1:
The Large Copacity cluster device of multi-service frame, exchange frame comprises 48 business frames and 36 exchange frames, business frame and exchange frame all adopt one side 1 Rotating fields, each business frame comprises 12 business boards and 4 interconnect devices, each business board comprises 2 time slots/cell segmentation device, each interconnect device comprises 18 interconnection elements, each time slot/cell segmentation device and 36 interconnection elements interconnected.
The switching processor part of each exchange frame is divided into 1 exchange plane, each exchange plane is divided into 8 I/O levels and exchanges board and 4 intergrades exchange boards, each I/O level exchanges board and 4 intergrades, and to exchange board interconnected, and it is interconnected that each intergrade exchange board and 8 I/O levels exchange board.Each I/O level exchanges board and is provided with 1 interconnect device, and interconnect device comprises 12 interconnection elements; The interconnection element of all business frames and the interconnection element of all exchange frames are 3456, I/O level exchange 1 interconnection element on board and 1 interconnection element on business frame interconnected.
The present invention is not limited to above-mentioned execution mode, and for those skilled in the art, under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications are also considered as within protection scope of the present invention.The content be not described in detail in this specification belongs to the known prior art of professional and technical personnel in the field.