CN106935515A - Lead frame and its manufacture method, the chip packaging method based on the lead frame - Google Patents
Lead frame and its manufacture method, the chip packaging method based on the lead frame Download PDFInfo
- Publication number
- CN106935515A CN106935515A CN201511010541.3A CN201511010541A CN106935515A CN 106935515 A CN106935515 A CN 106935515A CN 201511010541 A CN201511010541 A CN 201511010541A CN 106935515 A CN106935515 A CN 106935515A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- lead
- supporting plate
- metal
- framework supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 238000005516 engineering process Methods 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 7
- 210000003205 muscle Anatomy 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present invention discloses a kind of lead frame and its manufacture method, the chip packaging method based on the lead frame, and the lead frame manufacturing method includes：Framework supporting plate is provided；The galley will with multiple through holes is relatively fixed with the framework supporting plate, and the multiple through hole is arranged into predetermined pattern；Layer of metal is printed in the galley, it is metal filled that the through hole for being arranged into predetermined pattern is printed；The galley is removed, the metal in being filled into the through hole is left in the framework supporting plate, the lead metal frame of predetermined pattern is arranged into be formed in the framework supporting plate.So, lead metal frame is printed to framework supporting plate using galley, can the company's of saving muscle, such that it is able to improve the density of encapsulation, reduces cost.
Description
【Technical field】
The present invention relates to chip manufacturing field, more particularly to a kind of lead frame and its manufacture method, based on this
The chip packaging method of lead frame.
【Background technology】
The lead frame one of traditional QFN (Quad Flat No-lead Package, quad flat non-pin package)
As be made up of two parts, be respectively copper material and the back of the body pad pasting.Limited by copper material processing technology, product and product
Between must be supported by even muscle, a product can at most design two circle pins, the density and cost of encapsulation
It is greatly affected.
Fig. 1 is the schematic top plan view of the lead frame of existing QFN.Fig. 2 is the lead frame of existing QFN
Partial schematic sectional view.As shown in Figure 1, wherein the region of black is back of the body pad pasting 110, and white portion is
Lead metal frame, the lead metal frame includes island area 121, multiple pins 122 and connects muscle 123.It is described to draw
Line metal frame is made up of copper material processing technology, and due to there is even muscle 123, therefore the density and cost of encapsulation are received
To very big influence.
It is necessary to propose a kind of improved lead frame scheme to solve the above problems.
【The content of the invention】
An object of the present invention is to provide a kind of lead frame and its manufacture method, and it can improve encapsulation
Density, reduces cost.
The second object of the present invention is to provide a kind of chip packaging method based on the lead frame, and it can be with
Using packaging density is high, low cost lead frame carries out chip package.
To achieve the above object, according to an aspect of the present invention, the present invention provides a kind of lead frame manufacture
Method, it includes：Framework supporting plate is provided；To be there is the galley and the framework supporting plate of multiple through holes
It is relatively fixed, the multiple through hole is arranged into predetermined pattern；Layer of metal, institute are printed in the galley
State printed metal filled of through hole for being arranged into predetermined pattern；The galley is removed, in the framework branch
The metal being filled into the through hole is left on fagging, is arranged into the formation in the framework supporting plate pre-
Determine the lead metal frame of pattern.
Further, the through hole includes multiple pin through holes and island area through hole, described to be arranged into predetermined pattern
Lead metal frame include multiple pins and island area.
Further, the multiple pin is arranged into more than 2 circles.
Further, the framework supporting plate is steel plate, and the metal is silver.
According to another aspect of the present invention, the present invention provides a kind of lead frame, and it includes：Framework is supported
Plate and the lead metal frame for being arranged into predetermined pattern being formed in the framework supporting plate.The lead metal
Frame includes island area and multiple pins.
According to a further aspect of the invention, the present invention provides a kind of chip packaging method based on lead frame,
The lead frame includes framework supporting plate and the predetermined pattern that is arranged into being formed in the framework supporting plate
Lead metal frame, the lead metal frame includes island area and multiple pins, and the chip packaging method includes：
Chip is placed in the island area of the lead metal frame；Bonding line is connected to by the crystalline substance by bonding technology
On the weld pad of piece and the lead metal frame between corresponding pin；By plastic package die by the chip, key
Zygonema and lead metal frame plastic packaging, form plastic-sealed body；Remove the framework supporting plate；Cut the plastic-sealed body
To realize the separation of chip product.
Compared with prior art, in the present invention, lead metal frame is printed to framework using galley and is supported
On plate, so can the company's of saving muscle, such that it is able to improve the density of encapsulation, reduces cost.
【Brief description of the drawings】
Technical scheme in order to illustrate more clearly the embodiments of the present invention, below will be to needed for embodiment description
The accompanying drawing to be used is briefly described, it should be apparent that, drawings in the following description are only of the invention
Some embodiments, for those of ordinary skill in the art, without having to pay creative labor,
Other accompanying drawings can also be obtained according to these accompanying drawings.Wherein：
Fig. 1 is the schematic top plan view of the lead frame of existing QFN；
Fig. 2 is the partial schematic sectional view of the lead frame of existing QFN；
Fig. 3 is the manufacture method schematic flow sheet in one embodiment of the lead frame in the present invention；
Fig. 4 is lead frame in present invention dimensional structure diagram in one embodiment；
Fig. 5 is lead frame in present invention partial schematic sectional view in one embodiment.
【Specific embodiment】
It is of the invention describe in detail mainly by program, step, logical block, process or other symbolistic retouch
State the running for carrying out direct or indirect simulation technical solution of the present invention.It is the thorough explanation present invention, in the case where connecing
Many specific details are set forth in the description for coming.And without these specific details when, it is of the invention then may be still
It is capable of achieving.Technical staff in art is described using herein these and stated to its in art
His technical staff effectively introduces their work essence.In other words, it is the purpose of the present invention of avoiding confusion,
Because well known methods and procedures has been readily appreciated that, therefore they are not described in detail.
" one embodiment " or " embodiment " referred to herein refers to that may be included at least one realization side of the invention
Special characteristic, structure or characteristic in formula.Different places occur in this manual " in one embodiment "
Same embodiment is not referred both to, nor the single or selective reality mutually exclusive with other embodiment
Apply example.
Fig. 3 is the schematic flow sheet in one embodiment of manufacture method 300 of the lead frame in the present invention.
As shown in Figure 3, the manufacture method 300 of the lead frame comprises the following steps.
Step 310, there is provided a framework supporting plate.
Fig. 4 shows an example of the framework supporting plate 410.Specifically, the framework supporting plate 410
It can be steel plate.
Step 320, the galley will with multiple through holes is relatively fixed with the framework supporting plate 410, described
Multiple through holes are arranged into predetermined pattern.
The through hole runs through the galley, and the through hole for being arranged into predetermined pattern includes multiple pin through holes
With island area through hole, so as in the framework supporting plate 410 print predetermined pattern lead metal frame 420.
Step 330, prints layer of metal in the galley, and the through hole for being arranged into predetermined pattern is printed
That brushes is metal filled.The metal of printing can be silver or other metals that can be printed.
Step 340, removes the galley, is left in the framework supporting plate 410 and is filled into described leading to
Metal in hole, forms the lead metal frame for being arranged into predetermined pattern so in the framework supporting plate 410
420。
Fig. 4 is that the lead frame 400 obtained according to the manufacture of the manufacture method 300 of lead frame of the invention exists
Dimensional structure diagram in one embodiment；Fig. 5 is that the lead frame 400 in the present invention is implemented at one
Partial schematic sectional view in example.With reference to shown in Fig. 4 and Fig. 5, the lead frame 400 includes framework branch
Fagging 410 and the lead metal frame 420 for being arranged into predetermined pattern being formed in the framework supporting plate 410.
The lead metal frame 420 includes island area 421 and multiple pins 422.Due to the framework supporting plate 410
Support, can be arranged in the lead metal frame 420 in the absence of even muscle, therefore the multiple pin 422
Into more than 2 circles, such as 2 enclose, 3 circles or more circle.So, the density of encapsulation, reduces cost can be improved.
With framework supporting plate as carrier, framework supporting plate selects harder, on-deformable material to the present invention,
Lead metal frame is distributed in framework support plate surface, and the distribution of metal pins can be distributed many according to demand
Circle, it is not necessary to which extra support contacts product and product, pin and pin.Same die size, commonly
QFN frameworks, it is necessary to the package dimension of 10mm x 10mm, the lead frame manufactured using the present invention,
The encapsulation of 3 scheduling product can be designed, the package dimension of 8.2mm x 8.2mm, package area can reduce closely
30%.
The pin of lead metal frame can make arbitrary shape arbitrary size in the present invention.
According to another aspect of the present invention, the present invention provides a kind of chip package based on above-mentioned lead frame
Method.The chip packaging method comprises the following steps.
Step A, chip is placed in the island area 421 of the lead metal frame 420.
Step B, bonding line is connected to the weld pad and the lead metal frame of the chip by bonding technology
On 420 between corresponding pin 422.
Step C, by plastic package die by the chip, bonding line and lead metal frame plastic packaging, forms plastic-sealed body.
Step D, removes the framework supporting plate 410；
Step E, cut the plastic-sealed body to realize the separation of chip product.
So, when product separation is carried out, there is no metal to connect on Cutting Road, greatly reduce product cutting
When suffered stress, improve the service life of blade.
It is understood that, the chip is the semiconductor integrated circuit without encapsulation, the chip, core
Flake products or product are by the semiconductor integrated circuit after encapsulation.
Described above fully discloses specific embodiment of the invention.It is pointed out that being familiar with being somebody's turn to do
Any change that the technical staff in field is done to specific embodiment of the invention is all without departing from power of the invention
The scope of sharp claim.Correspondingly, the scope of claim of the invention is also not limited only to foregoing tool
Body implementation method.
Claims (8)
1. a kind of lead frame manufacturing method, it is characterised in that it includes：
Framework supporting plate is provided；
The galley will with multiple through holes is relatively fixed with the framework supporting plate, the multiple through hole arrangement
Into predetermined pattern；
Layer of metal, the printed metal of the through hole for being arranged into predetermined pattern are printed in the galley
Filling；
The galley is removed, the metal in being filled into the through hole is left in the framework supporting plate,
The lead metal frame of predetermined pattern is arranged into be formed in the framework supporting plate.
2. lead frame manufacturing method according to claim 1, it is characterised in that：The through hole includes
Multiple pin through holes and island area through hole,
The lead metal frame for being arranged into predetermined pattern includes multiple pins and island area.
3. lead frame manufacturing method according to claim 2, it is characterised in that：The multiple pin
It is arranged into more than 2 circles.
4. lead frame manufacturing method according to claim 2, it is characterised in that：The framework support
Plate is steel plate.
5. lead frame manufacturing method according to claim 2, it is characterised in that：The metal is silver.
6. a kind of lead frame, it is by any described lead frame manufacturing method systems of claim 1-5
Make and form.
7. lead frame according to claim 6, it is characterised in that：It is QFN lead frames.
8. a kind of lead frame obtained based on any described lead frame manufacturing method of claim 2-5
Chip packaging method, it is characterised in that it includes：
Chip is placed in the island area of the lead metal frame；
Bonding line is connected on the weld pad of the chip and the lead metal frame accordingly by bonding technology
Between pin；
By plastic package die by the chip, bonding line and lead metal frame plastic packaging, plastic-sealed body is formed；
Remove the framework supporting plate；
The plastic-sealed body is cut to realize the separation of chip product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511010541.3A CN106935515A (en) | 2015-12-29 | 2015-12-29 | Lead frame and its manufacture method, the chip packaging method based on the lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511010541.3A CN106935515A (en) | 2015-12-29 | 2015-12-29 | Lead frame and its manufacture method, the chip packaging method based on the lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106935515A true CN106935515A (en) | 2017-07-07 |
Family
ID=59457636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511010541.3A Pending CN106935515A (en) | 2015-12-29 | 2015-12-29 | Lead frame and its manufacture method, the chip packaging method based on the lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106935515A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1992252A (en) * | 2004-08-09 | 2007-07-04 | 江苏长电科技股份有限公司 | Lead frame for integrated circuit or discrete components ultra-thin non-pin packing |
| CN101095220A (en) * | 2004-12-28 | 2007-12-26 | Ask股份有限公司 | Double-sided electronic module for hybrid smart card |
| CN101308830A (en) * | 2007-05-18 | 2008-11-19 | 飞思卡尔半导体（中国）有限公司 | Lead frame for semiconductor encapsulation |
| CN103650122A (en) * | 2011-05-13 | 2014-03-19 | 意法半导体股份有限公司 | Method and apparatus for manufacturing lead frames |
| CN104854695A (en) * | 2012-09-07 | 2015-08-19 | 联达科技控股有限公司 | Lead carrier with print-formed terminal pads |
-
2015
- 2015-12-29 CN CN201511010541.3A patent/CN106935515A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1992252A (en) * | 2004-08-09 | 2007-07-04 | 江苏长电科技股份有限公司 | Lead frame for integrated circuit or discrete components ultra-thin non-pin packing |
| CN101095220A (en) * | 2004-12-28 | 2007-12-26 | Ask股份有限公司 | Double-sided electronic module for hybrid smart card |
| CN101308830A (en) * | 2007-05-18 | 2008-11-19 | 飞思卡尔半导体（中国）有限公司 | Lead frame for semiconductor encapsulation |
| CN103650122A (en) * | 2011-05-13 | 2014-03-19 | 意法半导体股份有限公司 | Method and apparatus for manufacturing lead frames |
| CN104854695A (en) * | 2012-09-07 | 2015-08-19 | 联达科技控股有限公司 | Lead carrier with print-formed terminal pads |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170707 |
|
| RJ01 | Rejection of invention patent application after publication |