CN106879173A - A kind of printed circuit board processing method and printed circuit board - Google Patents
A kind of printed circuit board processing method and printed circuit board Download PDFInfo
- Publication number
- CN106879173A CN106879173A CN201710169860.1A CN201710169860A CN106879173A CN 106879173 A CN106879173 A CN 106879173A CN 201710169860 A CN201710169860 A CN 201710169860A CN 106879173 A CN106879173 A CN 106879173A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- pad
- predeterminable area
- ruggedized construction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The embodiment of the invention provides a kind of printed circuit board processing method and printed circuit board.The method includes：Processing printed circuit board, predeterminable area on a printed circuit board opens up via；Via is metallized, reinforced column is formed；Pad is formed in predeterminable area, wherein, pad is connected with reinforced column.It can easily be seen that in this programme, the possibility that this failure mode appearance is split in weld pad hole can be substantially reduced.In addition, when the printed circuit board processing method in using this programme is to process printed circuit board, the batch production of printed circuit board has obtained preferably ensureing that the processing cost of printed circuit board is relatively low.
Description
Technical field
The present invention relates to technical field of electronic equipment, more particularly to a kind of printed circuit board processing method and printed circuit
Plate.
Background technology
In technical field of electronic equipment, widely, electronic component can be by printing electricity for the application of printed circuit board
The pad formed on the plate of road is fixed on the printed circuit board.
With the extensive use of lead-free process, under the action of mechanical stress, printed circuit board is easy to weld pad hole occur
Split the phenomenon of (also referred to as Pad Cratering).It refers to phenomenon that pad splits away off from printed circuit board that weld pad hole is split.When
After appearance is split in weld pad hole, the normal work of electronic component or even whole printed circuit board can all be influenceed by very serious.
Therefore, how to be effectively reduced weld pad hole and split the possibility of this failure mode appearance for those skilled in the art
For be a problem demanding prompt solution.
The content of the invention
The purpose of the embodiment of the present invention is to provide a kind of printed circuit board processing method and printed circuit board, with effectively
Reduce weld pad hole and split the possibility that this failure mode occurs.
A kind of printed circuit board processing method is the embodiment of the invention provides, methods described includes：
Processing printed circuit board, the predeterminable area on the printed circuit board opens up via；
The via is metallized, reinforced column is formed；
Pad is formed in the predeterminable area, wherein, the pad is connected with the reinforced column.
In a kind of specific embodiment of the embodiment of the present invention, the processing printed circuit board, in the printed circuit
Predeterminable area on plate opens up via, including：
Processing printed circuit board, to cause that the printed circuit inner cord forms ruggedized construction；
Predeterminable area on the printed circuit board opens up via, wherein, the via extends to the ruggedized construction.
In a kind of specific embodiment of the embodiment of the present invention, the printed circuit inner cord, along it is described printing electricity
The top surface of road plate to the direction of bottom surface has been sequentially formed at least two ruggedized constructions；
The via extends to the farthest ruggedized construction of predeterminable area described in distance at least two ruggedized construction.
In a kind of specific embodiment of the embodiment of the present invention, the ruggedized construction is：Positioned at the printed circuit board
Internal layer metal structure.
In a kind of specific embodiment of the embodiment of the present invention, the via is located at the edge of the predeterminable area.
In a kind of specific embodiment of the embodiment of the present invention, the pad is for installing BGA BGA elements
SMD pad；
The via is located at the edge of the corner location of the predeterminable area.
In a kind of specific embodiment of the embodiment of the present invention, the via is metallized, including：
Using plating fill and lead up or cap bore by the way of, the via is metallized.
The embodiment of the present invention additionally provides a kind of printed circuit board, and the predeterminable area on the printed circuit board was offered
Hole, is formed with the reinforced column of metal in the via, the predeterminable area is formed with pad, and the pad connects with the reinforced column
Connect.
In a kind of specific embodiment of the embodiment of the present invention, the printed circuit inner cord is formed with ruggedized construction,
The via extends to the ruggedized construction.
In a kind of specific embodiment of the embodiment of the present invention, the printed circuit inner cord, along it is described printing electricity
The top surface of road plate to the direction of bottom surface has been sequentially formed at least two ruggedized constructions；
The via extends to the farthest ruggedized construction of predeterminable area described in distance at least two ruggedized construction.
In this programme, because pad is connected with reinforced column, therefore metal/metal knot is there is between pad and printed circuit board
Conjunction face, and the faying face between pad and printed circuit board is entirely metal/metal faying face in the prior art.It is readily appreciated that
It is that the bond strength of metal/metal faying face is greater than the bond strength of nonmetallic/metal faying face, therefore, in this programme,
Bond strength between pad and printed circuit board can be greatly increased.In addition, be formed with reinforced column in via, by pad with plus
Gu the combination between post, when pad is subject to mechanical impact load, the effect of part impact goes to the resinous wood of printed circuit board
Matter part (generally insulating barrier of printed circuit board etc.), enables reinforced column effectively to resist the mechanical impact load, reduces
The shock loading that pad is directly subject to, phenomenon is split so as to avoid pad from weld pad hole occur in the presence of impact.In addition, work as adopting
Processed during printed circuit board with the printed circuit board processing method in this programme, due to the processing method and existing printing electricity
Road plate processing method is completely compatible, therefore the batch production of printed circuit board has obtained preferably ensureing, the processing of printed circuit board
Cost is relatively low.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
A kind of flow chart of printed circuit board processing method that Fig. 1 is provided by the embodiment of the present invention；
A kind of structural representation of printed circuit board that Fig. 2 is provided by the embodiment of the present invention；
Fig. 3 is the particular flow sheet of S101 in Fig. 1；
A kind of another structural representation of printed circuit board that Fig. 4 is provided by the embodiment of the present invention；
A kind of another structural representation of printed circuit board that Fig. 5 is provided by the embodiment of the present invention.
Corresponding relation between all parts title and respective drawings are marked in Fig. 2, Fig. 4 and Fig. 5 is：
13 pads；14 vias；15 ruggedized constructions.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
In general, having the various materials such as resin and glass in printed circuit board.In the prior art, operating personnel are worked as
Process on a printed circuit board after pad, the pad is specifically to be combined with the resin material part in printed circuit board
, correspondingly, the bond strength between the pad and printed circuit board is relatively low.When the pad is subject to mechanical impact load (for example
Along the pulling capacity in the direction away from printed circuit board) when, the mechanical shock that the pad is subject to the faying face of printed circuit board
Load can be than larger, correspondingly, and the phenomenon (i.e. splitting in weld pad hole) that the pad splits away off from printed circuit board is very easy to out
It is existing.
It is pointed out that printed circuit board is typically with what lead-free process was produced, in order to lead-free process phase
Matching, resin material in printed circuit board generally uses the phenolic resin based on phenyl ring, and this type resin is adopted
Become more crisp with printed circuit board can be caused.So, when pad is subject to mechanical impact load, the pad and printed circuit board
The impact strength that faying face bears will be bigger, and the possibility that Gu Handiankeng splits this failure mode appearance can be greatly increased.
The possibility that this failure mode occurs is split in order to be effectively reduced weld pad hole, one kind is the embodiment of the invention provides
Printed circuit board processing method and printed circuit board.
A kind of printed circuit board processing method for being provided the embodiment of the present invention first below is illustrated.
Referring to Fig. 1, a kind of flow chart of printed circuit board processing method that the embodiment of the present invention is provided is shown in figure.
As shown in figure 1, the method may include steps of：
S101, processes printed circuit board, and predeterminable area on a printed circuit board opens up via.
Wherein, the via can be blind hole or through hole.Specifically, the via can be that laser blind hole or machinery are blind
Hole, the quantity of the via can for one, two or more.
It should be noted that during printed circuit board is processed, operating personnel can prepare to form multiple individual layer printings
Circuit board, and in every layer of epigraph processing, and suppress multilayer printed circuit board to form one piece of print by the operation such as compressing
Circuit board processed.
S102, metallizes to via, forms reinforced column.
It should be noted that implementing for being metallized to via is various informative, citing introduction is carried out below.
In a kind of specific embodiment of the embodiment of the present invention, via is metallized, can included：
Using plating fill and lead up or cap bore by the way of, via is metallized.
It is easily understood that when being metallized to via using aforesaid way, after the completion of metallization operations, via will
Filled by metal material, correspondingly, the reinforced column formed in via is solid reinforced column.
Certainly, in addition to aforesaid way, during metallization operations, it is also possible to by modes such as chemical depositions, only
Layer of metal thin layer is formed in the inwall of via.So, after the completion of metallization operations, the reinforced column formed in via is hollow
Reinforced column.
No matter which kind of mode metallizes to via more than, and the metal material utilized in metallization processes can be with
It is copper material, certainly, the metal material utilized in metallization processes is not limited to copper material, specifically can be according to reality
Situation determines that this is no longer going to repeat them.
S103, pad is formed in predeterminable area, wherein, pad is connected with reinforced column.
Wherein, the pad that predeterminable area is formed can be SMD pad or other kinds of pad.
In general, being very easy to weld pad hole occur at the faying face of SMD pad and printed circuit board to split this failure
Form, so as to have influence on the normal work of the chip electronic element and whole printed circuit board being welded at the pad.Compare
For more SMD pad, although it is this also to occur that weld pad hole is split at the pad of remaining type and the faying face of printed circuit board
Failure mode, but, the likelihood ratio that this failure mode occurs is relatively low, therefore, this programme is primarily adapted for use in the SMD weldering of solution
Split in the weld pad hole occurred at disk and the faying face of printed circuit board.In view of this, in subsequent embodiment, with predeterminable area shape
Into pad to illustrate in case of SMD pad.
With reference to Fig. 2, this programme is described in detail.
As shown in Fig. 2 the top surface of printed circuit board have a predeterminable area, the predeterminable area for it is default, for being formed
The region of pad 13.
During specific implementation, operating personnel can first process printed circuit board, to complete interior tomographic image processing and be pressed into
Type etc. is operated.
Complete in tomographic image processing and it is compressing wait operate after, can be in the preset areas of printed circuit plate top surface
At domain, via 14 is opened up downwards by laser mode.After via 14 is opened up, can carry out needed for other figures are connected
The processing in hole.Next, operating personnel can metallize to via 14, for example carrying out plating to via fills and leads up, with mistake
Reinforced column is formed in hole 14.Afterwards, operating personnel can form pad 13 in the predeterminable area of printed circuit plate top surface, and make weldering
Disk 13 is connected with reinforced column.Finally, operating personnel can carry out top layer image processing and follow-up work flow.It is appreciated that
, the signal lead-out wire of pad 13 both can directly from the top layer extraction of printed circuit board, it is also possible to from printed circuit board
Internal layer is drawn.
Because pad 13 is connected with reinforced column, therefore metal/metal faying face is there is between pad 13 and printed circuit board,
And the faying face between pad 13 and printed circuit board is entirely metal/metal faying face in the prior art.It is easily understood that
The bond strength of metal/metal faying face is greater than the bond strength of nonmetallic/metal faying face, therefore, in this programme, pad
Bond strength between 13 and printed circuit board can be greatly increased.In addition, be formed with reinforced column in via 14, by pad 13 with
Combination between reinforced column, when pad 13 is subject to mechanical impact load, the effect of part impact goes to the tree of printed circuit board
Fat material part (generally insulating barrier of printed circuit board etc.), enables reinforced column effectively to resist the mechanical impact load,
The shock loading that pad 13 is directly subject to is reduced, phenomenon is split so as to avoid pad 13 from occurring weld pad hole in the presence of impact.
Therefore, when the faying face between pad 13 and printed circuit board is acted on by mechanical impact load, pad 13
The possibility split away off from printed circuit board can be substantially reduced, i.e., the possibility meeting that this failure mode occurs is split in weld pad hole
Substantially reduce.In addition, when the printed circuit board processing method in using this programme is to process printed circuit board, due to the processing
Method is completely compatible with existing printed circuit board processing method, therefore the batch production of printed circuit board has obtained preferably protecting
Card, the processing cost of printed circuit board is relatively low.
In a kind of specific embodiment of the embodiment of the present invention, as shown in figure 3, S101, that is, process printed circuit board,
Predeterminable area on printed circuit board opens up via, can include：
S1011, processes printed circuit board, to cause that printed circuit board internal layer forms ruggedized construction.
S1012, predeterminable area on a printed circuit board opens up via, wherein, via extends to ruggedized construction.
It is easily understood that because via extends to ruggedized construction, therefore, when operating personnel metallize to via,
Formed after reinforced column, reinforced column can also be connected with the ruggedized construction.
It should be noted that ruggedized construction can be：Positioned at the metal structure of printed circuit inner cord.Specifically, the gold
Category structure can be disc-shaped structure or square structure etc..In a preferred embodiment, the material of the metal structure can be with
Material with the metal material utilized when being metallized to via is identical, for example, be copper material, so can be further
Increase the bond strength between reinforced column and ruggedized construction.
With reference to Fig. 4, the specific implementation process to the present embodiment is illustrated.
During S1011 is performed, can be in printed circuit inner cord, under printed circuit plate top surface predeterminable area
The region of side forms ruggedized construction 15.Specifically, ruggedized construction 15 can be electric attribute and the identical metal structure of pad 13.
Afterwards, when via 14 is opened up, via 14 can specifically extend to ruggedized construction 15.So, metallized to via 14,
After forming reinforced column, reinforced column will be connected with ruggedized construction 15.So, when the predeterminable area of printed circuit plate top surface forms weldering
Disk 13, and pad 13, when being subject to mechanical impact load, mechanical impact load can be transferred to where ruggedized construction 15 by reinforced column
Insulating barrier at, i.e., shared at the insulating barrier part impact, so, the possibility that pad 13 splits away off from printed circuit board
Property can be reduced further.
It can easily be seen that the present embodiment can further reduce weld pad hole splits the possibility that this failure mode occurs.
In a kind of specific embodiment of the embodiment of the present invention, printed circuit inner cord, the top along printed circuit board
The direction of face to bottom surface has been sequentially formed at least two ruggedized constructions；
Via extends to farthest apart from predeterminable area ruggedized construction at least two ruggedized constructions.
With reference to Fig. 5, the specific implementation process to the present embodiment is illustrated.
During S1011 is performed, can be in printed circuit inner cord, the predeterminable area positioned at printed circuit plate top surface
The region of lower section, at least two (such as three) ruggedized constructions 15 are formed along the direction shown in arrow A.Afterwards, opening up
During hole 14, via 14 can be with two nearer ruggedized constructions 15 of the predeterminable area of penetration distance printed circuit plate top surface, and finally
Extend to the ruggedized construction 15 farthest apart from the predeterminable area of printed circuit plate top surface.
So, metallized to via 14, form reinforced column, and predeterminable area in printed circuit plate top surface is formed
After pad 13, if pad 13 is acted on by mechanical impact load, the mechanical impact load can be transferred to by reinforced column
At the insulating barrier where three ruggedized constructions 15 difference shown in Fig. 5, i.e., part impact is shared at the insulating barrier, so,
The possibility that pad 13 splits away off from printed circuit board can be reduced further.
It can easily be seen that the present embodiment can further reduce weld pad hole splits the possibility that this failure mode occurs.
In a kind of specific embodiment of the embodiment of the present invention, via may be located at the edge of predeterminable area.Specifically,
When predeterminable area is rectangular area, via can be opened in the edge of the corner location of predeterminable area.It is preferable to carry out at one
In example, pad can be the SMD pad for installing BGA BGA elements, and via is located at the corner location of predeterminable area
Edge.
In general, the position for being used to install BGA elements corner on printed circuit board tends to form stress concentration, phase
Ying Di, these positions are very easy to occur weld pad hole and split this failure mode.Therefore, in the present embodiment, operating personnel can be with pin
To these positions, open up corresponding via and via is metallized, and then effectively reduce these positions and weld pad hole occur
Split the possibility of this failure mode.
To sum up, the present embodiment significantly reduces the possibility that this failure mode appearance is split in weld pad hole.
A kind of printed circuit board for being provided the embodiment of the present invention below is illustrated.
Referring to Fig. 2, a kind of structural representation of printed circuit board that the embodiment of the present invention is provided is shown in figure.As schemed
Shown in 2, the predeterminable area on printed circuit board offers via 14, and the reinforced column of metal, predeterminable area are formed with via 14
Pad 13 is formed with, pad 13 is connected with reinforced column.
Because pad 13 is connected with reinforced column, therefore metal/metal faying face is there is between pad 13 and printed circuit board,
And the faying face between pad 13 and printed circuit board is entirely metal/metal faying face in the prior art.It is easily understood that
The bond strength of metal/metal faying face is greater than the bond strength of nonmetallic/metal faying face, therefore, in this programme, pad
Bond strength between 13 and printed circuit board can be greatly increased.In addition, be formed with reinforced column in via 14, by pad 13 with
Combination between reinforced column, when pad 13 is subject to mechanical impact load, the effect of part impact goes to the tree of printed circuit board
Fat material part (generally insulating barrier of printed circuit board etc.), enables reinforced column effectively to resist the mechanical impact load,
The shock loading that pad 13 is directly subject to is reduced, phenomenon is split so as to avoid pad 13 from occurring weld pad hole in the presence of impact.
Therefore, when the faying face between pad 13 and printed circuit board is acted on by mechanical impact load, pad 13
The possibility split away off from printed circuit board can be substantially reduced, i.e., the possibility meeting that this failure mode occurs is split in weld pad hole
Substantially reduce.In addition, when the printed circuit board processing method in using this programme is to process printed circuit board, due to the processing
Method is completely compatible with existing printed circuit board processing method, therefore the batch production of printed circuit board has obtained preferably protecting
Card, the processing cost of printed circuit board is relatively low.
In a kind of specific embodiment of the embodiment of the present invention, as shown in figure 4, printed circuit inner cord is formed with reinforcing
Structure 15, via 14 extends to ruggedized construction 15.
In the present embodiment, when pad 13 is subject to mechanical impact load, mechanical impact load can be transferred to by reinforced column
At insulating barrier where ruggedized construction 15, i.e., part impact is shared at the insulating barrier, so, pad 13 is from printed circuit board
The possibility for splitting away off can be reduced further.
It can easily be seen that the present embodiment can further reduce weld pad hole splits the possibility that this failure mode occurs.
In a kind of specific embodiment of the embodiment of the present invention, as shown in figure 5, printed circuit inner cord, along printing
The top surface of circuit board to the direction of bottom surface has been sequentially formed at least two ruggedized constructions 15；
Via 14 extends to farthest apart from predeterminable area ruggedized construction 15 at least two ruggedized constructions 15.
It can easily be seen that the present embodiment can further reduce weld pad hole splits the possibility that this failure mode occurs.
To sum up, the present embodiment significantly reduces the possibility that this failure mode appearance is split in weld pad hole.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or deposited between operating
In any this actual relation or order.And, term " including ", "comprising" or its any other variant be intended to
Nonexcludability is included, so that process, method, article or equipment including a series of key elements not only will including those
Element, but also other key elements including being not expressly set out, or also include being this process, method, article or equipment
Intrinsic key element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that
Also there is other identical element in process, method, article or equipment including the key element.
Each embodiment in this specification is described by the way of correlation, identical similar portion between each embodiment
Divide mutually referring to what each embodiment was stressed is the difference with other embodiment.Especially for system reality
Apply for example, because it is substantially similar to embodiment of the method, so description is fairly simple, related part is referring to embodiment of the method
Part explanation.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the scope of the present invention.It is all
Any modification, equivalent substitution and improvements made within the spirit and principles in the present invention etc., are all contained in protection scope of the present invention
It is interior.
Claims (10)
1. a kind of printed circuit board processing method, it is characterised in that methods described includes：
Processing printed circuit board, the predeterminable area on the printed circuit board opens up via；
The via is metallized, reinforced column is formed；
Pad is formed in the predeterminable area, wherein, the pad is connected with the reinforced column.
2. method according to claim 1, it is characterised in that the processing printed circuit board, in the printed circuit board
On predeterminable area open up via, including：
Processing printed circuit board, to cause that the printed circuit inner cord forms ruggedized construction；
Predeterminable area on the printed circuit board opens up via, wherein, the via extends to the ruggedized construction.
3. method according to claim 2, it is characterised in that the printed circuit inner cord, along the printed circuit
The top surface of plate to the direction of bottom surface has been sequentially formed at least two ruggedized constructions；
The via extends to the farthest ruggedized construction of predeterminable area described in distance at least two ruggedized construction.
4. method according to claim 2, it is characterised in that the ruggedized construction is：Positioned at the printed circuit board
The metal structure of internal layer.
5. method according to claim 1, it is characterised in that the via is located at the edge of the predeterminable area.
6. method according to claim 5, it is characterised in that the pad is for installing BGA BGA elements
SMD pad；
The via is located at the edge of the corner location of the predeterminable area.
7. the method according to any one of claim 1-6, it is characterised in that metallized to the via, including：
Using plating fill and lead up or cap bore by the way of, the via is metallized.
8. a kind of printed circuit board, it is characterised in that the predeterminable area on the printed circuit board offers via, the via
In be formed with the reinforced column of metal, the predeterminable area is formed with pad, and the pad is connected with the reinforced column.
9. printed circuit board according to claim 8, it is characterised in that the printed circuit inner cord is formed with reinforcing knot
Structure, the via extends to the ruggedized construction.
10. printed circuit board according to claim 9, it is characterised in that the printed circuit inner cord, along the print
The top surface of circuit board processed to the direction of bottom surface has been sequentially formed at least two ruggedized constructions；
The via extends to the farthest ruggedized construction of predeterminable area described in distance at least two ruggedized construction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710169860.1A CN106879173A (en) | 2017-03-21 | 2017-03-21 | A kind of printed circuit board processing method and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710169860.1A CN106879173A (en) | 2017-03-21 | 2017-03-21 | A kind of printed circuit board processing method and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106879173A true CN106879173A (en) | 2017-06-20 |
Family
ID=59171818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710169860.1A Pending CN106879173A (en) | 2017-03-21 | 2017-03-21 | A kind of printed circuit board processing method and printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106879173A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801302A (en) * | 2017-11-28 | 2018-03-13 | 无锡市同步电子科技有限公司 | A kind of printed circuit board BGA package pad |
| CN110996508A (en) * | 2019-12-26 | 2020-04-10 | 新华三技术有限公司合肥分公司 | Circuit board, manufacturing method thereof and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1043922A1 (en) * | 1997-12-29 | 2000-10-11 | Ibiden Co., Ltd. | Multilayer printed wiring board |
| CN203015288U (en) * | 2012-12-26 | 2013-06-19 | 广东欧珀移动通信有限公司 | Anti-shedding structure for pad of electronic product |
| CN105792512A (en) * | 2016-03-31 | 2016-07-20 | 努比亚技术有限公司 | Pad reinforcing structure |
-
2017
- 2017-03-21 CN CN201710169860.1A patent/CN106879173A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1043922A1 (en) * | 1997-12-29 | 2000-10-11 | Ibiden Co., Ltd. | Multilayer printed wiring board |
| CN203015288U (en) * | 2012-12-26 | 2013-06-19 | 广东欧珀移动通信有限公司 | Anti-shedding structure for pad of electronic product |
| CN105792512A (en) * | 2016-03-31 | 2016-07-20 | 努比亚技术有限公司 | Pad reinforcing structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801302A (en) * | 2017-11-28 | 2018-03-13 | 无锡市同步电子科技有限公司 | A kind of printed circuit board BGA package pad |
| CN110996508A (en) * | 2019-12-26 | 2020-04-10 | 新华三技术有限公司合肥分公司 | Circuit board, manufacturing method thereof and electronic equipment |
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