CN105792512A - Pad reinforcing structure - Google Patents
Pad reinforcing structure Download PDFInfo
- Publication number
- CN105792512A CN105792512A CN201610197218.XA CN201610197218A CN105792512A CN 105792512 A CN105792512 A CN 105792512A CN 201610197218 A CN201610197218 A CN 201610197218A CN 105792512 A CN105792512 A CN 105792512A
- Authority
- CN
- China
- Prior art keywords
- pad
- pcb board
- metal
- ruggedized construction
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a pad reinforcing structure and belongs to the electronic technology field. The pad reinforcing structure comprises a PCB provided with a multi-layer structure and a pad, wherein the pad is arranged at a surface layer of the PCB, a through hole is further comprised, the through hole passes through the pad and the PCB, and the metal of the pad and the metal of an insulation layer of the PCB are made to realize fusion through the through hole. According to the pad reinforcing structure, the metal of the pad and the metal of the insulation layer of the PCB are made to realize fusion through the through hole, the force bearing structure of the surface layer pad is reinforced, easy shedding is avoided, so the handset damage rate is reduced, and user experience is improved.
Description
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of pad ruggedized construction.
Background technology
Pad is the basic comprising unit of surface mount assembling, is used for constituting the welding disk pattern (landpattern) of circuit board, is the pad combination of various particular components type design.
Pad is only connected with the top layer of pcb board due to general, connecting motor, receiver etc. relatively greatly or when having the components and parts of vibration, it is easy to come off, the chance encountered in the process of taking is bigger, once come off, will result in whole mobile phone needs to reprocess, and adds the inconvenience and maintenance cost that make employment.
It is therefore desirable to provide a kind of pad ruggedized construction.
Summary of the invention
Present invention is primarily targeted at a kind of pad ruggedized construction of proposition, it is intended to solve the caducous problem of prior art pad.
For achieving the above object, a kind of pad ruggedized construction provided by the invention, including: it is provided with pcb board and the pad of multiple structure: described pad is located at the top layer of described pcb board, it also includes via, described via through pad and described pcb board, makes the metal of described pad be merged by metal between insulating barrier on described via and described pcb board.
Thering is provided a kind of as above pad ruggedized construction, described via is blind hole, and its penetration depth at least arrives the metal level of the second layer of described pcb board.
Thering is provided a kind of pad ruggedized construction as above, described via is through hole.
Thering is provided a kind of pad ruggedized construction as above, the metal of the metal in described via and described pad is structure as a whole, and during by processing described via on described pad, metal melt is formed.
Thering is provided a kind of pad ruggedized construction as above, the material of the metal level of described pad and described pcb board is Copper Foil.
Thering is provided a kind of pad ruggedized construction as above, described pad is provided with multiple through hole, and the tin cream on described pad is combined by the described through hole base material with described pcb board surface.
Thering is provided a kind of pad ruggedized construction as above, the edge of described pad is provided with multiple gap structure, and the tin cream on described pad passes through the side of the described groove base material with described pcb board surface and is combined.
Thering is provided a kind of pad ruggedized construction as above, described groove is semicircle, triangle or trapezoidal.
Thering is provided a kind of pad ruggedized construction as above, described via is one or more.
Thering is provided a kind of pad ruggedized construction as above, when described via is multiple, it is uniformly distributed on described pad.
The pad ruggedized construction that the present invention proposes, it is provided through pad and the via of described pcb board, and the metal of pad is merged by metal between insulating barrier on described via and described pcb board, strengthen the force structure of top layer pad, even if therefore pad is when components and parts bigger for weld motor, air duct etc., also being not easy to come off, thus reducing the probability that mobile phone damages, improve Consumer's Experience.
Accompanying drawing explanation
Fig. 1 is the via of the pad ruggedized construction of the embodiment of the present invention is structural representation during blind hole；
Fig. 2 is the structural representation that via is through hole of the pad ruggedized construction of the embodiment of the present invention；
Fig. 3 is the structural representation of the edge shape of a kind of pad of the pad ruggedized construction of the embodiment of the present invention.
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Detailed description of the invention
Should be appreciated that specific embodiment described herein is only in order to explain the present invention, is not intended to limit the present invention.
The mobile terminal realizing each embodiment of the present invention is described referring now to accompanying drawing.In follow-up description, use the suffix being used for representing such as " module ", " parts " or " unit " of element only for being conducive to the explanation of the present invention, itself do not have specific meaning.Therefore, " module " and " parts " can mixedly use.
Printed circuit board (PCB) (PrintedCircuitBoard, PCB), is the thin plate being equipped with integrated circuit and other electronic building bricks.Printed circuit board (PCB), by circuit copper cash complicated between part and part, after careful neat planning, is etched on one piece of plank, it is provided that the electronic components main support body when installing with interconnection, is the indispensable fundamental parts of all electronic products.In practical application, pcb board is mainly used in computer, communication, consumer electronics field, as mobile phone terminal router carry-on WiFi equipment etc..
Can classify according to its circuit number of plies according to pcb board: be divided into single sided board, dual platen and multi-layer sheet.
Single sided board (Single-SidedBoards) is most basic pcb board, and part concentrates on wherein one side, and wire then concentrates on another side.Because wire is only present in wherein one side, so this PCB is called single sided board (Single-sided).Because single sided board has many strict restrictions (because only that one side, can not intersect between wiring and must around path alone) in designed lines, so only the circuit of early stage just uses this kind of plank.
There is a wiring on the two sides of dual platen (Double-SidedBoards) this circuit board, but with the wire on two sides, it is necessary to there is suitable circuit to connect between two sides." bridge " between this circuit is called guide hole (via).Guide hole is on PCB, is full of or the duck eye of coated with metal, and it can be connected with the wire on two sides.Because the area ratio single sided board of dual platen is big one times, and because wiring can intermesh (can around another side), it is more suitable for use on the circuit more more complicated than single sided board.
Multi-layer sheet (Multi-LayerBoards), in order to increase the area that can connect up, more single or two-sided wiring plate used by multi-layer sheet.With one piece two-sided make internal layer, two pieces of one sides make outer layer or two pieces two-sided make internal layer, two pieces of one sides make the printed substrate of outer layer, replaced together by alignment system and adhesive material and conductive pattern just becomes four layers, six-layer printed circuit board by the printed substrate that designing requirement is interconnected, also referred to as multilayer printed circuit board.Which floor independent wiring layer is the number of plies of plank just represent, and the usual number of plies is all even number, and comprises outermost two-layer.Most motherboard is all that the baroque multi-layer sheet of 4 to 8 layers is up to tens layers.
In order to electronic devices and components being fixed and being connected electrically on pcb board, it is common that mount Copper Foil on the base material of pcb board top layer as pad, on Copper Foil, then it is coated with tin cream, by tin cream, electronic devices and components is electrically connected and secured on PCB.
Based on above-mentioned mobile terminal hardware configuration and communication system, it is proposed to each embodiment of the inventive method.
First embodiment of the invention proposes a kind of pad ruggedized construction, pcb board and pad including being provided with multiple structure: described pad is located at the top layer of described pcb board, it also includes via, described via through pad and described pcb board, makes the metal of described pad be merged by metal between insulating barrier on described via and described pcb board.
In a preferred scheme, this via could be arranged to blind hole, and its penetration depth at least arrives the metal level of the second layer of described pcb board.
As it is shown in figure 1, via 101 is through pad 102 until the layers of copper 103 of the second layer of pcb board 10.
In practical application, the number of plies that via penetrates can adjust flexibly according to practical situation, it is possible to penetrates one or two layers or penetrates one or two three layers, etc..
In a preferred scheme, this via can also be through hole.
Inventor finds in the process realize the present invention, in prior art, it is that the Copper Foil forming pad only passes through extruding and pastes and adhere on PCB top layer that pad holds a caducous major reason, and the material of PCB top layer substrate is mostly isolation material such as epoxy resin, and the adhesive force between Copper Foil and isolation material is poor.Therefore, in the present embodiment, by the via 101 through pad 102 and pcb board 10 metal level, the metal level of the metal on pad 102 Yu pcb board is fused together, compensate for the problem that pad is poor with pcb board top layer adhesive force.
As in figure 2 it is shown, via 101 ' through pad 102 and breaks through pcb board 10.
In a preferred scheme, it is possible to arrange multiple through hole on pad, the tin cream on pad is combined by the described through hole base material with described pcb board surface.
In a preferred scheme, the metal of the metal in via and described pad is structure as a whole, and during by processing described via on described pad, metal melt is formed.
In practical application, it is possible to arrange multiple via, these vias can uniformly or be randomly distributed on pad.Owing to the metal of pad utilizes via to be connected with the metal level of pcb board, therefore, should be noted that do not destroy original circuit structure when application, say, that as long as via does not destroy original circuit structure, just can be configured according to actual needs.
It is understandable that, existence due to via, the metal level of pad metal and pcb board merges, so the via on pad is more many, the metal level that via penetrates is more many, pad is more firm, for needing the pad of the bigger components and parts such as weld motor, air duct, it is possible to suitably increase number of vias and cross hole depth, accordingly even when these components and parts shake, or collide with, it is also ensured that pad without departing from.
In a preferred scheme, it is possible to be provided with multiple groove 104 (as shown in Figure 3) at the edge of pad 102 ', the tin cream on pad 102 ' passes through the inwall of the described groove base material with described pcb board surface and is combined.
Compared with the pad of flush edge, the area of the pad edge sidewall being provided with gap structure adds, during spray tin cream, tin cream from the breach stream of pad edge to the base material on pcb board top layer, that is, tin cream bond area on pad adds, same reason, owing to breach is filled up by tin cream, the bond area of tin cream pcb board top layer base material too increases, combine closely with the side of pad and the PCB substrate of groove by tin cream, effectively raise the adhesive force of pad so that pad will not come off easily PCB substrate.
In practical application, the shape of gap structure can be arranged to semicircle, triangle, trapezoidal etc..From the longitudinal direction of gap structure, the area of different notch geometry sidewalls also has difference, it is generally the case that sidewall area is more big, and the adhesive force of tin cream is more big, and pad gets over difficult drop-off.Preferably, it is possible on the pad that marginal texture is arc, gap structure is set.
In a preferred scheme, the material of the metal level of pad and described pcb board is Copper Foil.
The pad ruggedized construction of the embodiment of the present invention, it is provided through pad and the via of described pcb board, and the metal between insulating barrier merges on metal in described via and described pad and described pcb board, strengthen the stress of top layer pad, even if therefore pad is when components and parts bigger for weld motor, air duct etc., also being not easy to come off, thus reducing the probability that mobile phone damages, improving Consumer's Experience.
It should be noted that, in this article, term " includes ", " comprising " or its any other variant are intended to comprising of nonexcludability, so that include the process of a series of key element, method, article or device not only include those key elements, but also include other key elements being not expressly set out, or also include the key element intrinsic for this process, method, article or device.When there is no more restriction, statement " including ... " key element limited, it is not excluded that there is also other identical element in including the process of this key element, method, article or device.
The invention described above embodiment sequence number, just to describing, does not represent the quality of embodiment.
These are only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the present invention and accompanying drawing content to make or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical fields, all in like manner include in the scope of patent protection of the present invention.
Claims (10)
1. a pad ruggedized construction, it is characterized in that, including: it is provided with pcb board and the pad of multiple structure: described pad is located at the top layer of described pcb board, it also includes via, described via through pad and described pcb board, makes the metal of described pad be merged by metal between insulating barrier on described via and described pcb board.
2. pad ruggedized construction as claimed in claim 1, it is characterised in that described via is blind hole, and its penetration depth at least arrives the metal level of the second layer of described pcb board.
3. pad ruggedized construction as claimed in claim 1, it is characterised in that described via is through hole.
4. the pad ruggedized construction as described in any one of claims 1 to 3, it is characterised in that the metal of the metal in described via and described pad is structure as a whole, during by processing described via on described pad, metal melt is formed.
5. pad ruggedized construction as claimed in claim 4, it is characterised in that the material of the metal level of described pad and described pcb board is Copper Foil.
6. pad ruggedized construction as claimed in claim 5, it is characterised in that described pad is provided with multiple through hole, and the tin cream on described pad is combined by the described through hole base material with described pcb board surface.
7. pad ruggedized construction as claimed in claim 5, it is characterised in that the edge of described pad is provided with multiple gap structure, the tin cream on described pad passes through the side of the described groove base material with described pcb board surface and is combined.
8. pad ruggedized construction as claimed in claim 5, it is characterised in that described groove is semicircle, triangle or trapezoidal.
9. pad ruggedized construction as claimed in claim 5, it is characterised in that described via is one or more.
10. pad ruggedized construction as claimed in claim 9, it is characterised in that when described via is multiple, it is uniformly distributed on described pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610197218.XA CN105792512A (en) | 2016-03-31 | 2016-03-31 | Pad reinforcing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610197218.XA CN105792512A (en) | 2016-03-31 | 2016-03-31 | Pad reinforcing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105792512A true CN105792512A (en) | 2016-07-20 |
Family
ID=56395427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610197218.XA Withdrawn CN105792512A (en) | 2016-03-31 | 2016-03-31 | Pad reinforcing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105792512A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106132082A (en) * | 2016-07-26 | 2016-11-16 | 胜宏科技（惠州）股份有限公司 | A kind of LED circuit board of side paster and preparation method thereof |
| CN106879173A (en) * | 2017-03-21 | 2017-06-20 | 新华三技术有限公司 | A kind of printed circuit board processing method and printed circuit board |
| CN107801302A (en) * | 2017-11-28 | 2018-03-13 | 无锡市同步电子科技有限公司 | A kind of printed circuit board BGA package pad |
| CN107979914A (en) * | 2017-10-23 | 2018-05-01 | 努比亚技术有限公司 | A kind of circuit board and terminal |
| CN110337177A (en) * | 2019-06-21 | 2019-10-15 | 广州金鹏源康精密电路股份有限公司 | It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust |
| CN110996508A (en) * | 2019-12-26 | 2020-04-10 | 新华三技术有限公司合肥分公司 | Circuit board, manufacturing method thereof and electronic equipment |
| CN111148355A (en) * | 2019-12-31 | 2020-05-12 | 生益电子股份有限公司 | Method for improving bonding force between copper layer and resin in back drilling area and PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1611099A (en) * | 2001-09-26 | 2005-04-27 | 英特尔公司 | Tombstoning structures and methods of manufacture |
| CN203015288U (en) * | 2012-12-26 | 2013-06-19 | 广东欧珀移动通信有限公司 | Anti-shedding structure for pad of electronic product |
| US20130323526A1 (en) * | 2012-05-29 | 2013-12-05 | Essence Solar Solutions Ltd. | Self aligning soldering |
-
2016
- 2016-03-31 CN CN201610197218.XA patent/CN105792512A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1611099A (en) * | 2001-09-26 | 2005-04-27 | 英特尔公司 | Tombstoning structures and methods of manufacture |
| US20130323526A1 (en) * | 2012-05-29 | 2013-12-05 | Essence Solar Solutions Ltd. | Self aligning soldering |
| CN203015288U (en) * | 2012-12-26 | 2013-06-19 | 广东欧珀移动通信有限公司 | Anti-shedding structure for pad of electronic product |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106132082A (en) * | 2016-07-26 | 2016-11-16 | 胜宏科技（惠州）股份有限公司 | A kind of LED circuit board of side paster and preparation method thereof |
| CN106879173A (en) * | 2017-03-21 | 2017-06-20 | 新华三技术有限公司 | A kind of printed circuit board processing method and printed circuit board |
| CN107979914A (en) * | 2017-10-23 | 2018-05-01 | 努比亚技术有限公司 | A kind of circuit board and terminal |
| CN107801302A (en) * | 2017-11-28 | 2018-03-13 | 无锡市同步电子科技有限公司 | A kind of printed circuit board BGA package pad |
| CN110337177A (en) * | 2019-06-21 | 2019-10-15 | 广州金鹏源康精密电路股份有限公司 | It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust |
| CN110996508A (en) * | 2019-12-26 | 2020-04-10 | 新华三技术有限公司合肥分公司 | Circuit board, manufacturing method thereof and electronic equipment |
| CN111148355A (en) * | 2019-12-31 | 2020-05-12 | 生益电子股份有限公司 | Method for improving bonding force between copper layer and resin in back drilling area and PCB |
| CN111148355B (en) * | 2019-12-31 | 2022-12-23 | 生益电子股份有限公司 | Method for improving bonding force between copper layer and resin in back drilling area and PCB |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105792512A (en) | Pad reinforcing structure | |
| CN102917533B (en) | Printed wiring board and method for designing thereof and a kind of final product of mainboard | |
| US8654542B2 (en) | High-frequency switch module | |
| US9465467B2 (en) | Flexible printed circuit board and touch panel including the same | |
| AU2020305430B2 (en) | Printed circuit board assembly and terminal | |
| US10182494B1 (en) | Landless via concept | |
| US9635752B2 (en) | Printed circuit board and electronic device | |
| US20040214466A1 (en) | Joint connector of printed circuit board and manufacturing method thereof | |
| JP4552524B2 (en) | Composite electronic components | |
| JPH11177247A (en) | Wiring board | |
| US9042116B2 (en) | Printed circuit board with daughterboard | |
| CN105101642B (en) | A kind of method and multi-layer PCB board for increasing multi-layer PCB board metal foil area | |
| US9098646B2 (en) | Printed circuit board design system and method | |
| CN204721708U (en) | A kind of two-layer printed circuit board of resistance to bending | |
| US8779298B2 (en) | Electronic circuit | |
| CN105578749A (en) | Circuit board connecting assembly and mobile terminal | |
| JP2019021863A (en) | Multilayer substrate | |
| US10251264B2 (en) | Membrane circuit structure with function expandability | |
| CN105376962A (en) | Method for improving circuit board structure | |
| CN111787690B (en) | circuit board | |
| CN104619112A (en) | Multi-circuit-layer circuit board | |
| US20090255723A1 (en) | Printed circuit board with ground grid | |
| CN104080268B (en) | A kind of pcb board | |
| TW201316847A (en) | Complex circuit board and the manufacturing method thereof | |
| CN105792511A (en) | Pad compatible structure and PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20160720 |
|
| WW01 | Invention patent application withdrawn after publication |