CN106833470A - Fluid sealant and preparation method thereof, application method - Google Patents
Fluid sealant and preparation method thereof, application method Download PDFInfo
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- CN106833470A CN106833470A CN201710102818.8A CN201710102818A CN106833470A CN 106833470 A CN106833470 A CN 106833470A CN 201710102818 A CN201710102818 A CN 201710102818A CN 106833470 A CN106833470 A CN 106833470A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K9/04—Ingredients treated with organic substances
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
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- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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Abstract
The present invention provides a kind of fluid sealant, and preparation method thereof and application method.Fluid sealant includes component A and B component, component A contains 10~30 parts of 60~90 parts of epoxy resin, 5~20 parts of the first diluent, 0.5~5.0 part of silane coupler, 0.5~5 part of hydrophobic type gas phase silica and/or modified sheeted alumina powder, and B component contains 40~60 parts of curing agent, 10~30 parts of the second diluent, 0.5~5 part of hydrophobic type gas phase silica, 20~50 parts of modified sheeted alumina powder；Or component A contains 10~30 parts of 60~90 parts of epoxy resin, 5~20 parts of the first diluent, 0.5~5.0 part of silane coupler, 0.5~5 part of hydrophobic type gas phase silica and modified sheeted alumina powder, B component contains 20~50 parts of 40~60 parts of curing agent, 10~30 parts of the second diluent, 0.5~5 part of hydrophobic type gas phase silica or modified sheeted alumina powder.
Description
Technical field
The present invention relates to fluid sealant technical field, more particularly to a kind of fluid sealant, the preparation method of the fluid sealant and use
Method.
Background technology
With developing rapidly for electronics industry, the application of fluid sealant is increasingly extensive, especially can be quickly solid in 10 minutes
The fluid sealant of change has huge advantage in terms of improve production efficiency.It is main in epoxy adhesive can be with polysulfide alcohols curing agent
It is solid at the beginning of realizing in 5 minutes, but due to not being esthetically acceptable to the consumers generally with strong odor.And fluid sealant hardening after just solid,
Following process cannot be carried out.
The content of the invention
It is a primary object of the present invention to provide a kind of fluid sealant, it is desirable to provide a kind of environmental protection, thixotropy are high, quick sluggish
Fluid sealant.
To achieve the above object, the fluid sealant that the present invention is provided includes component A and B component, by weight, the component A
Containing 60~90 parts of epoxy resin, 5~20 parts of the first diluent, 0.5~5.0 part of silane coupler, the component A is also containing thin
10~30 parts of 0.5~5 part of water type aerosil and/or modified sheeted alumina powder, the B component contain curing agent 40~
20~50 parts of 60 parts, 10~30 parts of the second diluent, 0.5~5 part of hydrophobic type gas phase silica and modified sheeted alumina powder；
Or by weight, the component A contains 60~90 parts of epoxy resin, 5~20 parts of the first diluent, silane coupler 0.5~5.0
10~30 parts of part, 0.5~5 part of hydrophobic type gas phase silica and modified sheeted alumina powder, the B component contains curing agent 40
~60 parts, 10~30 parts of the second diluent, the B component also contain 0.5~5 part or modified sheeted of hydrophobic type gas phase silica
20~50 parts of alumina powder.
Preferably, the hydrophobic type gas phase silica is using dimethyl silscone, dimethyldichlorosilane or hexamethyl
Dichlorosilane is modified the product after treatment to nano silicon, and the specific surface area of the hydrophobic type gas phase silica is more than
80m2/g。
Preferably, the modified sheeted alumina powder is using laurate, stearic acid, the acid of Pork and beans fringed pink and unrighted acid
At least one of to alumina powder be modified treatment after product.
Preferably, the crystalline phase of the modified sheeted alumina powder is α types, and diameter is less than 50 microns, and radius-thickness ratio is more than 10.
Preferably, the epoxy resin be selected from bisphenol A type epoxy resin, bisphenol f type epoxy resin, alicyclic ring epoxide resin,
At least one in tetraglycidel ether epoxy resin, polyurethane modified epoxy resin and modifying epoxy resin by organosilicon.
Preferably, first diluent is reactive diluent and/or non-activated thinner, and second diluent is non-
Reactive diluent.
Preferably, the silane coupler is selected from epoxy silane coupling, amino containing silane coupling agent and acryloxy
At least one in silane coupler.
Preferably, the curing agent is amine curing agent, and the amine curing agent is polyetheramine, fatty amine or aliphatic cyclic amine.
The present invention also provides a kind of preparation method of fluid sealant, and it is comprised the following steps：
By weight, mix 60~90 parts of epoxy resin, 5~20 part of first diluent, 0.5~5.0 part of silane coupler,
And 0.5~5 part of hydrophobic type gas phase silica and/or 10~30 parts of modified sheeted alumina powders, component A is obtained；Mixing 40~
60 parts of curing agent, 10~30 part of second diluent, 0.5~5 part of hydrophobic type gas phase silica and 20~50 parts of modified sheeted oxygen
Change aluminium powder, B component is obtained；Or
By weight, mix 60~90 parts of epoxy resin, 5~20 part of first diluent, 0.5~5.0 part of silane coupler,
0.5~5 part of hydrophobic type gas phase silica and 10~30 parts of modified sheeted alumina powders, are obtained component A；40~60 parts of mixing is solid
Agent, 10~30 part of second diluent and 0.5~5 part of hydrophobic type gas phase silica or 20~50 parts of modified sheeted aluminum oxide
Powder, is obtained B component.
The present invention also provides a kind of application method of the fluid sealant, mixes the component A and B component, wherein, the A
Component is 0.9~1.1 with the mass ratio of B component:1.
Compared with prior art, the present invention has the advantages that：Component A and B component all contain hydrophobic type gas phase two
Silica and/or modified sheeted alumina powder so that fluid sealant has high thixotropic.Specifically, hydrophobic type gas phase silica
Rheological behavior in epoxy systems is that viscosity recovery times are long after being sheared, and has after shearing and can keep a period of time preferably
Mobility, be easy to applying glue.Rheological behavior of the modified sheeted alumina powder in epoxy systems is that meeting is stood after being sheared rapidly
Recover high viscosity, make product that there is quick sluggish characteristic after applying glue.Two kinds of Application of composite of different rheological properties filler can be with
So that fluid sealant has is easy to applying glue and quick the characteristics of stagnate simultaneously, and can in adjusting knot thixotroping recovery time in certain limit,
Namely corresponding tune has tied the operational and sluggish time.When modified sheeted alumina powder ratio is less, fluid sealant mobility is improved, and is coagulated
The stagnant time is slightly longer；When aerosil content ratio is less, mobility reduction, the time of stagnating is very fast.It is logical that fluid sealant stagnates
What over recovery high viscosity was realized, it is and uncured, by external force shearing still can thixotroping, that is, mean can still to carry out subsequent operation as soaked/
Insertion part, so being different from rapid curing mode, has the advantages that processing can be continued.It also avoid fast curable epoxy simultaneously
The excitant taste of thiol so that the fluid sealant also has the advantages that environmental protection.
Specific embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, this area is general
The every other embodiment that logical technical staff is obtained under the premise of creative work is not made, belongs to present invention protection
Scope.
In addition, the technical scheme between each embodiment can be combined with each other, but must be with ordinary skill
Personnel can be implemented as basis, when the combination appearance of technical scheme is conflicting or cannot realize it will be understood that this technical side
The combination of case does not exist, not within the protection domain of application claims yet.
The present invention provides a kind of fluid sealant.
The fluid sealant includes component A and B component, and by weight, the component A contains 60~90 parts of epoxy resin, the
One 5~20 parts of diluent, 0.5~5.0 part of silane coupler, the component A also contain hydrophobic type gas phase silica 0.5~5
10~30 parts of part and/or modified sheeted alumina powder, the B component contain 40~60 parts of curing agent, the second diluent 10~30
20~50 parts of part, 0.5~5 part of hydrophobic type gas phase silica and modified sheeted alumina powder；Or by weight, the component A
Contain 60~90 parts of epoxy resin, 5~20 parts of the first diluent, 0.5~5.0 part of silane coupler, hydrophobic type gas phase titanium dioxide
10~30 parts of 0.5~5 part of silicon and modified sheeted alumina powder, the B component contain 40~60 parts of curing agent, the second diluent 10
~30 parts, the B component also contains 20~50 parts of 0.5~5 part of hydrophobic type gas phase silica or modified sheeted alumina powder.
The epoxy resin can play a part of gluing, encapsulating as the main body of the fluid sealant.
The silane coupler can occur chemical reaction and be connected with inorganic matter, while reacted with organic matter and connected
Connect, to increase the adhesion strength of the fluid sealant.
The curing agent can be such that the fluid sealant solidifies after use.
The epoxy resin of technical solution of the present invention as fluid sealant main body, silane coupler can simultaneously with organic matter and nothing
Machine thing reacts, so as to increase the adhesion strength of fluid sealant, component A is also containing hydrophobic type gas phase silica and/or modified sheeted
Alumina powder, the B component also contains hydrophobic type gas phase silica and/or modified sheeted alumina powder so that contain the A
The fluid sealant of component and B component has high thixotropic.Specifically, the hydrophobic type gas phase silica can make fluid sealant thixotroping extensive
The multiple time is elongated, it is ensured that the operability of fluid sealant, the modified sheeted alumina powder can make fluid sealant thixotroping recovery time accelerate,
Accelerate stagnating for the fluid sealant, have compared with low viscosity and flowing when appropriate Application of composite is caused the fluid sealant applying glue
Property, standing can stagnate in one minute preferably after applying glue, and can be reprocessed.Meanwhile, in the component A and B component
Each component does not have excitant taste and harmful substance so that the fluid sealant of the application component A and B component also has environmental protection
Advantage.
The hydrophobic type gas phase silica is using dimethyl silscone, dimethyldichlorosilane or hexamethyl dichloro silicon
Alkane is modified the product after treatment to nano silicon, and the specific surface area of the hydrophobic type gas phase silica is more than 80m2/
g。
The hydrophobic type gas phase silica of technical solution of the present invention be using dimethyl silscone, dimethyldichlorosilane or
Hexamethyl dichlorosilane is modified the product after treatment to nano silicon, with larger specific surface area and hydrophobic, makes
Hydrophobic type gas phase silica adjustable sealing glue mobility, and after making the fluid sealant applying glue, with high thixotropic.
The modified sheeted alumina powder be using laurate, stearic acid, Pork and beans fringed pink acid and unrighted acid at least
A kind of product being modified to alumina powder after treatment, the crystalline phase of the modified sheeted alumina powder is α types, and diameter is micro- less than 50
Rice, radius-thickness ratio is more than 10.
The modified sheeted alumina powder of technical solution of the present invention is using laurate, stearic acid, the acid of Pork and beans fringed pink and unsaturation
At least one of aliphatic acid is modified the product after treatment to alumina powder so that modified sheeted alumina powder can make fluid sealant
With preferably levelability, accelerate the sluggish speed of fluid sealant.
The epoxy resin is selected from bisphenol A type epoxy resin, bisphenol f type epoxy resin, alicyclic ring epoxide resin, glycidol
At least one in ether epoxy resin, polyurethane modified epoxy resin and modifying epoxy resin by organosilicon.Wherein, preferably ring
Bisphenol A type epoxy resin of the oxygen value between 0.41-0.54.
The epoxy resin of technical solution of the present invention can play gluing effect as the main body of fluid sealant.
First diluent is reactive diluent and/or non-activated thinner.Reactive diluent can be C12-14 alkyl
Monoglycidyl ether AGE, non-activated thinner is phenmethylol or nonyl phenol.Diluent is not limited to nonactive and/or active dilution
Agent, wherein preferably C12-14 alkyl monoglycidyl ether AGE.
The epoxy resin of technical solution of the present invention, silane coupler, hydrophobic type gas phase silica and modified sheeted oxidation
Aluminium powder can be equably dissolved in the first diluent.
Second diluent is non-activated thinner.Non-activated thinner is phenmethylol or nonyl phenol.
The curing agent of technical solution of the present invention, hydrophobic type gas phase silica and modified sheeted alumina powder can equably divide
Dissipate in the second diluent.
The silane coupler is selected from epoxy silane coupling, amino containing silane coupling agent and acryloxy silane idol
At least one in connection agent.Wherein, preferably 3- diglycidyl ether epoxies yl alkyl alkoxy silicon.
The silane coupler of technical solution of the present invention can play cementation, to strengthen the bond effect of fluid sealant.
The curing agent is the amine curing agents such as polyetheramine, fatty amine, aliphatic cyclic amine.
The amine curing agent is selected from, but not limited to, in modified amine of the molecular weight below 500, polyamide or polyetheramine etc.
One or more, preferably polyoxypropylene diamine D400.
The curing agent of technical solution of the present invention can upon mixing solidify component A and B component.
Additionally, known wetting dispersing agent usually used in fluid sealant industry, fire retardant, releasing agent, anti-ultraviolet ageing are neat
The additives such as U, pigment, filler, when needed, can be added in component A or B component in usual amounts.
The present invention also provides a kind of preparation method of fluid sealant, and it is comprised the following steps：
By weight, 60~90 parts of epoxy resin, 5~20 part of first diluent, 0.5~5.0 part of silicon are mixed at room temperature
Alkane coupling agent and 0.5~5 part of hydrophobic type gas phase silica and/or 10~30 parts of modified sheeted alumina powders, stir,
And deaeration treatment is carried out to it, component A is obtained；Mix at room temperature 40~60 parts of curing agent, 10~30 part of second diluent,
0.5~5 part of hydrophobic type gas phase silica and 20~50 parts of modified sheeted alumina powders, stir, and carry out deaeration to it
Treatment, is obtained B component；Or
By weight, 60~90 parts of epoxy resin, 5~20 part of first diluent, 0.5~5.0 part of silicon are mixed at room temperature
Alkane coupling agent, 0.5~5 part of hydrophobic type gas phase silica and 10~30 parts of modified sheeted alumina powders, stir, and to it
Deaeration treatment is carried out, component A is obtained；Mix 40~60 parts of curing agent, 10~30 part of second diluent and 0.5~5 at room temperature
Part hydrophobic type gas phase silica or 20~50 parts of modified sheeted alumina powders, stir, and carry out deaeration treatment to it, make
Obtain B component.
May be appreciated, it is necessary to carry out closed storage to component A and B component.
The deaeration treatment is carried out 5~15 minutes under the vacuum of -0.08~0.1Mpa.
The epoxy resin can play a part of gluing encapsulating as the main body of the fluid sealant.
The silane coupler can occur chemical reaction and be connected with inorganic matter, while reacted with organic matter and connected
Connect, to increase the adhesion strength of the fluid sealant.
The curing agent can be such that the fluid sealant solidifies after use.
The epoxy resin of technical solution of the present invention as fluid sealant main body, silane coupler can simultaneously with organic matter and nothing
Machine thing reacts, so as to increase the adhesion strength of fluid sealant, component A is also containing hydrophobic type gas phase silica and/or modified sheeted
Alumina powder, the B component also contains hydrophobic type gas phase silica and/or modified sheeted alumina powder so that contain the A
The fluid sealant of component and B component has high thixotropic.Specifically, the hydrophobic type gas phase silica can adjust the fluid sealant
Applying glue mobility, the modified sheeted alumina powder can increase the fluid sealant high-viscosity thixotropy of fast quick-recovery, reduce institute
State the sluggish time of fluid sealant, and can continue to be processed further after stagnating, meanwhile, each component in the component A and B component
Do not have excitant taste so that the fluid sealant of the application component A and B component also has the advantages that environmental protection.
Further, the preparation process is simple of the preparation method of fluid sealant of the invention, the non-stimulated gas in manufacturing process
Taste, fluid sealant mixing modest viscosity, good fluidity, using easy to operate；When in use, at room temperature after applying glue, fluid sealant is not
Can stagnate within 1~5 minute under the premise of stress, lower step process or immersion part can be continued；Meanwhile, fluid sealant can quickly be consolidated at room temperature
Change, without heating, it is not necessary to extra power consumption.
The present invention also provides the application method of above-mentioned fluid sealant, mixes the component A and B component, wherein, the A groups
It is 0.9~1.1 to divide with the mass ratio of B component:1, it is solid at the beginning of 1 hour without heating under room temperature (20~37 DEG C), after 24 hours
It is fully cured.
After the component A of the fluid sealant mixes with B component, modest viscosity (at a temperature of 25 DEG C, viscosity be 5000~
6500cp), non-stimulated smell.After extrusion levelling, can be stagnated in fast quick-recovery in 1~5 minute to viscosity high and do not flowed at room temperature
Dynamic state, improve production efficiency is applicable to the sealed enclosure of various requirement electronic technology product solidifying soon.
It should be understood that the need for can be according to actual production, be adjusted the presetting period of fluid sealant, the presetting period is not intended to limit
In 1~5 minute.Presetting period is preferably 2 minutes.
Shore hardness after sealing glue solidifying is 75~80.
Fluid sealant thixotropic index scope is 7~7.5@0.5rpm/5rpm.The thixotropic index is cone-plate tested viscosity method
In, the ratio of viscosity of the fluid sealant under the rotating speed of 0.5rpm and the viscosity under the rotating speed of 5rpm.
Fluid sealant of the invention can be applied in filling process.
Fluid sealant of the invention is applicable to the sealed enclosure of various requirement electronic technology product solidifying soon.
Embodiment one
Component A contains：E51 epoxy resin 70g, C12_14 alkyl monoglycidyl ether AGE 5g, 3- glycidol ether rings
Epoxide propyl trimethoxy silicon 1g, modified sheeted alumina powder 25g；
B component contains：It is polyoxypropylene diamine D400 50g, phenmethylol 20g, hydrophobic type gas phase silica 1g, modified
Tabular alumina powder 35g.
After being respectively sufficiently mixed component A and B component, the fluid sealant, the mixing after mixing component A and B component is obtained
The mixing viscosity of thing is 5400cp (25 DEG C), and colloid mobility is good；Thixotropic index 7.5.Take 20g fluid sealants (component A and B component
Mass ratio be 0.9:1), after applying glue, fluid sealant stagnates for 2 minutes, and the shore hardness after being fully cured is 78.
Embodiment two
Component A contains：E51 epoxy resin 70g, C12_14 alkyl monoglycidyl ether AGE 5g, hydrophobic type gas phase dioxy
SiClx 1g, 3_ diglycidyl ether epoxy base propyl trimethoxy silicon 1g, modified sheeted alumina powder 20g；
B component contains：It is polyoxypropylene diamine D400 50g, phenmethylol 20g, hydrophobic type gas phase silica 2g, modified
Tabular alumina powder 30g.
After being respectively sufficiently mixed component A and B component, the fluid sealant, the mixing after mixing component A and B component is obtained
The mixing viscosity of thing is 6000cp (25 DEG C), and colloid mobility is good；Thixotropic index 7.2.Take 20g fluid sealants (component A and B component
Mass ratio be 1:1), after applying glue, fluid sealant stagnates for 3 minutes, and the shore hardness after being fully cured is 78.
Embodiment three
Component A contains：E51 epoxy resin 70g, C12_14 alkyl monoglycidyl ether AGE 5g, 3_ glycidol ether rings
Epoxide propyl trimethoxy silicon 3g, modified sheeted alumina powder 16g；
B component contains：It is polyoxypropylene diamine D400 50g, phenmethylol 20g, hydrophobic type gas phase silica 4g, modified
Tabular alumina powder 20g；
After being respectively sufficiently mixed component A and B component, the fluid sealant, the mixing after mixing component A and B component is obtained
The mixing viscosity of thing is 6500cp (25 DEG C), and colloid mobility is good；Thixotropic index 7.0.Take 20g fluid sealants (component A and B component
Mass ratio be 1.1:1), after applying glue, fluid sealant stagnates for 5 minutes, and the shore hardness after being fully cured is 77.
Above-described embodiment one to the fluid sealant of embodiment three is tested, test result is as shown in table 1：
Each embodiment fluid sealant test result of table 1
The preferred embodiments of the present invention are these are only, the scope of the claims of the invention is not thereby limited, it is every to utilize this hair
Equivalent structure or equivalent flow conversion that bright specification is made, or other related technical fields are directly or indirectly used in,
Similarly it is included within the scope of the present invention.
Claims (10)
1. a kind of fluid sealant, it is characterised in that the fluid sealant includes component A and B component, and by weight, the component A contains
60~90 parts of epoxy resin, 0.5~5.0 part of silane coupler, 5~20 parts of the first diluent, the component A also contains hydrophobic type
10~30 parts of 0.5~5 part of aerosil and/or modified sheeted alumina powder, the B component contains curing agent 40~60
Part, 10~30 parts of the second diluent, 0.5~5 part of hydrophobic type gas phase silica and 20~50 parts of modified sheeted alumina powder；Or
By weight, the component A contains 60~90 parts of epoxy resin, 0.5~5.0 part of silane coupler, the first diluent 5~20
10~30 parts of part, 0.5~5 part of hydrophobic type gas phase silica and modified sheeted alumina powder, the B component contains curing agent 40
~60 parts, 10~30 parts of the second diluent, the B component also contain 0.5~5 part or modified sheeted of hydrophobic type gas phase silica
20~50 parts of alumina powder.
2. fluid sealant as claimed in claim 1, it is characterised in that the hydrophobic type gas phase silica is to use dimethyl-silicon
Ketone, dimethyldichlorosilane or hexamethyl dichlorosilane are modified the product after treatment, the hydrophobic type to nano silicon
The specific surface area of aerosil is more than 80m2/g。
3. fluid sealant as claimed in claim 1, it is characterised in that the modified sheeted alumina powder is using laurate, hard
At least one of resin acid, the acid of Pork and beans fringed pink and unrighted acid are modified the product after treatment to alumina powder.
4. fluid sealant as claimed in claim 3, it is characterised in that the crystalline phase of the modified sheeted alumina powder is α types, diameter is small
In 50 microns, radius-thickness ratio is more than 10.
5. the fluid sealant as described in claim 1-4 is any, it is characterised in that the epoxy resin is selected from bisphenol type epoxy tree
Fat, bisphenol f type epoxy resin, alicyclic ring epoxide resin, tetraglycidel ether epoxy resin, polyurethane modified epoxy resin and organic
At least one in silicon modified epoxy resin.
6. the fluid sealant as described in claim 1-4 is any, it is characterised in that first diluent be reactive diluent and/
Or non-activated thinner, second diluent is non-activated thinner.
7. the fluid sealant as described in claim 1-4 is any, it is characterised in that the silane coupler is selected from epoxy radicals silicone hydride idol
At least one in connection agent, amino containing silane coupling agent and acryloxy silane coupling agent.
8. the fluid sealant as described in claim 1-4 is any, it is characterised in that the curing agent is amine curing agent, the amine
Class curing agent is polyetheramine, fatty amine or aliphatic cyclic amine.
9. a kind of preparation method of fluid sealant, it is comprised the following steps：
By weight, mix 60~90 parts of epoxy resin, 5~20 part of first diluent, 0.5~5.0 part of silane coupler and
0.5~5 part of hydrophobic type gas phase silica and/or 10~30 parts of modified sheeted alumina powders, are obtained component A；Mixing 40~60
Part curing agent, 10~30 part of second diluent, 0.5~5 part of hydrophobic type gas phase silica and 20~50 parts of modified sheeted oxidations
Aluminium powder, is obtained B component；Or
By weight, 60~90 parts of epoxy resin, 5~20 part of first diluent, 0.5~5.0 part of silane coupler, 0.5 are mixed
~5 parts of hydrophobic type gas phase silicas and 10~30 parts of modified sheeted alumina powders, are obtained component A；40~60 parts of solidifications of mixing
Agent, 10~30 part of second diluent and 0.5~5 part of hydrophobic type gas phase silica or 20~50 parts of modified sheeted alumina powders,
B component is obtained.
10. a kind of application method of fluid sealant as described in claim any one of 1-8, it is characterised in that the mixing component A
With B component, wherein, the mass ratio of the component A and B component is 0.9~1.1:1.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710102818.8A CN106833470A (en) | 2017-02-24 | 2017-02-24 | Fluid sealant and preparation method thereof, application method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710102818.8A CN106833470A (en) | 2017-02-24 | 2017-02-24 | Fluid sealant and preparation method thereof, application method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110467895A (en) * | 2019-07-17 | 2019-11-19 | 池州科成新材料开发有限公司 | A kind of low viscosity high thixotropic epoxy resin sealant and preparation method thereof |
| TWI835960B (en) * | 2018-12-21 | 2024-03-21 | 日商力森諾科股份有限公司 | Sealing composition and semiconductor device |
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| CN104277749A (en) * | 2013-07-09 | 2015-01-14 | 锋泾（中国）建材集团有限公司 | Novel waterproof sealing material for home decoration |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI835960B (en) * | 2018-12-21 | 2024-03-21 | 日商力森諾科股份有限公司 | Sealing composition and semiconductor device |
| CN110467895A (en) * | 2019-07-17 | 2019-11-19 | 池州科成新材料开发有限公司 | A kind of low viscosity high thixotropic epoxy resin sealant and preparation method thereof |
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