CN106550530A - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
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- CN106550530A CN106550530A CN201510590296.1A CN201510590296A CN106550530A CN 106550530 A CN106550530 A CN 106550530A CN 201510590296 A CN201510590296 A CN 201510590296A CN 106550530 A CN106550530 A CN 106550530A
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- adhesive layer
- rubber
- adhesive
- circuit board
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- 238000002360 preparation method Methods 0.000 title 1
- 239000012790 adhesive layer Substances 0.000 claims abstract description 137
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 229920001971 elastomer Polymers 0.000 claims abstract description 16
- 239000005060 rubber Substances 0.000 claims abstract description 16
- 229920003048 styrene butadiene rubber Polymers 0.000 claims abstract description 14
- 229920003049 isoprene rubber Polymers 0.000 claims abstract description 12
- 229920005549 butyl rubber Polymers 0.000 claims abstract description 11
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 11
- 229920000800 acrylic rubber Polymers 0.000 claims abstract description 10
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 10
- 229920000181 Ethylene propylene rubber Polymers 0.000 claims abstract description 9
- 239000002174 Styrene-butadiene Substances 0.000 claims abstract 4
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims abstract 4
- 239000011115 styrene butadiene Substances 0.000 claims abstract 4
- 239000000853 adhesive Substances 0.000 claims description 37
- 230000001070 adhesive effect Effects 0.000 claims description 37
- 239000010410 layer Substances 0.000 claims description 28
- 229920000459 Nitrile rubber Polymers 0.000 claims description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 239000012752 auxiliary agent Substances 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 2
- 239000011229 interlayer Substances 0.000 claims 2
- 230000009977 dual effect Effects 0.000 claims 1
- 239000002313 adhesive film Substances 0.000 description 57
- 239000011241 protective layer Substances 0.000 description 14
- 229920000106 Liquid crystal polymer Polymers 0.000 description 12
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 12
- 230000008054 signal transmission Effects 0.000 description 10
- 239000004809 Teflon Substances 0.000 description 6
- 229920006362 Teflon® Polymers 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000003712 anti-aging effect Effects 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- OUBMGJOQLXMSNT-UHFFFAOYSA-N N-isopropyl-N'-phenyl-p-phenylenediamine Chemical compound C1=CC(NC(C)C)=CC=C1NC1=CC=CC=C1 OUBMGJOQLXMSNT-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- ZNRLMGFXSPUZNR-UHFFFAOYSA-N 2,2,4-trimethyl-1h-quinoline Chemical compound C1=CC=C2C(C)=CC(C)(C)NC2=C1 ZNRLMGFXSPUZNR-UHFFFAOYSA-N 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
技术领域 technical field
本发明涉及一种电路板及其制作方法。 The invention relates to a circuit board and a manufacturing method thereof.
背景技术 Background technique
近年来，在传送信号高速化、高频化的需求下，对各种电子设备中的电路板所使用的材料在降低信号传送损耗方面的要求也越来越严格。其中，业内电路板的普遍制作方法是采用液晶高分子聚合物(Liquid Crystal Polymer，LCP)或铁氟龙(Teflon)等作为电路板的介质层以降低传送损耗。而在双面板或多面板电路板中通常还需要使用胶粘层以粘合各基板。其中，该胶粘层所使用的材料通常为环氧树脂及丁腈橡胶（NBR）。然而，由环氧树脂及丁腈橡胶（NBR）形成的胶粘层在信号传输时带来的传送损耗较大。 In recent years, under the demand for high-speed and high-frequency transmission signals, the requirements for the materials used in circuit boards in various electronic devices to reduce signal transmission loss have become more and more stringent. Among them, the common production method of circuit boards in the industry is to use liquid crystal polymers (Liquid Crystal Polymer (LCP) or Teflon (Teflon) is used as the dielectric layer of the circuit board to reduce transmission loss. In double-sided or multi-sided circuit boards, an adhesive layer is usually required to bond the substrates together. Wherein, the material used for the adhesive layer is usually epoxy resin and nitrile rubber (NBR). However, the adhesive layer formed of epoxy resin and nitrile rubber (NBR) causes relatively large transmission loss during signal transmission.
发明内容 Contents of the invention
鉴于上述情况，有必要提供一种结构稳固且信号衰减小的电路板。 In view of the above circumstances, it is necessary to provide a circuit board with a stable structure and little signal attenuation.
另外，还有必要提供一种上述电路板的制作方法。 In addition, it is also necessary to provide a method for manufacturing the above-mentioned circuit board.
一种电路板，其包括至少两基板及连接于各基板间的粘合膜，每一基板包括一线路基板，该线路基板上形成有导电线路，每一线路基板通过该粘合膜与另一线路基板结合，该粘合膜包括两第一胶粘层及一第二胶粘层，该两第一胶粘层分别结合于该第二胶粘层的两相对表面，该第一胶粘层的粘着力大于该第二胶粘层的粘着力，该第二胶粘层的主要成分为橡胶，该橡胶选自异戊二烯橡胶、苯乙烯丁二烯橡胶、乙烯丙烯橡胶、丁基橡胶、亚克力橡胶及聚丁二烯橡胶中的一种或几种。 A circuit board, which includes at least two substrates and an adhesive film connected between the substrates, each substrate includes a circuit substrate, and conductive circuits are formed on the circuit substrate, and each circuit substrate is connected to another circuit substrate through the adhesive film. The circuit substrate is combined, the adhesive film includes two first adhesive layers and a second adhesive layer, the two first adhesive layers are respectively bonded to two opposite surfaces of the second adhesive layer, the first adhesive layer The adhesive force is greater than the adhesive force of the second adhesive layer, the main component of the second adhesive layer is rubber, the rubber is selected from isoprene rubber, styrene butadiene rubber, ethylene propylene rubber, butyl rubber One or more of acrylic rubber and polybutadiene rubber.
一种电路板的制作方法，其包括一下步骤：在一离型膜一表面形成一第一胶粘层；在该第一胶粘层远离离型膜的表面形成一第二胶粘层，其中，该第二胶粘层的主要成分为橡胶，该橡胶选自异戊二烯橡胶、苯乙烯丁二烯橡胶、乙烯丙烯橡胶、丁基橡胶、亚克力橡胶及聚丁二烯橡胶中的一种或几种，该第一胶粘层的粘着力大于该第二胶粘层的粘着力；在该第二胶粘层远离离型膜的表面形成另一第一胶粘层，两第一胶粘层与夹设于该两第一胶粘层间的第二胶粘层构成一粘合膜；提供至少两基板，于每相邻的两基板之间贴合一所述粘合膜以将所述至少两基板层叠设置，其中，每一基板包括一线路基板，该线路基板上形成有导电线路，每一粘合膜中的每一第一胶粘层分别与一基板的线路基板结合。 A method for making a circuit board, comprising the steps of: forming a first adhesive layer on a surface of a release film; forming a second adhesive layer on a surface of the first adhesive layer away from the release film, wherein The main component of the second adhesive layer is rubber, which is selected from the group consisting of isoprene rubber, styrene butadiene rubber, ethylene propylene rubber, butyl rubber, acrylic rubber and polybutadiene rubber or several, the adhesive force of the first adhesive layer is greater than the adhesive force of the second adhesive layer; another first adhesive layer is formed on the surface of the second adhesive layer away from the release film, and the two first adhesive layers The adhesive layer and the second adhesive layer sandwiched between the two first adhesive layers constitute an adhesive film; at least two substrates are provided, and an adhesive film is pasted between each adjacent two substrates so as to The at least two substrates are stacked, wherein each substrate includes a circuit substrate on which conductive circuits are formed, and each first adhesive layer in each adhesive film is combined with the circuit substrate of one substrate respectively.
本发明的电路板，其包括至少两基板及结合于基板间的粘合膜。该粘合膜由两第一胶粘层夹设一第二胶粘层构成，由于该第二胶粘层的主要成分为异戊二烯橡胶、苯乙烯丁二烯橡胶、乙烯丙烯橡胶、丁基橡胶、亚克力橡胶以及聚丁二烯橡胶中的一种或几种，该第二胶粘层的介质损失因子Df与介电常数Dk较小，使得电路板的粘合膜在信号传输时引起的衰减αdiel较小，另外，由于该第二胶粘层两相对表面分别形成有一第一胶粘层，该第一胶粘层的粘着力大于该第二胶粘层的粘着力，该粘合膜通过所述第一胶粘层与基板连接，使得电路板中基板间的剥离强度增大，从而使得电路板的结构稳固。 The circuit board of the present invention comprises at least two substrates and an adhesive film combined between the substrates. The adhesive film is composed of two first adhesive layers interposed by a second adhesive layer. Since the main components of the second adhesive layer are isoprene rubber, styrene butadiene rubber, ethylene propylene rubber, butadiene rubber, One or more of the base rubber, acrylic rubber and polybutadiene rubber, the dielectric loss factor D f and the dielectric constant D k of the second adhesive layer are small, so that the adhesive film of the circuit board can be used in signal transmission The attenuation α diel caused by the time is small. In addition, since the two opposite surfaces of the second adhesive layer are respectively formed with a first adhesive layer, the adhesive force of the first adhesive layer is greater than the adhesive force of the second adhesive layer, The adhesive film is connected to the substrate through the first adhesive layer, so that the peeling strength between the substrates in the circuit board is increased, so that the structure of the circuit board is stable.
附图说明 Description of drawings
图1为本发明较佳实施例之电路板的剖视示意图。 FIG. 1 is a schematic cross-sectional view of a circuit board according to a preferred embodiment of the present invention.
图2为图1所示电路板的粘合膜的剖视示意图。 FIG. 2 is a schematic cross-sectional view of the adhesive film of the circuit board shown in FIG. 1 .
图3为制备图1所示的电路板时将第一胶粘层形成于离型膜表面的剖视示意图。 3 is a schematic cross-sectional view of forming the first adhesive layer on the surface of the release film when preparing the circuit board shown in FIG. 1 .
图4为于图3所示的第一胶粘层上形成第二胶粘层的剖视示意图。 FIG. 4 is a schematic cross-sectional view of forming a second adhesive layer on the first adhesive layer shown in FIG. 3 .
图5为于图4所示的第二胶粘层上形成另一第一胶粘层的剖视示意图。 FIG. 5 is a schematic cross-sectional view of forming another first adhesive layer on the second adhesive layer shown in FIG. 4 .
图6为于图5所示的粘合膜结合于两基板间的剖视示意图。 FIG. 6 is a schematic cross-sectional view of the adhesive film shown in FIG. 5 combined between two substrates.
主要元件符号说明 Description of main component symbols
如下具体实施方式将结合上述附图进一步说明本发明。 The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.
具体实施方式 detailed description
请参阅图1，本发明实施方式提供一电路板100，其应用于电子装置（图未示）中。该电子装置可以为智能手机、平板电脑、笔记本电脑、多媒体播放器等。该电路板100包括至少两基板10及连接于各个基板10之间的粘合膜30。每一基板10包括一线路基板11及一形成于该线路基板11一表面的与该粘合膜30结合的介质层13。 Please refer to FIG. 1 , an embodiment of the present invention provides a circuit board 100 , which is applied in an electronic device (not shown). The electronic device may be a smart phone, a tablet computer, a notebook computer, a multimedia player, and the like. The circuit board 100 includes at least two substrates 10 and an adhesive film 30 connected between each substrate 10 . Each substrate 10 includes a circuit substrate 11 and a dielectric layer 13 formed on a surface of the circuit substrate 11 and combined with the adhesive film 30 .
该线路基板11上形成有导电线路（图未示），其可为单面板或双面板。 Conductive circuits (not shown) are formed on the circuit substrate 11 , which can be single-sided or double-sided.
该介质层13的材质可为聚酰亚胺（PI）、液晶高分子聚合物(Liquid Crystal Polymer，LCP)或铁氟龙(Teflon)等。 The material of the dielectric layer 13 can be polyimide (PI), liquid crystal polymer (Liquid Crystal Polymer, LCP) or Teflon (Teflon).
请同时参阅图2，该粘合膜30包括两第一胶粘层31及一第二胶粘层33，两第一胶粘层31分别结合于该第二胶粘层33的两相对表面。该第一胶粘层31的粘着力大于该第二胶粘层33的粘着力。该第一胶粘层31的主要成分为丁腈橡胶（NBR）与环氧树脂。该第二胶粘层33的主要成分为橡胶。该橡胶选自异戊二烯橡胶（IR）、苯乙烯丁二烯橡胶（SBR）、乙烯丙烯橡胶（EPDM）、丁基橡胶（IIR）、亚克力橡胶（ACM）以及聚丁二烯橡胶（BR）中的一种或几种。所述两第一胶粘层31的总厚度为该粘合膜30厚度的0.1%~20%。由于第一胶粘层31在信号传输时引起的衰减大于第二胶粘层33在信号传输时引起的衰减，因此该粘合膜30在确保具有一定粘着力的情况下尽可能降低其两第一胶粘层31的厚度，从而减小第一胶粘层31在信号传输时引起的衰减。优选的，该粘合膜30的厚度为18~40μm，每一第一胶粘层31的厚度为0.1~3μm。更优选的，该粘合膜30的厚度为25μm，每一第一胶粘层31的厚度为1μm。 Please also refer to FIG. 2 , the adhesive film 30 includes two first adhesive layers 31 and a second adhesive layer 33 , and the two first adhesive layers 31 are bonded to two opposite surfaces of the second adhesive layer 33 respectively. The adhesive force of the first adhesive layer 31 is greater than the adhesive force of the second adhesive layer 33 . The main components of the first adhesive layer 31 are nitrile rubber (NBR) and epoxy resin. The main component of the second adhesive layer 33 is rubber. The rubber is selected from isoprene rubber (IR), styrene butadiene rubber (SBR), ethylene propylene rubber (EPDM), butyl rubber (IIR), acrylic rubber (ACM) and polybutadiene rubber (BR ) in one or more. The total thickness of the two first adhesive layers 31 is 0.1%-20% of the thickness of the adhesive film 30 . Since the attenuation caused by the first adhesive layer 31 during signal transmission is greater than the attenuation caused by the second adhesive layer 33 during signal transmission, the adhesive film 30 reduces its two second adhesive layers as much as possible while ensuring a certain adhesive force. The thickness of the first adhesive layer 31 can reduce the attenuation caused by the first adhesive layer 31 during signal transmission. Preferably, the thickness of the adhesive film 30 is 18-40 μm, and the thickness of each first adhesive layer 31 is 0.1-3 μm. More preferably, the thickness of the adhesive film 30 is 25 μm, and the thickness of each first adhesive layer 31 is 1 μm.
该粘合膜30结合于各个基板10之间，两第一胶粘层31分别与相邻的两基板10的介质层13结合。 The adhesive film 30 is bonded between the substrates 10 , and the two first adhesive layers 31 are respectively bonded to the dielectric layers 13 of the two adjacent substrates 10 .
该电路板100还包括两保护层60，所述两保护层60分别包覆于最外侧的两基板10远离粘合膜30的表面。每一保护层60包括一绝缘层61及一防护层63。该绝缘层61包覆于最外侧的其中一基板10中的线路基板11远离粘合膜30的表面。该防护层63形成于该绝缘层61远离所述线路基板11的表面。 The circuit board 100 further includes two protective layers 60 , and the two protective layers 60 respectively cover the surfaces of the two outermost substrates 10 away from the adhesive film 30 . Each protective layer 60 includes an insulating layer 61 and a protective layer 63 . The insulating layer 61 covers the surface of the circuit substrate 11 in one of the outermost substrates 10 away from the adhesive film 30 . The protective layer 63 is formed on the surface of the insulating layer 61 away from the circuit substrate 11 .
本发明还提供一种上述电路板100的制作方法，其包括以下步骤： The present invention also provides a method for manufacturing the above-mentioned circuit board 100, which includes the following steps:
请参阅图3，提供一离型膜1，并在该离型膜1一表面形成一第一胶粘层31。该第一胶粘层31的主要成分为丁腈橡胶（NBR）与环氧树脂。具体的，将丁腈橡胶与环氧树脂溶解于丁酮中并加入助剂，以制备一第一胶粘剂，然后将该第一胶粘剂涂布于该离型膜1的所述表面，经干燥后形成该第一胶粘层31。该助剂可为防老剂、增强剂及增稠剂等中的一种或多种。所述防老剂可为N-异丙基-N’-苯基对苯二胺（即防老剂4010NA）或2,2,4-三甲基-1,2-二氢喹啉聚合物（即防老剂RD）。 Referring to FIG. 3 , a release film 1 is provided, and a first adhesive layer 31 is formed on a surface of the release film 1 . The main components of the first adhesive layer 31 are nitrile rubber (NBR) and epoxy resin. Specifically, nitrile rubber and epoxy resin are dissolved in methyl ethyl ketone and additives are added to prepare a first adhesive, and then the first adhesive is coated on the surface of the release film 1, and after drying The first adhesive layer 31 is formed. The auxiliary agent can be one or more of anti-aging agent, reinforcing agent and thickener. The anti-aging agent can be N-isopropyl-N'-phenyl-p-phenylenediamine (that is, anti-aging agent 4010NA) or 2,2,4-trimethyl-1,2-dihydroquinoline polymer (that is, Antiager RD).
请参阅图4，在该第一胶粘层31远离离型膜1的表面形成一第二胶粘层33。其中，该第二胶粘层33的主要成分为橡胶，该橡胶选自异戊二烯橡胶（IR）、苯乙烯丁二烯橡胶（SBR）、乙烯丙烯橡胶（EPDM）、丁基橡胶（IIR）、亚克力橡胶（ACM）以及聚丁二烯橡胶（BR）中的一种或几种。该第一胶粘层31的粘着力大于该第二胶粘层33的粘着力。具体的，将所述橡胶溶解于溶剂（例如甲苯）后得到第二胶粘剂，并将该第二胶粘剂涂布于该第一胶粘层31远离离型膜1的表面，经干燥后形成该第二胶粘层33。 Referring to FIG. 4 , a second adhesive layer 33 is formed on the surface of the first adhesive layer 31 away from the release film 1 . Wherein, the main component of the second adhesive layer 33 is rubber, and the rubber is selected from isoprene rubber (IR), styrene butadiene rubber (SBR), ethylene propylene rubber (EPDM), butyl rubber (IIR ), acrylic rubber (ACM) and polybutadiene rubber (BR) in one or more. The adhesive force of the first adhesive layer 31 is greater than the adhesive force of the second adhesive layer 33 . Specifically, the rubber is dissolved in a solvent (such as toluene) to obtain a second adhesive, and the second adhesive is coated on the surface of the first adhesive layer 31 away from the release film 1, and the second adhesive is formed after drying. Two adhesive layers 33.
请参阅图5，在该第二胶粘层33远离离型膜1的表面形成另一第一胶粘层31，从而使所述两第一胶粘层31与设置于所述两第一胶粘层31间的第二胶粘层33构成所述粘合膜30。所述两第一胶粘层31的总厚度为该粘合膜30厚度的0.1%~20%。该第一胶粘层31形成的具体步骤同上，在此不再赘述。 Referring to Fig. 5, another first adhesive layer 31 is formed on the surface of the second adhesive layer 33 away from the release film 1, so that the two first adhesive layers 31 and the two first adhesive layers are arranged on the two first adhesive layers. The second adhesive layer 33 between the adhesive layers 31 constitutes the adhesive film 30 . The total thickness of the two first adhesive layers 31 is 0.1%-20% of the thickness of the adhesive film 30 . The specific steps of forming the first adhesive layer 31 are the same as above, and will not be repeated here.
请参阅图6，提供至少两基板10，于每相邻的两基板10之间贴合一粘合膜30以将所述至少两基板10层叠设置。其中，每一粘合膜30中的每一第一胶粘层31分别与一基板10结合。本实施方式中，每一基板10包括一线路基板11及一形成于该线路基板11一表面的介质层13。该粘合膜30中的两第一胶粘层31分别与相邻的两基板10的介质层13结合。该介质层13的材质可为聚酰亚胺（PI）、液晶高分子聚合物(Liquid Crystal Polymer，LCP)或铁氟龙(Teflon)等。 Referring to FIG. 6 , at least two substrates 10 are provided, and an adhesive film 30 is pasted between each adjacent two substrates 10 to stack the at least two substrates 10 . Wherein, each first adhesive layer 31 in each adhesive film 30 is combined with a substrate 10 respectively. In this embodiment, each substrate 10 includes a circuit substrate 11 and a dielectric layer 13 formed on a surface of the circuit substrate 11 . The two first adhesive layers 31 in the adhesive film 30 are combined with the dielectric layers 13 of the two adjacent substrates 10 respectively. The material of the dielectric layer 13 can be polyimide (PI), liquid crystal polymer (Liquid Crystal Polymer, LCP) or Teflon (Teflon).
请进一步参阅图1，在最外侧的两基板10远离粘合膜30的表面分别覆盖一保护层60。在本实施方式中，该保护层60包括一绝缘层61及一防护层63。该绝缘层61包覆于最外侧的其中一基板10中的线路基板11远离粘合膜30的表面。该防护层63形成于该绝缘层61远离所述线路基板11的表面。 Please refer to FIG. 1 further, the surfaces of the two outermost substrates 10 away from the adhesive film 30 are respectively covered with a protection layer 60 . In this embodiment, the protective layer 60 includes an insulating layer 61 and a protective layer 63 . The insulating layer 61 covers the surface of the circuit substrate 11 in one of the outermost substrates 10 away from the adhesive film 30 . The protective layer 63 is formed on the surface of the insulating layer 61 away from the circuit substrate 11 .
在另一实施方式中，该基板10中的介质层13可省略。此时，该粘合膜30的两第一胶粘层31分别与相邻的两基板10的线路基板11直接结合。在又一实施方式中，该粘合膜的其中一第一胶粘层31与一基板10的介质层13结合，而另一第一胶粘层31则与另一基板的线路基板11直接结合。 In another embodiment, the dielectric layer 13 in the substrate 10 can be omitted. At this time, the two first adhesive layers 31 of the adhesive film 30 are respectively directly bonded to the circuit substrates 11 of the two adjacent substrates 10 . In yet another embodiment, one of the first adhesive layers 31 of the adhesive film is combined with the dielectric layer 13 of a substrate 10, and the other first adhesive layer 31 is directly combined with the circuit substrate 11 of another substrate. .
下面通过实施例来对本发明进行具体说明。 The present invention will be described in detail below by way of examples.
实施例 Example
将丁腈橡胶与环氧树脂溶解于丁酮中并加入防老剂4010NA以制备第一胶粘剂，该第一胶粘剂中该丁腈橡胶与环氧树脂的浓度为25%。将苯乙烯丁二烯橡胶熔解于甲苯以制备第二胶粘剂，该第二胶粘剂中该苯乙烯丁二烯橡胶的浓度为20%。分別使用上述第一胶粘剂和第二胶粘剂制备两第一胶粘层31与第二胶粘层33，从而得到所述粘合膜30。该粘合膜30的厚度为25μm，其中，每一第一胶粘层31的厚度为1μm。提供两基板10，每一基板10包括一线路基板11及一材质为液晶高分子聚合物的介质层13。将该粘合膜30结合于两基板10间，该粘合膜30中的两第一胶粘层31分别与两基板10中的介质层13结合。在两线路基板11远离粘合膜30的表面分别覆盖一保护层60从而制得一电路板100。每一保护层60包括一绝缘层61及一防护层63。两绝缘层61分别包覆于对应的线路基板11远离粘合膜30的表面。该防护层63形成于该绝缘层61远离所述线路基板11的表面。 The nitrile rubber and epoxy resin were dissolved in methyl ethyl ketone and anti-aging agent 4010NA was added to prepare a first adhesive. The concentration of the nitrile rubber and epoxy resin in the first adhesive was 25%. Styrene butadiene rubber was dissolved in toluene to prepare a second adhesive, and the concentration of the styrene butadiene rubber in the second adhesive was 20%. Two first adhesive layers 31 and a second adhesive layer 33 are prepared by using the first adhesive and the second adhesive respectively, so as to obtain the adhesive film 30 . The adhesive film 30 has a thickness of 25 μm, wherein each first adhesive layer 31 has a thickness of 1 μm. Two substrates 10 are provided, and each substrate 10 includes a circuit substrate 11 and a dielectric layer 13 made of liquid crystal polymer. The adhesive film 30 is combined between the two substrates 10 , and the two first adhesive layers 31 in the adhesive film 30 are respectively combined with the dielectric layers 13 in the two substrates 10 . A protective layer 60 is respectively covered on the surfaces of the two circuit substrates 11 away from the adhesive film 30 to manufacture a circuit board 100 . Each protective layer 60 includes an insulating layer 61 and a protective layer 63 . The two insulating layers 61 are respectively coated on the corresponding surface of the circuit substrate 11 away from the adhesive film 30 . The protective layer 63 is formed on the surface of the insulating layer 61 away from the circuit substrate 11 .
比较例1 Comparative example 1
将丁腈橡胶与环氧树脂溶解于丁酮中并加入防老剂4010NA以制备第一胶粘剂，该第一胶粘剂中该丁腈橡胶与环氧树脂的浓度为25%。使用上述第一胶粘剂形成一胶粘层以制备粘合膜。该粘合膜的厚度为25μm。提供两基板，每一基板包括一线路基板及一材质为液晶高分子聚合物的介质层。将该粘合膜结合于两基板间。在两线路基板远离粘合膜的表面分别覆盖一上述保护膜从而制得一电路板。 The nitrile rubber and epoxy resin were dissolved in methyl ethyl ketone and anti-aging agent 4010NA was added to prepare a first adhesive. The concentration of the nitrile rubber and epoxy resin in the first adhesive was 25%. An adhesive layer was formed using the first adhesive described above to prepare an adhesive film. The adhesive film had a thickness of 25 μm. Two substrates are provided, and each substrate includes a circuit substrate and a dielectric layer made of liquid crystal polymer. The adhesive film is bonded between the two substrates. A circuit board is prepared by covering the surfaces of the two circuit substrates away from the adhesive film with the above-mentioned protective film respectively.
比较例2 Comparative example 2
将苯乙烯丁二烯橡胶熔解于甲苯以制备第二胶粘剂，该第二胶粘剂中该苯乙烯丁二烯橡胶的浓度为20%。使用上述第二胶粘剂形成一胶粘层以制备粘合膜。该粘合膜的厚度为25μm。提供两基板，每一基板包括一线路基板及一材质为液晶高分子聚合物的介质层。将该粘合膜结合于两基板间。在两线路基板远离粘合膜的表面分别覆盖一上述保护膜从而制得一电路板。 Styrene butadiene rubber was dissolved in toluene to prepare a second adhesive, and the concentration of the styrene butadiene rubber in the second adhesive was 20%. An adhesive layer was formed using the above-mentioned second adhesive to prepare an adhesive film. The adhesive film had a thickness of 25 μm. Two substrates are provided, and each substrate includes a circuit substrate and a dielectric layer made of liquid crystal polymer. The adhesive film is bonded between the two substrates. A circuit board is prepared by covering the surfaces of the two circuit substrates away from the adhesive film with the above-mentioned protective film respectively.
由信号传输时引起的衰减 。其中，f表示信号频率，Df表示介质损失因子，Dk表示介电常数。为了说明本发明制作的电路板100中各基板10间的结合能力及粘合膜30在信号传输时引起的衰减αdiel的大小，分别对实施例的电路板、比较例1的电路板及比较例2的电路板进行板间剥离强度的测试以及粘合膜的介质损失因子Df与介电常数Dk的检测。具体的，通过拉力机以90度角剥离该基体与粘合膜时测得的剥离强度（见表1）；在室温下，通过网络分析仪在10GHz下测得介质损失因子Df与介电常数Dk（见表1）。 Attenuation caused by signal transmission . Among them, f represents the signal frequency, D f represents the dielectric loss factor, and D k represents the dielectric constant. In order to illustrate the bonding ability between each substrate 10 in the circuit board 100 made by the present invention and the size of the attenuation α diel caused by the adhesive film 30 during signal transmission, the circuit board of the embodiment, the circuit board of Comparative Example 1, and the comparison The circuit board of Example 2 was tested for the peel strength between boards and the dielectric loss factor D f and dielectric constant D k of the adhesive film. Specifically, the peel strength measured when the substrate and the adhesive film are peeled off at an angle of 90 degrees by a tensile machine (see Table 1); at room temperature, the dielectric loss factor D f and the dielectric loss factor are measured at 10 GHz by a network analyzer. Constant D k (see Table 1).
表1 关于上述各电路板的相关数据的测量值 Table 1 Measured values of relevant data on the above boards
由上述表1可知，由于实施例的电路板中粘合膜由第一胶粘层31与第二胶粘层33组成，其Df与Dk小于比较例1中仅具有由第一胶粘剂形成的胶粘层作为粘合膜的Df与Dk，因此实施例的粘合膜相较于比较例1的粘合膜在信号传输时引起的衰减αdiel小；由于第一胶粘层31的粘着力大于第二胶粘层33的粘着力，从而使得实施例中基板间剥离强度大于比较例2中基板间的剥离强度更大。 As can be seen from the above Table 1, since the adhesive film in the circuit board of the embodiment is composed of the first adhesive layer 31 and the second adhesive layer 33, its D f and D k are smaller than that of Comparative Example 1, which is only formed by the first adhesive. The adhesive layer of the adhesive layer is used as the D f and D k of the adhesive film, so the attenuation α diel caused by the adhesive film of the embodiment is smaller than that of the adhesive film of Comparative Example 1 during signal transmission; due to the first adhesive layer 31 The adhesive force is greater than the adhesive force of the second adhesive layer 33, so that the peel strength between the substrates in the embodiment is greater than the peel strength between the substrates in Comparative Example 2.
本发明的电路板100，其包括多个基板10及结合于基板10间的粘合膜30。该粘合膜30由两第一胶粘层31夹设一第二胶粘层33构成，由于该第二胶粘层33的主要成分为异戊二烯橡胶、苯乙烯丁二烯橡胶、乙烯丙烯橡胶、丁基橡胶、亚克力橡胶以及聚丁二烯橡胶中的一种或几种，该第二胶粘层33的介质损失因子Df与介电常数Dk较小，使得电路板100的粘合膜在信号传输时引起的衰减αdiel较小，另外，由于该第二胶粘层33两相对表面分别形成有一第一胶粘层31，该第一胶粘层31的粘着力大于该第二胶粘层33的粘着力，该粘合膜30通过所述第一胶粘层31与基板10连接，使得电路板100中基板10间的剥离强度增大，从而使得电路板100的结构稳固。 The circuit board 100 of the present invention includes a plurality of substrates 10 and an adhesive film 30 combined between the substrates 10 . The adhesive film 30 is composed of two first adhesive layers 31 sandwiching a second adhesive layer 33. Since the main components of the second adhesive layer 33 are isoprene rubber, styrene butadiene rubber, ethylene One or more of propylene rubber, butyl rubber, acrylic rubber and polybutadiene rubber, the dielectric loss factor D f and the dielectric constant D k of the second adhesive layer 33 are small, so that the circuit board 100 The attenuation α diel caused by the adhesive film during signal transmission is small. In addition, since the two opposite surfaces of the second adhesive layer 33 are respectively formed with a first adhesive layer 31, the adhesive force of the first adhesive layer 31 is greater than that of the second adhesive layer 33. The adhesive force of the second adhesive layer 33, the adhesive film 30 is connected to the substrate 10 through the first adhesive layer 31, so that the peel strength between the substrates 10 in the circuit board 100 increases, so that the structure of the circuit board 100 stable.
另外，对于本领域的普通技术人员来说，可以根据本发明的技术构思做出其它各种相应的改变与变形，而所有这些改变与变形都应属于本发明权利要求的保护范围。 In addition, for those skilled in the art, various other corresponding changes and modifications can be made according to the technical concept of the present invention, and all these changes and modifications should belong to the protection scope of the claims of the present invention.
Claims (10)
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003243788A (en) * | 2002-02-20 | 2003-08-29 | Alps Electric Co Ltd | Printed wiring board and manufacturing method of the same |
| CN103379750A (en) * | 2012-04-27 | 2013-10-30 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
| US20140318698A1 (en) * | 2010-03-04 | 2014-10-30 | Rogers Corporation | Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof |
-
2015
- 2015-09-17 CN CN201510590296.1A patent/CN106550530A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003243788A (en) * | 2002-02-20 | 2003-08-29 | Alps Electric Co Ltd | Printed wiring board and manufacturing method of the same |
| US20140318698A1 (en) * | 2010-03-04 | 2014-10-30 | Rogers Corporation | Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof |
| CN103379750A (en) * | 2012-04-27 | 2013-10-30 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
Cited By (2)
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|---|---|---|---|---|
| CN113784548A (en) * | 2021-08-10 | 2021-12-10 | 深圳市信维通信股份有限公司 | Preparation method of sandwich adhesive layer and preparation method of multilayer circuit board |
| CN113784548B (en) * | 2021-08-10 | 2024-04-16 | 深圳市信维通信股份有限公司 | Sandwich adhesive layer preparation method and multilayer circuit board preparation method |
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