CN106550530A - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN106550530A CN106550530A CN201510590296.1A CN201510590296A CN106550530A CN 106550530 A CN106550530 A CN 106550530A CN 201510590296 A CN201510590296 A CN 201510590296A CN 106550530 A CN106550530 A CN 106550530A
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- China
- Prior art keywords
- adhesive layer
- rubber
- bonding film
- circuit board
- base plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A kind of circuit board, which includes at least two substrates and the bonding film being connected between each substrate, each substrate includes a circuit base plate, conducting wire is formed with the circuit base plate, each circuit base plate is combined with another circuit base plate by the bonding film, the bonding film includes two first adhesive layers and one second adhesive layer, two first adhesive layer is respectively in connection with two apparent surfaces of second adhesive layer, adhesion strength of the adhesion strength of first adhesive layer more than second adhesive layer, the main component of second adhesive layer is rubber, the rubber is selected from isoprene rubber, styrene butadiene ribber, ethylene propylene rubber, butyl rubber, one or more in acrylic rubber and polybutadiene rubber.
Description
Technical field
The present invention relates to a kind of circuit board and preparation method thereof.
Background technology
In recent years, under transmission signal high speed, the demand of high frequency, requirement of the material used to the circuit board in various electronic equipments in terms of signal transmission loss is reduced is also more and more stricter.Wherein, the universal manufacture method of circuit board is using polymeric liquid crystal copolymer (Liquid in the industry
Crystal Polymer, LCP) or Teflon (Teflon) etc. as circuit board dielectric layer reducing transmission loss.And generally also need to bond each substrate using adhesive layer in dual platen or multi-panel circuit board.Wherein, the material used by the adhesive layer is usually epoxy resin and nitrile rubber（NBR）.However, by epoxy resin and nitrile rubber（NBR）The transmission loss that the adhesive layer of formation is brought in signal transmission is larger.
The content of the invention
In view of the foregoing, it is necessary to provide a kind of stabilized structure and signal attenuation little circuit board.
In addition, there is a need to providing a kind of manufacture method of foregoing circuit plate.
A kind of circuit board, which includes at least two substrates and the bonding film being connected between each substrate, each substrate includes a circuit base plate, conducting wire is formed with the circuit base plate, each circuit base plate is combined with another circuit base plate by the bonding film, the bonding film includes two first adhesive layers and one second adhesive layer, two first adhesive layer is respectively in connection with two apparent surfaces of second adhesive layer, adhesion strength of the adhesion strength of first adhesive layer more than second adhesive layer, the main component of second adhesive layer is rubber, the rubber is selected from isoprene rubber, styrene butadiene ribber, ethylene propylene rubber, butyl rubber, one or more in acrylic rubber and polybutadiene rubber.
A kind of manufacture method of circuit board, which includes step：One first adhesive layer is formed on one surface of a mould release membrance；One second adhesive layer is formed away from the surface of mould release membrance in first adhesive layer, wherein, the main component of second adhesive layer is rubber, the rubber is selected from one or more in isoprene rubber, styrene butadiene ribber, ethylene propylene rubber, butyl rubber, acrylic rubber and polybutadiene rubber, and the adhesion strength of first adhesive layer is more than the adhesion strength of second adhesive layer；Another first adhesive layer is formed away from the surface of mould release membrance in second adhesive layer, two first adhesive layers constitute a bonding film with the second adhesive layer for being located in the two first gluing interlayer；At least two substrates are provided, bonding film described in one is fitted between per adjacent two substrates so that at least two substrates to be stacked, wherein, each substrate includes a circuit base plate, conducting wire is formed with the circuit base plate, combined with the circuit base plate of a substrate per one first adhesive layer respectively in each bonding film.
The circuit board of the present invention, which includes at least two substrates and the bonding film being incorporated between substrate.The bonding film is made up of two first adhesive layer sandwicheds, one second adhesive layer, as the main component of second adhesive layer is one or more in isoprene rubber, styrene butadiene ribber, ethylene propylene rubber, butyl rubber, acrylic rubber and polybutadiene rubber, the dielectric loss factor D of second adhesive layerfWith dielectric constant DkIt is less so that the attenuation alpha that the bonding film of circuit board causes in signal transmissiondielIt is less, in addition, due to second adhesive layer, two apparent surfaces is respectively formed with one first adhesive layer, adhesion strength of the adhesion strength of first adhesive layer more than second adhesive layer, the bonding film is by first adhesive layer and substrate connection, so that the peel strength increase in circuit board between substrate, so that the stabilized structure of circuit board.
Description of the drawings
Cross-sectional schematics of the Fig. 1 for the circuit board of present pre-ferred embodiments.
Cross-sectional schematics of the Fig. 2 for the bonding film of circuit board shown in Fig. 1.
Fig. 3 is the cross-sectional schematic that the first adhesive layer is formed at when preparing the circuit board shown in Fig. 1 mould release membrance surface.
Fig. 4 is the cross-sectional schematic that the second adhesive layer is formed on the first adhesive layer shown in Fig. 3.
Fig. 5 is the cross-sectional schematic that another first adhesive layer is formed on the second adhesive layer shown in Fig. 4.
Fig. 6 is to be incorporated into the cross-sectional schematic between two substrates in the bonding film shown in Fig. 5.
Main element symbol description
| Circuit board | 100 |
| Substrate | 10 |
| Circuit base plate | 11 |
| Dielectric layer | 13 |
| Bonding film | 30 |
| First adhesive layer | 31 |
| Second adhesive layer | 33 |
| Protective layer | 60 |
| Insulating barrier | 61 |
| Overcoat | 63 |
| Mould release membrance | 1 |
Following specific embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Specific embodiment
Fig. 1 is referred to, embodiment of the present invention provides a circuit board 100, and which is applied to electronic installation（It is not shown）In.The electronic installation can be smart mobile phone, panel computer, notebook computer, multimedia player etc..The bonding film 30 that the circuit board 100 includes at least two substrates 10 and is connected between each substrate 10.Each substrate 10 is included a circuit base plate 11 and one is formed at the dielectric layer 13 combined with the bonding film 30 on 11 1 surface of circuit base plate.
Conducting wire is formed with the circuit base plate 11（It is not shown）, which can be single sided board or dual platen.
The material of the dielectric layer 13 can be polyimides（PI）, polymeric liquid crystal copolymer (Liquid Crystal Polymer, LCP) or Teflon (Teflon) etc..
Please refer to Fig. 2, the bonding film 30 includes two first adhesive layers 31 and one second adhesive layer 33, and two first adhesive layers 31 are respectively in connection with two apparent surfaces of second adhesive layer 33.Adhesion strength of the adhesion strength of first adhesive layer 31 more than second adhesive layer 33.The main component of first adhesive layer 31 is nitrile rubber（NBR）With epoxy resin.The main component of second adhesive layer 33 is rubber.The rubber is selected from isoprene rubber（IR）, styrene butadiene ribber（SBR）, ethylene propylene rubber（EPDM）, butyl rubber（IIR）, acrylic rubber（ACM）And polybutadiene rubber（BR）In one or more.The gross thickness of described two first adhesive layers 31 is the 0.1% ~ 20% of 30 thickness of bonding film.As the decay that the first adhesive layer 31 causes in signal transmission is more than the decay that the second adhesive layer 33 causes in signal transmission, therefore the bonding film 30 reduces the thickness of its two first adhesive layer 31 as far as possible in the case where guaranteeing with certain adhesion strength, so as to reduce the decay that the first adhesive layer 31 causes in signal transmission.Preferably, the thickness of the bonding film 30 is 18 ~ 40 μm, and the thickness per one first adhesive layer 31 is 0.1 ~ 3 μm.It is furthermore preferred that the thickness of the bonding film 30 is 25 μm, the thickness per one first adhesive layer 31 is 1 μm.
The bonding film 30 is incorporated between each substrate 10, and two first adhesive layers 31 are combined with the dielectric layer 13 of adjacent two substrates 10 respectively.
The circuit board 100 also includes two protective layers 60, and two protective layer 60 is respectively coated by the surface in outermost two substrates 10 away from bonding film 30.Each protective layer 60 includes an insulating barrier 61 and an overcoat 63.The insulating barrier 61 is coated on surface of the circuit base plate 11 in an outermost wherein substrate 10 away from bonding film 30.The overcoat 63 is formed at surface of the insulating barrier 61 away from the circuit base plate 11.
The manufacture method that the present invention also provides a kind of foregoing circuit plate 100, which comprises the following steps：
Refer to Fig. 3, there is provided a mould release membrance 1, and one first adhesive layer 31 is formed on 1 one surface of mould release membrance.The main component of first adhesive layer 31 is nitrile rubber（NBR）With epoxy resin.Specifically, nitrile rubber and epoxy resin are dissolved in butanone and are added auxiliary agent, first adhesive, to prepare one first adhesive, is then coated the surface of the mould release membrance 1, first adhesive layer 31 is formed after drying.The auxiliary agent can be one or more in age resistor, reinforcing agent and thickening agent etc..The age resistor can be N- isopropyl-N '-diphenyl-para-phenylene diamine（That is antioxidant 4010NA）Or 2,2,4 trimethyl 1,2 dihydroquinoline polymer（That is anti-aging agent RD）.
Fig. 4 is referred to, one second adhesive layer 33 is formed away from the surface of mould release membrance 1 in first adhesive layer 31.Wherein, the main component of second adhesive layer 33 is rubber, and the rubber is selected from isoprene rubber（IR）, styrene butadiene ribber（SBR）, ethylene propylene rubber（EPDM）, butyl rubber（IIR）, acrylic rubber（ACM）And polybutadiene rubber（BR）In one or more.Adhesion strength of the adhesion strength of first adhesive layer 31 more than second adhesive layer 33.Specifically, by the rubber solution in solvent（Such as toluene）After obtain the second adhesive, and second adhesive is coated into surface of first adhesive layer 31 away from mould release membrance 1, forms second adhesive layer 33 after drying.
Fig. 5 is referred to, another first adhesive layer 31 is formed away from the surface of mould release membrance 1 in second adhesive layer 33, so that described two first adhesive layers 31 and the second adhesive layer 33 being arranged between described two first adhesive layers 31 constitute the bonding film 30.The gross thickness of described two first adhesive layers 31 is the 0.1% ~ 20% of 30 thickness of bonding film.The concrete steps that first adhesive layer 31 is formed ibid, will not be described here.
Refer to Fig. 6, there is provided at least two substrates 10, fit a bonding film 30 to be stacked at least two substrates 10 between per adjacent two substrates 10.Wherein, combined with a substrate 10 per one first adhesive layer 31 respectively in each bonding film 30.In present embodiment, each substrate 10 includes a circuit base plate 11 and one is formed at the dielectric layer 13 on 11 1 surface of circuit base plate.Two first adhesive layers 31 in the bonding film 30 are combined with the dielectric layer 13 of adjacent two substrates 10 respectively.The material of the dielectric layer 13 can be polyimides（PI）, polymeric liquid crystal copolymer (Liquid Crystal Polymer, LCP) or Teflon (Teflon) etc..
Further referring to Fig. 1, a protective layer 60 is covered each by away from the surface of bonding film 30 in outermost two substrates 10.In the present embodiment, the protective layer 60 includes an insulating barrier 61 and an overcoat 63.The insulating barrier 61 is coated on surface of the circuit base plate 11 in an outermost wherein substrate 10 away from bonding film 30.The overcoat 63 is formed at surface of the insulating barrier 61 away from the circuit base plate 11.
In another embodiment, the dielectric layer 13 in the substrate 10 can be omitted.Now, two first adhesive layers 31 of the bonding film 30 respectively with the circuit base plate 11 of adjacent two substrates 10 directly in conjunction with.In yet, wherein one first adhesive layer 31 of the bonding film is combined with the dielectric layer 13 of a substrate 10, and another first adhesive layer 31 then with the circuit base plate 11 of another substrate directly in conjunction with.
The present invention is specifically described below by embodiment.
Embodiment
Nitrile rubber and epoxy resin are dissolved in butanone and antioxidant 4010NA are added to prepare the first adhesive, and in first adhesive, the nitrile rubber and the concentration of epoxy resin are 25%.Styrene butadiene ribber is melted in into toluene to prepare the second adhesive, the concentration of the styrene butadiene ribber is 20% in second adhesive.Fen Do use above-mentioned first adhesive and the second adhesive to prepare two first adhesive layers 31 and the second adhesive layer 33, so as to obtain the bonding film 30.The thickness of the bonding film 30 is 25 μm, wherein, the thickness per one first adhesive layer 31 is 1 μm.Two substrates 10 are provided, each substrate 10 includes the dielectric layer 13 of a circuit base plate 11 and a material for polymeric liquid crystal copolymer.The bonding film 30 is incorporated between two substrates 10, two first adhesive layers 31 in the bonding film 30 are combined with the dielectric layer 13 in two substrates 10 respectively.A protective layer 60 is covered each by so as to be obtained a circuit board 100 away from the surface of bonding film 30 in two circuit base plates 11.Each protective layer 60 includes an insulating barrier 61 and an overcoat 63.Two insulating barriers 61 are respectively coated by the surface in corresponding circuit base plate 11 away from bonding film 30.The overcoat 63 is formed at surface of the insulating barrier 61 away from the circuit base plate 11.
Comparative example 1
Nitrile rubber and epoxy resin are dissolved in butanone and antioxidant 4010NA are added to prepare the first adhesive, and in first adhesive, the nitrile rubber and the concentration of epoxy resin are 25%.An adhesive layer is formed using above-mentioned first adhesive and prepares bonding film.The thickness of the bonding film is 25 μm.Two substrates are provided, each substrate includes the dielectric layer of a circuit base plate and a material for polymeric liquid crystal copolymer.The bonding film is incorporated between two substrates.A said protection film is covered each by so as to be obtained a circuit board away from the surface of bonding film in two circuit base plates.
Comparative example 2
Styrene butadiene ribber is melted in into toluene to prepare the second adhesive, the concentration of the styrene butadiene ribber is 20% in second adhesive.An adhesive layer is formed using above-mentioned second adhesive and prepares bonding film.The thickness of the bonding film is 25 μm.Two substrates are provided, each substrate includes the dielectric layer of a circuit base plate and a material for polymeric liquid crystal copolymer.The bonding film is incorporated between two substrates.A said protection film is covered each by so as to be obtained a circuit board away from the surface of bonding film in two circuit base plates.
The decay caused during by signal transmission
.Wherein, f represents signal frequency, DfRepresent the dielectric loss factor, DkRepresent dielectric constant.In order to illustrate attenuation alpha that binding ability and bonding film 30 in the circuit board 100 of present invention making between each substrate 10 cause in signal transmissiondielSize, the circuit board of circuit board, the circuit board of comparative example 1 and comparative example 2 respectively to embodiment enters the dielectric loss factor D of the test of peel strength and bonding film between andantefWith dielectric constant DkDetection.Specifically, the peel strength measured when peeling off the matrix with bonding film with an angle of 90 degrees by puller system（It is shown in Table 1）；At room temperature, dielectric loss factor D is measured under 10GHz by Network AnalyzerfWith dielectric constant Dk（It is shown in Table 1）.
Measured value of the table 1 with regard to the related data of above-mentioned each circuit board
From above-mentioned table 1, as in the circuit board of embodiment, bonding film is made up of with the second adhesive layer 33 the first adhesive layer 31, its DfWith DkLess than in comparative example 1 only with the adhesive layer formed by the first adhesive as bonding film DfWith Dk, therefore the bonding film of embodiment is compared to the attenuation alpha that causes in signal transmission of bonding film of comparative example 1dielIt is little；As the adhesion strength of the first adhesive layer 31 is more than the adhesion strength of the second adhesive layer 33, so that between substrate, peel strength is bigger more than the peel strength between substrate in comparative example 2 in embodiment.
The circuit board 100 of the present invention, its bonding film 30 for including multiple substrates 10 and being incorporated between substrate 10.The bonding film 30 is made up of two first adhesive layers, 31 sandwiched, one second adhesive layer 33, as the main component of second adhesive layer 33 is one or more in isoprene rubber, styrene butadiene ribber, ethylene propylene rubber, butyl rubber, acrylic rubber and polybutadiene rubber, the dielectric loss factor D of second adhesive layer 33fWith dielectric constant DkIt is less so that the attenuation alpha that the bonding film of circuit board 100 causes in signal transmissiondielIt is less, in addition, due to second adhesive layer, 33 liang of apparent surfaces are respectively formed with one first adhesive layer 31, adhesion strength of the adhesion strength of first adhesive layer 31 more than second adhesive layer 33, the bonding film 30 is connected with substrate 10 by first adhesive layer 31, so that the peel strength increase in circuit board 100 between substrate 10, so that the stabilized structure of circuit board 100.
In addition, for the person of ordinary skill of the art, other various corresponding changes and deformation can be made with technology according to the present invention design, and all these changes and deformation should all belongs to the protection domain of the claims in the present invention.
Claims (10)
1. a kind of circuit board, which includes at least two substrates and the bonding film being connected between each substrate, and each substrate includes a circuit base plate, and conducting wire is formed with the circuit base plate, and each circuit base plate is combined with another circuit base plate by the bonding film, it is characterised in that：The bonding film includes two first adhesive layers and one second adhesive layer, two first adhesive layer is respectively in connection with two apparent surfaces of second adhesive layer, adhesion strength of the adhesion strength of first adhesive layer more than second adhesive layer, the main component of second adhesive layer is rubber, the rubber one or more in isoprene rubber, styrene butadiene ribber, ethylene propylene rubber, butyl rubber, acrylic rubber and the polybutadiene rubber.
2. circuit board as claimed in claim 1, it is characterised in that：The gross thickness of two first adhesive layer is the 0.1% ~ 20% of the bonding film thickness.
3. circuit board as claimed in claim 2, it is characterised in that：The thickness of the bonding film is 18 ~ 40 μm, and the thickness per one first adhesive layer is 0.1 ~ 3 μm.
4. circuit board as claimed in claim 1, it is characterised in that：Each substrate also includes a dielectric layer, and each dielectric layer is formed at corresponding circuit base plate and the first gluing interlayer.
5. circuit board as claimed in claim 1, it is characterised in that：The circuit base plate is single sided board or dual platen.
6. a kind of manufacture method of circuit board, which comprises the following steps：
One first adhesive layer is formed on one surface of a mould release membrance；
One second adhesive layer is formed away from the surface of mould release membrance in first adhesive layer, wherein, the main component of second adhesive layer is rubber, the rubber is selected from one or more in isoprene rubber, styrene butadiene ribber, ethylene propylene rubber, butyl rubber, acrylic rubber and polybutadiene rubber, and the adhesion strength of first adhesive layer is more than the adhesion strength of second adhesive layer；
Another first adhesive layer is formed away from the surface of mould release membrance in second adhesive layer, two first adhesive layer constitutes a bonding film with the second adhesive layer for being located in the two first gluing interlayer；
At least two substrates are provided, bonding film described in one is fitted between per adjacent two substrates so that at least two substrates to be stacked, wherein, each substrate includes a circuit base plate, conducting wire is formed with the circuit base plate, combined with the circuit base plate of a substrate per one first adhesive layer respectively in each bonding film.
7. the manufacture method of circuit board as claimed in claim 6, it is characterised in that：Form concretely comprising the following steps for two first adhesive layer：Nitrile rubber and epoxy resin are dissolved in butanone and auxiliary agent are added to prepare one first adhesive, and the dry tack free away from mould release membrance that first adhesive coats one surface of mould release membrance or second adhesive layer is formed into first adhesive layer.
8. the manufacture method of circuit board as claimed in claim 6, it is characterised in that：Form concretely comprising the following steps for second adhesive layer：One or more in isoprene rubber, styrene butadiene ribber, ethylene propylene rubber, butyl rubber, acrylic rubber or polybutadiene rubber are dissolved in into toluene to prepare second adhesive, and second adhesive is coated into first adhesive layer second adhesive layer is formed away from the dry tack free of mould release membrance.
9. the manufacture method of circuit board as claimed in claim 6, it is characterised in that：The substrate also includes a dielectric layer, and two first adhesive layers in each bonding film are combined with the dielectric layer of two substrates respectively.
10. the manufacture method of circuit board as claimed in claim 6, it is characterised in that：The gross thickness of two first adhesive layer is the 0.1% ~ 20% of the bonding film thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510590296.1A CN106550530A (en) | 2015-09-17 | 2015-09-17 | Circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510590296.1A CN106550530A (en) | 2015-09-17 | 2015-09-17 | Circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106550530A true CN106550530A (en) | 2017-03-29 |
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ID=58362755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510590296.1A Pending CN106550530A (en) | 2015-09-17 | 2015-09-17 | Circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN106550530A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113784548A (en) * | 2021-08-10 | 2021-12-10 | 深圳市信维通信股份有限公司 | Preparation method of sandwich adhesive layer and preparation method of multilayer circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003243788A (en) * | 2002-02-20 | 2003-08-29 | Alps Electric Co Ltd | Printed wiring board and manufacturing method of the same |
| CN103379750A (en) * | 2012-04-27 | 2013-10-30 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
| US20140318698A1 (en) * | 2010-03-04 | 2014-10-30 | Rogers Corporation | Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof |
-
2015
- 2015-09-17 CN CN201510590296.1A patent/CN106550530A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003243788A (en) * | 2002-02-20 | 2003-08-29 | Alps Electric Co Ltd | Printed wiring board and manufacturing method of the same |
| US20140318698A1 (en) * | 2010-03-04 | 2014-10-30 | Rogers Corporation | Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof |
| CN103379750A (en) * | 2012-04-27 | 2013-10-30 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113784548A (en) * | 2021-08-10 | 2021-12-10 | 深圳市信维通信股份有限公司 | Preparation method of sandwich adhesive layer and preparation method of multilayer circuit board |
| CN113784548B (en) * | 2021-08-10 | 2024-04-16 | 深圳市信维通信股份有限公司 | Sandwich adhesive layer preparation method and multilayer circuit board preparation method |
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Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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Application publication date: 20170329 |