CN1064722C - 一种用于甲磺酸铅、锡电镀液的光亮整平剂 - Google Patents
一种用于甲磺酸铅、锡电镀液的光亮整平剂 Download PDFInfo
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Abstract
本发明涉及一种用于甲磺酸铅锡电镀液的光亮整平剂,由溶剂、主辅光亮剂和表面活性剂组成。其中的溶剂为水和水溶性醇,其中的主光亮剂为醛类化合物,其中的辅助光亮剂为酚,其中的表面活性剂为烷基酚聚氧乙烯醚,配制时先将主、辅光亮剂按比例溶于醇中,同时按比例把表面活性剂溶于水中,然后将水溶液与醇溶液按比例混合即得光亮整平添加剂。采用本发明的光亮整平剂,长时间电镀后,镀层致密、均匀,结合力强。
Description
本发明涉及一种用于甲磺酸铅、锡电镀液的光亮整平剂,属电镀技术领域。
在铜基上镀铅、锡或铅锡合金,广泛地应用于电子、机械等行业中。传统的铅锡电镀方法是利用氟硼酸及其铅、锡盐作为电镀液,这种电镀液能满足一般的电镀要求,但是用这种电镀液得到的镀层结晶粗糙、疏松,工艺性能较差,而且这种电镀液对设备有很强的腐蚀作用,电镀过程中产生的氟化氢有剧毒,造成很严重的环境污染。近年来开发的甲磺酸铅、甲磺酸锡电镀液,镀层致密、均匀,是目前比较理想的电镀液。但是,这种电镀液必须加入合适的光亮整平剂,才能得到光亮、平滑的镀层表面。目前国内使用的光亮整平剂,长时间电镀后镀层表面粗糙,有镀瘤产生。
本发明的目的是提供一种用于甲磺酸铅、甲磺酸锡电镀液的光亮整平剂,在甲磺酸铅、甲磺酸锡中加入这种光亮整平剂,即使长时间电镀之后,镀层表面仍光亮平滑,没有镀瘤产生。
本发明的用于甲磺酸铅、锡电镀液的光亮整平剂,由溶剂、主辅光亮剂和表面活性剂三部分组成;
其中的溶剂为水和水溶性醇,醇可以是甲醇、乙醇、丙醇、异丙醇、乙二醇、丙三醇、二甘醇、仲丁醇、聚乙二醇等,其中的一种或一种以上,在光亮整平剂中水含量为60~90%,醇含量为5~10%;
其中的主光亮剂为醛类化合物,醛类化合物可以是甲醛、乙醛、苯甲醛、萘甲醛、茴香醛、戊二醛,加入量为光亮剂总量的0.1~3%;
其中的辅助光亮剂为酚,酚类化合物可以是对二苯酚、2,6二叔丁基对甲酚、双酚A等。辅助光亮剂的加入量为光亮剂总量的0.3~2%;
其中的表面活性剂为烷基酚聚氧乙烯醚,加入量为光亮剂总量的10~20%。
配制时先将主、辅光亮剂按比例溶于醇中,同时按比例把表面活性剂溶于水中,然后将水溶液与醇溶液按比例混合即得光亮整平添加剂。在电镀液中,光亮剂的加入量,视电镀液中铅锡离子的浓度和电流密度而进行调整。
电镀过程实际上就是一种电解还原过程,金属离子在阴极上还原为金属附在电极表面成为镀层。在电镀过程中,在电流密度较大的情况下,电极周围会形成浓差极化,电极表面微突起处扩散层厚度比微凹处扩散层小,因此,突起处离子还原速度快,金属沉积速度也快,因而使得凹凸差距更加扩大,结果导致电镀表面凹凸不平,结晶松散,严重时会引起晶须和镀瘤。为防止这种现象发生,可以在电镀液中加入金属络合离子,控制离子移动的速度。也可以加入添加剂改善溶液的性质,使金属离子在凸起处受阻,在凹下部位并不受到很大的影响,这种添加剂就是光亮整平剂。本发明就是用于甲磺酸铅、甲磺酸锡的光亮整平剂。采用本发明的光亮整平剂,长时间电镀后,镀层致密、均匀,结合力强。
下面介绍本发明的实施例:
将不同比例的光亮剂原料调配成配方1-4,在一定条件下电镀,同时与已有定型光亮剂进行比较实验。
1、按不同比例配制光亮整平剂
配方1 | 水75 | 二甘醇7 | 苯甲醛1 | 2.6二叔丁基对甲酚1 | 烷基酚聚氧乙烯醚16 |
配方2 | 水77 | 异丙醇8 | 茴香醛0.5 | 双酚A0.5 | 烷基酚聚氧乙烯醚14 |
配方3 | 水78 | 乙二醇8.5 | 戊二醛0.8 | 2.6二叔丁基对甲酚0.7 | 烷基酚聚氧乙烯醚12 |
配方4 | 水77 | 丙三醇10 | 萘甲醛2 | 双酚A1 | 烷基酚聚氧乙烯醚10 |
2、电镀条件
电流密度:2-3 A/dm2
电镀时间:48小时
铅锡浓度:2g/l
光亮整平剂加入量:每升电镀液中含光亮整平剂60毫升。
3、电镀结果:用铜棒作阴极,按上述条件配制电镀液,电镀48小时后,实施例1、2、3表面细致、光亮、均匀,没有镀瘤。实施例4镀层表面有少量镀瘤。同样条件下电镀,已有定型光亮剂也有镀瘤产生。
Claims (1)
1、一种用于甲磺酸铅、锡电镀液的光亮整平剂,其特征在于,该光亮整平剂由溶剂、主辅光亮剂和表面活性剂三部分组成;
其中的溶剂为水和水溶性醇,醇为异丙醇、乙二醇、丙三醇,其中的一种或一种以上,光亮整平剂中水含量为60~90%,醇含量为5~10%;
其中的主光亮剂为醛类化合物,醛类化合物为苯甲醛、萘甲醛、茴香醛中的任何一种,加入量为光亮剂总量的0.1~3%;
其中的辅助光亮剂为酚,酚类化合物可以是2,6二叔丁基对甲酚、双酚A,辅助光亮剂的加入量为光亮剂总量的0.3~2%;
其中的表面活性剂为烷基酚聚氧乙烯醚,加入量为光亮剂总量的10~20%;
配制时先将主、辅光亮剂按比例溶于醇中,同时按比例把表面活性剂溶于水中,然后将水溶液与醇溶液按比例混合即得光亮整平添加剂。
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JP3523556B2 (ja) * | 2000-02-28 | 2004-04-26 | 古河電気工業株式会社 | メッキ方法 |
US6730209B2 (en) * | 2002-02-22 | 2004-05-04 | Lucent Technologies Inc. | Solder electroplating bath including brighteners having reduced volatility |
CN100457977C (zh) * | 2004-08-03 | 2009-02-04 | 上海新阳半导体材料有限公司 | 一种无铅纯锡电镀添加剂及其制备方法 |
CN102304732B (zh) * | 2011-08-22 | 2013-05-01 | 武汉吉和昌化工科技有限公司 | 耐高温光亮镀锡光亮剂 |
CN103008530A (zh) * | 2012-12-21 | 2013-04-03 | 安徽中兴华汉机械有限公司 | 铝合金泡沫模表面光亮剂及其制造方法 |
Citations (3)
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JPS5967387A (ja) * | 1982-10-08 | 1984-04-17 | Hiyougoken | すず、鉛及びすず―鉛合金メッキ浴 |
JPS59182986A (ja) * | 1983-04-01 | 1984-10-17 | Keigo Obata | スズ、鉛及びすず−鉛合金メツキ浴 |
JPH10102276A (ja) * | 1996-09-30 | 1998-04-21 | Mitsubishi Materials Corp | 鉛及び鉛−錫合金めっき浴 |
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JPS5967387A (ja) * | 1982-10-08 | 1984-04-17 | Hiyougoken | すず、鉛及びすず―鉛合金メッキ浴 |
JPS59182986A (ja) * | 1983-04-01 | 1984-10-17 | Keigo Obata | スズ、鉛及びすず−鉛合金メツキ浴 |
JPH10102276A (ja) * | 1996-09-30 | 1998-04-21 | Mitsubishi Materials Corp | 鉛及び鉛−錫合金めっき浴 |
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