CN106469695A - Electronic electric equipment - Google Patents
Electronic electric equipment Download PDFInfo
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- CN106469695A CN106469695A CN201610498844.2A CN201610498844A CN106469695A CN 106469695 A CN106469695 A CN 106469695A CN 201610498844 A CN201610498844 A CN 201610498844A CN 106469695 A CN106469695 A CN 106469695A
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- Prior art keywords
- conductor
- radiator
- fin
- noise reduction
- housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The electronic electric equipment of the present invention, by using the Sheet Conductor as noise reduction conductor, makes the fin part of radiator and housing contact and be conducted, and thus suppresses the generation of such resonance in conventional example.If enumerating specific example, the Sheet Conductor then reducing in noise arranges one or more protuberance, by this protuberance being inserted the gap between the fin part of radiator and housing, fin part and housing to make radiator are turned on Low ESR via the Sheet Conductor that noise reduces, and the Sheet Conductor that noise is reduced is fixed to this position in the gap between the fin part of embedded radiator and housing.
Description
Technical field
The present invention relates to the electronic electric equipment of the radiated noise being produced by electronic electric equipment can be reduced.
Background technology
In recent years, due to being equipped on high speed of the quasiconductor of electronic electric equipment etc., produced by electronic electric equipment
Radiated noise problem has been become to the impact that other electronic electric equipments bring.Give other because of this radiated noise
The impact that electronic electric equipment brings is referred to as EMI (Electro Magnetic Interference：Electromagnetism is done
Disturb), mainly can cause wireless device, the reception obstacle of communication equipment, the misoperation of electronic electric equipment.
For this reason, the difference in 30MHz～1GHz or according to the frequency using for the various countries, in its above frequency band,
The radiated noise being produced by electronic electric equipment is specified.
For the radiated noise suppressing electronic electric equipment to produce, widely use following methods, that is,：Using metal,
The shield shell of the resin after electroconductive resin, plating etc. comes circuit substrate in overlay electronic electrical equipment, module
The noise radiation such as wiring, radiator source.However, cover the method in noise radiation source using shield shell in, screen
Cover performance and the property taken into account of cooling performance becomes problem.
On the other hand, in following shown patent documentations 1 it is proposed that for raising heat dispersion outside housing
Week forms fin structure, the method thus to improve cooling performance.
Additionally, radiated noise occurs to become higher level under resonance or the frequency of standing wave in noise radiation source.As
For the radiated noise suppressing method of this characteristic, propose minimizing in patent documentation 2 described below by radiator
The method of the radiated noise producing.
Fig. 1 is to represent the state producing electromagnetic coupled between the radiator of existing known electronic electric equipment and housing
Figure.Fig. 2 is to represent that in the existing structures case shown in Fig. 1, intensity of radiation electric field is (by the electricity between radiator and housing
The resonance peak that magnetic coupling causes) observation example figure.
In Fig. 1 and Fig. 2, the noise component(s) producing because of the switch of semiconductor element 100 passes via parasitic capacitance
Transport to radiator 200.Now, due to radiator near metal shell electromagnetic coupled 350, thus dissipate
Resonance is produced between hot device 200 and housing 300.Then, under this resonant frequency, transmit to radiator 200
Noise component(s) produce larger electric field oscillation, thus being observed in outside as the radiated noise of higher level
Arrive.
Fig. 2 illustrates that the peak value under this state, 120MHz is seen as because of the above-mentioned electric field component being caused by resonance
Measure.
Fig. 3 is the figure of the state of standing wave producing in the radiator represent existing known electronic electric equipment.As figure
Shown in 3, if the noise being produced by semiconductor element (switch element) 100 passes through electrostatic capacitance with radiator 200
Etc. carrying out electric coupling, then the radiator 200 as conductor plays the effect of the antenna producing radiated noise.
Then, the size in radiator 200 becomes under the frequency of the 1/2 of wavelength, produces standing wave in radiator 200
400, the radiation efficiency of radiated noise improves.
As the countermeasure for consequent radiated noise it is proposed that following method, that is,：By designing radiator
Conductive path length so that noise radiation source is not covered by seal casinghousing, the basilar parts of radiator will not produce
Standing wave, thus to reduce the radiation efficiency of radiated noise itself.
Additionally, it is proposed that reducing semiconductor power switch element and radiator in following shown patent documentations 3
Between parasitic capacitance, or improve the resistance between radiator and the housing of inverter, thus to suppress because higher
Change in voltage and the leakage current that causes, the method reducing radiated noise.
As described above, in configuring semiconductor element (for example, thyristor), radiating successively from top to bottom
In device, the structure of existing electronic electric equipment of housing, produced radiated noise can be further because radiator
Electromagnetic coupled and between housing and produce larger radiated electric field in radiator it is therefore desirable to reduce this radiated noise
Method.
Patent documentation 1：Japanese Patent Laid-Open 2006-049555 publication
Patent documentation 2：Japanese Patent Laid-Open 2008-103458 publication
Patent documentation 3：No. 3649259 publications of Japanese Patent No.
Content of the invention
It is an object of the invention to provide a kind of electronic electric equipment, can be greatly decreased by including semiconductor element
The radiated noise that part, radiator, the electronic electric equipment of the configuration of housing produce.
To achieve these goals, the electronic electric equipment of the present invention possesses semiconductor element, to this semiconductor element
The radiator that cooled down of heating and the housing being formed by conductive material, described radiator is by electric conductivity material
Material is formed, and has following structures：In a face configuring semiconductor element of its basilar part, erect in contrary face
It is provided for improving the fin part of cooling performance, possess between described radiator and described housing for dissipating to described
Resonance between hot device and described housing section suppressed or high frequency electroconductive member.
Additionally, in order to be suppressed or high frequency to the resonance between described radiator and described housing section, possess and make
Described radiator contacts such radiator and the configuration of housing or the shape of radiator with described housing face.
Thereby, it is possible to simply and efficiently reduce dissipating of the semiconductor element surrounding the occurring source as heat and electromagnetic wave
The coherent radiation noise of hot device and shell structure.
Brief description
Fig. 1 is to represent the state producing electromagnetic coupled between the radiator of existing known electronic electric equipment and housing
Figure.
Fig. 2 is to represent that in the existing structures case shown in Fig. 1, intensity of radiation electric field is (by the electromagnetism between radiator and housing
Couple the resonance peak that causes) observation example figure.
Fig. 3 is the figure of the state of standing wave producing in the radiator represent existing known electronic electric equipment.
Fig. 4 is fin part and the shell of the radiator representing the electronic electric equipment involved by embodiments of the present invention 1
Body carries out the figure of the structure of face contact via noise reduction with conductor.
Fig. 5 is the reduction of intensity of radiation electric field in the electronic electric equipment representing involved by embodiments of the present invention 1
The figure of effect.
Fig. 6 is fin part and the shell of the radiator representing the electronic electric equipment involved by embodiments of the present invention 2
Body carries out the figure of the structure of face contact via noise reduction with conductor (for example, electrically conductive plate).
Fig. 7 is fin part and the shell of the radiator representing the electronic electric equipment involved by embodiments of the present invention 3
Body carries out the figure of the structure of face contact via noise reduction with conductor (for example, conductive lining).
Fig. 8 be the radiator representing the electronic electric equipment involved by embodiments of the present invention 4 fin part in warp
By carry out in the side crossing multiple protuberances upwardly extending noise reduction conductor face contact structure (one of) figure.
Fig. 9 be the radiator representing the electronic electric equipment involved by embodiments of the present invention 4 fin part in warp
Figure by the structure (two) carrying out face contact in the side crossing multiple protuberances upwardly extending noise reduction conductor.
Figure 10 is in the fin part of the radiator representing the electronic electric equipment involved by embodiments of the present invention 4
Via the structure (three) carrying out face contact in the side crossing multiple protuberances upwardly extending noise reduction conductor
Figure.
Figure 11 is the electronics with the side connecting housing and radiator representing involved by embodiments of the present invention 5
Reduce with leading via in the perpendicular upwardly extending noise in side in side that connects with housing and radiator in electrical equipment
Body carry out face contact structure (one of) figure.
Figure 12 is the electronics with the side connecting housing and radiator representing involved by embodiments of the present invention 5
Reduce with leading via in the perpendicular upwardly extending noise in side in side that connects with housing and radiator in electrical equipment
Body carries out the figure of the structure (two) of face contact.
Figure 13 is the electronics with the side connecting housing and radiator representing involved by embodiments of the present invention 5
Reduce with leading via in the perpendicular upwardly extending noise in side in side that connects with housing and radiator in electrical equipment
Body carries out the figure of the structure (three) of face contact.
Specific embodiment
Below, referring to the drawings embodiments of the present invention are illustrated.
[embodiment 1]
Fig. 4 is that the fin part of the radiator representing the electronic electric equipment involved by embodiments of the present invention 1 (dissipates
Hot portion) carry out the figure of the structure that face contacts with conductor via noise reduction with housing.That is, Fig. 4 (A) to Fig. 4
(D) illustrate that semiconductor element 10 in present embodiment, radiator 20, housing 30 and noise reduce with leading
The configuration relation of body 41～44 is as (A) example 1～(D) example 4.
If being specifically described further, example 1-1 shown in Fig. 4 (A-1), Fig. 4 (A-2), example 1-2,
And in the example 2 shown in Fig. 4 (B), by making fin part (radiating part) 24 and the housing 30 of radiator 20
Contact to carry out electrically conducting via carrying out face with the Sheet Conductor 41,41 ' of conductor as noise reduction, thus come
The generation of suppression resonance.
In addition, example 1-2 shown in Fig. 4 (A-2) except forming the one side in radiator portion 24 using the flat board crawling
Outside essentially identical with the example shown in example 1-1.
In Fig. 4 (A-1), Fig. 4 (A-2) and Fig. 4 (B), the Sheet Conductor 41,41 ' reducing in noise is arranged
Protuberance, by embed it in the gap between the fin of radiator 20 so that fin part 24 and housing 30 via
The Sheet Conductor 41 that noise reduces is turned on Low ESR, and the Sheet Conductor 41,41 ' that noise is reduced
It is fixed on the position of diagram.
In example 1-1 shown in Fig. 4 (A-1), Fig. 4 (A-2), example 1-2, the Sheet Conductor 41 of noise reduction,
Set protuberance only one of which in 41 ', but the example 2 as shown in Fig. 4 (B), in the plate of noise reduction
The protuberance of more than 2 can be set in shape conductor 42.
Additionally, in the example 3 shown in Fig. 4 (C), the Sheet Conductor 43 that noise reduces is set to substantially U-shaped
Shape, and the substantially u-shaped opposite site in Sheet Conductor 43 has radian and sandwiches the wing of radiator 20
Gap between piece, other positions without radian are contacted with housing 30 face, so that fin part 24 and housing
30 are turned on Low ESR via the Sheet Conductor 43 that noise reduces, and the Sheet Conductor being reduced using noise
The Sheet Conductor 43 that noise reduces is fixed on the position of diagram by 43 counteracting force.
Additionally, as the method for fixed conductor, can the example 4 as shown in Fig. 4 (D), using screw 80,
Or bonding agent, electric conductivity adhesive tape, conductive paste etc. are fixed on the structure of housing 30 it is also possible to reduce noise
Sheet Conductor 44 embeds the structure (not shown) of housing 30.
Fig. 4 (A) of illustrated example～Fig. 4 (D) only example, and make radiating using noise reduction conductor
It is of paramount importance that device carry out face to contact for implementing the present invention in Low ESR mode with housing.Radiated by reducing
Contact impedance between device and housing, can be adequately suppressed resonance.On the other hand, exist as resonance Retraining Measures
For insufficient situation, such as in the case of connecting radiator and housing with fine rule, its contact impedance becomes big,
Enough resonance inhibitions cannot be obtained, or difference according to circumstances and increase fine rule, thus lead to produce meaning
Resonance outside material etc..
The material of the therefore Sheet Conductor that noise reduces is preferably the relatively low material of surface impedance, but not especially
Restriction, can be for example aluminium sheet or copper coin.It can also be the material that only surface is formed by conductive material
Material, electric conductivity cloth, electric conductivity adhesive-bonded fabric, the such composite of conductivity silicon rubber.
In addition, above-mentioned Fig. 4 (A) is to be showed by the sectional view observed from front to Fig. 4 (D), though
So illustrated, but when side is observed, the protuberance of noise reduction conductor have with shown in Fig. 1, Fig. 3
What the side of radiator was corresponding extends to the planar portions of inner side.
Fig. 5 is the reduction of intensity of radiation electric field in the electronic electric equipment representing involved by embodiments of the present invention 1
The figure of effect.That is, Fig. 5 pass through by the inhibition of the radiated noise of present embodiment (with reference to Fig. 5 (A)) with
The radiated noise producing in existing structure shown in Fig. 2 is compared (with reference to Fig. 5 (B)) to represent, according to this
Figure understands, by applying present embodiment, represents in the Fig. 2 of external radiation electric field intensity in existing structure and is produced
Peak component near raw 120MHz is minimized.
[embodiment 2]
Fig. 6 is that the fin part of the radiator representing the electronic electric equipment involved by embodiments of the present invention 2 (dissipates
Hot portion) carry out the figure of the structure that face contacts with conductor (for example, electrically conductive plate) via noise reduction with housing.That is,
Fig. 6 (A) to Fig. 6 (C) illustrate semiconductor element 10 in present embodiment, radiator 20, housing 30, with
And the noise reduction configuration relation of conductor 51～53 is using as (A) example 1～(D) example 3.Radiator 20
The bottom surface of fin part (radiating part) 24 and housing 30 are by the electrically conductive plate 51～53 as noise reduction conductor
Carrying out face contact, thus conducting, thus suppressing above-mentioned resonance.
In Fig. 6 (A), the electrically conductive plate 51 reducing in noise arranges curved protrusion, by joining this curved protrusion
Put the space between the bottom surface of fin part 24 of radiator and housing 30, to make bottom surface and the shell of fin part 24
Body 30 is turned on Low ESR via the electrically conductive plate 51 that noise reduces, and the electrically conductive plate that noise is reduced
51 positions being fixed on diagram.
In Fig. 6 (B), the electrically conductive plate 52 reducing in noise arranges multiple curved protrusion, by will be convex for this bending
Space between the bottom surface of fin part 24 and housing 30 for portion's configuration, to make bottom surface and the housing 30 of fin part 24
Turned on Low ESR via the electrically conductive plate 52 that noise reduces, and the electrically conductive plate 52 that noise is reduced is fixed
Position in diagram.
In Fig. 6 (C), the electrically conductive plate 53 that noise is reduced is bent into U-shaped, by being configured in fin
The space of the bottom surface in portion 24 and housing 30, to make the bottom surface of fin part 24 and housing 30 reduces via noise
Electrically conductive plate 53 is turned on Low ESR, and the electrically conductive plate 53 that noise is reduced is fixed on the position of diagram.
The fixing meanss of the electrically conductive plate reducing as noise, show in Fig. 6 (A) to Fig. 6 (C) and utilize leaf spring
Counteracting force and be fixed in example between the fin part 24 of radiator and housing 30 but it is also possible to be making
It is fixed on the structure of housing 30 with screw, bonding agent and electric conductivity adhesive tape, conductive paste etc., or by noise
The electrically conductive plate 51～53 reducing embeds the structure (not shown) of housing 30.
Additionally, the material of the electrically conductive plate that noise is reduced, although not special as embodiment 1
Limit, but preferably use the relatively low material of contact impedance.
That is, same with embodiment 1, to reduce contact impedance between the fin part 24 of radiator and housing 30
Mode is non-for obtaining enough noise reduction to form and to configure the electrically conductive plate 51～53 that noise reduces
Often important.
[embodiment 3]
Fig. 7 is that the fin part of the radiator representing the electronic electric equipment involved by embodiments of the present invention 3 (dissipates
Hot portion) carry out the figure of the structure that face contacts with conductor (for example, conductive lining) via noise reduction with housing.
That is, Fig. 7 (A) to Fig. 7 (C) illustrate semiconductor element 10 in present embodiment, radiator 20, housing 30,
And the noise reduction configuration relation of conductor 61～63 is as (A) example 1～(D) example 3.Radiator 20
The bottom surface of fin part 24 and housing 30, or the side of fin part 24 of radiator 20 and the bottom of fin part 24
Face and housing 30 are by carrying out face as noise reduction with electric conductivity (for example, metal) substrate 61～63 of conductor
Contact, thus conducting, thus to suppress above-mentioned resonance.That is,
In Fig. 7 (A), by conductive lining 61 being configured bottom surface and the housing 30 of the fin part 24 in radiator
Space, so that the conductive lining 61 that the bottom surface of fin part 24 is reduced with noise is turned on Low ESR, and general
The conductive lining 61 that noise reduces is fixed on the position of diagram.
In Fig. 7 (B), by by space between the fin part 24 of radiator 20 for the conductive lining 62 and
The bottom surface of fin part 24 of radiator 20 and the space of housing 30 are configured to L-shaped, make the bottom surface of fin part 24
The conductive lining 62 being reduced with noise is turned on Low ESR, and the conductive lining 62 that noise is reduced
It is fixed on the position of diagram.
In Fig. 7 (C), by two different fins of the fin part 24 in radiator 20 by conductive lining 63
The bottom surface of fin part 24 of the space between portion 24 and radiator 20 and the space of housing 30 are configured to U
Font, makes the conductive lining that the fin side surface part of the fin part 24 of radiator 20 and bottom surface are reduced with noise
63 with Low ESR conducting, and the conductive lining 63 that noise is reduced is fixed on the position of diagram.
Here, it is shown with conductive lining 61～63 as the example of noise reduction conductor.In the case of being somebody's turn to do,
Conductive material is identical with embodiment 1 and embodiment 2, has no particular limits, but preferably contact impedance is relatively
Low material, can be the electric conductivity with thickness and elasticity for imbedding the space between above-mentioned fin part 24
Silicone rubber, electric conductivity cloth, electric conductivity adhesive-bonded fabric etc..
That is, same with embodiment 1 and embodiment 2, to reduce fin part 24 and the housing of radiator 20
The mode of the contact impedance between 30 is sufficient for obtaining to form and to configure the conductive lining 61～63 that noise reduces
Enough noise reduction are extremely important.
[embodiment 4]
Fig. 8 is via crossing radiator in the electronic electric equipment representing involved by embodiments of the present invention 4
Side's upwardly extending noise reduction conductor of the jog of fin part carry out face contact structure (one of) figure.
That is,
Fig. 8 (A) of present embodiment and Fig. 8 (B) is the Fig. 4 (B) and Fig. 4 (C) for embodiment 1, by noise
Reduction conductor 42 ', 43 ' configures in the structure in order to obtain strong noise reducing effect and required ad-hoc location.
That is, Fig. 8 (A) and Fig. 8 (B) has following characteristics with respect to above-mentioned Fig. 4 (B) and Fig. 4 (C)：In noise fall
Low multiple protuberances with setting on the long side direction of conductor are configured to cross the many of the fin part (radiating part) of radiator
Individual protuberance, this is the structure in order to obtain strong noise reducing effect and required noise reduction conductor.
Here, if the reasons why can obtain strong noise reducing effect to above-mentioned configuration structure illustrates, radiator
20 fin part 24 has multiple protuberances, produces close electromagnetic coupled between protuberance close to each other, this meeting
Become the fin part (radiating part) 24 leading to radiator inductively, electrostatic coupling increase major reason.
Due to this radiator fin part (radiating part) 24 inductively, electrostatic coupling, and Fig. 1 (B) shown in
Existing radiator and housing between electromagnetic coupled, thus producing in the fin part (radiating part) of radiator and housing
Raw resonance.
In present embodiment, configured with set multiple protuberances in conductor 42 ', 43 ' by using noise reduction
For crossing the fin part of radiator, thus the inductance producing in reducing the fin part (radiating part) 24 of this radiator,
Electric capacity, and by making the wing of radiator with set multiple protuberances in conductor 42 ', 43 ' via noise reduction
Piece portion (radiating part) 24 carries out face with housing 30 and contacts such that it is able to suppress the fin part (radiating part) of radiator
Resonance and between housing.
Fig. 9 is the fin part making radiator in the electronic electric equipment representing involved by embodiments of the present invention 4
(radiating part) carries out, via the noise reduction extending on long side direction, structure (it that face contacts with housing with conductor
Two) figure.That is,
The configuration example (two) of the present embodiment shown in Fig. 9 is with respect to the embodiment 2 shown in above-mentioned Fig. 6
Configuration example, by noise reduction conductor 51 '～53 ' configuration in order to obtain strong noise reducing effect and required spy
Positioning postpones and obtains.
This configuration and above-mentioned Fig. 8 configuration example (one of) identical, there are following characteristics, that is,：Noise is reduced and uses
On the long side direction of conductor 51 '～53 ', set curved protrusion is configured to cross the fin part of radiator 20 and (dissipates
Hot portion), its effect also with the configuration example of above-mentioned Fig. 8 (one of) identical.
In addition, noise reduction conductor 52 ' is divided into two and with the center with regard to becoming radiator in Fig. 9 (B)
Position mode point-symmetrically is configured, but as long as will be set many on the long side direction of noise reduction conductor
Individual curved protrusion is configured to cross the fin part (radiating part) of radiator 20, and the quantity of conductor is not limited to figure
The example shown.
Additionally, especially not illustrated corresponding to the embodiment of Fig. 6 (B), but with Fig. 9 (A) or Fig. 9 (B) phase
With as long as set single or multiple curved protrusion on the long side direction of noise reduction conductor are configured to cross
The fin part (radiating part) of radiator 20.
Here, Fig. 9 (D) be Fig. 6 embodiment 2 in mode (not shown), but its configuration example and noise reduce
Effect is similar with Fig. 9 (C), and it the difference is that only and is formed as the fin part for being fixed to radiator and housing
Between the applying direction of the counteracting force of leaf spring the becoming noise reduction conductor shape different from Fig. 9 (C).
Figure 10 is the fin part making radiator in the electronic electric equipment representing involved by embodiments of the present invention 4
(radiating part) carries out, via the noise reduction extending on long side direction, structure (it that face contacts with housing with conductor
Three) figure.That is,
The configuration example (three) of the present embodiment shown in Figure 10 is with respect to the embodiment shown in above-mentioned Fig. 7
3 configuration example, by noise reduction conductor 60 ', 61 ' configuration in order to obtain strong noise reducing effect and required
Obtain after ad-hoc location.
This configuration and above-mentioned Fig. 8 configuration example (one of) and the configuration example (two) of Fig. 9 identical, have following
Feature, that is,：It is configured so that the long side direction of noise reduction conductor 60 ', 61 ' crosses the fin of multiple radiators
Portion's (radiating part), its noise reduction is also same as described above.
Additionally, especially not illustrated corresponding to the embodiment of Fig. 7 (B) or Fig. 7 (C), but with Figure 10 (A)
Or Figure 10 (B) is identical, as long as being configured so that the long side direction of noise reduction conductor crosses the wing of multiple radiators
Piece portion (radiating part).
In addition, above-mentioned shown noise reduction conductor 60 ', 61 ' " is configured to cross the fin of multiple radiators
Portion's (radiating part) ", and in order to suppress the transmission of noise component(s) producing because of the switch of semiconductor element, preferably
" being configured to overlap with the underface of the semiconductor element after encapsulation ", and " it is configured to the central authorities with radiator
Portion overlaps ".
[embodiment 5]
Figure 11～Figure 13 is the side with connection housing and radiator representing involved by embodiments of the present invention 5
Electronic electric equipment in via with housing and radiator connect the perpendicular side's upwardly extending noise fall in side
The figure of the low structure carrying out face contact with conductor.
Configuration example involved by embodiments of the present invention 5 shown in Figure 11～Figure 13 one of (～three) is relatively
In above-mentioned embodiment 1～3, there are following characteristics, that is,：Can subtract while maintaining strong noise reducing effect
The area of few noise reduction conductor and amount.That is, in above-mentioned embodiment 1～3, scattered in order to increase as far as possible
Hot device and the contact area of housing, if increasing noise reduction conductor, can be expected that acquisition strong noise reducing effect.
If however, excessively increasing noise reduction conductor, cost increase can be produced, manufacturing is deteriorated, design freedom
The trade-off problem such as decline.
One of (～three) in order to overcome the problems referred to above however, configuration example involved by embodiments of the present invention 5,
By using the brand-new configuration with noise reduction such that it is able to maintain strong noise reducing effect while,
Reduce area and the amount of noise reduction conductor.That is,
Figure 11 (A) and Figure 11 (B) is with respect to the Fig. 4 (B) and Fig. 4 (C) representing embodiment 1, and noise is reduced
With conductor 42 ', 43 ' configuration in order to obtain strong noise reducing effect and required ad-hoc location structure (one of).
That is, Figure 11 (A) and Figure 11 (B) has following characteristics with respect to Fig. 4 (B) and Fig. 4 (C), that is,：Being configured to will
The long side direction of noise reduction conductor 42 ', 43 ' is configured to hang down with the side phase being connected with radiator connecting portion of housing
Directly.Thus, it is possible to obtain strong noise reducing effect.Below its reason is illustrated.
What the noise component(s) producing because of the switch of semiconductor element 10 produced via between semiconductor element and encapsulation posts
Give birth to electric capacity and transmit to radiator 20.Now, in existing structure, due to radiator near metal shell
Electromagnetic coupled and produce resonance, thus producing larger electric field oscillation in radiator and housing.
However, in the structure involved by embodiments of the present invention 5 shown in Figure 11～Figure 13, by this electric field
Vibrate the potential difference causing to produce between idiostatic part electrically can be considered.
Therefore, produce although can produce according to its electrical length on the side being connected with radiator connecting portion of housing
Standing wave, but will not produce by the electric field oscillation that causes of electromagnetic coupled producing between radiator and housing.
In structure involved by embodiments of the present invention 5, by using joining shown in Figure 11 (A) or Figure 11 (B)
Put structure to insert noise reduction conductor 42 ', 43 ', due to housing 31 be connected with radiator connecting portion
The perpendicular direction in side on also create and electrically can be considered idiostatic face such that it is able to suppression electric field shakes
Dynamic.
Thus, by noise reduction conductor is inserted using the configuration structure shown in Figure 11 (A) or Figure 11 (B)
42 ', 43 ', due to housing be connected with radiator connecting portion edge direction and perpendicular direction this two
Electric field oscillation is inhibited such that it is able to suppress resonance on individual direction.
Figure 12 is the electronics with the side connecting housing and radiator representing involved by embodiments of the present invention 5
Reduce with leading via in the perpendicular upwardly extending noise in side in side that connects with housing and radiator in electrical equipment
Body carries out the figure of the structure (two) of face contact.
That is, in configuration example (two), Figure 12 (A) and Figure 12 (B) is with respect to above-mentioned expression embodiment 2
Fig. 6 (A) noise reduction conductor 51 '～53 ' is configured in order to obtain strong noise reducing effect and required spy
Position the structure put, Figure 12 (C) be with respect to above-mentioned expression embodiment 2 Fig. 6 (C) by noise reduction conductor
51 '～53 ' configurations are in the structure in order to obtain strong noise reducing effect and required ad-hoc location.
This configuration is identical with above-mentioned Figure 11, has following characteristics, that is,：By noise reduction conductor 51 '～53 '
Long side direction be configured to housing be connected with radiator connecting portion side perpendicular, its noise reduction also with upper
State identical.
In addition, being divided into two to be configured with conductor 52 ' noise reduction in Figure 12 (B), but as long as by noise
The long side direction of reduction conductor 52 ' be configured to housing 31 be connected with radiator connecting portion side perpendicular i.e.
Can, the quantity of conductor is not limited to illustrated example.
Additionally, with regard to corresponding to Fig. 6 (B) although embodiment especially do not illustrated, with Figure 12 (A)
Or Figure 12 (B) is identical, as long as the long side direction of noise reduction conductor being configured to and being connected with radiator connecting portion
Side perpendicular.
Here, Figure 12 (D) be above-mentioned Fig. 6 embodiment 2 in mode (not shown), but its configuration example and noise
Reducing effect is similar with Figure 12 (C), its difference is that only be formed as the fin part that is fixed to radiator with
The applying direction of the counteracting force of leaf spring becoming noise reduction conductor between housing 31 is different from Figure 12 (C)
Shape.
Figure 13 is the electronics with the side connecting housing and radiator representing involved by embodiments of the present invention 5
Reduce with leading via in the perpendicular upwardly extending noise in side in side that connects with housing and radiator in electrical equipment
Body carries out the figure of the structure (three) of face contact.
That is, Figure 13 (A) and Figure 13 (B) is the Fig. 7 (A) with respect to above-mentioned expression embodiment 3, and noise is reduced
Obtained after required ad-hoc location to obtain strong noise reducing effect with conductor 60 ', 61 ' configuration.
This configuration is identical with above-mentioned Figure 11 or Figure 12, has following characteristics, that is,：By noise reduction conductor 60 ',
61 ' long side direction be configured to housing 31 be connected with radiator connecting portion side perpendicular, its noise reduce effect
Fruit is also same as described above.
Additionally, corresponding to Fig. 7 (B) or Fig. 7 (C) although embodiment especially do not illustrated, with Figure 13 (A)
Or Figure 13 (B) is identical, as long as the long side direction of noise reduction conductor being configured to and being connected with radiator connecting portion
Side perpendicular.
In addition, present embodiment 5 " long side direction configuration by noise reduction conductor identical with embodiment 4
It is perpendicular with the side being connected with radiator connecting portion ", and in order to suppress to produce because of the switch of semiconductor element
Noise component(s) transmission, preferably " be configured to overlap with the underface of the semiconductor element after encapsulation ", and
" being configured to overlap with the central part of radiator ".
Industrial practicality
The present invention can not only be applied to possess the semiconductor element of the occurring source as heat and electromagnetic wave, this is partly led
Radiator that the heating of volume elements part is cooled down and formed and to described semiconductor element and dissipated by conductive material
The electronic apparatus of the housing that hot device is received are additionally it is possible to be applied to the electrical equipment dress possessing these components
Put.
Claims (14)
1. a kind of electronic electric equipment, including semiconductor element, cools down to the heating of described semiconductor element
Radiator and the housing being formed by electric conductor, described electronic electric equipment is characterised by,
Described radiator includes：The basilar parts that formed by electric conductor and by stand up described basilar parts or
It is installed on the fin part that at least one fin of the chimeric use recess of described basilar parts is constituted,
It is provided with and contacts with described fin part and described housing face, and surface is the noise reduction conductor of conductor.
2. electronic electric equipment as claimed in claim 1 it is characterised in that
Described noise reduction conductor is contacted with the protuberance of described fin part and described housing face.
3. electronic electric equipment as claimed in claim 2 it is characterised in that
Described fin part is made up of plural fin,
Described noise reduction conductor is the flat board at least with a protuberance,
There are following structures：Described protuberance configures between described fin, the depth portion of described protuberance with described
The side of fin carries out face contact, and the planar portions of described noise reduction conductor are contacted with described housing face.
4. electronic electric equipment as claimed in claim 2 it is characterised in that
Described fin part is made up of the fin of more than three,
Described noise reduction conductor is created as the flat board of U-shaped,
There are following structures：The opposite site of U-shaped configures between described fin, relative in described U-shaped
The depth portion at position carries out face with the side of described fin and contacts, and described noise reduction conductor except described U
Planar portions beyond the opposite site of font are contacted with described housing face.
5. electronic electric equipment as claimed in claim 4 it is characterised in that
The opposite site of described U-shaped has and bends to curvilinear structure.
6. electronic electric equipment as claimed in claim 2 it is characterised in that
Described noise reduction conductor is the flat board at least with a curved protrusion, and is configured at described fin part
Fin bottom surface and described housing between space,
There is following structure：Described curved protrusion is contacted with the fin bottom portion face of described fin part, described noise fall
The flat part of low use conductor is contacted with described housing face, or has following structure：Described curved protrusion and described wing
The fin bottom plane-plane contact in piece portion, described flat part is contacted with described housing face.
7. electronic electric equipment as claimed in claim 2 it is characterised in that
Described noise reduction conductor is created as the flat board of U-shaped, and is configured at the fin bottom of described fin part
Space between face and described housing,
There are following structures：One of opposite site of U-shaped of described noise reduction conductor and described wing
The bottom plane-plane contact in piece portion, another of the parallel position of described U-shaped is contacted with described housing face.
8. electronic electric equipment as claimed in claim 2 it is characterised in that
Described noise reduction conductor is constituted by having resilient component,
The thickness of the resilient component of this tool is equal to or is slightly thicker than between the minimum between described housing and described radiator
Every, or be equal to or be slightly narrower than the minimum interval between the fin of described radiator.
9. electronic electric equipment as claimed in claim 8 it is characterised in that
Described noise reduction conductor is configured to contact with described fin protuberance and described housing face.
10. electronic electric equipment as claimed in claim 8 it is characterised in that
Described noise reduction conductor has a kink, and is configured to and described fin protuberance, described radiator
Fin depth portion and the contact of described housing face.
11. electronic electric equipments as claimed in claim 2 it is characterised in that
Described noise reduction conductor is configured to cross multiple fins of described radiator.
12. electronic electric equipments as claimed in claim 1 it is characterised in that
Described housing has the position with the conducting of described radiator,
The long side direction configuration of described noise reduction conductor is hung down on the side with the long side direction at the position of described conducting
On straight direction.
13. electronic electric equipments as claimed in claim 1 it is characterised in that
Described noise reduction is configured in the underface of described semiconductor element with conductor.
14. electronic electric equipments as claimed in claim 1 it is characterised in that
Described noise reduction conductor is configured to the position of the center of gravity with regard to becoming described radiator point-symmetrically.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015161053A JP6582717B2 (en) | 2015-08-18 | 2015-08-18 | Electronic electrical equipment |
| JP2015-161053 | 2015-08-18 |
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| Publication Number | Publication Date |
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| CN106469695A true CN106469695A (en) | 2017-03-01 |
| CN106469695B CN106469695B (en) | 2021-02-09 |
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| JP (1) | JP6582717B2 (en) |
| CN (1) | CN106469695B (en) |
| DE (1) | DE102016213517B4 (en) |
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| KR102434571B1 (en) * | 2018-01-15 | 2022-08-19 | 미쓰비시덴키 가부시키가이샤 | heat sink |
| JP7047613B2 (en) * | 2018-06-08 | 2022-04-05 | 株式会社デンソー | Control device integrated rotary electric machine |
| JP7434768B2 (en) * | 2018-09-14 | 2024-02-21 | 富士電機株式会社 | electronic electrical equipment |
| TW202319476A (en) | 2021-11-04 | 2023-05-16 | 日商Ｄｉｃ股份有限公司 | Crosslinkable resin composition and cured article |
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| US20020080587A1 (en) * | 2000-12-22 | 2002-06-27 | Patrizio Vinciarelli | Heat dissipation for electronic components |
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| US20140247564A1 (en) * | 2011-10-31 | 2014-09-04 | Thomson Licensing A Corporation | Shielding structure for electronic device |
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| JP2853618B2 (en) * | 1995-11-15 | 1999-02-03 | 日本電気株式会社 | Heat dissipation structure of electronic device |
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| JP2000286584A (en) * | 1999-03-30 | 2000-10-13 | Kokusai Electric Co Ltd | Shielding structure of portable-type communication machine |
| JP4383981B2 (en) | 2004-08-04 | 2009-12-16 | トヨタ自動車株式会社 | Inverter device |
| JP3113691U (en) * | 2005-06-14 | 2005-09-15 | オリオン電機株式会社 | Digital broadcast receiver having a shield structure |
| JP2008103458A (en) | 2006-10-18 | 2008-05-01 | Seiko Epson Corp | Method for manufacturing semiconductor device |
| JP5432085B2 (en) * | 2010-08-24 | 2014-03-05 | 三菱電機株式会社 | Power semiconductor device |
| WO2012169104A1 (en) | 2011-06-10 | 2012-12-13 | 日本電気株式会社 | Electronic device, structure, and heat sink |
| JP2014239089A (en) * | 2013-06-06 | 2014-12-18 | シャープ株式会社 | Electronic circuit and heat sink attachment detection method |
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- 2016-07-22 DE DE102016213517.1A patent/DE102016213517B4/en active Active
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| JPH09298889A (en) * | 1996-04-26 | 1997-11-18 | Yaskawa Electric Corp | Inverter |
| US20020080587A1 (en) * | 2000-12-22 | 2002-06-27 | Patrizio Vinciarelli | Heat dissipation for electronic components |
| CN101031197A (en) * | 2006-03-02 | 2007-09-05 | 华硕电脑股份有限公司 | Electronic device with electromagnetic interference-inhibiting function and its radiating mold set |
| CN201957387U (en) * | 2011-01-20 | 2011-08-31 | 纬创资通股份有限公司 | Heat radiation assembly and electronic device with same |
| US20140247564A1 (en) * | 2011-10-31 | 2014-09-04 | Thomson Licensing A Corporation | Shielding structure for electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017041493A (en) | 2017-02-23 |
| DE102016213517A1 (en) | 2017-02-23 |
| DE102016213517B4 (en) | 2022-02-10 |
| CN106469695B (en) | 2021-02-09 |
| JP6582717B2 (en) | 2019-10-02 |
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