JP7434768B2 - electronic electrical equipment - Google Patents

Description

The present invention relates to electronic and electrical equipment that generates electromagnetic noise during operation.

Power conversion devices such as inverters and pulse width modulation (PWM) rectifiers are typified by MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) and IGBTs (Insulated Gates). Bipolar Transistor) and other semiconductor devices are used as switching elements. configured. Power conversion devices are increasingly being applied in various fields because of their ability to convert electricity into a desired form. However, electromagnetic noise (conduction noise and radiation noise) generated during operation of the power converter propagates and spreads through cables provided in the power converter and the space in which the power converter is arranged. The electromagnetic noise that spreads in this way can cause problems such as damage or malfunction of peripheral devices and noise contamination of wireless devices.

For this reason, limits are set for electromagnetic noise (conducted noise and radiated noise) generated by electronic and electrical equipment, including power conversion equipment, according to the EMC (Electro-Magnetic Compatibility) standard, and these are sufficient for power conversion equipment. It is required to reduce electromagnetic noise. Among these, in the EMC standard, radiation noise propagating in space is regulated in a frequency band of 30 MHz to 1 GHz, or higher depending on the frequency used.

Taking a power conversion device as an example of electronic and electrical equipment, the intensity of high-frequency electromagnetic noise exceeding 10 MHz depends on the switching characteristics of the semiconductor element (semiconductor switch) used as a switching element, the board pattern of the electric circuit, the design of the EMC filter, And it varies greatly depending on various factors such as the structure of the power conversion device. For this reason, it is difficult to determine whether or not the power conversion device complies with the EMC standards until an EMC test is performed after the power conversion device is assembled. If electromagnetic noise exceeds the limit value in this EMC test, it will be necessary to reconsider at least one of the electrical and structural design of the power conversion device, which will significantly increase the resource and schedule for the development of the power conversion device. You will be under pressure.

A method of covering noise radiation sources such as circuit boards, module wiring, and heat sinks inside the power converter with a shielding case made of metal, conductive resin, or plated resin in order to suppress radiation noise generated from the power converter. is widely used. However, the method of covering the noise radiation source with a shield housing poses a problem of compatibility with cooling performance.

Patent Document 1 proposes a radiation noise countermeasure technique that devises the internal structure of a power conversion device. Patent Document 1 proposes a method of suppressing standing waves generated in the heat sink by connecting the gap between the heat sink and the housing with a countermeasure conductor, and reducing radiation noise around 100 MHz. .

On the other hand, the noise level of radiation noise generated by a power conversion device tends to decrease as the frequency increases due to the characteristics of the square wave spectrum of the switching of the semiconductor element serving as the noise source. Therefore, it is most difficult to reduce noise components around 30 MHz, which is the starting frequency of the frequency band regulated by the EMC standard, than around 100 MHz. With the countermeasure method described in Patent Document 1, it is difficult to reduce low frequency components around 30 MHz.

Patent Document 2 discloses a technology related to the structure of a heat sink and a housing. Patent Document 2 discloses that the cooling performance of the power conversion device is improved by bringing the heat sink and the casing into surface contact.

2. Description of the Related Art A power conversion device is known that has a structure in which the side surface of a heat sink and a casing are brought into surface contact. This type of structure connects the internal part of the power converter that should be at ground potential with the casing with low impedance, and strengthens the grounding within the casing to reduce radiated noise. It is said that However, the structure in which the heat sink and the casing are in surface contact has a problem in that radiation noise around 30 MHz cannot be reduced.

Unexamined Japanese Patent Publication No. 2015-161053 Patent No. 5614542

In order to reduce the radiation noise emitted from the power conversion equipment, especially the radiation noise in the low frequency band around 30MHz, to a level below the EMC standard, it is necessary to add noise countermeasure components, but the large size of the equipment There is an issue of increasing cost and increasing costs.

An object of the present invention is to provide an electronic and electrical device that can reduce electromagnetic noise.

In order to achieve the above object, an electronic and electrical device according to one aspect of the present invention includes a semiconductor element and a heat conductive part formed of a heat conductor in at least a part, and at least a part of the semiconductor element has a heat conductive part formed with a heat conductor. A heat sink provided in contact with a heat conductive part, a casing having at least a part of the conductive part made of a conductor, and a conductive member connecting the heat conductive part and the conductive part and having conductivity. It is characterized by having the following.

The electronic and electrical equipment according to one aspect of the present invention may include a ground wire connection terminal that is disposed on the conductive portion and connects a ground wire.

The electronic and electrical equipment according to one aspect of the present invention may include an impedance element attached in series with the conductive member.

The impedance element may be a core.

The conductive member may be wound around the core.

The electronic and electrical equipment according to one aspect of the present invention may include a capacitor connected to the conductive member in parallel with the core.

According to one aspect of the present invention, electromagnetic noise can be reduced.

1 is a diagram schematically showing the external configuration of a power converter E1 as an electronic and electrical device according to a first embodiment of the present invention, and FIG. 1A is a perspective view schematically showing the power converter E1, and FIG. 1(b) is a side view schematically showing the power converter E1. 2 is a diagram showing a schematic configuration of a power conversion device E1 as an electronic and electrical device according to a first embodiment of the present invention, FIG. 2(a) is a circuit diagram of the power conversion device E1, and FIG. 2(b) is a power conversion device E1. FIG. 2 is a diagram illustrating an electrical connection state between a semiconductor switch Q1 provided in a device E1 and a heat sink 12. FIG. 1 is a diagram showing a schematic configuration of a power conversion device 1 as an electronic and electrical device according to Example 1 of a first embodiment of the present invention. It is a figure which shows the measurement result of the spectrum of the radiation electric field strength of the noise of the power converter 1 according to Example 1 of the first embodiment of the present invention and the power converter having a conventional structure. FIG. 2 is a diagram showing measurement results of noise current spectra of the power converter 1 according to Example 1 of the first embodiment of the present invention and the power converter having a conventional structure. FIG. 2 is a diagram showing a schematic configuration of a power conversion device 2 as an electronic and electrical device according to Example 2 of the first embodiment of the present invention. FIG. 3 is a diagram showing a schematic configuration of a power conversion device 3 as an electronic and electrical device according to Example 3 of the first embodiment of the present invention. FIG. 6 is a diagram showing the measurement results of the spectrum of the noise radiation electric field strength of the power converters 2 and 3 according to Examples 2 and 3 of the first embodiment of the present invention and the power converter having a conventional structure. FIG. 3 is a diagram showing a schematic configuration of a power conversion device 4 as an electronic and electrical device according to Example 4 of the first embodiment of the present invention. FIG. 3 is a diagram showing a schematic configuration of a power conversion device 5 as an electronic and electrical device according to Example 5 of the first embodiment of the present invention. 7 is a diagram showing measurement results of noise current spectra of the power converter device 5 according to Example 5 and the power converter device 1 according to Example 1 of the first embodiment of the present invention. FIG. FIG. 6 is a diagram showing a schematic configuration of a power conversion device 6 as an electronic and electrical device according to Example 6 of the first embodiment of the present invention. 7 is a diagram showing measurement results of noise current spectra of the power conversion device 6 according to Example 6 of the first embodiment of the present invention and the power conversion device 1 according to Example 1. FIG. FIG. 6 is a diagram showing a schematic configuration of a power conversion device 6a as an electronic and electrical device according to a first modification of the sixth embodiment of the present invention. FIG. 7 is a diagram showing a schematic configuration of a power conversion device 6b as an electronic and electrical device according to a second modification of the sixth embodiment of the present invention. FIG. 2 is a diagram showing a schematic configuration of a power converter device E2 as an electronic and electrical device according to a second embodiment of the present invention. FIG. 17A is a diagram showing a schematic configuration of a power conversion device 7 as an electronic and electrical device according to Example 1 of the second embodiment of the present invention, and FIG. FIG. 17B is a perspective view showing the configuration, and FIG. 17(b) is a plan view showing the configuration of the power converter 7 at the time of product shipment (initial state). 18A is a diagram showing a schematic configuration of a power conversion device 7 as an electronic and electrical device according to Example 1 of the second embodiment of the present invention, and FIG. 18(a) shows the power conversion device 7 at the time of product shipment (initial state) is a perspective view showing a different configuration, and FIG. 18(b) is a plan view showing a different configuration from the time of product shipment (initial state) of the power conversion device 7. FIG. 19A is a diagram showing a schematic configuration of a power conversion device 8 as an electronic and electrical device according to Example 2 of the second embodiment of the present invention, and FIG. FIG. 19B is a perspective view showing the configuration, and FIG. 19(b) is a plan view showing the configuration of the power conversion device 8 at the time of product shipment (initial state). 20A is a diagram showing a schematic configuration of a power conversion device 8 as an electronic and electrical device according to Example 2 of the second embodiment of the present invention, and FIG. 20(a) shows the power conversion device 8 at the time of product shipment (initial state) is a perspective view showing a different configuration, and FIG. 20(b) is a plan view showing a different configuration from the time of product shipment (initial state) of the power conversion device 8. FIG. 3 is a perspective view showing a schematic configuration of a power conversion device 9 as an electronic and electrical device according to Example 3 of the second embodiment of the present invention. FIG. 22A is a diagram showing a schematic configuration of a power conversion device 9 as an electronic and electrical device according to Example 3 of the second embodiment of the present invention, and FIG. FIG. 22B is a plan view showing a configuration mode, and FIG. 22(b) is a plan view showing a configuration mode different from the one at the time of product shipment (initial state) of the power conversion device 9. FIG. 23A is a diagram showing a schematic configuration of a power conversion device 70 as an electronic and electrical device according to Example 4 of the second embodiment of the present invention, and FIG. FIG. 23B is a perspective view showing the configuration, and FIG. 23(b) is a plan view showing the configuration of the power conversion device 70 at the time of product shipment (initial state). FIG. 24A is a diagram showing a schematic configuration of a power conversion device 70 as an electronic and electrical device according to Example 4 of the second embodiment of the present invention, and FIG. is a perspective view showing a different configuration, and FIG. 24(b) is a plan view showing a different configuration from the time of product shipment (initial state) of the power conversion device 70. It is a perspective view showing a schematic structure of a power converter device 80 as an electronic and electrical device according to Example 5 of a second embodiment of the present invention. FIG. 26A is a diagram showing a schematic configuration of a power conversion device 80 as an electronic and electrical device according to Example 5 of the second embodiment of the present invention, and FIG. FIG. 26(b) is a plan view showing the configuration, and FIG. 26(b) is a configuration in which the usage environment (installation conditions) of the power conversion device 80 can be considered to be the same as the EMC standard certified measurement configuration (manufacturer recommended installation configuration). It is a top view showing an aspect.

An electronic/electrical device according to the present invention has a structure in which a heat sink provided inside the electronic/electrical device to cool a semiconductor element and a conductive casing are connected by a conductive member (for example, a cable). By having the structure, the electronic and electrical equipment according to the present invention can suppress radiation noise, particularly radiation noise in a low frequency band around 30 MHz.
Hereinafter, the electronic and electrical equipment according to the first embodiment of the present invention will be described in detail by taking a power conversion device as an example.

[First embodiment]
First, a schematic configuration of a power conversion device as an electronic and electrical device according to a first embodiment and a second embodiment of the present invention will be described using FIGS. 1 and 2. In FIG. 1A, illustration of the semiconductor module is omitted for ease of understanding. Further, in FIG. 1(b), in order to facilitate understanding, the power conversion device is illustrated with a part of the side wall of the casing being transparent.

As shown in FIG. 1(a), a power conversion device E1 as an electronic and electrical device according to a first embodiment of the present invention has a housing having at least a part thereof a conductive part made of a conductive material such as a sheet metal, for example. It is equipped with 11. The housing 11 has a side wall (an example of a conductive part) at least partially formed of a conductor, and a rear surface part (an example of a conductive part) at least partly formed of a conductor. The housing 11 has a space inside. The power conversion device E1 includes a power semiconductor module (an example of a semiconductor element) 14 (see FIG. 1(b)), and at least a portion of the power semiconductor module 14, which has a thermal conductive portion formed of a thermal conductor. A heat sink 12 is provided in contact with the heat conductive part. The heat sink 12 can radiate heat generated by the power semiconductor module 14 by mechanically and thermally contacting the power semiconductor module 14 . The power semiconductor module 14 and the heat sink 12 are arranged inside the housing 11.

Heat sink 12 is attached to housing 11 via an insulator. The heat sink 12 includes a plate-shaped base portion 121 and a plurality of thin plate-shaped fin portions 122 arranged perpendicularly to the base portion 121. The plurality of fin parts 122 are arranged in parallel with each other with a predetermined gap. The base portion 121 and the fin portion 122 are both made of a heat conductor such as aluminum or an aluminum alloy, and correspond to an example of a heat conduction portion. The power semiconductor module 14 is placed in mechanical and thermal contact with the base portion 121.

The power converter E1 includes a printed circuit board 17. The printed circuit board 17 has a wiring pattern section 171. As shown in FIG. 1B, the power semiconductor module 14 has a plurality of terminals 142, and is mounted on the printed circuit board 17 with the plurality of terminals 142 penetrating the wiring pattern portion 171.

As shown in FIG. 1(a), a group of electronic components 172 constituting a converter section, a noise filter, etc. are mounted on the printed circuit board 17. The power semiconductor module 14 is disposed inside the housing 11 by being mounted on the printed circuit board 17 . Inside the housing 11, a heat sink 12, a power semiconductor module 14, and a printed circuit board 17 are arranged in this order from the rear side of the housing 11.

The power converter E1 includes an input terminal R, an input terminal S, and an input terminal T to which three-phase AC power is input. The input terminal R, the input terminal S, and the input terminal T are provided on the printed circuit board 17.

The power converter E1 includes an output terminal U, an output terminal V, and an output terminal W. The output terminal U, the output terminal V, and the output terminal W are provided on the printed circuit board 17.

The power converter E1 includes an input grounding terminal (an example of a grounding line connection terminal) 15 that is disposed on the conductive portion of the casing 11 and connects a grounding line. The input ground terminal 15 is provided in a region formed of a conductive material on the side wall of the housing 11 . Thereby, electrical connection between the housing 11 and the input ground terminal 15 is ensured. The input ground terminal 15 is used to ground the power converter E1 to a reference ground plane such as the earth or the floor.

The power converter E1 includes an output ground terminal 16 that is arranged on the thermally conductive portion of the heat sink 12 and connects a ground wire. The output ground terminal 16 is provided on a base portion 121 that is an example of a thermally conductive portion of the heat sink 12. This ensures electrical connection between the heat sink 12 and the output ground terminal 16. The output ground terminal 16 is used to connect the power converter E1 and a load such as a motor (not shown) and ground the load device. Note that the output ground terminal 16 may be provided on the fin portion 122.

The power converter E1 includes a conductive cable (an example of a conductive member) 13 that connects the thermally conductive portion of the heat sink 12 and the conductive portion of the casing 11. The cable 13 is provided, for example, in a state where the base portion 121, which is an example of a thermally conductive portion of the heat sink 12, and the bottom portion, which is an example of a conductive portion of the casing 11, are connected. The cable 13 may be connected to the fin section 122 instead of the base section 121. The heat sink 12 and the housing 11 are electrically connected only by a cable 13. The cable 13 is provided to adjust the impedance of a noise transmission path in the power converter E1 alone or in a motor drive system including the power converter E1. In other words, the cable 13 functions as an impedance adjustment member for the noise transmission path in the motor drive system. The cable 13 is formed by bundling a plurality of thin wires made of copper, for example. Cable 13 has flexibility. The cable 13 is stretched between the heat sink 12 and the housing 11, for example, over the shortest distance. Furthermore, the cable 13 is stretched in a straight line between the heat sink 12 and the housing 11 without being folded back.

Next, the motor drive system MS including the power conversion device E1 will be described using FIG. 2 while referring to FIG. 1.

As shown in FIG. 2(a), the motor drive system MS includes a power conversion device E1 that converts AC power supplied from a commercial AC power supply P that supplies three-phase AC power into AC power with a different frequency, and The converter includes a motor M driven by AC power supplied from the converter E1.

As shown in FIG. 2(a), the motor drive system MS includes an input cable 91 that connects a commercial AC power source P such as a commercial power source and the power converter E1. The input cable 91 includes a cable 91r to which an R-phase AC voltage is supplied from a commercial AC power supply P, a cable 91s to which an S-phase AC voltage is supplied from a commercial AC power supply P, and a cable 91s to which an S-phase AC voltage is supplied from a commercial AC power supply P. It has a cable 91t to which the T-phase AC voltage supplied from P is supplied, and a ground wire 91a. The cable 91r, the cable 91s, and the cable 91t are connected to input terminals R, S, and T provided in the power converter E1, respectively. The ground wire 91a is connected to the input ground terminal 15 provided in the power converter E1. The ground wire 91a corresponds to an example of a ground wire. The power converter E1 is grounded to a reference ground surface 93 such as the earth or a floor surface via a ground wire 91a. The commercial AC power supply P is also grounded to the reference ground plane 93.

As shown in FIG. 2(a), the power converter E1 includes a noise filter 18 connected to input terminals R, S, and T, a converter section 19 connected to the noise filter 18, and a converter section 19 connected to the converter section 19. It has a smoothing capacitor Cdc and an inverter section 20 connected to the smoothing capacitor Cdc.

The noise filter 18 is provided to reduce conduction noise and radiation noise. The noise filter 18 is provided mainly to reduce conduction noise flowing from the power converter E1 to the commercial AC power supply P and radiation noise radiated from the power converter E1 to external space. The noise filter 18 is composed of an LC filter. The noise filter 18 includes an input capacitor 181 connected to input terminals R, S, and T, a common mode choke coil 182, and an output capacitor 183 connected to the converter section 19.

The input side capacitor 181 has three star-connected capacitors Cr1, Cs1, and Ct1 on the input terminals R, S, and T sides. In addition, in the input side capacitor 181, one end of each of the capacitors Cr1, Cs1, and Ct1 is connected between the input terminals R, S, and T and the common mode choke coil 182, and the other ends are connected to each other via the capacitor C1. and is connected to the input ground terminal 15.

The common mode choke coil 182 has a structure in which three copper wires are wound around one core, and one end of each winding is connected to input terminals R, S, and T, and the other end is connected to the converter section 19. There is.

The output-side capacitor 183 includes three capacitors Cr3, Cs3, and Ct3 connected in a star connection to the converter section 19 side. Further, in the output side capacitor 183, one end of each of capacitors Cr3, Cs3, and Ct3 is connected between the common mode choke coil 182 and the converter section 19, and the other ends are connected to each other and connected to the input ground terminal via the capacitor C3. 15.

The converter unit 19 includes six diodes 19a, 19b, 19c, 19d, 19e, and 19f to which commercial AC voltages output from input terminals R, S, and T are applied, respectively. The diode 19a and the diode 19d are connected in series, and the R-phase AC voltage of the commercial AC power supply P is applied to the intermediate point that is the connection point between the diode 19a and the diode 19d. The cathode of the diode 19a is connected to the positive electrode of the smoothing capacitor Cdc, and the anode of the diode 19d is connected to the negative electrode of the smoothing capacitor Cdc. The other end of the reactor Lr of the common mode choke coil 182 is connected to an intermediate point that is a connection point between the diode 19a and the diode 19d.

The diode 19b and the diode 19e are connected in series, and the S-phase AC voltage of the commercial AC power supply P is applied to the intermediate point that is the connection point between the diode 19b and the diode 19e. The cathode of the diode 19b is connected to the positive electrode of the smoothing capacitor Cdc, and the anode of the diode 19e is connected to the negative electrode of the smoothing capacitor Cdc. The other end of the reactor Ls of the common mode choke coil 182 is connected to an intermediate point that is a connection point between the diode 19b and the diode 19e.

The diode 19c and the diode 19f are connected in series, and the T-phase AC voltage of the commercial AC power supply P is applied to the intermediate point that is the connection point between the diode 19c and the diode 19f. The cathode of the diode 19c is connected to the positive electrode of the smoothing capacitor Cdc, and the anode of the diode 19f is connected to the negative electrode of the smoothing capacitor Cdc. The other end of the reactor Lt of the common mode choke coil 182 is connected to an intermediate point that is a connection point between the diode 19c and the diode 19f.

The inverter section 20 has six switching sections S1, S2, S3, S4, S5, and S6. The power semiconductor module 14 includes an inverter section 20 including six switching sections S1, S2, S3, S4, S5, and S6.

The switching sections S1, S2, and S3 are connected to the positive electrode side of the smoothing capacitor Cdc. The switching sections S4, S5, and S6 are connected to the negative electrode side of the smoothing capacitor Cdc. The switching section S1 and the switching section S4 are connected in series between respective output sections of the DC voltage generated between the positive electrode side and the negative electrode side. The switching section S2 and the switching section S5 are connected in series between the positive electrode side and the negative electrode side of this DC voltage. The switching section S3 and the switching section S6 are connected in series between the output sections of the positive and negative DC voltages, respectively. A connection point between the switching section S1 and the switching section S4 is connected to the output terminal U. A connection point between the switching section S2 and the switching section S5 is connected to the output terminal V. A connection point between the switching section S3 and the switching section S6 is connected to the output terminal W.

Switching section S1 and switching section S4 constitute a U-phase arm, switching section S2 and switching section S5 constitute a V-phase arm, and switching section S3 and switching section S6 constitute a W-phase arm. Therefore, the power semiconductor module 14 has a three-phase bridge circuit in which these U-phase arms, V-phase arms, and W-phase arms are connected in parallel. Switching sections S1, S2, and S3 constitute a high-side switch, and switching sections S4, S5, and S6 constitute a low-side switch.

Although not shown, the power conversion device E1 includes six gate drive devices that individually control the switching operations of switching units S1, S2, S3, S4, S5, and S6, and a control unit that controls the gate drive devices. It is equipped with

The switching section S1 is an insulated gate bipolar transistor (Insulated gate type bipolar transistor).
The semiconductor switch Q1 includes a gate bipolar transistor (IGBT), and a freewheeling diode D1 connected in antiparallel to the semiconductor switch Q1. A cathode of a freewheeling diode D1 is connected to the collector terminal of the semiconductor switch Q1, and an anode of the freewheeling diode D1 is connected to an emitter terminal of the semiconductor switch Q1. A gate drive device (not shown) is connected to the gate terminal of the semiconductor switch Q1.

The switching section S2 has the same configuration as the switching section S1 when the semiconductor switch Q1 is read as a semiconductor switch Q2, and the free wheel diode D1 is read as a free wheel diode D2. The switching section S3 has the same configuration as the switching section S1 when the semiconductor switch Q1 is read as a semiconductor switch Q3, and the free wheel diode D1 is read as a free wheel diode D3. The switching section S4 has the same configuration as the switching section S1 when the semiconductor switch Q1 is read as a semiconductor switch Q4, and the free wheel diode D1 is read as a free wheel diode D4. The switching section S5 has the same configuration as the switching section S1 when the semiconductor switch Q1 is read as a semiconductor switch Q5 and the free wheel diode D1 is read as a free wheel diode D5. The switching section S6 has the same configuration as the switching section S1 when the semiconductor switch Q1 is read as a semiconductor switch Q6 and the free wheel diode D1 is read as a free wheel diode D6.

Each of the switching units S1 to S6 provided in the power semiconductor module 14 (see FIG. 1(b)) constituting the inverter unit 20 corresponds to an example of a semiconductor element. Furthermore, the semiconductor switches Q1 to Q6 provided in the switching sections S1 to S6 each correspond to an example of a semiconductor element.

As shown in FIG. 2(a), the motor drive system MS includes an output cable 92 that connects the power conversion device E1 and the motor M. The output cable 92 includes a cable 92u for supplying the motor M with the U-phase AC voltage generated by the power converter E1. The output cable 92 includes a cable 92v for supplying the motor M with the V-phase AC voltage generated by the power converter E1. The output cable 92 includes a cable 92w for supplying the motor M with the W-phase AC voltage generated by the power converter E1. The output cable 92 has a ground wire 92a. Cable 92u is connected to output terminal U provided in power converter E1. Cable 92v is connected to output terminal V provided in power converter E1. The cable 92w is connected to an output terminal W provided in the power converter E1. The ground wire 92a is connected to the output ground terminal 16 provided in the power converter E1. The motor M is grounded to a heat sink 12 provided in the power converter E1 via a ground wire 92a and an output ground terminal 16. The heat sink 12 is grounded to a reference ground plane 93 via the cable 13, the housing 11, the input ground terminal 15, and the ground wire 91a. Therefore, the motor M is also grounded to the reference ground plane 93 via the power converter E1 and the ground wire 91a. Further, as the output cable, for example, a shielded cable in which the cable 92u, cable 92v, cable 92w, and ground wire 92a are surrounded by a braided wire is used.

As shown in FIG. 2(b), the semiconductor switch Q1 includes a semiconductor chip 11q and a circuit pattern 12q. The circuit pattern 12q is provided to supply the semiconductor chip 11q with a DC voltage or the like input from the converter section 19. Further, the semiconductor switch Q1 includes a copper base 14q for making thermal contact with the heat sink 12, and an insulating layer 13q for insulating the circuit pattern 12q and the copper base 14q. The copper base 14q and the heat sink 12 are screwed together. Therefore, the copper base 14q is electrically connected to the heat sink 12. Further, the copper base 14q and the circuit pattern 12q are arranged to face each other with the insulating layer 13q interposed therebetween. Since the film thickness of the insulating layer 13q is thin, a stray capacitance Cp is formed by the copper base 14q, the circuit pattern 12q, and the insulating layer 13q. The circuit pattern 12q is connected to a connecting portion between the switching section S1 and the switching section S4. Therefore, a stray capacitance Cp is formed between the switching section S1 and the heat sink 12.

The semiconductor switches Q2 to Q3 also have the same configuration as the semiconductor switch Q1. Therefore, as shown in FIG. 2A, a stray capacitance Cp is formed between the connection portion of the semiconductor switch Q1 and the semiconductor switch Q4 and the heat sink 12. Stray capacitance Cp is formed between the connection portions of semiconductor switch Q2 and semiconductor switch Q5 and heat sink 12, and stray capacitance Cp is formed between semiconductor switch Q3 and semiconductor switch Q6 and heat sink 12.

Further, as shown in FIG. 2(a), in the motor M, a stray capacitance Cm is formed between the winding and the frame. Furthermore, a stray capacitance C91 is formed between the cables 91r, 91s, 91t of the input cable 91 and the ground wire 91a. However, although the stray capacitance C91 originally exists in a distributed manner on the input cable, it is shown concentratedly in FIG. 2 for simplicity. In addition, the stray capacitance between the cable 91t and the ground wire 91a is typically shown as "C91", and the stray capacitance between the cable 91r and the ground wire 91a, and between the cable 91s and the ground wire 91a are It is omitted. Furthermore, a stray capacitance C92 is formed between the cables 92u, 92v, 92w of the output cable 92 and the ground wire 92a. Similarly, stray capacitance C92 exists distributed on the output cable, but is shown concentratedly in FIG. 2 for simplicity. In addition, the stray capacitance between the cable 92u and the ground wire 92a and between the cable 92v and the ground wire 92a are omitted, and the stray capacitance between the cable 92w and the ground wire 92a is representatively shown as "C92". ing.

Therefore, in the motor drive system MS, the switching operations of the semiconductor switches Q1 to Q6 and the charging and discharging currents that charge and discharge each of the stray capacitances Cp, C92, and Cm become noise sources. Noise generated by the switching operations of the semiconductor switches Q1 to Q6 is transmitted to the commercial AC power supply P, the input cable 91, the noise filter 18, the converter section 19, the power semiconductor module 14, the output cable 92, the motor M, the heat sink 12, and the input cable 91. is transmitted through the motor drive system MS as a transmission path, flows out to the commercial AC power supply P, or is radiated to the outside of the motor drive system MS.

Hereinafter, the electronic and electrical equipment according to this embodiment will be described in more detail using examples. In the following examples as well, the electronic and electrical equipment according to the present embodiment will be explained using a power conversion device as an example. Further, the same reference numerals are given to the components having the same functions and operations as those of the power converter E1 described using FIGS. 1 and 2, and the description thereof will be omitted as appropriate.

(Example 1)
As shown in FIG. 3, the power conversion device 1 according to the present embodiment includes a power semiconductor module (an example of a semiconductor element) 14 and a power semiconductor module 14 having at least a part thereof a thermally conductive part formed of a thermal conductor. A heat sink 12 is provided with a heat conductive portion in contact with at least a portion of the heat sink 12 . The heat sink 12 has a base portion 121 and a plurality of fin portions 122 as a heat conduction portion. The entire heat sink 12 is made of a thermal conductor. The heat sink 12 is made of a conductor. A power semiconductor module 14 is mounted on the base portion 121 of the heat sink 12. Thermal contact between the power semiconductor module 14 and the heat sink 12 is ensured by a copper base 14q (see FIG. 2(b)). As a result, heat generated by the switching operations of the semiconductor switches Q1 to Q6 (see FIG. 2(a)) is conducted to the heat sink 12 via the copper base 14q, and is radiated to the outside.

The power conversion device 1 includes a casing 11 having at least a part of a conductive part made of a conductive material, a thermally conductive part of a heat sink 12 (base part 121 in this embodiment), and a conductive part (in this embodiment, a casing). 11) and a conductive cable (an example of a conductive member) 13. A portion of the side wall and the bottom of the casing 11 are made of a conductor. The heat sink 12 is attached to the housing 11 such that there is a gap between the tip of the fin portion 122 and the bottom of the housing 11. The heat sink 12 is supported by the housing 11 via an insulator (not shown). Therefore, the heat sink 12 and the housing 11 are electrically connected only by the cable 13. The heat sink 12 and the housing 11 are electrically connected at one point by a cable 13.

The cable 13 has a stranded wire structure formed by bundling thin wires made of copper. For example, the cable 13 has a diameter of 3.5 mm and a length of 150 mm. For example, crimp terminals are provided at both ends of the cable 13, and the cable 13 is fixed to the heat sink 12 and the housing 11 using the crimp terminals, respectively. The cable 13 is provided so as to be stretched between the heat sink 12 and the casing 11 in a straight line over the shortest distance without being folded back.

Here, the measurement results of comparing the radiated noise of the power converter 1 according to this embodiment with the radiated noise of the power converter having a conventional structure using the same settings as the EMC standard certification measurement will be explained using FIGS. 4 and 5. do. A power conversion device with a conventional structure has a structure in which a heat sink is attached to a housing in surface contact with the housing. The power converter device with the conventional structure has the same configuration as the power converter device 1 according to the present embodiment, except that the electrical connection between the heat sink and the casing is secured by surface contact instead of a conductive cable. ing. The horizontal axis of the graph shown in FIG. 4 indicates the noise frequency (MHz), and the vertical axis of the graph indicates the noise radiated electric field strength (dBμV/m). The curve N1 shown in FIG. 4 shows the spectrum of the radiated electric field intensity of the radiated noise of the power converter 1 in Example 1, and the curve N0 shown in FIG. Shows the intensity spectrum. The horizontal axis of the graph shown in FIG. 5 indicates the noise frequency (MHz), and the vertical axis of the graph indicates the noise current (dBμA). A curve I1 shown in FIG. 4 shows the noise current spectrum of the power converter 1 in Example 1, and a curve I0 shown in FIG. 5 shows the noise current spectrum of the power converter of the conventional structure.

As shown by the ellipse α in FIG. 4, the power converter 1 according to this embodiment has a radiation noise that is reduced by about 6 dB in the vicinity of 30 MHz, compared to the power converter of the conventional structure.
The power conversion device 1 according to this embodiment has a configuration in which a heat sink 12 and a housing 11 are connected by a conductive cable 13. Therefore, in the power converter 1, the impedance between the heat sink 12 and the casing 11 is higher than that of a power converter with a conventional structure in which the heat sink and the casing are in electrical contact through surface contact. As a result, in the power conversion device 1, the impedance of the path through which the noise current flows in the commercial AC power supply P and the power conversion device 1 becomes higher compared to a power conversion device with a conventional structure. As a result, the resonant frequency, which was around 30 MHz in the power converter with the conventional structure, moves to a frequency lower than 30 MHz in the power converter 1, and the radiation noise around 30 MHz is reduced. More specifically, as shown by the arrow Y1 in FIG. 5, the resonance frequency of the noise current is higher than 30 MHz in the power conversion device with the conventional structure, whereas it is lower than 30 MHz in the power conversion device 1. . Furthermore, as shown by arrow Y2 in FIG. 5, the noise level around 30 MHz, which is the lowest frequency subject to regulation of radiation noise, is lower in the power converter 1 than in the power converter with the conventional structure.

Returning to FIG. 4, as shown surrounded by an ellipse β in FIG. 4, the power converter 1 can reduce radiation noise in the vicinity of 70 to 80 MHz compared to a power converter with a conventional structure, but it can reduce radiation noise in the vicinity of 90 to 120 MHz. has started to increase, and a trade-off has occurred in the noise level between frequencies. However, since the noise level of the power converter 1 at 90 to 120 MHz is small, it is extremely unlikely to cause a problem with radiation noise regulations. As described above, the power conversion device 1 according to the present embodiment can reduce the noise level around 30 MHz, which is the most difficult countermeasure against radiation noise. As a result, the configuration including the cable 13 that connects the heat sink 12 and the housing 11 becomes an effective measure against radiation noise.

Furthermore, the power conversion device 1 according to this embodiment has a structure in which connection points for the cable 13 are provided on the base portion 121 of the heat sink 12 and the bottom portion of the casing 11. However, the connection point of the cable 13 may be provided at the fin portion 122 of the heat sink 12. Further, even if the cable 13 is provided at the upper part of the housing 11, the same radiation noise reduction effect as in the power converter 1 according to this embodiment can be obtained.

(Example 2)
Next, a power conversion device as an electronic and electrical device according to Example 2 of this embodiment will be described using FIG. 6.
As shown in FIG. 6, the power converter 2 according to this embodiment has the same configuration as the power converter E1 shown in FIGS. 1 and 2, and therefore the description thereof will be omitted.

(Example 3)
Next, a power conversion device as an electronic and electrical device according to Example 3 of the present embodiment will be described using FIG. 7. The power converter 3 according to this embodiment has the same configuration as the power converter E1 shown in FIGS. 1 and 2, except that the output ground terminal is provided in the housing 11.

As shown in FIG. 7, the power conversion device 3 according to this embodiment includes an output grounding terminal 16a provided in the casing 11. The output ground terminal 16a and the motor M are connected by a ground wire 92a. The housing 11 is grounded to a reference ground plane 93 via an input ground terminal 15 and a ground wire 91a. Therefore, the motor M is grounded to the reference ground plane 93 via the ground wire 92a, the output ground terminal 16a, the housing 11, the input ground terminal 15, and the ground wire 91a.

(Effect of noise reduction in Examples 2 and 3)
Next, the noise reduction effects of the power converter 2 according to the second embodiment and the power converter 3 according to the third embodiment will be described using FIG. 8 with reference to FIGS. 6 and 7. The horizontal axis of the graph shown in FIG. 8 indicates the noise frequency (MHz), and the vertical axis of the graph indicates the noise radiated electric field strength (dBμV/m). A curve N0 shown in FIG. 8 shows a spectrum of the radiated electric field intensity of the radiated noise of the power converter having the conventional structure. A curve N2 shown in FIG. 8 shows a spectrum of the radiated electric field intensity of the radiated noise of the power converter 2 in the second embodiment. A curve N3 shown in FIG. 8 shows a spectrum of the radiated electric field intensity of the radiated noise of the power converter 3 in the third embodiment. Further, a curve N4 shown in FIG. 8 shows a spectrum of the radiated electric field intensity of radiated noise of a power converter having a structure in which an input ground terminal and an output ground terminal are provided in a heat sink. A curve N5 shown in FIG. 8 shows the spectrum of the radiated electric field strength of the radiated noise of a power converter having a structure in which the input ground terminal is provided in the heat sink and the output ground terminal is provided in the casing. The power conversion device having the spectrum shown by curve N4 and the power conversion device having the spectrum shown by curve N5 are the same as the power conversion device according to Example 2, except that the locations where the input grounding terminal and the output grounding terminal are provided are different. It has the same configuration as device 2. Further, the power conversion device with the conventional structure has the same configuration as the power conversion device 1 according to the first embodiment above, except that the electrical connection between the heat sink and the casing is secured by surface contact instead of a cable. There is.

Note that FIG. 8 and FIGS. 11 and 13, which will be described later, show the results of measuring radiated noise with the ground wire 91a connected to a power source impedance stabilization network (LISN) and the power converter placed in an anechoic chamber. It is shown.

As shown in FIG. 8, when the heat sink and the casing are connected by cable, the installation positions of the input ground terminal and the output ground terminal affect the radiation noise level. As shown by curve N0, curve N2, and curve N3 in FIG. It is possible to reduce radiation noise around 30 MHz compared to the power converter. On the other hand, as shown by curves N0, N4, and N5 in FIG. 8, the power converter in which the input ground terminal is installed on the heat sink has less radiated noise around 30 MHz than the power converter with the conventional structure. This resulted in an increase. Therefore, in order to reduce radiation noise around 30 MHz, the input ground terminal needs to be installed in the housing.

Further, the difference in the position where the output ground terminal is provided has a smaller effect on radiated noise than the input ground terminal. As shown by curves N2 and N3 in FIG. Compared to converter 3, radiation noise around 30 MHz can be reduced. The power conversion device 2 according to the second embodiment has a structure in which a ground wire 92a is directly screwed to the heat sink 12 to form an output ground terminal 16. However, even if the power conversion device 2 has a structure in which one end of the copper bar is screwed to the heat sink 12 and the other end of the copper bar is the output grounding terminal 16, the same radiation noise reduction can be achieved. The effect of this can be obtained. However, in view of the difficulty of structural design of the power conversion device, even if the power conversion device 3 according to the third embodiment has a structure in which the output grounding terminal 16a is installed in the casing 11, the power conversion device according to the second embodiment Although the radiation noise is not reduced as much as in the power converter 2, the effect of noise reduction can be obtained more than in the power converter having the conventional structure.

(Example 4)
Next, a power conversion device as an electronic and electrical device according to Example 4 of the present embodiment will be described using FIG. 9. As shown in FIG. 9, the power conversion device 4 according to the present embodiment includes a heat sink 12, a casing 11 having a side wall that partially faces one side of a base portion 121 of the heat sink 12, a heat sink 12 and a casing 11. and an insulating layer 42 disposed between. The insulating layer 42 is made of an insulating material such as insulating paper. The power conversion device 4 includes resin screws 41 that fix the heat sink 12 to the housing 11. By screwing the heat sink 12 to the casing 11 with the resin screws 41 with the insulating layer 42 sandwiched between the heat sink 12 and the casing 11, insulation at the attachment point of the heat sink 12 is ensured.

The housing 11 has an open shape on the side facing the side wall to which the heat sink 12 is attached. An input ground terminal 15 is provided at the bottom of the housing 11 on the side wall side to which the heat sink 12 is attached.

The power conversion device 4 is configured such that the heat sink 12 is attached to the housing 11 while ensuring insulation from the housing 11, and the heat sink 12 and the housing 11 are electrically connected only by a conductive cable 13. ing. As a result, the power converter 4 according to this embodiment can reduce radiation noise around 30 MHz, similarly to the power converter 1 according to the first embodiment.

(Example 5)
Next, a power conversion device as an electronic and electrical device according to Example 5 of the present embodiment will be described using FIGS. 10 and 11. The power conversion device 5 according to this embodiment is characterized in that it includes an impedance element attached to a conductive member.

As shown in FIG. 10, the power conversion device 5 includes a resistance element (an example of an impedance element) 131 attached in series with a cable (an example of a conductive member) 13. By attaching the resistive element 131 in series to the cable 13, the impedance of the noise transmission path of the motor drive system MS having the power conversion device 5 is adjusted.

The noise current passing through the cable 13 has a radiation noise peak at the path impedance resonance point. The resistance element 131 inserted in series with the cable 13 functions as a damping resistance near the path impedance resonance point. Thereby, the power converter device 5 can alleviate the resonance peak of the radiation noise.

Here, the measurement results of the noise current spectrum of the power conversion device 5 according to the present example will be explained using FIG. 11. The horizontal axis of the graph shown in FIG. 11 indicates the noise frequency (MHz), and the vertical axis of the graph indicates the noise current (dBμA). Curve I5 shown in FIG. 11 shows the spectrum of noise current of power converter 5 in Example 5, and curve I1 shown in FIG. 11 shows the spectrum of noise current of power converter 1 according to Example 1. , a curve I0 shown in FIG. 11 shows a spectrum of noise current of a power conversion device having a conventional structure. Note that the power conversion device with the conventional structure has the same configuration as the power conversion device 1 according to Example 1 above, except that the electrical connection between the heat sink and the casing is ensured by surface contact instead of a conductive cable. have.

As shown by the arrow Y1 in FIG. 11, the power conversion device 5 includes a cable 13 that connects the heat sink 12 and the housing 11, thereby reducing the path impedance resonance point compared to a power conversion device with a conventional structure. It can be shifted to a lower frequency range. Furthermore, as shown by arrow Y2 in FIG. 11, the power conversion device 5 has a resistance element 131 inserted in series with the cable 13, thereby reducing radiation noise around 30 MHz compared to the power conversion device 1. Level can be lowered.

If the output grounding terminal 16 needs to be provided above the base portion 121 of the heat sink 12 due to a structural problem in the power conversion device 5, the resistance element 131 should be set to a level that will not cause an electric shock near the frequency of the AC power supplied by the commercial AC power source. It is good to have low impedance. Thereby, it is possible to prevent a rise in the potential of the frame of the motor M connected as a load at the subsequent stage of the power converter 5.

In this way, the power conversion device 5 according to the present embodiment includes the cable 13 that connects the heat sink 12 and the housing 11, and the resistance element 131 that is attached in series with the cable 13. Thereby, the power conversion device 5 can shift the resonance frequency of the radiated noise to around 30 MHz and reduce the level of the radiated noise around 30 MHz. Furthermore, the power conversion device 5 has a compact structure including the cable 13 and the resistive element 131, so that the level of radiation noise around 30 MHz can be reduced.

(Example 6)
Next, a power conversion device as an electronic and electrical device according to Example 6 of the present embodiment will be described using FIGS. 12 and 13. The power conversion device 6 according to this embodiment is characterized in that it includes an impedance element attached to a conductive member.

As shown in FIG. 12, like the power converter 5 according to the fifth embodiment, the power converter 6 includes an impedance element attached in series with a cable (an example of a conductive member) 13. The impedance element provided in the power conversion device 6 is the core 132. Core 132 has a cylindrical shape. The core 132 is attached to the cable 13 by passing the cable 13 through the space on the inner wall side. By inserting the cable 13 into the space on the inner wall side of the core 132, the core 132 and the cable 13 are electrically connected in series. The core 132 has a characteristic in which the resistance component is dominant in the 30 MHz band of radiation noise. Thereby, the core 132 functions as a resistance component near the resonance frequency (30 MHz) determined by the path impedance of the motor drive system MS. Thereby, the power conversion device 6 can reduce the noise level near the resonance point (30 MHz).

Here, the measurement results of the noise current spectrum of the power conversion device 6 according to this example will be explained using FIG. 13. The horizontal axis of the graph shown in FIG. 13 indicates the noise frequency (MHz), and the vertical axis of the graph indicates the noise current (dBμA). Curve I6 shown in FIG. 13 shows the spectrum of noise current of power converter 6 in Example 6, and curve I1 shown in FIG. 13 shows the spectrum of noise current of power converter 1 according to Example 1. ing.

By having the core 132 inserted in series with the cable 13, the resistance component of the impedance formed by the cable 13 and the core 132 becomes larger in the 30 MHz band compared to the case without the core 132. Therefore, as shown by arrow Y1 in FIG. 13, power conversion device 6 can reduce the level of radiation noise around 30 MHz compared to power conversion device 1. In this case, it is preferable that the core 132 has a low impedance so as not to cause an electric shock near the frequency of AC power supplied by a commercial AC power source. Thereby, even in the case of a structure in which the output ground terminal 16 is installed on the fin portion 122 of the heat sink 12, an increase in potential of the frame of the motor M can be prevented.

When an impedance element such as the core 132 is inserted into the cable 13, the level of radiation noise is reduced near 30 MHz, but increases in a frequency band higher than 30 MHz, which is indicated by the frequency region γ in FIG. When the cable 13 is passed through the core 132, the impedance formed by the cable 13 and the core 132 is different from the impedance of the cable 13 alone in the frequency domain with respect to the impedance of other paths of the motor drive system MS. It becomes high at γ. This causes a problem in that the noise current in the frequency band corresponding to the frequency region γ does not pass through the core 132, and the noise level increases.

(Modification 1)
Next, a power conversion device according to Modification Example 1 of Example 6 will be described using FIG. 14. The power conversion device 6a according to this modification has a structure that can solve the above-mentioned problems of the power conversion device 6 according to the sixth embodiment.

Specifically, as shown surrounded by a square frame ε1 in FIG. 14, in the power conversion device 6a according to this modification, the cable (an example of a conductive member) 13 is wound around the core 132. Cable 13 is wound around core 132 multiple times. When the cable 13 is wound around the core 132, not only the impedance of the core 132 increases, but also stray capacitance is formed between the windings of the wound portion of the cable 13. This stray capacitance forms a path for bypassing high frequency noise current across the core 132. Therefore, by adjusting the number of turns of the cable 13 wound around the core 132 to form an appropriate value of stray capacitance, it becomes possible for the high frequency noise current to pass through the path formed by the cable 13 and the core 132. This makes it possible to suppress an increase in noise current in the frequency region γ in FIG. 13. However, the structure in which stray capacitance is formed by winding the cable 13 around the core 132 has a problem in that it may be difficult to form a necessary stray capacitance by increasing the number of turns.

(Modification 2)
Next, a power conversion device according to a second modification of the sixth embodiment will be described using FIG. 15. The power converter 6b according to the present modification has a structure that can solve the above problems of the power converter 6 according to the sixth embodiment and the above problems of the power converter 6a according to the first modification.

Specifically, as shown surrounded by a rectangular frame ε2 in FIG. It is equipped with 133. A capacitor 133 connected to the cable 13 in parallel with the core 132 has a higher impedance than the core 132 in the low frequency of radiated noise, and has a lower impedance than the core 132 in the high frequency band where the radiated noise starts to increase. It has characteristics. Thereby, a path is formed in which the noise current bypasses both ends of the core 132 in the high frequency band. As a result, high frequency noise current can pass through the path formed by cable 13, core 132 and capacitor 133. Thereby, the power conversion device 6b is able to suppress an increase in noise in the high frequency band. Furthermore, it may be difficult to form the required stray capacitance simply by increasing the number of turns of the cable 13 around the core 132 as in the power conversion device 6a according to the first modification. On the other hand, the power converter 6b according to the present modification can select and use a capacitor with an optimal capacitance, so compared to the power converter 6a according to the first modification, high-frequency noise current is reduced. Easy to do.

As explained above, the power conversion devices E1, 1 to 6, 6a, 6b according to the present embodiment, Examples 1 to 6, and Modifications 1 and 2 include the power semiconductor module 14 constituting the inverter section 20, and the heat conduction A heat sink 12 that has a thermally conductive portion (for example, a base portion 121) formed of a body and a plurality of fin portions 122 and is provided with the base portion 121 in contact with at least a portion of the power semiconductor module 14; The casing 11 which has a formed conductive part in at least a part (for example, the bottom part), the thermally conductive part (for example, the base part 121) of the heat sink 12, and the conductive part (for example, the bottom part) of the casing 11 are connected to make the conductive part. A cable 13 having a cable 13 is provided.

According to the power conversion devices E1, 1 to 6, 6a, 6b having the above configuration, electromagnetic noise can be reduced. In particular, the power converters E1, 1 to 6, 6a, and 6b can effectively reduce radiation noise in the 30 MHz band.

Further, in the power conversion devices E1, 1 to 6, 6a, 6b, electromagnetic noise can be reduced by providing a conductive cable between the heat sink 12 and the housing 11. As a result, the power converter E1, 1 to 6, 6a, 6b has a simpler structure than the conventional noise countermeasure method, which is achieved by attaching electronic components such as multiple through cores inside the power converter, and can handle low frequency bands. (for example, 30 MHz band) radiation noise can be reduced.

Furthermore, in conventional power conversion devices, it has been common knowledge in the art that the heat sink and the casing should be in surface contact with each other and grounded in order to reduce noise. In contrast, the present invention connects the heat sink and the casing with a wire using a conductive member such as a cable, thereby lowering the resonance point of noise below 30 MHz and reducing the noise level around 30 MHz. Can be done.

[Second embodiment]
An electronic and electrical device according to a second embodiment of the present invention will be described using FIGS. 16 to 26. In explaining the power conversion device as an electronic and electrical device according to the second embodiment, the same reference numerals are given to the components having the same operation and function as those of the power conversion device as the electronic and electrical device according to the first embodiment. Detailed explanation will be omitted. Furthermore, the configuration inside the casing of the power conversion device according to the present embodiment is similar to the configuration of the power conversion device E1 according to the first embodiment described above using FIGS. 1 and 2, so a description of the configuration will be omitted. do.

As shown in FIG. 16, a power conversion device E2 as an electronic and electrical device according to the present embodiment includes a casing 11 that includes, at least in part, a conductive portion 111 formed of a conductor such as a sheet metal. The housing 11 includes, at least in part, a non-conductive portion 112 made of, for example, insulating resin. The housing 11 has a side wall (an example of a conductive part) at least partially formed of a conductor, and a rear surface part (an example of a conductive part) at least partly formed of a conductor. The housing 11 has a space inside. The power conversion device E2 includes a power semiconductor module (an example of a semiconductor element) 14 and at least a part of the heat conduction part formed of a heat conductor, and the heat conduction part is brought into contact with at least a part of the power semiconductor module 14. A heat sink 12 is provided. The heat sink 12 can radiate heat generated by the power semiconductor module 14 by mechanically and thermally contacting the power semiconductor module 14 . The power semiconductor module 14 and the heat sink 12 are arranged inside the housing 11.

Heat sink 12 is attached to housing 11 via an insulator. The heat sink 12 includes a plate-shaped base portion 121 and a plurality of thin plate-shaped fin portions 122 arranged perpendicularly to the base portion 121. The plurality of fin parts 122 are arranged in parallel with each other with a predetermined gap. The base portion 121 and the fin portion 122 are both made of a heat conductor such as aluminum or an aluminum alloy, and correspond to an example of a heat conduction portion. The power semiconductor module 14 is placed in mechanical and thermal contact with the base portion 121.

The power converter E2 includes a conductive cable (an example of a conductive member) 13 that connects the thermally conductive portion of the heat sink 12 and the conductive portion of the casing 11. The cable 13 is provided, for example, in a state where the base portion 121, which is an example of a thermally conductive portion of the heat sink 12, and the bottom portion, which is an example of a conductive portion of the casing 11, are connected. The cable 13 may be connected to the fin section 122 instead of the base section 121. The heat sink 12 and the housing 11 are electrically connected only by a cable 13. The cable 13 is provided to adjust the impedance of a noise transmission path in the power converter E2 alone or in a motor drive system including the power converter E2. In other words, the cable 13 functions as an impedance adjustment member for the noise transmission path in the motor drive system. The cable 13 is formed by bundling a plurality of thin wires made of copper, for example. Cable 13 has flexibility. The cable 13 is stretched between the heat sink 12 and the housing 11, for example, over the shortest distance. Furthermore, the cable 13 is stretched in a straight line between the heat sink 12 and the housing 11 without being folded back.

The power converter E2 has an input-side grounding terminal 51 to which a grounding wire 91a (an example of an input-side grounding wire) is connected, and an output-side grounding terminal 51 to which a grounding wire 92a (an example of an output-side grounding wire) is connected. A terminal 52 is provided. The input side grounding terminal 51 and the output side grounding terminal 52 are each provided in the non-conductive part 112 of the housing 11.

The input side grounding terminal 51 has, for example, electrical conductivity. The input-side grounding terminal 51 is attached to the non-conductive portion 112 of the housing 11, for example, with at least a portion to which the grounding wire 91a and the input grounding member 31 (details will be described later) being connected exposed. Moreover, when the input side grounding terminal 51 is not connected to the conductive part 111 of the housing 11 by the input ground member 31, it is electrically insulated from the conductive part 111 by the non-conductive part 112.

Similarly, the output side grounding terminal 52 has, for example, electrical conductivity. The output-side grounding terminal 52 is attached to the non-conductive portion 112 of the housing 11, for example, with at least a portion to which the grounding wire 92a and the output grounding member 32 (details will be described later) being connected exposed. Moreover, when the output side grounding terminal 52 is not connected to the conductive part 111 of the housing 11 by the output ground member 32, it is electrically insulated from the conductive part 111 by the non-conductive part 112.

The power converter E2 includes an input grounding member (an example of an input-side conductive member) 31 that connects the input-side grounding terminal 51 and at least one of the thermally conductive portion of the heat sink 12 and the conductive portion of the casing 11 and has conductivity. It is equipped with The power conversion device E2 includes an output grounding member (an example of an output-side electrically conductive member) 32 that connects the output-side grounding terminal 52 and at least one of the thermally conductive portion of the heat sink 12 and the electrically conductive portion of the casing 11 and has electrical conductivity. It is equipped with

The power converter E2 includes a first input side connection section 61 and a second input side connection section 71 to which the input ground member 31 is connected as necessary. The first input side connection part 61 is provided in the conductive part 111 of the housing 11. The second input side connection part 71 is provided in the heat conduction part of the heat sink 12. The power converter E2 includes a first output side connection part 62 and a second output side connection part 72 to which the output ground member 32 is connected as necessary. The first output side connection part 62 is provided in the conductive part 111 of the housing 11. The second output side connection section 72 is provided in the heat conduction section of the heat sink 12.

By the way, at the time of EMC standard certification, the power converter device is suspended by directly screwing a portion of the conductive portion (for example, the back surface) of the casing to a metal plate on a pedestal simulating an electric control panel. The metal plate of this pedestal is connected to the floor by a braided wire. Furthermore, the input terminal of the power converter and the commercial AC power source are connected by a 4-core VCT cable, and the output terminal of the power converter and the motor are connected by a 4-core VCT shielded cable.

Here, the shield of the cable on the output side is clamped to a metal plate simulating an electrical control panel with a part of the sheath exposed. Thereby, the shield on the output side and the metal plate are electrically connected. Radiation noise measurement of the power converter device is performed in this setting state. In an EMC standard certification measurement setting configured in this way, the largest source of noise radiation is the input cable.

In the first embodiment, the radiation noise measurement results explained using FIGS. 4, 5, 8, 11, and 13 are results obtained with the same configuration as the EMC standard certification measurement. In the configuration for EMC standard certification measurements, a shielded cable is used as the output cable, and a portion of the shielded cable is clamped to a metal plate simulating an electrical control panel. Therefore, in the configuration for EMC standard certification measurement, the input cable is the dominant radiation source, and the radiation noise from the output cable is small. In other words, if a shielded cable is not used for the output cable, the dominant radiation source will be the output cable, the input cable and the output cable, depending on the frequency of the radiated noise. There may be cases where they are replaced. Note that when a four-core cable is used for both input and output, radiation from the output cable becomes dominant. Therefore, if the internal structure is optimized to reduce radiation noise in the configuration for EMC standard certification measurement, as in the electronic and electrical equipment according to the first embodiment, if the input/output cable conditions are changed, In addition, there is a possibility that radiation noise in a low frequency band around 30 MHz cannot be sufficiently reduced.

The power converter E2 according to the present embodiment includes a cable 13 similarly to the power converter E1 according to the first embodiment. Thereby, the power converter E2 can reduce the noise radiated from the input cable in the EMC standard certification measurement. Note that in the case where the power conversion device is not shielded and does not include the cable 13 on the output side, the output side cable becomes the largest source of noise radiation. Therefore, it is recommended that the user of the power converter E2 use the power converter E2 with the same settings as in the EMC standard certification measurement, for example, as described in the product instruction manual.

However, when the power converter E2 is actually used, it may be used in a setting different from the recommended configuration (configuration at the time of EMC standard certification measurement) due to constraints on the installation location, construction policy of the set manufacturer, etc. Specifically, there are cases where a shielded wire is not used for the output cable, or a three-core wire is used for the power line, and a single wire is used for the ground wire. In such a case, the power converter E2 may not be able to sufficiently reduce radiation noise in a low frequency band around 30 MHz.

In the power conversion device as an electronic and electrical device according to the first embodiment, by connecting the heat sink 12 and the conductive part of the housing 11 with the cable 13, the impedance between the heat sink 12 and the input ground terminal 15 is high. Become. Thereby, in the power conversion device according to the first embodiment, the high frequency current flowing through the input cable 91 is suppressed. As a result, the power conversion device according to the first embodiment can reduce noise radiated from the input cable 91. In other words, radiation noise can be reduced by increasing the impedance from the heat sink 12 to the input cable 91, which is a dominant radiation source.

Therefore, if the input/output cable conditions are changed and noise radiation from the output cable becomes dominant, the radiation noise from the output cable can be reduced by increasing the impedance from the heat sink 12 to the output ground terminal. be able to.

In the power conversion device according to the first embodiment, the impedance from the heat sink 12 to the input ground terminal or the output ground terminal can be adjusted at the locations where the input ground terminal and the output ground terminal are connected, respectively. The power conversion device in the first embodiment has a configuration in which the input ground terminal 15 is provided on the conductive portion of the housing 11 and the output ground terminal is provided on the heat sink 12. As a result, in the power converter according to the first embodiment, the high-frequency current passes through the earth potential inside the power converter through a path of "heat sink 12 → cable 13 → conductive part of housing 11 → input ground terminal 15", It flows from the ground wire 91a of the input cable 91 to the outside. On the output side of the power conversion device in the first embodiment, the heat sink 12 and the output ground terminal are directly connected. Therefore, inside the power converter according to the first embodiment, the input side is connected to a higher impedance than the output side, so the magnitude of the high frequency current flowing through the input cable 91 can be suppressed.

Therefore, the power conversion device E2 as an electronic and electrical device according to the present embodiment includes an input side grounding terminal 51, an output side grounding terminal 52, an input grounding member 31, and an output grounding member 32. Thereby, the power conversion device E2 can be configured to be different from the configuration at the time of EMC standard certification measurement, depending on the usage situation. That is, the power converter E2 can change the connection conditions of the input cable and the output cable using the input ground member 31 and the output ground member 32.

For example, if the power conversion device E2 can be used in the same configuration as the EMC standard certification measurement, the input grounding member 31 connects the input side grounding terminal 51 and the first input side connection part 61 corresponding to the input grounding terminal. The output grounding member 32 connects the second output side connecting portion 72 corresponding to the output grounding terminal and the output side grounding terminal 52. The input grounding member 31 is connected to the grounding wire 91a at the input-side grounding terminal 51. Further, the output grounding member 32 is connected to the grounding wire 92a at the output-side grounding terminal 52. As a result, the ground wire 91a and the conductive portion 111 of the casing 11 are connected via the input ground member 31, and the thermally conductive portion of the heat sink 12 and the ground wire 92a are connected via the output ground member 32. Therefore, the power converter E2 has the same configuration as the connection conditions of the input cable and the output cable as in the EMC standard certification measurement. As a result, the power converter E2 can reduce radiation noise in a low frequency band around 30 MHz.

For example, if the power converter E2 cannot be used in the same configuration as the EMC standard certification measurement and radiation noise from the output cable becomes dominant, the input grounding member 31 connects the input side grounding terminal 51 to the input grounding terminal. The output ground member 32 connects the first output side connection portion 62 corresponding to the output ground terminal and the output side grounding terminal 52. As a result, the ground wire 91a and the heat conductive portion of the heat sink 12 are connected via the input ground member 31, and the conductive portion 111 of the casing 11 and the ground wire 92a are connected via the output ground member 32. Therefore, even if the power converter E2 cannot be used with the same configuration as in the EMC standard certification measurement and has a different configuration from the EMC standard certification measurement, the impedance on the output side can be higher than on the input side. Thereby, the power converter E2 can suppress the high frequency current flowing through the output cable, which is a dominant noise radiation source, and reduce the magnitude of radiation noise in a low frequency band around 30 MHz.

In the power conversion device E2, the input side grounding terminal 51 and the output side grounding terminal 52 are each provided on the outer surface of the housing 11. Further, the input ground member 31 is configured to be connected to at least one of the outer surface of the housing 11 and the outer surface of the heat sink 12. Further, the output ground member 32 is configured to be connected to at least one of the outer surface of the housing 11 and the outer surface of the heat sink 12. That is, the connection state of the input ground member 31 and the output ground member 32 can be changed from outside the power converter E2. As a result, the user of the power conversion device E2 can adjust the internal structure of the power conversion device E2 according to the usage environment (for example, the connection conditions of the input cable 91 and the output cable 92) without disassembling the entire power conversion device E2. The configuration can be switched from outside the power conversion device E2. Here, the "outside" of the power converter E2 refers to the area that the user of the power converter E2 touches when performing normal wiring work for the input cable 91 and the output cable 92, such as the outer surface of the casing 11. and the outer surface of the heat sink 12. Moreover, the "inside" of the power converter E2 refers to an area that the user of the power converter E2 does not touch when performing normal wiring work for the input cable 91 and the output cable 92.

In the power conversion device E2, at the time of product shipment (initial state), the input grounding terminal 51 and the first input side connection part 61 (i.e., the conductive part of the housing 11) are at least connected by the input grounding member 31. . Thereby, at the time of product shipment (initial state), electrical connection between the conductive portion of the casing 11 and the input-side grounding terminal 51 is ensured. The input side grounding terminal 51 is used to ground the power converter E2 to a reference ground plane 93 such as the earth or the floor.

In the power conversion device E2, at the time of product shipment (initial state), the output grounding member 32 connects at least the second output side connection portion 72 (i.e., the thermal conduction portion of the heat sink 12) and the output side grounding terminal 52. . Thereby, at the time of product shipment (initial state), electrical connection between the thermally conductive portion of the heat sink 12 and the output-side grounding terminal 52 is ensured. The output side grounding terminal 52 is used to connect the power converter E2 and the frame of a load such as the motor M, and to ground the load device. In FIG. 16, the output-side grounding terminal 52 is provided on the base portion 121, which is an example of a thermally conductive portion of the heat sink 12, but it is provided on the fin portion 122, which is an example of a thermally conductive portion of the heat sink 12. Good too.

As explained above, the electronic and electrical equipment according to the present embodiment can switch the location where the electrical connection between the grounding wire and the electronic and electrical equipment is made. Depending on the usage situation), it is possible to reduce the radiation of electromagnetic noise.

Hereinafter, the electronic and electrical equipment according to this embodiment will be described in more detail using examples. In the following examples as well, the electronic and electrical equipment according to the present embodiment will be explained using a power conversion device as an example. In addition, the same reference numerals are given to components that have the same functions and functions as the power converter E1 according to the first embodiment or the power converter E2 according to the present embodiment shown in FIGS. may be omitted as appropriate.

(Example 1)
A power conversion device as an electronic and electrical device according to Example 1 of the present embodiment will be described using FIGS. 17 and 18. 17(a) and 18(a), for ease of understanding, the power conversion device is shown with the input ground member and the output ground member removed. In addition, in FIGS. 17A and 18A, in order to facilitate understanding, the non-conductive portion of the casing provided in the power conversion device is shown transparently. In the power converter 7 according to this embodiment, the input ground member 31 and the output ground member 32 each have four types of earth bars, and four types of earth bars can be selected according to the usage status (installation status) of the power converter 7. The feature is that any two of them can be selected and the input and output can be connected.

As shown in FIGS. 17 and 18, the power conversion device 7 according to this embodiment includes a power semiconductor module (an example of a semiconductor element) 14 (not shown in FIGS. 17 and 18, see FIG. 1), and a thermal conductor. The power semiconductor module 14 includes a heat sink 12 that has a thermally conductive portion formed in at least a portion thereof and is provided with the thermally conductive portion in contact with at least a portion of the power semiconductor module 14 . The heat sink 12 has a base portion 121 and a plurality of fin portions 122 as a heat conduction portion. The entire heat sink 12 is made of a thermal conductor. The heat sink 12 is made of a conductor. A power semiconductor module 14 is mounted on the base portion 121 of the heat sink 12. Thermal contact between the power semiconductor module 14 and the heat sink 12 is ensured. As a result, the heat generated by the switching operation of the semiconductor switches Q1 to Q6 (not shown in FIGS. 17 and 18, see FIG. 2(a)) is conducted to the heat sink 12 via the copper base 14q, and is transferred to the outside. Heat is dissipated.

The power conversion device 7 includes a casing 11 having at least a part thereof a conductive part 111 made of a conductor, a heat conductive part (base part 121 in this embodiment) of a heat sink 12, and a conductive part (in this embodiment, a casing). A conductive cable (an example of a conductive member) 13 (not shown in FIGS. 17 and 18, see FIG. 16) is provided. A portion of the side wall and the bottom of the casing 11 are made of a conductor. The heat sink 12 is attached to the housing 11 such that there is a gap between the tip of the fin portion 122 and the bottom of the housing 11. The heat sink 12 is supported by the housing 11 via an insulator (not shown). Therefore, the heat sink 12 and the housing 11 are electrically connected only by the cable 13. The heat sink 12 and the housing 11 are electrically connected at one point by a cable 13.

As shown in FIGS. 17 and 18, the power conversion device 7 includes an input side grounding terminal 51, an output side grounding terminal 52, an input grounding member (an example of an input side conductive member) 31, and an output grounding member (an example of an output side conductive member). (Example of member) 32. The input ground member 31 includes a first input ground bar (an example of a first input conductive member) 311 (see FIG. 18) that connects the input side grounding terminal 51 and the thermally conductive part of the heat sink 12, and an input side grounding terminal. 51 and the conductive portion of the housing 11. The second input ground bar (an example of the second input side conductive member) 312 (see FIG. 17) connects the conductive portion of the housing 11. The output ground member 32 includes a first output ground bar (an example of a first output conductive member) 321 (see FIG. 17) that connects the output side grounding terminal 52 and the thermally conductive part of the heat sink 12, and an output side grounding terminal. 52 and the conductive part 111 of the housing 11. The second output ground bar (an example of the second output side conductive member) 322 (see FIG. 18) connects the conductive part 111 of the housing 11.

As shown in FIG. 18, the first input side connection part 61 provided in the conductive part 111 of the casing 11 connects a thin rectangular cut-out part formed by protruding from a part of the bottom of the casing 11 to the casing. It is provided at a portion formed by vertically bending the side wall of the frame 11. The end of the portion (the end opposite to the bottom end of the casing 11) is bent outward to be substantially parallel to the bottom of the casing 11. The first input-side connection portion 61 is composed of the end portion of the portion and a screw hole formed in the end portion.

On the other hand, the first output side connection part 62 provided in the conductive part 111 of the housing 11 is provided on the side wall side opposite to the side wall side where the first input side connection part 61 is provided. The first output side connection part 62 is provided at the end of a part having a symmetrical structure with the part where the first input side connection part 61 is provided. The first output-side connection portion 62 is comprised of the end portion of the portion and a screw hole formed in the end portion. As shown in FIG. 17(b) and FIG. 17, the first input side connection part 61 and the first output side connection part 62 are arranged almost in a straight line when the power conversion device 7 is viewed from above. .

The second input-side connection portion 71 includes a screw hole formed in, for example, a portion of the base portion 121 of the heat sink 12 and a portion of the base portion 121 around the screw hole. The second input side connection part 71 is provided on the same side wall side as the side wall of the housing 11 where the first input side connection part 61 is provided. The first input side connection part 61 and the second input side connection part 71 are arranged substantially in a straight line along the side wall.

The second output-side connection portion 72 includes a screw hole formed in, for example, a part of the base portion 121 of the heat sink 12 and a portion of the base portion 121 around the screw hole. The second output side connection part 72 is provided on the same side wall side as the side wall of the housing 11 where the first output side connection part 62 is provided. The first output side connection part 62 and the second output side connection part 72 are arranged substantially in a straight line along the side wall. The first output side connection part 62 and the second output side connection part 72 are arranged substantially on a straight line in a direction orthogonal to the side wall.

The input-side grounding terminal 51 and the output-side grounding terminal 52 are provided in a non-conductive part 112 that is arranged to surround the conductive part 111 and is made of resin, for example. The input-side grounding terminal 51 and the output-side grounding terminal 52 are arranged side by side at the upper end of one side wall of the non-conductive portion 112 . The input-side grounding terminal 51 and the output-side grounding terminal 52 each include a hole formed in one side wall of the non-conductive portion 112 from the upper end to a predetermined position. One side wall of the non-conductive part 112 in which the input side grounding terminal 51 and the output side grounding terminal 52 are provided is the conductive part of the housing 11 in which the first input side connection part 61 and the first output side connection part 62 are provided. The conductive portion 111 is disposed substantially perpendicular to the side wall of the portion 111 and the side wall of the conductive portion 111 of the housing 11 in which the second input side connection portion 71 and the second output side connection portion 72 are provided.

The first input ground bar 311, the second input ground bar 312, the first output ground bar 321, and the second output ground bar 322 are each formed by bending a thin rectangular metal plate into a predetermined shape. The first input ground bar 311, the second input ground bar 312, the first output ground bar 321, and the second output ground bar 322 have mutually different shapes.

When the first input ground bar 311 is installed in the power converter 7, one end is arranged on the input side grounding terminal 51, and the other end is arranged on the second input side connection part 71. It is configured as follows. A through hole is formed in one end of the first input ground bar 311 at a position corresponding to a hole forming the input grounding terminal 51. A through hole is formed in the other end of the first input ground bar 311 at a position corresponding to the screw hole of the second input side connecting portion 71. The first input ground bar 311 has, for example, an insulator that exposes a metal plate around these through holes and covers other conductive parts. That is, the first input ground bar 311 is covered with the insulator, for example, with the metal plate exposed around these through holes. The first input ground bar 311 is configured to be attached to the inside of the power converter 7 from above outside. The first input ground bar 311 is covered with an insulating material except for a part, so that the input cable is connected to the thermally conductive part of the heat sink 12 (the base part 121 in this embodiment) and the input side grounding terminal 51. Contact with conductive parts other than the ground wire 91a (not shown in FIGS. 17 and 18, see FIG. 2) constituting the ground wire 91 is prevented.

When the second input ground bar 312 is installed in the power conversion device 7, one end is arranged on the input side grounding terminal 51, and the other end is arranged on the first input side connection part 61. It is configured as follows. A through hole is formed in one end of the second input ground bar 312 at a position corresponding to a hole forming the input side grounding terminal 51. A through hole is formed at the other end of the second input ground bar 312 at a position corresponding to the screw hole of the first input side connecting portion 61. The second input ground bar 312 has, for example, an insulator that exposes a metal plate around these through holes and covers other conductive parts. That is, the second input ground bar 312 is covered with the insulator, for example, with the metal plate exposed around these through holes. The second input ground bar 312 is configured to be attached to the inside of the power converter 7 from above outside. Since the second input ground bar 312 is covered with an insulating material except for a part, when it is attached to the power conversion device 7, it is connected to the conductive part 111 of the housing 11 and the input side grounding terminal 51. Contact with conductive parts other than the ground wire 91a constituting the input cable 91 is prevented.

When the first output ground bar 321 is installed in the power conversion device 7, one end is arranged on the output side grounding terminal 52, and the other end is arranged on the second output side connection part 72. It is configured as follows. A through hole is formed in one end of the first output earth bar 321 at a position corresponding to a hole forming the output side grounding terminal 52. A through hole is formed in the other end of the first output earth bar 321 at a position corresponding to the screw hole of the second output side connecting portion 72. The first output ground bar 321 has, for example, an insulator with exposed metal plates around these through holes and covering other conductive parts. In other words, the first output ground bar 321 is covered with the insulator, for example, with the metal plate exposed around these through holes. The first output ground bar 321 is configured to be attached to the inside of the power converter 7 from above outside. The first output ground bar 321 is covered with an insulating material except for a part, so that the output cable is connected to the thermally conductive part (the base part 121 in this embodiment) of the heat sink 12 and the output side grounding terminal 52. Contact with conductive parts other than the ground wire 92a (not shown in FIGS. 17 and 18, see FIG. 2) constituting the ground wire 92 is prevented.

When the second output ground bar 322 is installed in the power converter 7, one end is arranged on the output side grounding terminal 52, and the other end is arranged on the first output side connection part 62. It is configured as follows. A through hole is formed in one end of the second output earth bar 322 at a position corresponding to the hole forming the output side grounding terminal 52. A through hole is formed at the other end of the second output earth bar 322 at a position corresponding to the screw hole of the first output side connecting portion 62. The second output ground bar 322 has, for example, an insulator that exposes a metal plate around these through holes and covers other conductive parts. That is, the second output ground bar 322 is covered with the insulator, for example, with the metal plate exposed around these through holes. The second output ground bar 322 is configured to be attached to the inside of the power converter 7 from above outside. Since the second output ground bar 322 is covered with an insulating material except for a part, when it is attached to the power conversion device 7, it is connected to the conductive part 111 of the housing 11 and the output side grounding terminal 52. Contact with conductive parts other than the ground wire 92a constituting the output cable 92 is prevented.

As shown in FIG. 17, at the time of product shipment (initial state), the power conversion device 7 is configured in an EMC standard certified measurement configuration (manufacturer's recommended installation configuration), that is, the second input ground bar 312 and the first output ground bar 321 are selected. Has been installed. Therefore, when the power conversion device 7 is used in a state that can be considered to be the same as the EMC standard certified measurement configuration, the input grounding member 31 and the output grounding member 32 can be used without being replaced.

As shown in FIG. 18, when the power conversion device 7 is used in a manner different from that at the time of product shipment (initial state) due to the usage environment etc. (for example, in a manner in which the output cable cannot be shielded), the first input ground bar is 311 and the second output ground bar 322 are selected and installed. For example, the operation of replacing the input ground member 31 and the output ground member 32 is performed by a user of the power conversion device 7. To replace the input grounding member 31 and the output grounding member 32, open the outer cover (not shown) that is opened when connecting the normal input cable 91 and output cable 92, and remove and tighten the screws to replace the input grounding member 31. And each type of output ground member 32 can be replaced. Therefore, the power conversion device 7 can prevent the work of replacing the input grounding member 31 and the output grounding member 32 from becoming complicated.

Thereby, the power conversion device 7 according to this embodiment can obtain the same effects as the power conversion device E2 in the second embodiment.

(Example 2)
A power conversion device as an electronic and electrical device according to Example 2 of the present embodiment will be described using FIGS. 19 and 20. 19(a) and 20(a), for ease of understanding, the power conversion device is shown with the input grounding member and the output grounding member removed. Further, in FIGS. 19 and 20, illustration of the printed circuit board is omitted for easy understanding. In the power converter 8 according to this embodiment, the input ground member 31 and the output ground member 32 each have four earth bars of two types, and two types of earth bars can be used depending on the usage status (installation status) of the power converter 8. The feature is that two of one type are selected and the input and output are connected.

As shown in FIGS. 19 and 20, the power conversion device 7 according to this embodiment includes a power semiconductor module (an example of a semiconductor element) 14 (not shown in FIGS. 19 and 20, see FIG. 1), and a thermal conductor. The power semiconductor module 14 includes a heat sink 12 that has a thermally conductive portion formed in at least a portion thereof and is provided with the thermally conductive portion in contact with at least a portion of the power semiconductor module 14 . The heat sink 12 has a base portion 121 and a plurality of fin portions 122 (not shown in FIGS. 19 and 20, see FIG. 1) as a heat conduction portion. The entire heat sink 12 is made of a thermal conductor. The heat sink 12 is made of a conductor. A power semiconductor module 14 is mounted on the base portion 121 of the heat sink 12. Thermal contact between the power semiconductor module and the heat sink 12 is ensured. As a result, the heat generated by the switching operations of the semiconductor switches Q1 to Q6 (not shown in FIGS. 19 and 20, see FIG. 2(a)) is conducted to the heat sink 12 and radiated to the outside.

The power conversion device 8 includes a casing 11 having at least a part thereof a conductive part 111 made of a conductor, a heat conductive part (base part 121 in this embodiment) of a heat sink 12, and a conductive part (in this embodiment, a casing). A conductive cable (an example of a conductive member) 13 (not shown in FIGS. 19 and 20, see FIG. 16) is provided. A portion of the side wall and the bottom of the casing 11 are made of a conductor. The heat sink 12 is attached to the housing 11 such that there is a gap between the tip of the fin portion 122 and the bottom of the housing 11. The heat sink 12 is supported by the housing 11 via an insulator (not shown). Therefore, the heat sink 12 and the housing 11 are electrically connected only by the cable 13. The heat sink 12 and the housing 11 are electrically connected at one point by a cable 13.

As shown in FIGS. 19 and 20, the power conversion device 8 includes an input side grounding terminal 51, an output side grounding terminal 52, an input grounding member (an example of an input side conductive member) 31, and an output grounding member (an example of an output side conductive member). (Example of member) 32. The input ground member 31 includes a first input ground bar (an example of a first input conductive member) 313 (see FIG. 20) that connects the input side grounding terminal 51 and the thermally conductive part of the heat sink 12, and an input side grounding terminal. 51 and the conductive part of the housing 11. The second input ground bar (an example of the second input side conductive member) 314 (see FIG. 19) connects the conductive part of the housing 11. The output ground member 32 includes a first output ground bar (an example of a first output conductive member) 323 (see FIG. 19) that connects the output side grounding terminal 52 and the thermally conductive portion of the heat sink 12, and an output side grounding terminal. 52 and the conductive part 111 of the housing 11. The second output earth bar (an example of the second output side conductive member) 324 (see FIG. 20) connects the conductive part 111 of the housing 11.

The first input ground bar 313 and the second output ground bar 324 have the same shape, and the second input ground bar 314 and the first output ground bar 323 have the same shape. As a result, in the power conversion device 8 according to the present embodiment, it is only necessary to manufacture two types of ground members for the input ground member 31 and the output ground member 32, so that manufacturing costs can be reduced.

The input side grounding terminal 51 has a first input side grounding terminal 511 and a second input side grounding terminal 512, and the output side grounding terminal 52 has a first output side grounding terminal 521 and a second output side grounding terminal 521. It has a grounding terminal 522. The first input side grounding terminal 511, the first output side grounding terminal 521, the second input side grounding terminal 512, and the second output side grounding terminal 522 are arranged along the upper end of one side wall of the non-conductive part 112. It is located. The first input-side grounding terminal 511, the first output-side grounding terminal 521, the second input-side grounding terminal 512, and the second output-side grounding terminal 522 are each provided on one side wall of the non-conductive part 112 from the upper end. It is attached to the hole formed up to the position. One side wall of the non-conductive part 112 provided with the first input-side grounding terminal 511, the first output-side grounding terminal 521, the second input-side grounding terminal 512, and the second output-side grounding terminal 522 is The side wall of the conductive part 111 of the casing 11 in which the input side connection part 61 and the first output side connection part 62 are provided, and the side wall of the casing 11 in which the second input side connection part 71 and the second output side connection part 72 are provided. The conductive portion 111 is disposed substantially perpendicular to the side wall of the conductive portion 111 . The first input side grounding terminal 511, the first output side grounding terminal 521, the second output side grounding terminal 522, and the second input side grounding terminal 512 are connected to a housing in which the first input side connection part 61 is provided. They are arranged in this order from the side wall of No. 11.

The first input side grounding terminal 511, the second input side grounding terminal 512, the first output side grounding terminal 521, and the second output side grounding terminal 522 are each, for example, on the upper end side of one side wall of the non-conductive part 112. It has a cylindrical shape with an opening. The first input-side grounding terminal 511, the second input-side grounding terminal 512, the first output-side grounding terminal 521, and the second output-side grounding terminal 522 each have, for example, a thread cut on the inner wall surface of this cylindrical shape. ing. As a result, the ground wire 91a (not shown in FIGS. 19 and 20, see FIG. 16) and the first input ground bar 313 or the second input ground bar 314 are electrically connected to the first input grounding terminal 511. It can be screwed in place. Similarly, the ground wire 91a and the first input ground bar 313 or the second input ground bar 314 can be screwed to the second input grounding terminal 512 in a state where they are electrically connected. Similarly, the first output grounding terminal 521 is electrically connected to the grounding wire 92a (not shown in FIGS. 19 and 20, see FIG. 16) and the first output grounding bar 323 or the second output grounding bar 324. It can be screwed in place. Similarly, the ground wire 92a and the first output ground bar 323 or the second output ground bar 324 can be screwed to the second output side grounding terminal 522 in a state where they are electrically connected.

The first input side connection section 61 in this embodiment has the same configuration as the first input side connection section 61 in the above-mentioned Example 1 of this embodiment. The first output side connection part 62 in this example has the same structure as the first output side connection part 62 in the above-mentioned Example 1 of this embodiment. The first output side connection part 62 in this example has the same structure as the first output side connection part 62 in the above-mentioned Example 1 of this embodiment. The second output side connection section 72 in this example has the same configuration as the second output side connection section 72 in the above-mentioned Example 1 of this embodiment.

However, the second input side connection part 71 in this example is arranged closer to the first input side connection part 61 than the second input side connection part 71 in the above-mentioned Example 1 of this embodiment. Similarly, the second output side connection part 72 in this example is arranged closer to the first output side connection part 62 than the second output side connection part 72 in the above-mentioned Example 1 of this embodiment. As a result, the power conversion device 8 in this embodiment has a length from the first input side grounding terminal 511 to the second input side connection part 71, and a length from the second input side grounding terminal 512 to the first input side connection part 61. They are constructed so that their lengths are approximately the same. Similarly, the power conversion device 8 has a length from the first output side grounding terminal 521 to the second output side connection part 72, and a length from the second output side grounding terminal 522 to the first output side connection part 62. are constructed so that they are almost the same. Moreover, the power converter 8 has a length from the first input side grounding terminal 511 to the second input side connection part 71 and a length from the first output side grounding terminal 521 to the second output side connection part 72. They are configured to be almost the same. Furthermore, the power conversion device 8 has a length from the second input side grounding terminal 512 to the first input side connection part 61 and a length from the second output side grounding terminal 522 to the first output side connection part 62. They are configured to be almost the same.

Therefore, by using the second input ground bar 314 and the first output ground bar 323 having the same shape, as shown in FIG. The first output earthing bar 323 can connect the first output side grounding terminal 521 and the second output side connection part 72 . In addition, by using the first input ground bar 313 and the second output ground bar 324 having the same shape, as shown in FIG. The second output grounding terminal 522 and the first output side connecting portion 62 can be connected by the second output grounding bar 324 .

Like the first input ground bar 311 in Example 1 of this embodiment, the first input ground bar 313 has a metal plate exposed at a portion connected to the second input ground terminal 512 and the first input connection part 61. The other parts are covered with an insulating material. Like the second input ground bar 312 in Example 1 of this embodiment, the second input ground bar 314 has a metal plate exposed at a portion connected to the first input ground terminal 511 and the second input connection part 71. The other parts are covered with an insulating material. Like the first output earth bar 321 in Example 1 of this embodiment, the first output earth bar 323 has a metal plate exposed at a portion connected to the first output side grounding terminal 521 and the second output side connection part 72. The other parts are covered with an insulating material. The second output earth bar 324 has a metal plate exposed at a portion connected to the second output side grounding terminal 522 and the first output side connection part 62, like the second output earth bar 322 in Example 1 of the present embodiment. The other parts are covered with an insulating material. As a result, when the first input ground bar 313, the second input ground bar 314, the first output ground bar 323, and the second output ground bar 324 are respectively attached to the power conversion device 8, it is possible to prevent them from coming into contact with conductive parts other than predetermined terminals. is prevented.

As shown in FIG. 19, at the time of product shipment (initial state), the power conversion device 8 is in an EMC standard certified measurement configuration (manufacturer's recommended installation configuration), that is, one of the two types of earth bars. Input ground bar 314 and first output ground bar 323 are selected and attached. Therefore, when the power conversion device 8 is used in a state that can be considered to be the same as the EMC standard certified measurement configuration, the input grounding member 31 and the output grounding member 32 can be used without being replaced.

As shown in FIG. 20, when the power conversion device 8 is used in a manner different from that at the time of product shipment (initial state) due to the usage environment etc. (for example, in a manner in which the output cable cannot be shielded), two types of earth bars are used. The other type of first input ground bar 313 and second output ground bar 324 are selected and installed. The work of replacing the input grounding member 31 and the output grounding member 32 in this embodiment can be performed in the same way as the work of replacing the input grounding member 31 and the output grounding member 32 according to the first embodiment of the present embodiment. Furthermore, since the first input ground bar 313 and the second output ground bar 324 have the same shape, the replacement work of the input ground member 31 and the output ground member 32 according to this embodiment is difficult because the first input ground bar 313 and the second output ground bar 324 have the same shape. The output ground bar 324 can be connected to either the input/output side, and the power converter 8 can obtain the same radiation noise reduction effect even when connected to either side. Therefore, the power converter 8 according to the present embodiment prevents the replacement work of the input ground member 31 and the output ground member 32 from becoming complicated, and is better than the power converter 7 according to the first embodiment of the present embodiment. It is possible to improve the work efficiency of replacing the input grounding member 31 and the output grounding member 32.

Furthermore, in the power conversion device 8 according to this embodiment, the second input ground bar 314 and the first output ground bar 323 have the same shape, and the first input ground bar 313 and the second output ground bar 324 have the same shape. There is. As a result, in the power conversion device 8 according to the present embodiment, it is only necessary to manufacture two types of ground members for the input ground member 31 and the output ground member 32, so that manufacturing costs can be reduced.

The power conversion device 8 according to this embodiment includes a first input ground bar 313, a second input ground bar 314, a first output ground bar 323, and a second output ground bar 324, that is, two types of four ground bars. However, the power conversion device 8 according to this embodiment may include two types and two earth bars. As described above, in the power conversion device 8, the second input ground bar 314 and the first output ground bar 323 are selected and attached when the product is shipped (initial state). Therefore, if the power converter 8 is used in a manner different from the one at the time of shipment (initial state) due to the usage environment (for example, in a manner in which the output cable cannot be shielded), the second input ground bar 314 is It can be used as a dual output ground bar and the first output ground bar 323 can be switched to be used as the first input ground bar. As a result, the number of earth bars used in the power converter 8 can be reduced, so that the cost of the power converter 8 can be reduced.

In this embodiment, the first input ground bar 313 and the first output ground bar 323 have different shapes, and the second input ground bar 314 and the second output ground bar 324 have different shapes. However, the first input ground bar 313 and the first output ground bar 323 may have the same shape, and the second input ground bar 314 and the second output ground bar 324 may have the same shape. That is, the first input ground bar 313, the second input ground bar 314, the first output ground bar 323, and the second output ground bar 324 may have the same shape. For example, the length from the first input side grounding terminal 511 to the second input side connection part 71, the length from the second output side grounding terminal 522 to the first input side connection part 61, the length for the first output side grounding By making the length from the terminal 521 to the second output side connection part 72 and the length from the second input side grounding terminal 512 to the first output side connection part 62 the same, each earth bar has the same shape. can do. Thereby, the cost of the power conversion device 8 can be reduced.

(Example 3)
A power conversion device as an electronic and electrical device according to Example 3 of the present embodiment will be described using FIGS. 21 and 22. In FIG. 21, for ease of understanding, the power converter is shown with the input ground member and the output ground member removed. Further, in FIGS. 21 and 22, illustration of the printed circuit board is omitted for easy understanding. The power conversion device 9 according to the present embodiment can be adapted to the usage environment by appropriately changing the connection points between the input grounding member 33 and the output grounding member 34 and the conductive portion 111 of the housing 11 and the thermally conductive portion of the heat sink 12. It has the following characteristics.

As shown in FIGS. 21 and 22, the power conversion device 9 according to this embodiment includes a power semiconductor module (an example of a semiconductor element) 14 (not shown in FIGS. 21 and 22, see FIG. 1), and a thermal conductor. The power semiconductor module 14 includes a heat sink 12 that has a thermally conductive portion formed in at least a portion thereof and is provided with the thermally conductive portion in contact with at least a portion of the power semiconductor module 14 . The heat sink 12 has a base portion 121 and a plurality of fin portions 122 (not shown in FIGS. 21 and 22, see FIG. 1) as a heat conduction portion. The entire heat sink 12 is made of a thermal conductor. The heat sink 12 is made of a conductor. A power semiconductor module 14 is mounted on the base portion 121 of the heat sink 12. Thermal contact between the power semiconductor module and the heat sink 12 is ensured. As a result, the heat generated by the switching operations of the semiconductor switches Q1 to Q6 (not shown in FIGS. 21 and 22, see FIG. 2(a)) is conducted to the heat sink 12 and radiated to the outside.

The power conversion device 9 includes a casing 11 having at least a part thereof a conductive part 111 made of a conductor, a heat conductive part (base part 121 in this embodiment) of a heat sink 12, and a conductive part (in this embodiment, a casing). A conductive cable (an example of a conductive member) 13 (not shown in FIGS. 21 and 22, see FIG. 16) is provided. A portion of the side wall and the bottom of the casing 11 are made of a conductor. The heat sink 12 is attached to the housing 11 such that there is a gap between the tip of the fin portion 122 and the bottom of the housing 11. The heat sink 12 is supported by the housing 11 via an insulator (not shown). Therefore, the heat sink 12 and the housing 11 are electrically connected only by the cable 13. The heat sink 12 and the housing 11 are electrically connected at one point by a cable 13.

As shown in FIGS. 21 and 22, the power conversion device 9 includes an input side grounding terminal 51 and an output side grounding terminal 52. The power conversion device 9 also includes an input grounding member (an input-side conductive member) that connects the input-side grounding terminal 51 and at least one of the thermally conductive portion of the heat sink 12 and the conductive portion 111 of the housing 11 and has conductivity. Example) 33. Furthermore, the power conversion device 9 connects the output-side grounding terminal 52 and at least one of the thermally conductive portion of the heat sink 12 and the conductive portion 111 of the casing 11, and includes an output grounding member (an output-side conductive member) having conductivity. Example) 34.

The input grounding member 33 includes an input-side insulator 33a that covers the conductive portion and exposes at least the portion that electrically contacts the input-side grounding terminal 51, the thermally conductive portion of the heat sink 12, and the conductive portion 111 of the housing 11. have. The output grounding member 34 has an output side insulator 34a that covers the conductive portion while exposing at least the portion that contacts the output side grounding terminal 52, the heat conduction portion of the heat sink 12, and the conductive portion 111 of the housing 11. ing.

The input ground member 33 is formed of, for example, a metal plate. The input side insulator 33a is formed by insulating the metal surface (an example of a conductive portion) of the input ground member 33, leaving a part of the surface. For this reason, the input side insulator 33a is composed of, for example, an insulating film that covers the surface of the input ground member 33.

The output ground member 34 is formed of, for example, a metal plate. The output side insulator 34a is formed by insulating the metal surface (an example of a conductive portion) of the output ground member 34, leaving a part of the surface. For this reason, the output side insulator 34a is composed of, for example, an insulating film that covers the surface of the output ground member 34.

As shown in FIG. 22, the power converter 9 includes a screw 81 (first input side connecting member example). The power conversion device 9 includes an output ground member 34 and a screw 82 (an example of a first output side connection member) that connects the other of the thermally conductive portion of the heat sink 12 and the conductive portion 111 of the housing 11. There is.

As shown in FIGS. 21 and 22, the input grounding member 33 has a screw hole 331, a screw hole 332 (see FIG. 22(b)), and a screw hole 333 at a location that does not have the input side insulator 33a. ing. When the input grounding member 33 is attached to the power conversion device 9, the screw hole 331 is arranged at a position corresponding to the input side grounding terminal 51, and the screw hole 332 is arranged at a position corresponding to the first input side connection part 61. The screw hole 333 is arranged at a position corresponding to the second input side connection part 71. Note that the input side grounding terminal 51 in this example has the same structure as the input side grounding terminal 51 in Example 1 of this embodiment. Moreover, the first input side connection part 61 in this example has the same structure as the first input side connection part 61 in Example 1 of this embodiment. Furthermore, the second input side connection section 71 in this example has the same structure as the second input side connection section 71 in Example 1 of this embodiment.

The input side insulator 33a has a conductive portion exposed at a location on the input ground member 33 that the screw 81 comes into contact with. More specifically, the input side insulator 33a is not formed on the inner surface of the input ground member 33 where the screw holes 331, 332, and 333 are threaded. On the other hand, the input side insulator 33a is formed at the peripheral edge of the screw hole 331, the screw hole 332, and the screw hole 333. As a result, the input-side insulator 33a exposes the inner surface of the input ground member 33 where the screw holes 331, 332, and 333 are threaded. As a result, when the screw 81 is attached to the screw hole 332 and the first input side connection part 61, the screw hole 332 and the first input side connection part 61 come into mechanical contact with the screw 81, and the screw 81 Therefore, the input ground member 33 and the conductive portion 111 of the housing 11 can be electrically contacted via the screw 81 . On the other hand, when the screw 81 is attached to the screw hole 333 and the second input side connection part 71, the screw hole 333 and the second input side connection part 71 are in mechanical and electrical contact with the screw 81. The input ground member 33 and the thermally conductive portion of the heat sink 12 can be electrically contacted via the screw 81 .

As shown in FIGS. 21 and 22, the output grounding member 34 has a screw hole 341, a screw hole 342 (see FIG. 22(a)), and a screw hole 343 at a location where the output side insulator 34a is not provided. ing. When the output grounding member 34 is attached to the power converter 9, the screw hole 341 is arranged at a position corresponding to the output side grounding terminal 52, and the screw hole 342 is arranged at a position corresponding to the first output side connection part 62. The screw hole 343 is arranged at a position corresponding to the second output side connection part 72. Note that the output side grounding terminal 52 in this example has the same structure as the output side grounding terminal 52 in Example 1 of this embodiment. Moreover, the first output side connection part 62 in this example has the same structure as the first output side connection part 62 in Example 1 of this embodiment. Furthermore, the second output side connection section 72 in this example has the same structure as the second output side connection section 72 in Example 1 of this embodiment.

The output side insulator 34a has a conductive portion exposed at a location on the output ground member 34 that the screw 82 comes into contact with. More specifically, the output side insulator 34a is not formed on the inner surface of the output ground member 34 where the screw holes 341, 342, and 343 are threaded. On the other hand, the output side insulator 34a is formed at the periphery of the screw hole 341, the screw hole 342, and the screw hole 343. As a result, the output side insulator 34a exposes the inner surface of the output grounding member 34 where the screw holes 341, 342, and 343 are threaded. As a result, when the screw 82 is attached to the screw hole 342 and the first output side connection part 62, the screw hole 342 and the first output side connection part 62 are in mechanical contact with the screw 82, and the screw 82 is attached to the screw hole 342 and the first output side connection part 62. Therefore, the output ground member 34 and the conductive portion 111 of the housing 11 can be electrically contacted via the screw 82 . On the other hand, when the screw 82 is attached to the screw hole 343 and the second output side connection part 72, the screw hole 342 and the second output side connection part 72 are in mechanical and electrical contact with the screw 82. The output ground member 34 and the thermally conductive portion of the heat sink 12 can be in electrical contact via the screw 82 .

As shown in FIGS. 22(a) and 22(b), the input grounding member 33 and the output grounding member 34 are electrically contacted in opposite directions. More specifically, as shown in FIG. 22(a), the input grounding member 33 has the screw 81 attached to the screw hole 332 and makes electrical contact with the conductive part 111 of the housing 11, whereas the input grounding member 33 The grounding member 34 has the screw 82 attached to the screw hole 343 and comes into electrical contact with the thermally conductive portion of the heat sink 12 . On the other hand, as shown in FIG. 22(b), the input grounding member 33 has the screw 81 attached to the screw hole 333 and comes into electrical contact with the thermally conductive part of the heat sink 12, whereas the output grounding member 34 The screw 82 is attached to the screw hole 342 and makes electrical contact with the conductive portion 111 of the housing 11 .

As shown in FIG. 22(a), the power converter 9 is in the EMC standard certified measurement configuration (manufacturer's recommended installation configuration) at the time of product shipment (initial state), that is, the screw 81 is connected to the screw hole 332 (FIG. (see FIG. 22(b)), and the screw 82 is attached to the screw hole 343 (see FIG. 22(b)). As a result, in the power conversion device 9, when the product is shipped (initial state), the input ground member 33 is connected to the conductive part 111 of the casing 11, and the output ground member 34 is connected to the thermally conductive part of the heat sink 12. Therefore, when the power conversion device 9 is used in a state that can be considered to be the same as the EMC standard certified measurement configuration, it can be used without replacing the screws 81 and 82.

As shown in FIG. 22(b), when the power converter 9 is used in a manner different from that at the time of product shipment (initial state) due to the usage environment etc. (for example, in a manner in which the output cable cannot be shielded), 81 is attached to the screw hole 333 (see FIG. 22(a)), and a screw 82 is attached to the screw hole 342 (see FIG. 22(a)). The work of changing the connection state of the input ground member 33 and the output ground member 34 in this embodiment (corresponding to the work of replacing the ground members in Examples 1 and 2 of this embodiment) involves changing the attachment points of the screws 81 and 82. Just change it. Therefore, the power conversion device 9 according to the present embodiment prevents the work of changing the connection state of the input ground member 33 and the output ground member 34 from becoming complicated, and also prevents the power conversion device 9 according to the above embodiments 1 and 2 of the present embodiment. The work efficiency can be improved compared to the work of replacing the input grounding member 31 and the output grounding member 32 in the converters 7 and 8.

In the power conversion device 9 according to this embodiment, the input ground member 33 is electrically contacted with either the conductive portion 111 of the housing 11 or the thermally conductive portion of the heat sink 12 through the screw holes 332 and 333 and the screw 81. It is configured as follows. Further, the power converter 9 is configured such that the output grounding member 34 is electrically contacted with either the conductive portion 111 of the housing 11 or the thermally conductive portion of the heat sink 12 through the screw holes 342 and 343 and the screw 82. It is configured. However, the power conversion device 9 does not have such a configuration, but has a configuration in which the input ground member 33 and the output ground member 34 are held, such as cuts in the conductive part 111 of the housing 11 and the thermally conductive part of the heat sink 12. It's okay. In this case, the power conversion device 9 presses, for example, the region of these regions that is to be brought into electrical contact with the input grounding member 33 to bring it into electrical contact with the input grounding member 33, and In the area, the area is not pressed and is not brought into electrical contact with the input ground member 33. Similarly, the power conversion device 9 presses, for example, the region of these regions that is to be brought into electrical contact with the output grounding member 34 to bring it into electrical contact with the output grounding member 34, and In the area, the area is not pressed and is not brought into electrical contact with the output ground member 34. Even with such a configuration, the input grounding member 33 and either the conductive portion 111 of the casing 11 or the heat conducting portion of the heat sink 12 are brought into electrical contact, and the output grounding member 34 and the casing 11 are brought into electrical contact with each other. Since either the conductive part 111 of the heat sink 12 or the other of the heat conductive part of the heat sink 12 can be electrically contacted, the same effect as the power converter device 9 according to this embodiment can be obtained.

(Example 4)
A power conversion device as an electronic and electrical device according to Example 4 of the present embodiment will be described using FIGS. 23 and 24. In FIGS. 23 and 24, illustration of the printed circuit board is omitted for easy understanding. The power converter 70 according to this embodiment includes two input-side grounding terminals and two output-side grounding terminals, and covers unused input-side grounding terminals and output-side grounding terminals with a cover member. It has the following characteristics.

As shown in FIGS. 23 and 24, the power converter 70 according to this embodiment includes a power semiconductor module (an example of a semiconductor element) 14 (not shown in FIGS. 23 and 24, see FIG. 1), and a thermal conductor. The power semiconductor module 14 includes a heat sink 12 that has a thermally conductive portion formed in at least a portion thereof and is provided with the thermally conductive portion in contact with at least a portion of the power semiconductor module 14 . The heat sink 12 has a base portion 121 and a plurality of fin portions 122 (not shown in FIGS. 23 and 24, see FIG. 1) as a heat conduction portion. The entire heat sink 12 is made of a thermal conductor. The heat sink 12 is made of a conductor. A power semiconductor module 14 is mounted on the base portion 121 of the heat sink 12. Thermal contact between the power semiconductor module and the heat sink 12 is ensured. As a result, heat generated by the switching operations of the semiconductor switches Q1 to Q6 (not shown in FIGS. 23 and 24, see FIG. 2(a)) is conducted to the heat sink 12 and radiated to the outside.

The power conversion device 70 includes a casing 11 having at least a part thereof a conductive part 111 (not shown in FIGS. 23 and 24, see FIG. 19) formed of a conductor, and a thermally conductive part of a heat sink 12 (not shown in this embodiment). In this example, a conductive cable (an example of a conductive member) 13 (not shown in FIGS. 23 and 24, see FIG. 16) connects the base portion 121) and the conductive portion (the bottom of the casing 11 in this example). It is equipped with A portion of the side wall and the bottom of the casing 11 are made of a conductor. The heat sink 12 is attached to the housing 11 such that there is a gap between the tip of the fin portion 122 and the bottom of the housing 11. The heat sink 12 is supported by the housing 11 via an insulator (not shown). Therefore, the heat sink 12 and the housing 11 are electrically connected only by the cable 13. The heat sink 12 and the housing 11 are electrically connected at one point by a cable 13.

The housing 11 has an upper member 113 disposed on a non-conductive portion 112. The upper member 113 is made of resin, for example, like the non-conductive part 112. Although details will be described later, the upper member 113 is also arranged at a location where the input side grounding terminal 51 and the output side grounding terminal 52 are provided.

As shown in FIGS. 23 and 24, the power conversion device 70 includes an input side grounding terminal 51 and an output side grounding terminal 52. The input side grounding terminal 51 has a first input side grounding terminal 513 (see FIG. 23) and a second input side grounding terminal 514 (see FIG. 24), and the output side grounding terminal 52 has a first input side grounding terminal 513 (see FIG. 23) and a second input side grounding terminal 514 (see FIG. 24). It has a side grounding terminal 523 (see FIG. 24) and a second output side grounding terminal 524 (see FIG. 23). The first input-side grounding terminal 513 and the first output-side grounding terminal 523 are arranged at one end of the housing 11 . The second input side grounding terminal 514 and the second output side grounding terminal 524 are arranged near the input/output terminal block.

The first input-side grounding terminal 513 is a thin rectangular cutout formed by protruding from a part of the bottom of the housing 11, similar to the first input-side connection portion 61 in Examples 1 to 3 of this embodiment. It is provided at a portion formed by bending the portion vertically toward the side wall of the casing 11. The first input-side grounding terminal 513 is composed of an end of the part and a screw hole formed in the end, similar to the first input-side connection part 61 in Examples 1 to 3 of this embodiment. has been done. The second input side grounding terminal 514 is provided in the non-conductive part 112 of the housing 11 similarly to the input side grounding terminal 51 in Examples 1 and 3 of this embodiment. The second input side grounding terminal 514 has the same configuration as the input side grounding terminal 51 in Example 1 and Example 3 of this embodiment. That is, the second input side grounding terminal 514 is conductive and has a thread cut on the inner wall surface, so that the grounding wire 91a of the input cable 91 (not shown in FIGS. 23 and 24, 2) and an input ground member (details will be described later) can be screwed together while electrically connected.

The first output side grounding terminal 523 is a thin rectangular cutout formed by projecting from a part of the bottom of the housing 11, similar to the first output side connection part 62 in Examples 1 to 3 of this embodiment. It is provided at a portion formed by bending the portion vertically toward the side wall of the casing 11. The first output-side grounding terminal 523 is composed of an end of the part and a screw hole formed in the end, similar to the first output-side connection part 62 in Examples 1 to 3 of this embodiment. has been done. The second output side grounding terminal 524 is provided in the non-conductive part 112 of the housing 11 similarly to the output side grounding terminal 52 in Examples 1 and 3 of this embodiment. The second output side grounding terminal 524 has the same configuration as the output side grounding terminal 52 in Example 1 and Example 3 of this embodiment. That is, the second output side grounding terminal 524 has conductivity and has a thread cut on the inner wall surface, so that the grounding wire 92a of the output cable 92 (not shown in FIGS. 23 and 24, 2) and an output ground member (details will be described later) can be screwed together while electrically connected.

As shown in FIGS. 23 and 24, the power conversion device 70 includes an input side cover member 57 made of an insulating material (for example, resin) and covering the input side grounding terminal 51, and an input side cover member 57 made of an insulating material (for example, resin). The output side cover member 58 is formed to cover the output side grounding terminal 52. As described above, the input side grounding terminal 51 has the first input side grounding terminal 513 and the second input side grounding terminal 514, and the output side grounding terminal 52 has the first output side grounding terminal 523 and the second input side grounding terminal 514. It has a second output side grounding terminal 524.

The input side cover member 57 is formed to separately and independently cover the first input side grounding terminal 513 and the second input side grounding terminal 514. Further, the output side cover member 58 is formed to cover the first output side grounding terminal 523 and the second output side grounding terminal 524 separately and independently. More specifically, as shown in FIG. 24, when the input side cover member 57 covers the first input side grounding terminal 513, it is configured not to cover the second input side grounding terminal 514. has been done. Moreover, as shown in FIG. 23, the input side cover member 57 is configured to cover the second input side grounding terminal 514 when it does not cover the first input side grounding terminal 513. As shown in FIG. 24, the output side cover member 58 is configured to cover the second output side grounding terminal 524 when it does not cover the first output side grounding terminal 523. Moreover, as shown in FIG. 23, the output side cover member 58 is configured not to cover the second output side grounding terminal 524 when covering the first output side grounding terminal 523.

The first input side grounding terminal 513 and the first output side grounding terminal 523 are exposed and arranged in a region where a part of the upper member 113 is cut out. The input side cover member 57 has a shape that can be fitted into a notch area that exposes the first input side grounding terminal 513. The output side cover member 58 has a shape that can be fitted into a notch area that exposes the first output side grounding terminal 523. The input side cover member 57 can prevent the first input side grounding terminal 513 from being exposed to the outside by being fitted into the notch area that exposes the first input side grounding terminal 513. Similarly, the output side cover member 58 can prevent the first output side grounding terminal 523 from being exposed to the outside by being fitted into the notch area that exposes the first output side grounding terminal 523.

The second input side grounding terminal 514 and the second output side grounding terminal 524 are arranged between opposing walls formed on the upper surface of the upper member 113. The second input-side grounding terminal 514 is exposed and arranged between the opposing walls provided on both sides of the second input-side grounding terminal 514. The second output side grounding terminal 524 is exposed and arranged between the opposing wall portions provided on both sides of the second output side grounding terminal 524. The input side cover member 57 has a shape that can be sandwiched between the opposing walls provided on both sides of the second input side grounding terminal 514. The output side cover member 58 has a shape that can be sandwiched between the opposing walls provided on both sides of the second output side grounding terminal 524. Therefore, the input side cover member 57 is sandwiched between the opposing walls provided on both sides of the second input side grounding terminal 514, so that the second input side grounding terminal 514 is not exposed to the outside. can be prevented. Similarly, the output side cover member 58 is sandwiched between the opposing walls provided on both sides of the second output side grounding terminal 524, thereby preventing the second output side grounding terminal 524 from being exposed to the outside. can be prevented.

The power conversion device 70 includes an input grounding member (an example of an input-side conductive member, not shown in FIGS. 23 and 24) that connects the second input-side grounding terminal 514 and the thermally conductive portion of the heat sink 12. The power conversion device 70 includes an output grounding member (an example of an output-side conductive member, not shown in FIGS. 23 and 24) that connects the second output-side grounding terminal 524 and the thermally conductive portion of the heat sink 12. The input ground member is screwed to the second input grounding terminal 514 at one end, and screwed to the thermally conductive portion of the heat sink 12 at the other end. The output grounding member is screwed to the second output side grounding terminal 524 at one end, and screwed to the thermally conductive portion of the heat sink 12 at the other end.

As shown in FIG. 23, at the time of product shipment (initial state), the power converter 70 has an input side cover member attached to the second input side grounding terminal 514 in the EMC standard certified measurement configuration (manufacturer recommended installation configuration). 57 is attached, and an output side cover member 58 is attached to the first output side grounding terminal 523. As a result, when the power conversion device 70 is used in a state that can be considered to be the same as the EMC standard certified measurement configuration, the first input side grounding can be used without replacing the input side cover member 57 and the output side cover member 58. It can be used by connecting the ground wire 91a of the input cable 91 to the terminal 513 and connecting the ground wire 92a of the output cable 92 to the second output side grounding terminal 524.

As shown in FIG. 24, when the power conversion device 70 is used in a manner different from that at the time of product shipment (initial state) due to the usage environment etc. (for example, in a manner in which the output cable cannot be shielded), the first input side The input side cover member 57 is replaced with the grounding terminal 513, and the output side cover member 58 is replaced with the second output side grounding terminal 524. Furthermore, the ground wire 91a of the input cable 91 is connected to the second input side ground terminal 514, and the ground wire 92a of the output cable 92 is connected to the first output side ground terminal 523. Thereby, the ground wire 91a of the input cable 91 and the thermally conductive portion of the heat sink 12 are connected via the input ground member, and the ground wire 92a of the output cable 92 and the conductive portion 111 of the housing 11 are connected.

In this embodiment, the work of replacing the input side cover member 57 and the output side cover member 58 can be performed manually without using any tools. In addition, the input side cover member 57 and the output side cover member 58 are attached to locations that can be touched by simply opening the outer cover (not shown) that is opened when connecting the normal input cable 91 and output cable 92. There is. Therefore, the power conversion device 70 according to this embodiment can prevent the work of replacing the input-side cover member 57 and the output-side cover member 58 from becoming complicated. Furthermore, the power conversion device 70 according to the present embodiment can cover the unused input side grounding terminal and the output side grounding terminal with the input side cover member 57 and the output side cover member 58, so that the input cable can be adjusted according to the usage environment. 91 and output cable 92 can be reduced.

(Example 5)
A power conversion device as an electronic and electrical device according to Example 5 of the present embodiment will be described using FIGS. 25 and 26. In FIG. 25, for ease of understanding, the power converter is shown with the input ground member and the output ground member removed. Further, in FIGS. 25 and 26, illustration of the printed circuit board is omitted for easy understanding. The power conversion device 80 according to the present embodiment has the advantage of adapting to the usage environment by releasing the connection points between the input ground member 33 and the output ground member 34 and the conductive part 111 of the casing 11 and the heat conductive part of the heat sink 12. It has characteristics.

Since the power converter 80 according to this embodiment has almost the same configuration as the power converter 9 according to the third embodiment of the present embodiment, the points different from the power converter 9 will be described in detail.
As shown in FIG. 26(a), the power converter 80 includes a screw 811 (first input (an example of a side connection member). The power conversion device 80 includes an output ground member 34 and a screw 821 (an example of a first output side connection member) that connects the other of the thermally conductive portion of the heat sink 12 and the conductive portion 111 of the casing 11. There is.

The power conversion device 80 includes a screw 812 (an example of a second input-side connection member) that connects the input ground member 33 and the other of the thermally conductive portion of the heat sink 12 and the conductive portion 111 of the casing 11. . The power conversion device 80 includes a screw 822 (an example of a second output-side connection member) that connects the output ground member 34 and either the thermally conductive portion of the heat sink 12 or the conductive portion 111 of the casing 11. .

The input side insulator 33a has a conductive portion exposed at a location on the input ground member 33 that the screw 812 comes into contact with. More specifically, the input side insulator 33a is formed on the inner surface of the input grounding member 33 where the screw hole 333 (see FIGS. 25 and 26(b)) is threaded to which the screw 812 is attached. do not have. On the other hand, the input side insulator 33a is formed at the periphery of the screw hole 333. Thereby, the input side insulator 33a exposes the inner surface of the input ground member 33 where the screw hole 333 is threaded. As a result, when the screw 812 is attached to the screw hole 333 and the second input side connection part 71, the screw hole 333 and the second input side connection part 71 are in mechanical and electrical contact with the screw 812. , the input ground member 33 and the heat conductive portion of the heat sink 12 can be electrically contacted via the screw 812 .

The output-side insulator 34a has a conductive portion exposed at a location on the output ground member 34 that the screw 822 comes into contact with. More specifically, the output side insulator 34a is connected to the output ground member 34, which has a threaded screw hole 343 (not shown in FIGS. 25 and 26, see FIG. 22(b)) to which the screw 822 is attached. Not formed on the inner surface. On the other hand, the output side insulator 34a is formed at the peripheral edge of the screw hole 343. As a result, the output side insulator 34a exposes the inner surface of the output ground member 34 where the screw hole 343 is threaded. As a result, when the screw 822 is attached to the screw hole 343 and the second output side connection part 72, the screw hole 343 and the second output side connection part 72 are in mechanical and electrical contact with the screw 822. , the output ground member 34 and the thermally conductive portion of the heat sink 12 can be electrically contacted via the screw 822 .

Although detailed explanation is omitted, when the screw 811 is attached to the screw hole 332 and the first input side connection part 61, the screw hole 332 and the first input side connection part 61 are in mechanical contact with the screw 811. However, since they are electrically contacted via the screw 811, the input ground member 33 and the conductive portion 111 of the housing 11 can be electrically contacted via the screw 811. Further, when the screw 821 is attached to the screw hole 342 and the first output side connection part 62, the screw hole 342 and the first output side connection part 62 are in mechanical contact with the screw 821, and the screw hole 342 and the first output side connection part 62 are in mechanical contact with the screw 821. Therefore, the output ground member 34 and the conductive portion 111 of the housing 11 can be electrically contacted via the screw 821.

As shown in FIG. 26A, when the power converter 80 is shipped (initial state), screws 811, 812, 821, and 822 are attached to predetermined positions of the power converter 80. Therefore, in the power conversion device 80, at the time of product shipment (initial state), the conductive portion 111 of the housing 11 and the thermally conductive portion of the heat sink 12 are connected to the input ground member 33, screws 811, 812, output ground member 34, and They are connected at multiple points by screws 821 and 822. Therefore, in the power conversion device 80, when the product is shipped (initial state), the effect of the cable 13 is disabled, and the thermally conductive portion of the heat sink 12 and the conductive portion 111 of the casing 11 are in surface contact. be equivalent.

As a result, although the effect of the cable 13 is nullified, the power converter 80 can be used for input grounding in the recombination work of the input grounding member and the output grounding member as in the power converting devices according to Examples 1 to 3 of the present embodiment. It is possible to prevent malfunctions in which the load cannot be grounded due to forgetting to attach a member or output grounding member or a poor connection.

As shown in FIG. 26(b), the screws 812 and 821 of the power conversion device 80 are removed when the usage environment is considered to be similar to the EMC standard certified measurement configuration (manufacturer's recommended configuration). As a result, the thermally conductive portion of the heat sink 12 and the conductive portion 111 of the housing 11 are connected only by the cable 13. Further, the recommended installation state is such that the input side grounding terminal 51 is connected to the conductive part 111 of the housing 11 and the output side grounding terminal 52 is connected to the thermally conductive part of the heat sink 12. As a result, power converter 80 can reduce radiation noise.

The power converter device 80 is used as it is in the product shipping state unless the usage environment is an EMC standard certified measurement configuration. Since the inside of the power conversion device 80 can be considered to be in a state where the casing 11 and the heat sink 12 are in surface contact, the impedance from the heat sink 12 to the input side ground terminal 51 and the impedance from the heat sink 12 to the output side ground terminal The impedances up to 52 are approximately equal. As a result, power conversion device 80 can suppress an increase in noise radiated from output cable 92.

The power conversion device 80 has screws 811, 812, 821, and 822 at the connection point between the input ground member 33 and the conductive part 111 of the housing 11, and the connection point between the output ground member 34 and the heat conduction part of the heat sink 12. A cover member may be provided to cover the screws 811, 812, 821, 822 so that they do not come off. By having the cover member, the power conversion device 80 can ground the load more reliably.

As explained above, the power conversion devices E2, 7 to 8, 70, and 80 according to the present embodiment and Examples 1 to 5 include the power semiconductor module 14 that constitutes the inverter section 20, and the A heat sink 12 that has a conductive part (for example, a base part 121) and a plurality of fin parts 122 and is provided with the base part 121 in contact with at least a part of the power semiconductor module 14, and a conductive part made of a conductor. A casing 11 that has at least a portion (for example, the bottom), and a conductive cable 13 that connects the heat conductive part (for example, the base part 121) of the heat sink 12 and the conductive part (for example, the bottom) of the casing 11. ing.

As a result, the power conversion devices E2, 7 to 8, 70, 80 according to the present embodiment and Examples 1 to 5 are the same as the power conversion devices E1, 1 to 6, 6a according to the first embodiment, examples, and modified examples. The same effect as 6b can be obtained.

In addition, the power converters E2, 7 to 8, 70, and 80 according to the present embodiment and Examples 1 to 5 have an input side grounding terminal 51 to which an input side grounding wire 91a is connected, and an output side grounding wire 92a. an input grounding member 31 that connects the output side grounding terminal 52 to which is connected, the input side grounding terminal 51, and at least one of the thermally conductive part of the heat sink 12 and the conductive part 111 of the casing 11 and has conductivity; 33, output-side grounding terminal 52, and output grounding members 32 and 34 having electrical conductivity and connecting at least one of the thermally conductive portion of the heat sink 12 and the conductive portion 111 of the casing 11.

As a result, the power conversion devices E2, 7 to 8, 70, 80 according to the present embodiment and Examples 1 to 5 can perform Radiation noise in the 30 MHz band can be effectively reduced.

The present invention is not limited to the above embodiments, and various modifications are possible.
Although the power conversion devices E1, 1 to 6, 6a, 6b, E2, 7 to 9, 79, and 80 according to the above embodiments have conductive members composed of cables, the present invention is not limited to this. do not have. For example, the conductive member may be a rigid member such as a copper plate as long as it has a predetermined impedance that can reduce the resonance frequency of the noise transmission path to less than 30 MHz.

In the above embodiments and the like, the cable 13 is stretched over the shortest distance between the heat sink 12 and the housing 11, but the present invention is not limited to this. For example, if the conductive member exemplified by the cable 13 has a predetermined impedance that can reduce the resonance frequency of the noise transmission path to less than 30 MHz, it can be stretched over the shortest distance between the heat sink 12 and the housing 11. It doesn't have to be. However, if the conductive member is routed too far inside the housing, noise may be radiated from the conductive member itself. For this reason, the conductive member is preferably formed to have the shortest possible length while ensuring a predetermined impedance.

In the above embodiments and the like, the switching section includes a semiconductor switch composed of an IGBT, but the present invention is not limited thereto. For example, the semiconductor switch provided in the switching section may be a high voltage MOSFET having a wide bandgap semiconductor. For example, at least one of silicon carbide (SiC), gallium nitride (GaN), and diamond may be used as the wide bandgap semiconductor.

Although the power converters E1 and E2 according to the first and second embodiments are provided with the noise filter 18, they do not need to be provided with the noise filter.

In the power conversion devices according to Examples 1 to 5 of the second embodiment, the heat sink 12 and the housing 11 are connected by the cable 13, but the present invention is not limited to this. For example, the power converters according to Examples 1 to 5 of the second embodiment have impedance elements (for example, (resistance element 131 or core 132). Further, in this case, the cable 13 may be wound around the core 132 as an impedance element, similar to the power conversion device according to the first modification of the sixth example of the first embodiment. Further, in the power converter according to Examples 1 to 5 of the second embodiment, the cable 13 is arranged in parallel with the core 132, similarly to the power converter according to the second modification of Example 6 of the first embodiment. It may also include a capacitor 133 connected to.

Although the power converters according to Examples 1 and 2 of the second embodiment have one input grounding member and one output grounding member each attached at the time of product shipment (initial state), the present invention is not limited to this. I can't. The power conversion device may be provided with two input ground members and two output ground members. In this case, the power converter is used with one of the input grounding member and the output grounding member being removed depending on the usage environment. Further, similarly to the power conversion device according to Example 5 of the second embodiment, the conductive part 111 of the housing 11 and the heat conductive part of the heat sink 12 are connected to the input ground member 33, the screws 811 and 812, and the output ground member 34. and are connected at multiple points by screws 821 and 822. Therefore, in the power conversion device, the effect of the cable 13 is nullified, and the state is equivalent to a state in which the thermally conductive portion of the heat sink 12 and the conductive portion 111 of the casing 11 are in surface contact. The power converter in this case can obtain the same effects as the power converter according to Example 5 of the second embodiment.

Specifically, if the usage environment of the power conversion device can be considered to be the same as the EMC standard certified measurement configuration (manufacturer's recommended configuration), the input grounding member connecting between the input side grounding terminal and the heat sink, and the output side The output grounding member connecting between the grounding terminal and the conductive part of the casing is removed. As a result, the heat sink and the conductive portion of the housing 11 are connected only by the cable. Moreover, the input side grounding terminal and the conductive part of the casing are connected by the input grounding member, and the output side grounding terminal and the heat sink are connected by the output grounding member. Therefore, the power converter has the same configuration as the EMC standard certified measurement configuration (configuration recommended by the manufacturer), so it is possible to reduce radiation noise.

Furthermore, the input grounding member, which connects between the input-side grounding terminal and the conductive part of the housing, and the output grounding member, which connects between the output-side grounding terminal and the heat sink, may have a structure that cannot be removed from the outside. good. Furthermore, the input grounding member that connects between the input-side grounding terminal and the heat sink, and the output grounding member that connects the output-side grounding terminal and the conductive part of the casing may be constructed so that they can be removed from the outside. good. As a result, when the power converter is shipped (initial state), two input grounding members and two output grounding members are connected, and depending on the installation situation (usage environment), the input side grounding terminal and The user of the power conversion device can select whether to remove the input ground member that connects between the heat sinks and the output ground member that connects between the output side ground terminal and the conductive part of the casing.

This makes it possible to ensure that the power converter and the load connected to the subsequent stage are grounded, thereby preventing malfunctions of the power converter. Furthermore, if the installation conditions (usage environment) of the power conversion device can be considered to be the same as the EMC standard measurement configuration, the input grounding member connecting between the input side grounding terminal and the heat sink, the output side grounding terminal, and the casing. By removing the output ground member that connects the conductive parts of the body, radiation noise can be reduced. In addition, if it is determined that the installation conditions (usage environment) of the power converter are different from the EMC standard measurement configuration, by selecting a state in which all input grounding members and output grounding members are connected, the case can be The conductive part and the heat sink are connected at multiple points (three points). For this reason, the conductive part of the housing and the heat sink are equivalent to a surface contact state, so the impedance between the heat sink and the input side grounding terminal and the impedance between the heat sink and the output side grounding terminal are approximately the same. Become the same and balance. As a result, the power conversion device can reduce the increase in radiation noise from the output cable.

In the second embodiment, the input-side grounding terminal 51 and the output-side grounding terminal 52 have conductivity, but the present invention is not limited thereto. The input ground terminal 51 may be non-conductive as long as it can hold the ground wire 91a and the input ground member 31 in an electrically connected state. Similarly, the output-side grounding terminal 52 may be non-conductive as long as it can hold the ground wire 92a and the output ground member 32 in an electrically connected state. For example, the input side grounding terminal 51 and the output side grounding terminal 52 may be formed integrally with the non-conductive portion 112 of the housing 11. In this case, the input side grounding terminal 51 and the output side grounding terminal 52 may be configured, for example, by a hole formed in one side wall of the non-conductive part 112 of the housing 11 from the upper end to a predetermined position. The input side grounding terminal 51 and the output side grounding terminal 52 may be threaded, for example, on the inner wall surface surrounding the hole. Thereby, the input side grounding terminal 51 can screw the grounding wire 91a and the input grounding member 31 in an electrically connected state. Furthermore, the output grounding terminal 52 can be screwed to the electrically connected grounding wire 92a and the output grounding member 32.

In this way, even if the input-side grounding terminal 51 and the output-side grounding terminal 52 are non-conductive, the grounding wire 91a and the input grounding member 31 and the grounding wire 92a and the output grounding member 32 are electrically Since the connection can be secured, the power conversion device can obtain the same effects as the power conversion device according to the second embodiment.

In Example 2 of the second embodiment, the first input-side grounding terminal 511, the second input-side grounding terminal 512, the first output-side grounding terminal 521, and the second output-side grounding terminal 522 are conductive. However, the present invention is not limited thereto. The first input side grounding terminal 511 and the second input side grounding terminal 512 are non-contactable if they can hold the ground wire 91a and the first input ground bar 313 or the second input ground bar 314 in an electrically connected state, respectively. It may have conductivity. Moreover, if the first output side grounding terminal 521 and the second output side grounding terminal 522 can respectively hold the ground wire 92a and the first output ground bar 323 or the second output ground bar 324 in an electrically connected state, , may have non-conductivity. In this case, the first input side grounding terminal 511, the second input side grounding terminal 512, the first output side grounding terminal 521, and the second output side grounding terminal 522 are connected to the non-conductive part 112 of the housing 11, for example. It may be configured with a hole formed in one side wall from the upper end to a predetermined position. The first input-side grounding terminal 511, the second input-side grounding terminal 512, the first output-side grounding terminal 521, and the second output-side grounding terminal 522 have, for example, a thread cut on the inner wall surface surrounding the hole. You can leave it there. Thereby, the first input side grounding terminal 511 and the second input side grounding terminal 512 respectively screw the electrically connected ground wire 91a and the first input ground bar 313 or the second input ground bar 314. can do. Further, the first output side grounding terminal 521 and the second output side grounding terminal 522 respectively screw the electrically connected grounding wire 92a and the first output grounding bar 323 or the second output grounding bar 324. be able to.

In this way, even if the first input side grounding terminal 511, the second input side grounding terminal 512, the first output side grounding terminal 521, and the second output side grounding terminal 522 are non-conductive, Since the electrical connection between the ground wire 92a and the first output ground bar 323 or the second output ground bar 324 can be ensured, and the electrical connection between the ground wire 92a and the first output ground bar 323 or the second output ground bar 324 can be ensured, , the power conversion device can obtain the same effects as the power conversion device according to Example 2 of the second embodiment.

In Example 4 of the second embodiment, the second input-side grounding terminal 514 and the second output-side grounding terminal 524 have conductivity, but the present invention is not limited to this. The second input side ground terminal 514 may be non-conductive as long as it can hold the ground wire 91a and the input ground member in an electrically connected state. Similarly, the second output side grounding terminal 524 may be non-conductive as long as it can hold the ground wire 92a and the output ground member in an electrically connected state. For example, the second input side grounding terminal 514 and the second output side grounding terminal 524 may be formed integrally with the non-conductive portion 112 of the housing 11. In this case, the second input side grounding terminal 514 and the second output side grounding terminal 524 are configured, for example, by holes formed in one side wall of the non-conductive part 112 of the housing 11 from the upper end to a predetermined position. It's okay. The second input side grounding terminal 514 and the second output side grounding terminal 524 may be threaded, for example, on the inner wall surface surrounding the hole. Thereby, the second input side grounding terminal 514 can screw the ground wire 91a and the input ground member that are electrically connected. Further, the second output side grounding terminal 524 can be screwed to the electrically connected ground wire 92a and the output ground member.

In this way, even if the second input side grounding terminal 514 and the second output side grounding terminal 524 are non-conductive, the grounding wire 91a and the input grounding member, and the grounding wire 92a and the output grounding member, respectively. Since the electrical connection can be ensured, the power conversion device can obtain the same effects as the power conversion device according to Example 4 of the second embodiment.

The scope of the invention is not limited to the exemplary embodiments shown and described, but also includes all embodiments which give equivalent effects to the object of the invention. Furthermore, the scope of the invention is not limited to the combinations of inventive features delineated by the claims, but may be delimited by any desired combinations of specific features of each and every disclosed feature. sell.

1, 2, 3, 4, 5, 6, 6a, 6b, 7, 8, 9, 70, 80, E1, E2 Power conversion device 11 Housing 11q Semiconductor chip 12 Heat sink 12q Circuit pattern 13, 91r, 91s, 91t , 92u, 92v, 92w Cable 13q Insulating layer 14 Power semiconductor module 14q Copper base 15 Input grounding terminals 16, 16a Output grounding terminal 17 Printed circuit board 18 Noise filter 19 Converter section 19a, 19b, 19c, 19d, 19e, 19f Diode 20 Inverter section 42 Insulating layers 31, 33 Input grounding members 32, 34 Output grounding member 33a Input side insulator 34a Output side insulator 51 Input side grounding terminal 52 Output side grounding terminal 57 Input side cover member 58 Output side cover member 61 First input side connection part 62 First output side connection part 71 Second input side connection part 72 Second output side connection part 91 Input cables 91a, 92a Ground wire 92 Output cable 93 Reference ground plane 112 Non-conductive part 113 Upper member 121 Base part 122 Fin part 131 Resistance element 132 Core 133 Capacitor 142 Terminal 171 Wiring pattern part 172 Electronic component group 181 Input side capacitor 182 Common mode choke coil 183 Output side capacitor 311 First input ground bar 312 Second input ground bar 313 First input ground bar 314 Second input ground bar 321 First output ground bar 322 Second output ground bar 323 First output ground bar 324 Second output ground bar 331, 332, 333, 341, 342, 343 Screw holes 511, 513 First input side grounding terminal 512, 514 Second input side grounding terminal 521, 523 First output side grounding terminal 522, 524 Second output side grounding terminal C1, C3, Cr1, Cr3, Cs1, Cs3, Ct1, Ct3 Capacitor C91, C92, Cm, Cp Stray capacitance Cdc Smoothing capacitor D1, D2, D3, D4, D5, D6 Freewheeling diode Lr, Ls, Lt Reactor M Motor MS Motor drive system P Commercial AC power supply Q1, Q2, Q3, Q4, Q5, Q6 Semiconductor switch R, S, T Input terminal S1, S2, S3, S4, S5, S6 Switching section U, V, W Output terminal

Claims (13)

a semiconductor element;
a heat sink having at least a part of the heat conduction part made of a heat conductor, the heat conduction part being in contact with at least a part of the semiconductor element;
a casing having at least a portion thereof a conductive part made of a conductor;
a conductive member that connects the thermally conductive part and the conductive part and has conductivity;
an input side grounding terminal to which the input side grounding wire is connected;
An output side grounding terminal to which the output side grounding wire is connected,
an input-side electrically conductive member that connects the input-side grounding terminal and at least one of the thermally conductive part and the electrically conductive part and has electrical conductivity;
an output-side electrically conductive member that connects the output-side grounding terminal and at least one of the thermally conductive part and the electrically conductive part and has electrical conductivity;
The input-side conductive member can change the connection state in which the input-side grounding terminal is connected to either the thermally conductive part or the conductive part,
The output-side conductive member can change the connection state in which the output-side grounding terminal is connected to either the thermally conductive part or the conductive part.
An electronic and electrical device characterized by : an input cable that connects a commercial power source and the electronic and electrical equipment;
an output cable connecting the electronic and electrical device to the motor;
2. The electronic/electrical device according to claim 1, wherein the connection state can be changed in a region that is touched when wiring the input cable and the output cable . The input-side electrically conductive member has an input-side insulator that covers the electrically conductive portion and exposes at least a portion that electrically contacts the input-side grounding terminal, the thermally conductive portion, and the electrically conductive portion;
The output-side electrically conductive member has an output-side insulator that covers the electrically conductive portion and exposes at least a portion that electrically contacts the output-side grounding terminal, the thermally conductive portion, and the electrically conductive portion. The electronic and electrical equipment according to claim 1 or 2 . a first input-side connecting member that connects the input-side conductive member and either the thermally conductive part or the conductive part and has conductivity;
comprising a first output-side connecting member that connects the output-side conductive member and the other of the thermally conductive portion and the conductive portion and has conductivity;
The input-side insulator exposes the conductive portion at a portion of the input-side conductive member that is in contact with the first input-side connection member,
Any one of claims 1 to 3, wherein the output-side insulator exposes the conductive portion at a location of the output-side conductive member that is in contact with the first output-side connection member. Electronic and electrical equipment as described in section . a second input-side connecting member that connects the input-side conductive member and the other of the thermally conductive portion and the conductive portion and has conductivity;
comprising a second output-side connecting member that connects the output-side conductive member and either the thermally conductive part or the conductive part and has conductivity;
The input-side insulator exposes the conductive portion at a portion of the input-side conductive member that is in contact with the second input-side connection member,
Any one of claims 1 to 3, wherein the output-side insulator exposes the conductive portion at a location of the output-side conductive member that is in contact with the second output-side connection member. Electronic and electrical equipment as described in section . The input side conductive member is
a first input-side conductive member that connects the input-side grounding terminal and the thermally conductive part;
a second input-side conductive member connecting the input-side grounding terminal and the conductive part;
The output side conductive member is
a first output-side electrically conductive member that connects the output-side grounding terminal and the thermally conductive portion;
The electronic and electrical equipment according to any one of claims 1 to 3, further comprising: a second output-side conductive member that connects the output-side grounding terminal and the conductive portion. The first input-side conductive member and the second output-side conductive member have the same shape,
The electronic/electrical device according to claim 6 , wherein the second input-side conductive member and the first output-side conductive member have the same shape. an input side cover member formed of an insulating material and covering the input side grounding terminal;
an output-side cover member formed of an insulating material and covering the output-side grounding terminal;
The input side grounding terminal has a first input side grounding terminal and a second input side grounding terminal,
The output side grounding terminal has a first output side grounding terminal and a second output side grounding terminal,
The input side cover member is formed to separately and independently cover the first input side grounding terminal and the second input side grounding terminal,
Any one of claims 1 to 7, wherein the output side cover member is formed so as to separately and independently cover the first output side grounding terminal and the second output side grounding terminal. The electronic and electrical equipment described in item 1 . The electronic and electrical equipment according to any one of claims 1 to 7, wherein the input side grounding terminal and the output side grounding terminal are each provided in a non-conductive part of the housing. . The electronic and electrical equipment according to any one of claims 1 to 9, further comprising an impedance element attached in series with the electrically conductive member. The electronic/electrical device according to claim 10 , wherein the impedance element is a core. The electronic and electrical device according to claim 11 , wherein the conductive member is wound around the core. The electronic/electrical device according to claim 11 or 12 , further comprising a capacitor connected to the conductive member in parallel with the core.

Images