CN106289826A - A kind of cpu heat Performance Test System - Google Patents
A kind of cpu heat Performance Test System Download PDFInfo
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- CN106289826A CN106289826A CN201510301097.4A CN201510301097A CN106289826A CN 106289826 A CN106289826 A CN 106289826A CN 201510301097 A CN201510301097 A CN 201510301097A CN 106289826 A CN106289826 A CN 106289826A
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- cpu heat
- heat
- cpu
- thermocouple
- performance test
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Abstract
nullThe invention belongs to computer testing field，Particularly relate to a kind of cpu heat Performance Test System，Including caloric value input equipment、Ammeter、Voltmeter、Heat block、Cpu heat、Thermocouple、Air channel、Anemobiagraph、Blower fan、Testboard、Rotary apparatus、Multichannel temperature scanner and computer，It is characterized in that ammeter is connected with caloric value input equipment，Voltmeter is in parallel with caloric value input equipment，Heat block is fixed with testboard by fixture，Rotary apparatus is arranged on below testboard by clamping structure，Heat block is arranged on bottom cpu heat，Air stream is drawn by air channel and is transported on cpu heat by blower fan，Anemobiagraph it is provided with on air channel，Thermocouple is placed with on cpu heat surface，Thermocouple gathers data by multichannel temperature scanner，Multichannel temperature scanner is connected with computer by interface.The method have the benefit that testboard passes through rotary apparatus changing angle, wind speed is adjustable to be measured, and testing efficiency is high, can debug the duty of actual cpu heat with and complete cpu heat performance test.
Description
Technical field
The invention belongs to computer testing field, relate to a kind of cpu heat Performance Test System.
Background technology
Along with improving constantly of PC CPU integrated level and performance, the power consumption of CPU is increasing, CPU surface heat flux
Sharply increase, reduce performance and the life-span of chip, have impact on system reliability of operation.Also to CPU cooling means simultaneously
Proposing very high request, make cooling means there occurs many changes, cpu heat is varied.
Conventional cpu heat Performance Test System, heating part size is non-adjustable, is suitable only for a kind of cpu heat,
Only measure under gravity-flow ventilation or single fan, when testing air-cooled, it is impossible to the impact that cpu heat is dispelled the heat by research wind speed.
Summary of the invention
For the problems referred to above to be solved, the present invention provides a kind of cpu heat Performance Test System.
Technical scheme, a kind of cpu heat Performance Test System, including caloric value input equipment, ammeter,
Voltmeter, heat block, cpu heat, thermocouple, air channel, anemobiagraph, blower fan, testboard, rotary apparatus, many
Channel temperature scanner and computer, it is characterised in that described ammeter is connected with described caloric value input equipment, described voltage
Table is in parallel with described caloric value input equipment, and described rotary apparatus is arranged on below described testboard by clamping structure, institute
Stating heat block to be fixed with described testboard by fixture, described heat block is arranged on bottom described cpu heat, described CPU
Radiator utilizes fixture to be fixed on described heat block, and air stream is drawn by described air channel and is transported to institute by described blower fan
Stating on cpu heat, described air channel is provided with anemobiagraph, described thermocouple is placed with in described cpu heat surface, institute
Stating thermocouple and gather data by described multichannel temperature scanner, described multichannel temperature scanner passes through interface with described
Computer connects.
Described caloric value input equipment is DC source.
Thermal conductive silicon lipid layer is set between described heat block and described cpu heat.
Described heat block includes multiple copper billet being tied with heating wire.
Described thermocouple uses the copper-constantan thermocouple calorimetric galvanic couple of a diameter of 1mm.
Described thermocouple has multipair.
The method have the benefit that testboard passes through rotary apparatus changing angle, wind speed is adjustable to be measured, and testing efficiency is high,
Heat block size is adjustable, is suitable for different types of cpu heat, can debug the work of actual cpu heat
State with and complete cpu heat performance test.
Accompanying drawing explanation
Fig. 1 is reality structural representation of the present invention.
In figure:
1. caloric value input equipment 2. ammeter
3. voltmeter 4. heat block
5.CPU radiator 6. thermocouple
7. air channel 8. anemobiagraph
9. blower fan 10. testboard
11. rotary apparatuss 12, multichannel temperature scanner
13. computers
Detailed description of the invention
A kind of detailed description of the invention of 1 couple of present invention is explained below in conjunction with the accompanying drawings.
The present invention relates to a kind of cpu heat Performance Test System, including caloric value input equipment 1, ammeter 2, voltage
Table 3, heat block 4, cpu heat 5, thermocouple 6, air channel 7, anemobiagraph 8, blower fan 9, testboard 10, rotation dress
Putting 11, multichannel temperature scanner 12 and computer 13, ammeter 2 is connected with caloric value input equipment 1, voltmeter 3 and heating
Amount input equipment 1 is in parallel, and rotary apparatus 11 is arranged on below testboard 10 by clamping structure, heat block 4 by fixture and
Testboard 10 is fixed, and heat block 4 is arranged on bottom cpu heat 5, and cpu heat 5 utilizes fixture to be fixed on heat block 4,
Air stream is drawn by air channel 7 and is transported on cpu heat 5 by blower fan 9, and air channel 7 is provided with anemobiagraph 8, thermocouple 6
Being placed with on cpu heat 5 surface, thermocouple 6 gathers data, multichannel temperature scanning 12 by multichannel temperature scanner 12
Instrument is connected with computer 13 by interface.
Caloric value input equipment 1 is DC source.Thermal conductive silicon lipid layer is set between heat block 4 and cpu heat 5, has
Being beneficial to conduction of heat, heat block 4 includes multiple copper billet being tied with heating wire, can increase according to the situation of cpu heat 5
Or minimizing is tied with the copper billet of heating wire to adapt to different cpu heats, it is ensured that the efficiency of heating surface.Thermocouple 6 uses diameter
For the copper-constantan thermocouple calorimetric galvanic couple of 1mm, highly sensitive, reliable and stable, antidetonation drop resistant, interchangeability are good, price
Cheap.Thermocouple 6 has multipair, thermocouple 6 can be increased or decreased according to the situation of cpu heat 5, it is ensured that measure essence
Accurate.
Make use-case: adjusting caloric value input equipment 1 i.e. DC source and provide thermal source for heating fast 4, cpu heat 5 utilizes
Fixture is fixed on heat block 4, and heat block 4 includes multiple copper billet being tied with heating wire, can according to the situation of cpu heat 5,
The copper billet that be tied with heating wire being increased or decreased to adapt to different cpu heats, it is ensured that the efficiency of heating surface, blower fan 9 provides
Air stream is drawn by air channel 7 and is transported to cpu heat 5, cools down cpu heat 5, blower fan 9 is adjustable wind speed,
Wind speed is surveyed by wind speed 8 instrument, is fixed on testboard 10 by cpu heat 5, adjusts CPU by rotary apparatus and dispels the heat
Device test angle, closely pastes electroheat pair 6 at cpu heat 5 end not, and thermocouple has multipair, is respectively provided with CPU
The diverse location of radiator 5, thermocouple 6 is by multichannel temperature scanner 14 temperature acquisition data, and multichannel temperature is swept
Retouch instrument temperature to be connected with computer by interface, obtain and record test data.
Cpu heat top surface temperature is that end face multi-measuring point temperature averages is
Cpu heat bottom surface temperature is that bottom surface multi-measuring point temperature averages isCalculate both
Difference Te-Tc and a setting value compare, and setting value is set as the case may be, if representing this less than setting value
Cpu heat 5 heat dispersal situations is good, if representing this cpu heat 5 heat dispersal situations more than this cpu heat 5 of setting value
Poor, carry out indicating to improve further.
Testboard 12 angle can be changed by rotary apparatus 13, and then change cpu heat 5 test angles, repeat with
Upper operation, can study the work angle impact on cpu heat 5, assesses cpu heat 5 performance.
The air stream that blower fan 9 provides is drawn by air channel 7 and is transported to cpu heat 5, cools down cpu heat 5,
Can by change blower fan 9 gear change wind speed, and then change cpu heat 5, operating temperature, more than repetition
Operation, can study the operation wind speed impact on cpu heat 5, assess cpu heat 5 performance.
Above an example of the present invention is described in detail, but described content has been only presently preferred embodiments of the present invention,
It is not to be regarded as the practical range for limiting the present invention.All impartial changes made according to the present patent application scope and improvement etc.,
Within all should still belonging to the patent covering scope of the present invention.
Claims (6)
1. a cpu heat Performance Test System, including caloric value input equipment, ammeter, voltmeter, heat block,
Cpu heat, thermocouple, air channel, anemobiagraph, blower fan, testboard, rotary apparatus, multichannel temperature scanner and
Computer, it is characterised in that described ammeter is connected with described caloric value input equipment, described voltmeter is defeated with described caloric value
Entering equipment in parallel, described rotary apparatus is arranged on below described testboard by clamping structure, and described heat block passes through fixture
Fixing with described testboard, described heat block is arranged on bottom described cpu heat, and described cpu heat utilizes fixture solid
Being scheduled on described heat block, air stream is drawn by described air channel and is transported on described cpu heat, institute by described blower fan
Stating and be provided with anemobiagraph on air channel, described thermocouple is placed with on described cpu heat surface, and described thermocouple is by described many
Channel temperature scanner gathers data, and described multichannel temperature scanner is connected with described computer by interface.
A kind of cpu heat Performance Test System the most according to claim 1, it is characterised in that described caloric value is defeated
Entering equipment is DC source.
A kind of cpu heat Performance Test System the most according to claim 1, it is characterised in that described heat block and
Thermal conductive silicon lipid layer is set between described cpu heat.
A kind of cpu heat Performance Test System the most according to claim 3, it is characterised in that described heat block bag
Include multiple copper billet being tied with heating wire.
A kind of cpu heat Performance Test System the most according to claim 1, it is characterised in that described thermocouple is adopted
With the copper-constantan thermocouple calorimetric galvanic couple of a diameter of 1mm.
A kind of cpu heat Performance Test System the most according to claim 5, it is characterised in that described thermocouple has
Multipair.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510301097.4A CN106289826A (en) | 2015-06-05 | 2015-06-05 | A kind of cpu heat Performance Test System |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510301097.4A CN106289826A (en) | 2015-06-05 | 2015-06-05 | A kind of cpu heat Performance Test System |
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| Publication Number | Publication Date |
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| CN106289826A true CN106289826A (en) | 2017-01-04 |
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| CN201510301097.4A Pending CN106289826A (en) | 2015-06-05 | 2015-06-05 | A kind of cpu heat Performance Test System |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107300479A (en) * | 2017-08-16 | 2017-10-27 | 国网湖南省电力公司 | A kind of test platform and its application process of SVG heat-pipe radiators characteristic |
| CN108007955A (en) * | 2017-11-27 | 2018-05-08 | 成都共同散热器有限公司 | A kind of thermal performance detection device and detection method |
| CN109144207A (en) * | 2018-11-01 | 2019-01-04 | 合肥享淘科技有限公司 | A kind of computer processor fan cooling effect detection device and its detection method |
| CN114076689A (en) * | 2020-08-20 | 2022-02-22 | 株洲中车奇宏散热技术有限公司 | Heat pipe radiator temperature rise detection method and heat pipe radiator detection equipment |
| CN114076690A (en) * | 2020-08-20 | 2022-02-22 | 株洲中车奇宏散热技术有限公司 | Heat pipe radiator overturning inspection bench |
-
2015
- 2015-06-05 CN CN201510301097.4A patent/CN106289826A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107300479A (en) * | 2017-08-16 | 2017-10-27 | 国网湖南省电力公司 | A kind of test platform and its application process of SVG heat-pipe radiators characteristic |
| CN107300479B (en) * | 2017-08-16 | 2023-11-14 | 国网湖南省电力公司 | Test platform for SVG heat pipe radiator characteristics and application method thereof |
| CN108007955A (en) * | 2017-11-27 | 2018-05-08 | 成都共同散热器有限公司 | A kind of thermal performance detection device and detection method |
| CN108007955B (en) * | 2017-11-27 | 2023-03-21 | 成都共同散热器有限公司 | Thermal performance detection device and detection method |
| CN109144207A (en) * | 2018-11-01 | 2019-01-04 | 合肥享淘科技有限公司 | A kind of computer processor fan cooling effect detection device and its detection method |
| CN109144207B (en) * | 2018-11-01 | 2020-11-13 | 嘉兴考普诺机械科技有限公司 | Computer processor fan heat dissipation effect detection device and detection method thereof |
| CN114076689A (en) * | 2020-08-20 | 2022-02-22 | 株洲中车奇宏散热技术有限公司 | Heat pipe radiator temperature rise detection method and heat pipe radiator detection equipment |
| CN114076690A (en) * | 2020-08-20 | 2022-02-22 | 株洲中车奇宏散热技术有限公司 | Heat pipe radiator overturning inspection bench |
| CN114076690B (en) * | 2020-08-20 | 2023-09-05 | 株洲中车奇宏散热技术有限公司 | Turnover inspection bench for heat pipe radiator |
| CN114076689B (en) * | 2020-08-20 | 2023-09-05 | 株洲中车奇宏散热技术有限公司 | Temperature rise detection method and equipment for heat pipe radiator |
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Application publication date: 20170104 |