CN106156746B - Fingerprint identification module and terminal - Google Patents
Fingerprint identification module and terminal Download PDFInfo
- Publication number
- CN106156746B CN106156746B CN201610569974.0A CN201610569974A CN106156746B CN 106156746 B CN106156746 B CN 106156746B CN 201610569974 A CN201610569974 A CN 201610569974A CN 106156746 B CN106156746 B CN 106156746B
- Authority
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- China
- Prior art keywords
- rim
- fingerprint identification
- identification module
- metal ring
- frame
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 24
- 238000007747 plating Methods 0.000 claims abstract description 13
- 238000005240 physical vapour deposition Methods 0.000 claims description 27
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 description 21
- 239000000758 substrate Substances 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 201000004624 Dermatitis Diseases 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 231100000315 carcinogenic Toxicity 0.000 description 1
- 230000007850 degeneration Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 210000002216 heart Anatomy 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 210000004185 liver Anatomy 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Laser Beam Processing (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The embodiment of the invention discloses a fingerprint identification module, which comprises: a metal ring including a top surface, a bottom surface, an inner side surface, and an outer side surface. The top surface is a high gloss surface, the outer surface, the inner side surface and the outer side surface are provided with PVD layers, and the bottom surface is provided with a nickel plating layer. The embodiment of the invention also discloses a terminal. By adopting the invention, the grounding impedance of the fingerprint module can be ensured, so that the ESD test can be successfully passed.
Description
Technical Field
The invention relates to the field of electronic materials, in particular to a fingerprint identification module and a terminal.
Background
At present, in electronic products, a nickel layer is generally electroplated on the surface of an electronic component to reduce the impedance of the electronic component. The metal frame in the existing fingerprint identification module generally adopts integral nickel plating to ensure that the grounding resistance from the metal frame to the connector steel sheet is less than 5 ohms after the frame is assembled to the module, and ensure the electric conductivity and the good ESD (Electro-Static discharge) protection effect of the fingerprint identification module.
However, because the metal ring in the fingerprint identification module is plated with nickel integrally, the content of lead and cadmium in the nickel-plated layer is higher, which exceeds the content standard of harmful Substances in the directive of European Union ROHS (Restriction of hazardous components in electronic and electrical equipment), and the nickel released in the using process of the products can cause skin allergy and even dermatitis of users, and the serious person who inhales nickel chronically can cause the degeneration of heart, brain, liver and the like. Meanwhile, nickel is a carcinogenic heavy metal and a shortage of expensive resources, so that the exposed top surface, outer side surface and inner side surface of the fingerprint module cannot be provided with nickel, and only the part assembled on the bottom surface is provided with nickel.
Therefore, need to improve the processing technology of becket in the fingerprint identification module, when guaranteeing the electric conductivity of fingerprint identification module, eliminate the negative effects that nickel itself brought.
Disclosure of Invention
The technical problem to be solved by the embodiments of the present invention is to provide a fingerprint identification module and a terminal. Can ensure the electric conductivity of the fingerprint identification module, eliminate the negative effects that nickel itself brought.
In order to solve the above technical problem, an embodiment of the present invention provides a fingerprint identification module, including: the metal ring comprises a top surface, a bottom surface, an inner side surface and an outer side surface, wherein the top surface is a high gloss surface, PVD (Physical Vapor Deposition) layers are arranged on the top surface, the inner side surface and the outer side surface, and a nickel plating layer is arranged on the bottom surface.
Wherein the thickness of the PVD layer is 0.30-1.50 μm.
Wherein the thickness of the nickel plating layer is 1-3 μm.
Wherein the PVD layer is black in color and has a resistance of less than 200 ohms; or
The PVD layer is golden or silver in color, and the resistance of the PVD layer is less than 2 ohms.
The metal ring comprises a first frame, a second frame, a third frame and a fourth frame, wherein the first frame is opposite to and parallel to the third frame, the second frame is opposite to and parallel to the fourth frame, the first frame is perpendicular to the second frame and the fourth frame, the third frame is perpendicular to the second frame and the fourth frame, the first frame and the third frame are equal in length, the second frame and the fourth frame are equal in length, and the second frame is shorter than the first frame; two adjacent frames in the four frames are connected through a strip-shaped curve.
The first laser etching processing area and the second laser etching processing area are not provided with PVD layers, and impedance between the first laser etching processing area and the second laser etching processing area is smaller than 1 ohm.
The first laser etching processing area and the second laser etching processing area are rectangles with equal areas, the first laser etching processing area is located in the middle of the second frame, and the second laser etching processing area is located in the middle of the fourth frame.
Wherein, the material of becket is stainless steel.
The metal ring is characterized in that the top surface of the metal ring is a plane or an arc-shaped convex surface.
Correspondingly, the embodiment of the invention provides a terminal, which is characterized by comprising the fingerprint identification module.
The embodiment of the invention has the following beneficial effects:
only the bottom surface of the metal ring is provided with a nickel plating layer, the other places are not provided with the nickel plating layer, and the machining process adopts a mode of firstly plating nickel materials, then CNC cutting the top surface, the inner side and the outer side surface, and then PVD shielding. Ensure the electric conductivity of fingerprint identification module simultaneously, eliminate the negative effects that nickel itself brought.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present invention;
FIG. 2 is a top view of a metal ring of a fingerprint identification module according to an embodiment of the present invention;
FIG. 3 is a side view of a metal ring of a fingerprint identification module according to an embodiment of the present invention;
fig. 4 is a bottom view of a metal ring of a fingerprint identification module according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a schematic structural diagram of a fingerprint identification module according to an embodiment of the present invention is provided. The fingerprint identification module comprises a circuit board 110, a fingerprint identification chip 130, a metal ring 150 and a conductive substrate 160. Metal ring 150 has a top surface 151, a bottom surface 153, an inner side surface 154, and an outer side surface 152. The circuit board 110 may be a rigid circuit board, a flexible circuit board, or a rigid-flex board. In the present embodiment, the circuit board 110 is a flexible circuit board.
The conductive substrate 160 is used for carrying the fingerprint identification chip 130. The conductive substrate 160 is electrically connected to the circuit board 110. The conductive substrate 160 is fixed on the circuit board 110. And the conductive substrate 160 is fixed on the circuit board 110 by the solder 163, so as to realize the electrical connection between the conductive substrate 160 and the circuit board 110 while realizing the fixation of the conductive substrate 160. Specifically, the conductive substrate 160 is connected to the circuit board 110 by a contact array package or a ball grid array package 163. The conductive substrate 160 is mounted on the circuit board 110, and the filling adhesive 165 is filled between the conductive substrate 130 and the circuit board 110. The bottom surface 153 of the metal ring 150 is attached to the circuit board 110 to form a cavity with the circuit board 110, and the cavity is filled with epoxy resin 170 to improve the vibration resistance and the waterproof capability of the fingerprint identification module.
As shown in fig. 1-3, the metal ring 150 includes a top surface 151, a bottom surface 153, an inner side surface 154 and an outer side surface 152, the shape of the metal ring is not limited, and may be circular, square or rectangular, etc., the top surface 151, the bottom surface 153, the inner side surface 154 and the outer side surface 152 of the metal ring 150 are previously subjected to a high light treatment, wherein the high light treatment may be performed by a CNC process, the top surface 151, the inner side surface 154 and the outer side surface 152 are provided with PVD layers, the bottom surface 153 is provided with a nickel plating layer, and the metal ring 150 is in a manner that only the bottom surface 153 has the nickel layer, so that the electrical conductivity of the fingerprint identification module can be.
In one possible embodiment, the PVD layers on top surface 151, inner side 154, and outer side 152 have a thickness of 0.30 μm to 1.50 μm.
In one possible embodiment, the thickness of the nickel plating layer disposed on the bottom surface 153 is 1 μm to 3 μm, wherein the process conditions for nickel plating the bottom surface 153 of the metal ring may be: the operation temperature is maintained at 55-60 ℃, and the pH value of the nickel plating electrolyte is maintained between 3-4.
In one possible embodiment, the PVD layer is black in color and the PVD layer has a resistance of less than 200 ohms; or
The PVD layer is golden or silver in color, and the resistance of the PVD layer is less than 2 ohms.
In particular, the PVD layers on top surface 151, inner side surface 154, and outer side surface 152 may be black, and the resistance of the black PVD layer is less than 200 ohms. Alternatively, the PVD layers on top 151, inner 154, and outer 152 sides may be gold or silver, with the resistance of the silver or silver PVD layers being less than 2 ohms.
In a possible embodiment, the metal ring 150 includes a first frame 101, a second frame 102, a third frame 103, and a fourth frame 104, the first frame 101 is opposite to and parallel to the third frame 103, the second frame 102 is opposite to and parallel to the fourth frame 104, the first frame 101 is perpendicular to the second frame 102 and the fourth frame 104, the third frame 103 is perpendicular to the second frame 104 and the fourth frame 104, the first frame 101 and the third frame 103 have the same length, the second frame 102 and the fourth frame 104 have the same length, and the second frame 102 has a length smaller than the first frame 101; the first frame 101 is adjacent to the second frame 102 and the fourth frame 104, respectively, the third frame 103 is adjacent to the second frame 102 and the fourth frame 104, respectively, and two adjacent frames of the four frames are transitionally connected through a strip-shaped curve.
In a possible embodiment, the second frame 102 is provided with a first laser etching processing area 106, the fourth frame 104 is provided with a second laser etching processing area 105, the surfaces of the first laser etching processing area 106 and the second laser etching processing area 105 are not provided with a PVD layer, the PVD layer on the surface can be removed specifically by laser etching, and the impedance between the first laser etching processing area 106 and the second laser etching processing area 105 is smaller than 1 ohm, the impedance between the first laser etching processing area 106 and the second laser etching processing area 105 is very small, so that the contact resistance between the finger of the user and the bottom surface 153 of the metal ring 150 is small, so that the signal attenuation of the metal ring 150 transmitted to the fingerprint sensing area by the finger is reduced, and the fingerprint image sampled by the fingerprint identification module is clearer.
In one possible embodiment, the first laser etching processing area 106 and the second laser etching processing area 105 are rectangles with equal areas, the first laser etching processing area 106 is located in the middle of the second frame 102, and the second laser etching processing area 105 is located in the middle of the fourth frame 104.
In one possible embodiment, the metal ring 150 is made of stainless steel.
In one possible embodiment, the top surface of the metal ring 150 is a flat surface or a convex arc surface.
The embodiment of the invention also provides a terminal, wherein the terminal comprises the fingerprint identification module, and the terminal comprises but is not limited to a carrier
Or other operating system such as a mobile phone. Other terminals are also possible, such as a laptop or tablet computer or desktop computer with a touch-sensitive surface (e.g., a touch screen display and/or a touch pad).
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The utility model provides a fingerprint identification module which characterized in that includes: the metal ring comprises a top surface, a bottom surface, an inner side surface and an outer side surface, wherein the top surface is a high gloss surface, Physical Vapor Deposition (PVD) layers are arranged on the bottom surface, the inner side surface and the outer side surface, and a nickel plating layer is arranged on the bottom surface;
the fingerprint identification module group further comprises a circuit board and a fingerprint identification chip, the metal ring is arranged on the circuit board, the bottom surface of the metal ring is attached to the circuit board and then forms a cavity with the circuit board, and the fingerprint identification chip is contained in the cavity.
2. The fingerprint identification module of claim 1, wherein the PVD layer has a thickness of 0.30 μ ι η to 1.50 μ ι η.
3. The fingerprint identification module of claim 1, wherein the nickel plating layer has a thickness of 1 μ ι η to 3 μ ι η.
4. The fingerprint identification module of claim 1, wherein the PVD layer is black in color and has a resistance of less than 200 ohms; or
The PVD layer is golden or silver in color, and the resistance of the PVD layer is less than 2 ohms.
5. The fingerprint recognition module of claim 1, wherein the metal ring comprises a first rim, a second rim, a third rim and a fourth rim, wherein the first rim is opposite to and parallel to the third rim, the second rim is opposite to and parallel to the fourth rim, the first rim is perpendicular to the second rim and the fourth rim, the third rim is perpendicular to the second rim and the fourth rim, the first rim and the third rim are equal in length, the second rim and the fourth rim are equal in length, and the second rim is shorter than the first rim; two adjacent frames in the four frames are connected through a strip-shaped curve.
6. The fingerprint identification module of claim 5, wherein a first laser etch processing region is disposed on the second border, wherein a second laser etch processing region is disposed on the fourth border, wherein the first and second laser etch processing regions are not disposed with PVD layers, and wherein an impedance between the first and second laser etch processing regions is less than 1 ohm.
7. The fingerprint identification module of claim 6, wherein the first and second laser scribe processing areas are rectangles of equal area, the first laser scribe processing area is located at a middle position of the second border, and the second laser scribe processing area is located at a middle position of the fourth border.
8. The fingerprint identification module of claim 1 wherein the metal ring is made of stainless steel.
9. The fingerprint identification module of any one of claims 1-8, wherein the top surface of the metal ring is planar or convexly curved.
10. A terminal, characterized in that it comprises a fingerprint recognition module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610569974.0A CN106156746B (en) | 2016-07-19 | 2016-07-19 | Fingerprint identification module and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610569974.0A CN106156746B (en) | 2016-07-19 | 2016-07-19 | Fingerprint identification module and terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106156746A CN106156746A (en) | 2016-11-23 |
| CN106156746B true CN106156746B (en) | 2020-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610569974.0A Expired - Fee Related CN106156746B (en) | 2016-07-19 | 2016-07-19 | Fingerprint identification module and terminal |
Country Status (1)
| Country | Link |
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| CN (1) | CN106156746B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9946915B1 (en) | 2016-10-14 | 2018-04-17 | Next Biometrics Group Asa | Fingerprint sensors with ESD protection |
| CN109670370A (en) * | 2017-10-13 | 2019-04-23 | 南昌欧菲生物识别技术有限公司 | Becket and preparation method thereof, fingerprint recognition mould group and terminal |
| CN112162594B (en) * | 2020-09-08 | 2023-03-10 | 华为技术有限公司 | Electronic device |
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| CN102142430A (en) * | 2010-12-24 | 2011-08-03 | 深圳顺络电子股份有限公司 | Chip type high polymer electrostatic discharge protecting element and manufacturing method thereof |
| CN102280427A (en) * | 2011-07-04 | 2011-12-14 | 启东市捷捷微电子有限公司 | Silicon controlled packaging structure capable of packaging metal and plastic in mixed mode and method thereof |
| CN102315182A (en) * | 2010-07-08 | 2012-01-11 | 台湾积体电路制造股份有限公司 | Semiconductor chip and manufacturing method thereof |
| CN102956386A (en) * | 2011-08-21 | 2013-03-06 | 比亚迪股份有限公司 | Key and manufacturing method thereof |
| CN103942538A (en) * | 2014-04-04 | 2014-07-23 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition sensor encapsulation structure |
| KR20160071561A (en) * | 2014-12-11 | 2016-06-22 | 주식회사 바이오메트릭스 | Finger Print Sensor Module with Film Cover Transmitter |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9898644B2 (en) * | 2014-11-20 | 2018-02-20 | Chih-Chung Lin | Touch panel with fingerprint identification function |
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2016
- 2016-07-19 CN CN201610569974.0A patent/CN106156746B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101292319A (en) * | 2005-08-17 | 2008-10-22 | 株式会社G-设备 | Compact tilt and vibration sensor and method for manufacturing the same |
| CN102315182A (en) * | 2010-07-08 | 2012-01-11 | 台湾积体电路制造股份有限公司 | Semiconductor chip and manufacturing method thereof |
| CN102142430A (en) * | 2010-12-24 | 2011-08-03 | 深圳顺络电子股份有限公司 | Chip type high polymer electrostatic discharge protecting element and manufacturing method thereof |
| CN102280427A (en) * | 2011-07-04 | 2011-12-14 | 启东市捷捷微电子有限公司 | Silicon controlled packaging structure capable of packaging metal and plastic in mixed mode and method thereof |
| CN102956386A (en) * | 2011-08-21 | 2013-03-06 | 比亚迪股份有限公司 | Key and manufacturing method thereof |
| CN103942538A (en) * | 2014-04-04 | 2014-07-23 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition sensor encapsulation structure |
| KR20160071561A (en) * | 2014-12-11 | 2016-06-22 | 주식회사 바이오메트릭스 | Finger Print Sensor Module with Film Cover Transmitter |
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| CN106156746A (en) | 2016-11-23 |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330000 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330000 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20200828 |