CN109670370A - Becket and preparation method thereof, fingerprint recognition mould group and terminal - Google Patents
Becket and preparation method thereof, fingerprint recognition mould group and terminal Download PDFInfo
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- CN109670370A CN109670370A CN201710952283.3A CN201710952283A CN109670370A CN 109670370 A CN109670370 A CN 109670370A CN 201710952283 A CN201710952283 A CN 201710952283A CN 109670370 A CN109670370 A CN 109670370A
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- becket
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- skirt
- top surface
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention provides a kind of becket and preparation method thereof, fingerprint recognition mould group and terminals.The preparation method of the becket includes: to go out becket using lathe process；Nickel layer is prepared with the bottom surface in becket using vacuum plating process in the bottom surface nickel plating of becket using top surface, medial surface and the lateral surface of the first masking jig masking becket.The preparation method of becket provided by the invention, it is realized by the first masking jig and nickel plating only is carried out to the bottom surface of becket, nickel layer only is set in the bottom surface of becket, so that becket can be produced using the technique of lathe, the production cost for reducing becket improves the processing efficiency of becket.
Description
Technical field
The present invention relates to fingerprint identification technology fields, more specifically, be related to a kind of becket and preparation method thereof including
The fingerprint recognition mould group of the becket and terminal including the fingerprint recognition mould group.
Background technique
Fingerprint recognition mould group uses the project of pure gluing process with stainless steel metal ring and with mould group at present, is by gold
Belong to ring bottom using water power plate in the way of, control fingerprint mould group impedance ground.
It is to be put into becket in chemical-electrical plating solution to be electroplated that water power, which plates main technique, and metal is made in the way of electrolysis
Or alloy deposition is in metal ring surface, process uniform with formation, fine and close, the good metal layer of binding force, so after plating
Product electric conductivity significantly increases, and the defect of this technique has: water power plates general coating material and uses " sexavalence lattice ", this is non-environmental protection
Material, environmental pollution are more serious；Appearance is flatter, and color is darker；Productivity is low etc..
For the becket using lathe technique, it cannot be plated as conventional project (CNC technique) using water power, can not be accomplished
There is bottom nickel plating, easily causes the nickel in metallic rings contact face to discharge exceeded, be harmful to the human body.
Summary of the invention
The present invention is directed at least solve one of the technical problems existing in the prior art.
For this purpose, a kind of preparation method for being designed to provide becket of the first aspect of the invention.
Being designed to provide for the second aspect of the invention is a kind of using becket made of above-mentioned preparation method.
The third aspect of the invention is designed to provide a kind of fingerprint recognition mould group including above-mentioned becket.
The fourth aspect of the invention is designed to provide a kind of terminal including above-mentioned fingerprint recognition mould group.
To achieve the above object, the embodiment of one aspect of the present invention provides a kind of preparation method of becket, packet
It includes: the becket is gone out using lathe process；Top surface, medial surface and the outside of the becket are covered using the first masking jig
Face prepares nickel layer using vacuum plating process in the bottom surface nickel plating of the becket with the bottom surface in the becket.
The preparation method for the becket that the above embodiment of the present invention provides processes becket using lathe turning first,
Becket is annular in shape, has the bottom surface of top surface and top surface relative to setting, medial surface and outside between top surface and bottom surface
Face, medial surface and lateral surface are annular in shape, and medial surface is located at the inside of lateral surface.Becket is covered by the first masking jig again
Top surface, medial surface and lateral surface, prepare nickel layer, wherein vacuum in the bottom surface nickel plating of becket using vacuum plating process
Plating refers under vacuum conditions, using low-voltage, the arc-discharge technique of high current, makes target evaporation simultaneously using gas discharge
Make to be evaporated substance and gas all ionizes, using the acceleration of electric field, makes to be evaporated substance and its reaction product deposition
On becket, the coating material which uses is extensive, readily conforms to environmental requirement, and relatively glistens, and color is brighter.
By the first masking jig in the application, the bottom surface nickel plating only in becket is realized, becket is on the one hand made
Be not in that nickel discharges exceeded risk, on the other hand can use lathe process becket, processes metal compared to CNC technique
Ring, the high in machining efficiency of lathe, manufacturing cost are low.
In addition, the preparation method for the becket that the above embodiment of the present invention provides also has following additional technical feature:
In above-mentioned technical proposal, it is preferable that less than 1 μm, the thickness of nickel layer can be but be not limited to the thickness of the nickel layer
0.3μm、0.6μm、0.9μm。
In above-mentioned technical proposal, it is preferable that cover the top surface of the becket, inside using the first masking jig described
Face and lateral surface prepare nickel using vacuum plating process in the bottom surface nickel plating of the becket with the bottom surface in the becket
Before or after layer, further includes: carry out laser carving processing to the bottom surface of the becket.
The bottom surface of becket and the glue connection of circuit board point carry out the roughness that laser carving processing is capable of increasing becket bottom surface,
Increase the bonding strength between the bottom surface and circuit board of becket.
In above-mentioned technical proposal, it is preferable that the flatness of the bottom surface of the becket is less than or equal to 0.05mm.
The flatness of the bottom surface of becket can be but be not limited to 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm.
In above-mentioned technical proposal, it is preferable that cover the top surface of the becket, inside using the first masking jig described
Face and lateral surface prepare nickel using vacuum plating process in the bottom surface nickel plating of the becket with the bottom surface in the becket
Before or after layer, further includes: cover the bottom surface of the becket using the second masking jig, (physical vapor is heavy using PVD method
Area method) on the top surface of the becket, medial surface and lateral surface prepare PVD layer.
In above-mentioned technical proposal, it is preferable that the PVD layer with a thickness of 0.30 μm~1.50 μm.
The color of PVD layer can be random color, such as silver color, gold etc..
The bottom surface of becket needs to test according to scolding tin test specification by scolding tin, and the purpose of scolding tin test is verifying metal
The bottom surface of ring is either with or without nickel layer is plated, to examine the effect of bottom surface nickel plating.
In above-mentioned technical proposal, it is preferable that the becket is equipped with indicating area, and the indicating area includes the gold
Belong to the connection of the lateral surface of the top surface of ring and the junction of medial surface of the becket and/or the top surface of becket and becket
The junction of the medial surface of place and/or the bottom surface of the becket and the becket is hidden described using the second masking jig
Covert states the bottom surface of becket, before preparing PVD layer on the top surface of the becket, medial surface and lateral surface using PVD method,
Further include: CNC high light processing is carried out to the indicating area.
In above-mentioned technical proposal, it is preferable that the becket includes that metal ring body and the metal ring body are prolonged outward
The skirt to be formed is stretched, the lateral surface of the becket includes the outer side surface of the metal ring body and the upper table of the skirt
The bottom surface of the becket is covered using the second masking jig described in face, using PVD method in the top surface, interior of the becket
After preparing PVD layer on side and lateral surface, further includes: laser carving processing is carried out to the upper surface of the skirt, described in removal
The PVD layer of the upper surface of skirt.
The upper surface of skirt is connected with casing, carries out laser carving processing to the upper surface of skirt, can remove table on skirt
The PVD layer in face increases the roughness of skirt upper surface, improves the upper surface of skirt and the bonding strength of casing.
Preferably, a dyne value for the upper surface of skirt is greater than or equal to 36, and the upper surface of skirt is not allow for flash, hair
Thorn.
In above-mentioned technical proposal, it is preferable that the flatness of the upper surface of the skirt is less than or equal to 0.5mm.
Preferably, the flatness of the upper surface of skirt can be but be not limited to 0.1mm, 0.2mm, 0.3mm, 0.4mm,
0.5mm。
The embodiment of the second aspect of the present invention provides a kind of becket, using becket described in any of the above-described embodiment
Preparation method be made, thus all beneficial effects of the preparation method with becket described in any of the above-described embodiment,
This is repeated no more.
Preferably, the material of becket is SUS316L.
The embodiment of third aspect of the present invention provides a kind of fingerprint recognition mould group, including metal described in above-described embodiment
Ring, thus all beneficial effects with becket described in above-described embodiment, details are not described herein.
The embodiment of the 4th aspect of the present invention provides a kind of terminal, using fingerprint recognition mould described in above-described embodiment
Group, thus all beneficial effects with fingerprint recognition mould group described in above-described embodiment, details are not described herein.
The terminal is mobile phone, the calculating on knee with sensing surface (such as touch-screen display and/or Trackpad)
Machine or tablet computer or desktop computer.
Additional aspect and advantage of the invention will become obviously in following description section, or practice through the invention
Recognize.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the schematic view of the front view of becket described in one embodiment of the present of invention；
Fig. 2 be in Fig. 1 D-D to schematic cross-sectional view；
Fig. 3 is the right side structural representation of becket shown in FIG. 1；
Fig. 4 is the backsight structural representation of becket shown in FIG. 1；
Fig. 5 is the flow diagram of the preparation method of becket described in one embodiment of the present of invention.
Wherein, the corresponding relationship in Fig. 1 to Fig. 4 between appended drawing reference and component names are as follows:
100 beckets, 1 metal ring body, 2 skirts, 3 top surfaces, 4 bottom surfaces, 5 medial surfaces, 6 lateral surfaces, 7 upper surfaces, 8 outsides
Wall surface.
Specific embodiment
To better understand the objects, features and advantages of the present invention, with reference to the accompanying drawing and specific real
Applying mode, the present invention is further described in detail.It should be noted that in the absence of conflict, the implementation of the application
Feature in example and embodiment can be combined with each other.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, still, the present invention may be used also
Implement in a manner of using other than the one described here, therefore, protection scope of the present invention is not by following public tool
The limitation of body embodiment.
Becket according to some embodiments of the invention and preparation method thereof, fingerprint recognition mould group are described with reference to the accompanying drawings
And terminal.
As shown in Figures 1 to 5, a kind of preparation method of the becket 100 provided according to some embodiments of the invention, packet
It includes:
Step S10 goes out becket 100 using lathe process；
Step S20, using top surface 3, medial surface 5 and the lateral surface 6 of the first masking jig masking becket 100, using true
Dummy plating technique is in 4 nickel plating of the bottom surface of becket 100, to prepare nickel layer in the bottom surface of becket 100 4.
The preparation method for the becket 100 that the above embodiment of the present invention provides processes metal using lathe turning first
Ring 100, becket 100 is annular in shape, with top surface 3, the bottom surface 4 being oppositely arranged with top surface 3, between top surface 3 and bottom surface 4
Medial surface 5 and lateral surface 6, medial surface 5 and lateral surface 6 are annular in shape, and medial surface 5 is located at the inside of lateral surface 6.Pass through first again
Top surface 3, medial surface 5 and the lateral surface 6 for covering jig masking becket 100, using vacuum plating process, in becket 100
4 nickel plating of bottom surface, prepares nickel layer, and wherein vacuum plating refers under vacuum conditions, using low-voltage, the arc discharge of high current
Technology evaporates target using gas discharge and makes to be evaporated substance and gas all to ionize, using the acceleration of electric field,
Make to be evaporated substance and its reaction product is deposited on becket 100, the coating material which uses is extensive, readily conforms to ring
Guaranteed request, and relatively glisten, color is brighter.
It by the first masking jig in the application, realizes only in 4 nickel plating of the bottom surface of becket 100, on the one hand, so that gold
Belonging to ring 100 is not in that nickel discharges exceeded risk, on the other hand, lathe process becket 100 can be used, compared to CNC
Technique processes becket 100, and the high in machining efficiency of lathe, manufacturing cost are low.
Preferably, less than 1 μm, the thickness of nickel layer can be but be not limited to 0.3 μm, 0.6 μm, 0.9 μm the thickness of nickel layer.
Preferably, in top surface 3, medial surface 5 and the lateral surface 6 using the first masking jig masking becket 100, using true
Dummy plating technique is in 4 nickel plating of the bottom surface of becket 100, also to wrap before or after the bottom surface of becket 100 4 prepares nickel layer
It includes: laser carving processing is carried out to the bottom surface 4 of becket 100.
The bottom surface 4 of becket 100 and the glue connection of circuit board point carry out laser carving processing and are capable of increasing 100 bottom surface 4 of becket
Roughness increases the bonding strength between the bottom surface 4 and circuit board of becket 100.Laser carving processing can before vacuum nickel plating,
It can also be after vacuum nickel plating.
Preferably, the flatness of the bottom surface 4 of becket 100 is less than or equal to 0.05mm.
The flatness of the bottom surface 4 of becket 100 can be but be not limited to 0.01mm, 0.02mm, 0.03mm, 0.04mm,
0.05mm。
Preferably, the preparation method of becket further include: using the bottom surface 4 of the second masking jig masking becket 100, adopt
PVD layer is prepared on the top surface of becket 100 3, medial surface 5 and lateral surface 6 with PVD method (physical vaporous deposition), the preparation
The step of PVD layer, can be before the nickel plating of bottom surface, can also be after the nickel plating of bottom surface.
Preferably, PVD layer with a thickness of 0.30 μm~1.50 μm, the thickness of PVD layer can be but be not limited to 0.03 μm,
0.60μm、0.90μm、1.20μm、1.50μm。
The color of PVD layer can be random color, such as silver color, gold etc..
The bottom surface 4 of becket 100 needs to test according to scolding tin test specification by scolding tin, and the purpose of scolding tin test is verifying
The bottom surface 4 of becket 100 is either with or without nickel layer is plated, to examine the effect of 4 nickel plating of bottom surface.
Preferably, becket 100 is equipped with indicating area, and indicating area includes top surface 3 and the becket of becket 100
The junction of the lateral surface of 100 junction of medial surface 5 and/or the top surface of becket and becket and/or becket 100
The junction of the medial surface 5 of bottom surface 4 and becket 100 is used in the bottom surface 4 using the second masking jig masking becket 100
Before PVD method prepares PVD layer on the top surface of becket 100 3, medial surface 5 and lateral surface 6, further includes: carried out to indicating area
CNC high light processing.
The bottom surface 4 of becket 100 refers to the bottom surface 4 of skirt 2.
Indicating area includes in the angle the C (place A in such as Fig. 2 that the medial surface 5 of becket 100 and the junction of bottom surface 4 are arranged
Show), the junction of medial surface 5 and top surface 3 be arranged the angle C (as shown in B in Fig. 2) and lateral surface 6 and top surface 3 junction
The angle R (as shown in C in Fig. 2).Wherein, the angle C that the junction of medial surface 5 and bottom surface 4 is arranged is used to indicate becket 100
Bottom surface 4, assembling when, avoid sealing, the angle C of the junction setting of medial surface 5 and top surface 3 and the company of lateral surface 6 and top surface 3
The angle R at the place of connecing can prevent becket 100 from scratching hand.
Preferably, becket 100 includes the skirt 2 that metal ring body 1 and metal ring body 1 extend outward to form, metal
The lateral surface 6 of ring 100 includes the outer side surface 8 of metal ring body 1 and the upper surface 7 of skirt 2, is hidden using the second masking jig
The bottom surface 4 for covering becket 100, prepared on the top surface of becket 100 3, medial surface 5 and lateral surface 6 using PVD method PVD layer it
Afterwards, further includes: laser carving processing is carried out to the upper surface 7 of skirt 2, to remove the PVD layer of the upper surface 7 of skirt 2.
Preferably, metal body is annular in shape, and the center of circle in the center of circle of the circle where metal ring body and the circle where skirt
Between deviation be less than or equal to 0.05mm.
The upper surface 7 of skirt 2 is oppositely arranged with the bottom surface 4 of becket 100.And the upper surface 7 of skirt 2 is connected with casing
It connects, laser carving processing is carried out to the upper surface 7 of skirt 2, the PVD layer of 2 upper surface 7 of skirt can be removed, increase 2 upper surface 7 of skirt
Roughness, improve skirt 2 upper surface 7 and casing bonding strength.
Preferably, the flatness of the upper surface 7 of skirt 2 is less than or equal to 0.5mm.
Preferably, the flatness of the upper surface 7 of skirt 2 can be but be not limited to 0.1mm, 0.2mm, 0.3mm, 0.4mm,
0.5mm。
The embodiment of the second aspect of the present invention provides a kind of becket 100, using gold described in any of the above-described embodiment
The preparation method for belonging to ring 100 is made, thus one of the preparation method with becket 100 described in any of the above-described embodiment cuts with
Beneficial effect, details are not described herein.
The embodiment of third aspect of the present invention provides a kind of fingerprint recognition mould group, including metal described in above-described embodiment
Ring 100, thus all beneficial effects with becket 100 described in above-described embodiment, details are not described herein.
The embodiment of the 4th aspect of the present invention provides a kind of terminal, using fingerprint recognition mould described in above-described embodiment
Group, thus all beneficial effects with fingerprint recognition mould group described in above-described embodiment, details are not described herein.
The terminal is mobile phone, the calculating on knee with sensing surface (such as touch-screen display and/or Trackpad)
Machine or tablet computer or desktop computer.
In conclusion the preparation method of becket 100 provided in an embodiment of the present invention, is realized by the first masking jig
Nickel plating only is carried out to the bottom surface 4 of becket 100, i.e., nickel layer only is set in the bottom surface of becket 100 4, so that becket 100
It can be produced using the technique of lathe, reduce the production cost of becket 100, improve the processing effect of becket 100
Rate.
In the description of the present invention unless specifically defined or limited otherwise, term " multiple " refer to two or two with
On；Unless otherwise prescribed or illustrate, term " connection ", " fixation " etc. shall be understood in a broad sense, for example, " connection " can be fixation
Connection, may be a detachable connection, or be integrally connected, or electrical connection；It can be directly connected, intermediate matchmaker can also be passed through
Jie is indirectly connected.For the ordinary skill in the art, above-mentioned term can be understood in the present invention as the case may be
In concrete meaning.
In the description of this specification, it is to be understood that the instruction such as term " on ", "lower", "front", "rear", "left", "right"
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the present invention and simplification retouch
It states, rather than the device or unit of indication or suggestion meaning must have specific direction, be constructed and operated in a specific orientation,
It is thus impossible to be interpreted as limitation of the present invention.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one reality of the invention
It applies in example or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or reality
Example.Moreover, description particular features, structures, materials, or characteristics can in any one or more of the embodiments or examples with
Suitable mode combines.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (12)
1. a kind of preparation method of becket characterized by comprising
The becket is gone out using lathe process；
Top surface, medial surface and the lateral surface that the becket is covered using the first masking jig, using vacuum plating process in institute
The bottom surface nickel plating of becket is stated, nickel layer is prepared with the bottom surface in the becket.
2. the preparation method of becket according to claim 1, which is characterized in that
The thickness of the nickel layer is less than 1 μm.
3. the preparation method of becket according to claim 1, which is characterized in that
In top surface, medial surface and the lateral surface for covering the becket using the first masking jig, using vacuum plating work
Skill the becket bottom surface nickel plating, before or after the bottom surface of the becket prepares nickel layer, further includes:
Laser carving processing is carried out to the bottom surface of the becket.
4. the preparation method of becket according to claim 1, which is characterized in that
The flatness of the bottom surface of the becket is less than or equal to 0.05mm.
5. the preparation method of becket according to any one of claim 1 to 4, which is characterized in that
In top surface, medial surface and the lateral surface for covering the becket using the first masking jig, using vacuum plating work
Skill the becket bottom surface nickel plating, before or after the bottom surface of the becket prepares nickel layer, further includes:
Cover the bottom surface of the becket using the second masking jig, using PVD method the top surface of the becket, medial surface and
PVD layer is prepared on lateral surface.
6. the preparation method of becket according to claim 5, which is characterized in that
The PVD layer with a thickness of 0.30 μm~1.50 μm.
7. the preparation method of becket according to claim 5, which is characterized in that the becket is equipped with instruction area
Domain, the indicating area include junction and/or the becket of the top surface of the becket and the medial surface of the becket
The company of the medial surface of the bottom surface and becket of the junction and/or becket of the lateral surface of top surface and the becket
Meet place, cover the bottom surface of the becket using the second masking jig described, using PVD method the becket top surface,
Before preparing PVD layer on medial surface and lateral surface, further includes:
CNC high light processing is carried out to the indicating area.
8. the preparation method of becket according to claim 5, which is characterized in that
The becket includes the skirt that metal ring body and the metal ring body extend outward to form, the becket it is outer
Side includes the outer side surface of the metal ring body and the upper surface of the skirt, is covered described using the second masking jig
The bottom surface of the becket, after preparing PVD layer on the top surface of the becket, medial surface and lateral surface using PVD method, also
Include:
Laser carving processing is carried out to the upper surface of the skirt, to remove the PVD layer of the upper surface of the skirt.
9. the preparation method of becket according to claim 8, which is characterized in that
The flatness of the upper surface of the skirt is less than or equal to 0.5mm.
10. a kind of becket, which is characterized in that using the preparation method of becket as claimed in any one of claims 1-9 wherein
It is made.
11. a kind of fingerprint recognition mould group, which is characterized in that including becket as claimed in claim 10.
12. a kind of terminal, which is characterized in that use fingerprint recognition mould group as claimed in claim 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710952283.3A CN109670370A (en) | 2017-10-13 | 2017-10-13 | Becket and preparation method thereof, fingerprint recognition mould group and terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710952283.3A CN109670370A (en) | 2017-10-13 | 2017-10-13 | Becket and preparation method thereof, fingerprint recognition mould group and terminal |
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| CN109670370A true CN109670370A (en) | 2019-04-23 |
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| CN201710952283.3A Withdrawn CN109670370A (en) | 2017-10-13 | 2017-10-13 | Becket and preparation method thereof, fingerprint recognition mould group and terminal |
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Address after: 330013 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 no.1189 Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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Application publication date: 20190423 |