CN106058009A - Covering film type dispensing method of COB technology LED display screen - Google Patents
Covering film type dispensing method of COB technology LED display screen Download PDFInfo
- Publication number
- CN106058009A CN106058009A CN201610545903.7A CN201610545903A CN106058009A CN 106058009 A CN106058009 A CN 106058009A CN 201610545903 A CN201610545903 A CN 201610545903A CN 106058009 A CN106058009 A CN 106058009A
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- China
- Prior art keywords
- led display
- glue
- external member
- pcb
- film type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 59
- 238000005516 engineering process Methods 0.000 title abstract description 3
- 239000003292 glue Substances 0.000 claims abstract description 46
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 8
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 238000004020 luminiscence type Methods 0.000 claims description 26
- 239000000084 colloidal system Substances 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 14
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 6
- 238000005266 casting Methods 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 3
- 238000010257 thawing Methods 0.000 claims description 2
- 238000004382 potting Methods 0.000 abstract 4
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 description 4
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 206010068052 Mosaicism Diseases 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 210000003765 sex chromosome Anatomy 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a covering film type dispensing method of a COB technology LED display screen. The method comprises steps that a #-shaped set member is customized according to dimensions of a circuit board, the set member covers at a blank of a light emitting chip of a PCB, and liquid crystal packaging is simulated; a glue melting method is employed to melt glue to fill at a lower portion of the #-shaped set member, and the #-shaped set member is in seamless connection with the PCB; after the potting glue is dry, a single-point potting mode is employed for dispensing so as to guarantee light transmission and sealing of the light emitting chip on an LED display screen; after potting of the light emitting chip, a black covering film is employed to realize integral potting of the PCB. Through the method, an inky uniformity problem can be excellently solved.
Description
Technical field
The present invention relates to LED display encapsulation field, particularly relate to the overlay film type point glue of a kind of COB technique LED display
Method.
Background technology
Owing to, in current COB technique display screen production process, typically having two kinds: a kind of is the FR-4 asphalt mixtures modified by epoxy resin at PCB
Direct rolled copper foil on aliphatic radical plate, then carries out the fixing of luminescence chip, after fixing, and the most overall ring covering layer of transparent
Oxygen tree adipose membrane, owing to the aberration problem of PCB substrate causes display screen finished product to have aberration, the refraction additionally, due to epoxy resin does not has
Using reflex mechanism, this kind of technique also has optical crosstalk situation；The second: in one layer of perforate of calendering on the basis of the first
FR-4 epoxy resin, then carries out the embedding of luminescence chip in fixing position, hole, can reduce optical crosstalk phenomenon to a certain extent,
But due to the colourity difference of FR-4, the glue that puts a spot uses transparent technological design, so it is even to easily cause bad colour.
Summary of the invention
The technical problem to be solved in the present invention is for COB technique display screen in prior art being packaged when
Easily cause the defect that bad colour is even, it is provided that a kind of COB technique LED display that can solve good colour sex chromosome mosaicism well
Overlay film type dotting glue method.
The technical solution adopted for the present invention to solve the technical problems is:
The overlay film type dotting glue method of a kind of COB technique LED display is provided, comprises the following steps:
According to circuit board size intersecting parallels customized external member, and cover luminescence chip blank space in PCB, with simulation
Liquid crystal encapsulates；
Employing is melted glue method and is circulated into below intersecting parallels external member by colloid thawing, and intersecting parallels external member is seamless with PCB
Connect；
After casting glue is dried, single-point encapsulation type is used to carry out a glue, to ensure the saturating of luminescence chip on LED display
Light and sealing；
After luminescence chip embedding, use black coating that PCB carries out overall embedding..
In the overlay film type dotting glue method of COB technique LED display of the present invention, described intersecting parallels external member fusing point be
The non-metallic material of more than 600 degree.
In the overlay film type dotting glue method of COB technique LED display of the present invention, described intersecting parallels external member is dark resistance to height
Temperature epoxy resin molding.
In the overlay film type dotting glue method of COB technique LED display of the present invention, when using fusion dotting glue method encapsulating, glue
The heating-up temperature of body is 250-255 degree.
In the overlay film type dotting glue method of COB technique LED display of the present invention, during point glue, the maximum temperature of colloid exists
Within 150 degree.
In the overlay film type dotting glue method of COB technique LED display of the present invention, described black coating be one layer frivolous
Bright epoxy resin.
In the overlay film type dotting glue method of COB technique LED display of the present invention, described intersecting parallels external member uses in black
Property insulant is made.
Present invention also offers a kind of COB technique LED display, this display screen includes PCB and intersecting parallels external member,
The luminescence chip blank space that described intersecting parallels external member is covered in this PCB by colloid, to simulate liquid crystal encapsulation；
It is coated with employing single-point encapsulation type on each luminescence chip and carries out colloid for dispensing glue, to ensure to send out on LED display
The printing opacity of optical chip and sealing；
This display screen outermost layer is also covered with one layer of black coating.
The beneficial effect comprise that: first due to the addition of black coating, have adjusted display on integrated artistic
The uniformity of the surface mass colour of screen finished product, second, due to the extinction effect that black is good, add setting of intersecting parallels external member groove
Meter, can increase the reflective surface area of luminescence chip, greatly shortens the optical crosstalk of whole screen simultaneously.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the flow chart of the overlay film type dotting glue method of embodiment of the present invention COB technique LED display；
Fig. 2 is the structural representation schematic diagram of embodiment of the present invention LED display.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, right
The present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, not
For limiting the present invention.
The overlay film type dotting glue method of embodiment of the present invention COB technique LED display, as it is shown in figure 1, comprise the following steps:
S1, foundation circuit board size intersecting parallels customized external member, intersecting parallels external member can use black neutrality insulant to make.
And covering luminescence chip blank space in PCB, it is achieved circuit board, except luminescent crystal is with outer portion whole black extinction, is protected
The good colour property of card PCB surface, to simulate liquid crystal encapsulation；
S2, use and melt glue method and colloid is melted be circulated into below intersecting parallels external member, by intersecting parallels external member and PCB without
Seam connects；
S3, casting glue dry after, use single-point encapsulation type carry out a glue, to ensure luminescence chip on LED display
Printing opacity and sealing；
After S4, luminescence chip embedding, PCB (the most whole luminous PCB panel) is carried out overall embedding, specifically
Black coating can be used to carry out overall embedding.
Owing to the maximum feature of COB technique is i.e. to be directly encapsulated into above PCB by luminescence chip, not through the envelope of lamp bead
Dress is so chip is that zero distance contacts with PCB, at the surface coating of COB technique, is i.e. to cover in the place that luminescence chip is blank
Upper intersecting parallels external member, simulation liquid crystal encapsulation.Intersecting parallels external member selects fusing point non-metallic material more than 600 degree, as can be selected for
Dark high-temperature-resistant epoxy resin film.
In one preferred embodiment of the present invention, intersecting parallels external member uses dark high-temperature-resistant epoxy resin film.External member must be with
PCB seamless link, therefore the present invention selects and melts glue method, is melted by colloid and is circulated into below intersecting parallels external member, makes intersecting parallels external member
With PCB seamless link.
The when of encapsulating, temperature to be ensured is about 250 degree, and deviation is less than 5 degree.Optional fusing point is at about 200 degree
Black epoxy colloid, can allow colloid fully melt at about 250 degree and be unlikely to the dilutest, it is possible to ensure effect during point glue
Reach optimal.
Luminescence chip brocken spectrum glue, needs after casting glue is dried.Luminescence chip is COB technique LED display core
The part of the heart, can use transparent highly dense epoxy resin to carry out a glue, uses single-point encapsulation type accurately more to can guarantee that lamp bead
Printing opacity and sealing.The maximum temperature of colloid needs to control within 150 degree, and first, this temperature will not break the colloid of ring overlay film,
Second, the most do not destroy the physical arrangement of luminescence chip, it is ensured that the stability of product.
Transparent stamper step is carried out after luminescence chip embedding is complete, i.e. frivolous module surface entirety embedding one layer
Transparent epoxy resin, carries out overall embedding to PCB light pattern.
Present invention also offers a kind of COB technique LED display, made by the method for above-described embodiment, such as Fig. 2 institute
Showing, this display screen includes PCB 10 and intersecting parallels external member 20, and PCB is neatly welded with multiple luminescence chip 11,
The luminescence chip blank space that described intersecting parallels external member is covered in this PCB 10 by colloid, to simulate liquid crystal encapsulation；
It is coated with employing single-point encapsulation type on each luminescence chip 11 and carries out colloid for dispensing glue, to ensure on LED display
The printing opacity of luminescence chip 11 and sealing；
This display screen outermost layer is also covered with one layer of black coating (not shown).
Intersecting parallels external member 20 is as in figure 2 it is shown, be referred to as grid cover.
It should be appreciated that for those of ordinary skills, can be improved according to the above description or be converted,
And all these modifications and variations all should belong to the protection domain of claims of the present invention.
Claims (8)
1. the overlay film type dotting glue method of a COB technique LED display, it is characterised in that comprise the following steps:
According to circuit board size intersecting parallels customized external member, and cover luminescence chip blank space in PCB, to simulate liquid crystal
Encapsulation；
Employing is melted glue method and is circulated into below intersecting parallels external member by colloid thawing, by intersecting parallels external member and PCB seamless link；
After casting glue is dried, use single-point encapsulation type to carry out a glue, with ensure on LED display the printing opacity of luminescence chip and
Seal；
After luminescence chip embedding, use black coating that PCB carries out overall embedding.
The overlay film type dotting glue method of COB technique LED display the most according to claim 1, it is characterised in that described intersecting parallels
External member is fusing point non-metallic material more than 600 degree.
The overlay film type dotting glue method of COB technique LED display the most according to claim 1, it is characterised in that described intersecting parallels
External member is dark high-temperature-resistant epoxy resin film.
The overlay film type dotting glue method of COB technique LED display the most according to claim 1, it is characterised in that use merging point
During glue method encapsulating, the heating-up temperature of colloid is 250-255 degree.
The overlay film type dotting glue method of COB technique LED display the most according to claim 1, it is characterised in that during point glue, glue
The maximum temperature of body is within 150 degree.
The overlay film type dotting glue method of COB technique LED display the most according to claim 1, it is characterised in that described black covers
Film is one layer of frivolous transparent epoxy resin.
The overlay film type dotting glue method of COB technique LED display the most according to claim 1, it is characterised in that described intersecting parallels
External member uses black neutrality insulant to make.
8. a COB technique LED display, it is characterised in that this display screen includes PCB and intersecting parallels external member, described
The luminescence chip blank space that intersecting parallels external member is covered in this PCB by colloid, to simulate liquid crystal encapsulation；
It is coated with employing single-point encapsulation type on each luminescence chip and carries out colloid for dispensing glue, to ensure luminous core on LED display
The printing opacity of sheet and sealing；
This display screen outermost layer is also covered with one layer of black coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610545903.7A CN106058009A (en) | 2016-07-12 | 2016-07-12 | Covering film type dispensing method of COB technology LED display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610545903.7A CN106058009A (en) | 2016-07-12 | 2016-07-12 | Covering film type dispensing method of COB technology LED display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106058009A true CN106058009A (en) | 2016-10-26 |
Family
ID=57185292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610545903.7A Pending CN106058009A (en) | 2016-07-12 | 2016-07-12 | Covering film type dispensing method of COB technology LED display screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106058009A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107038965A (en) * | 2017-05-05 | 2017-08-11 | 深圳浩翔光电技术有限公司 | LED display, shaping module and its production technology |
| CN109410752A (en) * | 2018-11-05 | 2019-03-01 | 深圳市山本光电股份有限公司 | A kind of COB lamp bar adhesive method, COB lamp bar and display screen |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201340702Y (en) * | 2008-12-22 | 2009-11-04 | 北京巨数数字技术开发有限公司 | LED display screen |
| US20100252848A1 (en) * | 2009-04-01 | 2010-10-07 | Chih-Lung Liang | Method for forming an led lens structure and related structure |
| CN103345886A (en) * | 2013-07-09 | 2013-10-09 | 深圳市华海诚信电子显示技术有限公司 | LED display screen based on chip-on-board packaging technique and production method thereof |
| CN203300159U (en) * | 2013-07-09 | 2013-11-20 | 深圳市华海诚信电子显示技术有限公司 | Chip-on-board packaging technology based light-emitting diode (LED) display screen |
-
2016
- 2016-07-12 CN CN201610545903.7A patent/CN106058009A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201340702Y (en) * | 2008-12-22 | 2009-11-04 | 北京巨数数字技术开发有限公司 | LED display screen |
| US20100252848A1 (en) * | 2009-04-01 | 2010-10-07 | Chih-Lung Liang | Method for forming an led lens structure and related structure |
| CN103345886A (en) * | 2013-07-09 | 2013-10-09 | 深圳市华海诚信电子显示技术有限公司 | LED display screen based on chip-on-board packaging technique and production method thereof |
| CN203300159U (en) * | 2013-07-09 | 2013-11-20 | 深圳市华海诚信电子显示技术有限公司 | Chip-on-board packaging technology based light-emitting diode (LED) display screen |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107038965A (en) * | 2017-05-05 | 2017-08-11 | 深圳浩翔光电技术有限公司 | LED display, shaping module and its production technology |
| CN109410752A (en) * | 2018-11-05 | 2019-03-01 | 深圳市山本光电股份有限公司 | A kind of COB lamp bar adhesive method, COB lamp bar and display screen |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161026 |