CN103258941B - LED matrix, the fluorescent powder film of coated LED chip and the method for coating of fluorescent powder film - Google Patents
LED matrix, the fluorescent powder film of coated LED chip and the method for coating of fluorescent powder film Download PDFInfo
- Publication number
- CN103258941B CN103258941B CN201210034623.1A CN201210034623A CN103258941B CN 103258941 B CN103258941 B CN 103258941B CN 201210034623 A CN201210034623 A CN 201210034623A CN 103258941 B CN103258941 B CN 103258941B
- Authority
- CN
- China
- Prior art keywords
- led chip
- shaped cavity
- convex shaped
- fluorescent powder
- powder film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention provides a kind of LED matrix, the fluorescent powder film of coated LED chip and the method for coating of fluorescent powder film, LED matrix includes the flip LED chips of at least one die bond, one containing the transparent fluorescent powder film of fluorescent material, described fluorescent powder film has thermal contraction performance, containing one or more convex shaped cavity for holding described LED chip on it, cover and the coated described fluorescent powder film of pyrocondensation on the front and side surface of described LED chip; The invention process process is convenient for production, the thickness of whole technical process phosphor powder layer and the controllability of shape high, have good uniformity, importantly after follow-up encapsulation, the ejecting white light of uniformity can be obtained.
Description
Technical field
The invention belongs to LED technical field, particularly relate to a kind of LED matrix, the fluorescent powder film of coated LED chip and the method for coating of fluorescent powder film.
Background technology
At present, LED illumination, specular removal, high-color rendering energy-conservation with it is progressively popularized.In LED field, what current domestic LED industry mainly adopted is traditional process for filling colloid into, directly in chip surface spot printing phosphor gel, by fluorescent material Homogeneous phase mixing in silica gel or epoxy resin isocolloid, then by point gum machine fine needle class instrument, the colloid being mixed with fluorescent material is coated on chip surface, under normal circumstances, the coating of similar spherical crown shape can be formed at chip surface, cause the centerand edge of this fluorescent coating occur non-homogeneous outside, and in practical operation, between the LED chip of same batch, phosphor powder layer all can have certain difference in shape, be difficult to control uniformity and consistency, colourity difference larger between device will certainly be brought, meanwhile, due to coating adhesive, to drip actual microscopic surface uneven, and when beam projecting, will form white light color uneven, the inhomogeneities hot spot causing local partially yellow or partially blue occurs.There is obvious fault of construction in obvious this method and coating.
Overcome above-mentioned defect, improve the uniformity consistency of colourity, brightness between the hot spot uniform spatial distribution of white light LEDs and pipe, just must change shape and the technique of existing fluorescent coating, make the fluorescent material of chip surface thickness uniformizing, so just can obtain the ejecting white light of uniformity, namely realize the controllability of the concentration of fluorescent coating, thickness and shape.The planar structure of phosphor powder layer should be a kind of effective solution route.
Patent: application number is 200810306164.1, publication number is: CN101749653A, name are called: the state of fluorescent-powder coating method application discloses a kind of film being mixed with fluorescent material, be coated in the light-emitting area of LED chip by heating, thus fluorescent material is spread evenly across on LED chip, to realize the photochromic uniformity improving LED.But how fluorescent powder film and LED chip realize reliably being connected and fixed before heating, during guarantee heating, fluorescent powder film is successfully attached in the light-emitting area of LED chip, is not mentioned in the patent, so method implements certain difficulty.
Summary of the invention
The object of the present invention is to provide a kind of LED matrix, the fluorescent powder film of coated LED chip and the method for coating of fluorescent powder film, the fluorescent material thickness of chip surface is even, can obtain the emergent light of uniformity.
The present invention is achieved through the following technical solutions:
LED matrix, includes the LED chip of die bond and is mixed with the fluorescent powder film of fluorescent material; Wherein, described fluorescent powder film includes the convex shaped cavity holding described LED chip, in the front that described fluorescent powder film is coated on LED chip and side surface; LED chip is in described convex shaped cavity; Described fluorescent powder film is positioned at the periphery of convex shaped cavity, is provided with more than one breaking groove.
Described LED chip adopts upside-down mounting mode to install, and described LED chip is inverted pyramid structure.
The fluorescent powder film of coated above-mentioned LED chip, wherein, for a kind of heat-schrinkable film, in the raw material of described heat-schrinkable film, the fluorescent material of the perspex particle containing 70 ~ 90% (weight), 7 ~ 28% (weight) and the coupling agent of 0.5 ~ 2% (weight).
Described perspex particle adopts the wherein a kind of of PP, PE, PVC, TPR, TPE material.
The method for coating of above-mentioned fluorescent powder film, wherein, includes following procedure of processing:
Fluorescent material, perspex particle and coupling agent are mixed in proportion the rear employing hot calender method of forming and are rolled into flake by S1;
The plastic slice containing fluorescent material that S2 will be rolled into, carries out biaxial tension at a certain temperature and becomes heat-schrinkable film;
Described heat-schrinkable film heats by S3 at the same temperature again, and multiple convex shaped cavity for holding LED chip that stretches on described heat-schrinkable film, simultaneously at the multiple breaking groove of periphery stamping-out of described convex shaped cavity;
Die bond is fixed in positioning fixture to the LED chip on substrate by S4, cover described heat-schrinkable film on corresponding described LED chip, and guarantee that described LED chip is covered completely by convex shaped cavity, heat described LED chip, guarantee that described convex shaped cavity shrinks and is covered on the front of described LED chip and the surface of surrounding side.
Beneficial effect of the present invention is as follows:
LED matrix of the present invention, the fluorescent powder film of coated LED chip and the method for coating of fluorescent powder film, due to adopt there is heat-shrinkable the transparent fluorescent powder film front that is firmly attached to LED chip after the heating and side surface on, its implementation process is simple, the thickness of whole technical process phosphor powder layer and the controllability of shape high, have good uniformity, importantly after follow-up encapsulation, the ejecting white light of uniformity can be obtained.
Accompanying drawing explanation
Fig. 1 is the fluorescent powder film of LED matrix of the present invention and the structural representation of described LED chip fit-state;
Fig. 2 is the plan structure schematic diagram of the fluorescent powder film of LED matrix of the present invention;
Fig. 3 is the molding structure schematic diagram of the step S3 of the method for coating of fluorescent powder film of the present invention.
Description of reference numerals:
10, fluorescent powder film, 20, LED chip, 30, positioning fixture, 11, convex shaped cavity, 12, breaking groove, 31, directed pressing plate, 30, positioning fixture, 40, substrate, 51, stretching counterdie, 52, stretching patrix, 53, holding pad.
Embodiment
The invention discloses a kind of LED matrix, ask for an interview Fig. 1 to Fig. 3, include the LED chip 20 of die bond and be mixed with the fluorescent powder film 10 of fluorescent material; Wherein, described fluorescent powder film 10 includes the convex shaped cavity 11 holding described LED chip 20, in the front that described fluorescent powder film 10 is coated on LED chip 20 and side surface; LED chip 20 is positioned at described convex shaped cavity 11; Described fluorescent powder film 10 is positioned at the periphery of convex shaped cavity, is provided with more than one breaking groove 12.
Described LED chip 20 adopts upside-down mounting mode to install, and described LED chip 20 is inverted pyramid structure.
The invention also discloses a kind of fluorescent powder film 10 of coated above-mentioned LED chip 20, wherein, for a kind of heat-schrinkable film, in the raw material of described heat-schrinkable film, the fluorescent material of the perspex particle containing 70 ~ 90% (weight), 7 ~ 28% (weight) and the coupling agent of 0.5 ~ 2% (weight).
Described perspex particle adopts PP, PE, PVC, TPR, TPE material one wherein.
Fluorescent material used adopts YAG or silicate fluorescent powder, the silicate fluorescent powder that preferential employing heatproof is higher, badly causes YAG fluorescent powder to cross heat ageing to avoid heatproof in process in plasticizing and follow-up calendering and heating of the YAG of 127 DEG C and to dispel the heat after being combined with LED chip 20 and occurs decaying.The content of fluorescent material then determines the color of white light, therefore can according to different experimental datas and photochromic requirement, and selectively allotment fluorescent material content in the film, to produce different photochromic LED component.In the raw material of described heat-schrinkable film 70 ~ 90% perspex material, 7 ~ 28% is fluorescent material, and strengthens the adhesion of perspex material and fluorescent material and improve 0.5 ~ 2% coupling agent of decentralization of fluorescent material.
The method for coating of above-mentioned fluorescent powder film 10, wherein, includes following procedure of processing:
Fluorescent material, perspex particle and coupling agent are mixed in proportion the rear employing hot calender method of forming and are rolled into flake by S1;
The plastic slice containing fluorescent material that S2 will be rolled into, carries out biaxial tension at a certain temperature and becomes heat-schrinkable film;
Described heat-schrinkable film heats by S3 at the same temperature again, and multiple convex shaped cavity for holding LED chip that stretches on described heat-schrinkable film, simultaneously at the multiple breaking groove of periphery stamping-out of described convex shaped cavity;
Die bond is fixed in positioning fixture to the LED chip on substrate by S4, cover described heat-schrinkable film on corresponding described LED chip, and guarantee that described LED chip is covered completely by convex shaped cavity, heat described LED chip, guarantee that described convex shaped cavity shrinks and is covered on the front of described LED chip and the surface of surrounding side.
As shown in Figure 1,3, in the implementation method of step S2:
Owing to carrying out coated to the surrounding side of LED chip 20, therefore the general molding mode adopting biaxial tension, LED chip 20 can be coated on the surface with circumferentially shrinking to make fluorescent powder film.
Wherein: biaxial tension multiple is 3-4 times, and draft temperature carries out between polymer glass temperature and fusing point.And vitrification point peculiar as polymer institute be important parameter, be the intrinsic character of amorphous state macromolecular material, the draft temperature that therefore different plastic cement masterbatch adopts is slightly different.
In the implementation method of step S3:
As shown in Figure 3, described fluorescent powder film 10 is positioned at the upper surface of stretching counterdie 51 by holding pad 53, by adding hot-stretch counterdie 51 to the temperature required by step S2, then on stretching patrix 52, downward active force is applied, make the surface of fluorescent powder film 10 form multiple described convex shaped cavity 11 and breaking groove 12, the stretching height of described convex shaped cavity 11 and volume are greater than described LED chip 20.So that described LED chip 20 can be held completely by described convex shaped cavity 11, the regularity of distribution of described convex shaped cavity 11 on described fluorescent powder film 10 is identical with the queueing discipline of described LED chip 20, described breaking groove 12 for when the coated described LED chip 20 of described convex shaped cavity 11 and thermal contraction time, be convenient to the connecting band 13 that described convex shaped cavity 11 tears described breaking groove 12 periphery under the effect of thermal shrinkage force and be separated from described fluorescent powder film 10.
In the implementation method of step S4:
As shown in Figure 1, for guaranteeing that described fluorescent powder film 10 shrinks towards the direction at described LED chip 20 place when described LED chip 20 heats, but not contrary direction, a directed pressing plate 31 is provided with above described positioning fixture 30, the bottom of described directed pressing plate 31 is provided with the groove for holding described convex shaped cavity 11, and described convex shaped cavity 11 fits with the upper surface of described LED chip 20.
The contour structures of described LED chip 20 is inverted pyramid shape, and namely the peripheral side of described LED chip 20 slopes inwardly, so that after described fluorescent powder film 10 contraction, not easily come off from the surface of described LED chip 20.Simultaneously described LED chip 20 adopts the installation method of flip-chip, avoids the lead-in wire because positive cartridge chip uses and the laminating tightness that has influence between described fluorescent powder film 10 and described LED chip.Described fluorescent powder film 10 is after being heated, the described convex shaped cavity 11 of fitting with heating surface first shrinks at the upper surface of described LED chip 2, drive the surrounding side of LED chip 2 described in all side direction of described convex shaped cavity 11 draw close and fit simultaneously, be coated on the surface of the surrounding side of described LED chip 2 after being heated further, and the connecting band 13 of described breaking groove 12 periphery be connected with the circumference of described convex shaped cavity 11 is stretched to fracture under the effect of thermal shrinkage force, thus described convex shaped cavity 11 is separated from described fluorescent powder film 10, and be coated on the front of described LED chip 20 and the surface of surrounding side.
Above-mentioned listed specific implementation is nonrestrictive, and to one skilled in the art, not departing from the scope of the invention, the various modifications and variations of carrying out, all belong to protection scope of the present invention.
Claims (6)
1. the method for coating of fluorescent powder film, described fluorescent powder film includes and holds the convex shaped cavity of LED chip, in the front that described fluorescent powder film is coated on LED chip and side surface; LED chip is in described convex shaped cavity; The periphery being positioned at convex shaped cavity of described fluorescent powder film is provided with more than one breaking groove; It is characterized in that: include following procedure of processing:
Fluorescent material, perspex particle and coupling agent are mixed in proportion the rear employing hot calender method of forming and are rolled into flake by S1;
The plastic slice containing fluorescent material that S2 will be rolled into, carries out biaxial tension at a certain temperature and becomes heat-schrinkable film;
Described heat-schrinkable film heats by S3 at the same temperature again, and multiple convex shaped cavity for holding LED chip that stretches on described heat-schrinkable film, simultaneously at the multiple breaking groove of periphery stamping-out of described convex shaped cavity;
Die bond is fixed in positioning fixture to the LED chip on substrate by S4, cover described heat-schrinkable film on corresponding described LED chip, and guarantee that described LED chip is covered completely by convex shaped cavity, heat described LED chip, guarantee that described convex shaped cavity shrinks and is covered on the front of described LED chip and the surface of surrounding side.
2. the method for coating of fluorescent powder film, described fluorescent powder film includes and holds the convex shaped cavity of LED chip, in the front that described fluorescent powder film is coated on LED chip and side surface; LED chip is in described convex shaped cavity; The periphery being positioned at convex shaped cavity of described fluorescent powder film is provided with more than one breaking groove, and LED chip adopts upside-down mounting mode to install; It is characterized in that: include following procedure of processing:
Fluorescent material, perspex particle and coupling agent are mixed in proportion the rear employing hot calender method of forming and are rolled into flake by S1;
The plastic slice containing fluorescent material that S2 will be rolled into, carries out biaxial tension at a certain temperature and becomes heat-schrinkable film;
Described heat-schrinkable film heats by S3 at the same temperature again, and multiple convex shaped cavity for holding LED chip that stretches on described heat-schrinkable film, simultaneously at the multiple breaking groove of periphery stamping-out of described convex shaped cavity;
Die bond is fixed in positioning fixture to the LED chip on substrate by S4, cover described heat-schrinkable film on corresponding described LED chip, and guarantee that described LED chip is covered completely by convex shaped cavity, heat described LED chip, guarantee that described convex shaped cavity shrinks and is covered on the front of described LED chip and the surface of surrounding side.
3. the method for coating of fluorescent powder film, described fluorescent powder film includes and holds the convex shaped cavity of LED chip, in the front that described fluorescent powder film is coated on LED chip and side surface; LED chip is in described convex shaped cavity; The periphery being positioned at convex shaped cavity of described fluorescent powder film is provided with more than one breaking groove; Described LED chip is inverted pyramid structure; It is characterized in that: include following procedure of processing:
Fluorescent material, perspex particle and coupling agent are mixed in proportion the rear employing hot calender method of forming and are rolled into flake by S1;
The plastic slice containing fluorescent material that S2 will be rolled into, carries out biaxial tension at a certain temperature and becomes heat-schrinkable film;
Described heat-schrinkable film heats by S3 at the same temperature again, and multiple convex shaped cavity for holding LED chip that stretches on described heat-schrinkable film, simultaneously at the multiple breaking groove of periphery stamping-out of described convex shaped cavity;
Die bond is fixed in positioning fixture to the LED chip on substrate by S4, cover described heat-schrinkable film on corresponding described LED chip, and guarantee that described LED chip is covered completely by convex shaped cavity, heat described LED chip, guarantee that described convex shaped cavity shrinks and is covered on the front of described LED chip and the surface of surrounding side.
4. the method for coating of the fluorescent powder film as described in claim 1 or 2 or 3, is characterized in that: in the implementation method of step S2: biaxial tension multiple is 34 times, and draft temperature carries out between perspex particle vitrification point and fusing point.
5. the method for coating of the fluorescent powder film as described in claim 1 or 2 or 3, it is characterized in that: in the implementation method of step S3: the upper surface described fluorescent powder film (10) being positioned at stretching counterdie (51) by holding pad (53), by adding hot-stretch counterdie (51) to the temperature required by step S2, then at the active force that the upper applying of stretching patrix (52) is downward, the surface of fluorescent powder film (10) is made to form multiple described convex shaped cavity (11) and breaking groove (12), the stretching height of described convex shaped cavity (11) and volume are greater than described LED chip (20).
6. the method for coating of the fluorescent powder film as described in claim 1 or 2 or 3, it is characterized in that: in the implementation method of step (S4): be provided with a directed pressing plate (31) in the top of described positioning fixture (30), the bottom of described directed pressing plate (31) is provided with the groove for holding described convex shaped cavity (11), and described convex shaped cavity (11) fits with the upper surface of described LED chip (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210034623.1A CN103258941B (en) | 2012-02-16 | 2012-02-16 | LED matrix, the fluorescent powder film of coated LED chip and the method for coating of fluorescent powder film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210034623.1A CN103258941B (en) | 2012-02-16 | 2012-02-16 | LED matrix, the fluorescent powder film of coated LED chip and the method for coating of fluorescent powder film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103258941A CN103258941A (en) | 2013-08-21 |
| CN103258941B true CN103258941B (en) | 2015-12-16 |
Family
ID=48962753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210034623.1A Expired - Fee Related CN103258941B (en) | 2012-02-16 | 2012-02-16 | LED matrix, the fluorescent powder film of coated LED chip and the method for coating of fluorescent powder film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103258941B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928451A (en) * | 2014-04-25 | 2014-07-16 | 南京琦光光电科技有限公司 | White-light LED light source module based on low luminance decrease and high color rendering index of purple light chip |
| CN107591470B (en) * | 2017-08-16 | 2019-06-21 | 佛山市顺德区蚬华多媒体制品有限公司 | A method of for precisely fixing LED chip |
| JP2023121619A (en) * | 2022-02-21 | 2023-08-31 | スタンレー電気株式会社 | semiconductor light emitting device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1900186A (en) * | 2006-07-27 | 2007-01-24 | 王晖 | Water soluble fluorescent powder coating glue and use |
| CN101609863A (en) * | 2008-06-16 | 2009-12-23 | 启萌科技有限公司 | Fluorescent film |
| EP2175695A1 (en) * | 2008-10-13 | 2010-04-14 | Michel Tramontana | Electroluminescent layer configuration and method for production thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002329896A (en) * | 2001-05-02 | 2002-11-15 | Kansai Tlo Kk | Led surface light emission device |
| KR20050034936A (en) * | 2003-10-10 | 2005-04-15 | 삼성전기주식회사 | Wavelength - converted light emitting diode package using phosphor and manufacturing method |
-
2012
- 2012-02-16 CN CN201210034623.1A patent/CN103258941B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1900186A (en) * | 2006-07-27 | 2007-01-24 | 王晖 | Water soluble fluorescent powder coating glue and use |
| CN101609863A (en) * | 2008-06-16 | 2009-12-23 | 启萌科技有限公司 | Fluorescent film |
| EP2175695A1 (en) * | 2008-10-13 | 2010-04-14 | Michel Tramontana | Electroluminescent layer configuration and method for production thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103258941A (en) | 2013-08-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101826590B (en) | LED lamp with lens injected with fluorescent glue and packaging method thereof | |
| CN109471298A (en) | A kind of miniature LED LCD backlight structure and preparation method thereof based on quantum dot | |
| CN103258941B (en) | LED matrix, the fluorescent powder film of coated LED chip and the method for coating of fluorescent powder film | |
| CN201638850U (en) | LED lamp with lens filled with fluorescent glue | |
| CN108109993A (en) | A kind of manufacturing method of CSP | |
| CN102931328B (en) | A kind of preparation method of LED packaging body | |
| US9281455B2 (en) | LED packaging structure having concave lens structure at light-emitting side of LED chip | |
| CN102120213B (en) | LED fluorescent powder spraying process | |
| CN103022326B (en) | Intensive packaging method of LEDs | |
| CN105449083B (en) | A kind of method of LED fluorescent powder glue coating | |
| CN204178089U (en) | A kind of LED backlight and LED backlight module of exempting from secondary lens | |
| CN110098350A (en) | Display panel, packaging system and packaging method | |
| CN100514683C (en) | Technological process of LED fluorescent powder coating | |
| EP3340321B1 (en) | Process method using deformable organic silicone resin photoconverter to bond-package led | |
| CN105322071B (en) | A kind of chip-scale white light LEDs and preparation method thereof | |
| CN203950801U (en) | A kind of backlight module and paster type encapsulation LED | |
| CN110970573A (en) | Panel and packaging method thereof | |
| CN204144309U (en) | A kind of chip-scale white light LEDs | |
| CN201638852U (en) | Fluorescent glue injection-supporting lens | |
| CN104009145A (en) | Backlight module, surface-mounted LED and packaging technology of surface-mounted LED | |
| CN110246935B (en) | L ED packaging method | |
| CN103756615B (en) | Polyolefin polymer modified binder material for organic electroluminescent device | |
| CN112885818A (en) | Novel Mini LED packaging process | |
| CN104004126A (en) | Preparation method of organic fluorescent luminous film | |
| CN203377263U (en) | Fluorescent glue sheet LED |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190917 Address after: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee after: ELEC-TECH INTERNATIONAL CO.,LTD. Address before: Xiangzhou District of Guangdong city in Zhuhai province 519000 tangjiewan Jinfeng Road, No. 1 Patentee before: ELEC-TECH INTERNATIONAL Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee after: Zhuhai Leishi Lighting Co.,Ltd. Address before: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee before: ELEC-TECH INTERNATIONAL Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151216 Termination date: 20220216 |