CN105728929A - Nanometer diffusion bonding method for Cu and CuCrZr alloy - Google Patents
Nanometer diffusion bonding method for Cu and CuCrZr alloy Download PDFInfo
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- CN105728929A CN105728929A CN201610252059.9A CN201610252059A CN105728929A CN 105728929 A CN105728929 A CN 105728929A CN 201610252059 A CN201610252059 A CN 201610252059A CN 105728929 A CN105728929 A CN 105728929A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/001—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by extrusion or drawing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C17/00—Disintegrating by tumbling mills, i.e. mills having a container charged with the material to be disintegrated with or without special disintegrating members such as pebbles or balls
- B02C17/10—Disintegrating by tumbling mills, i.e. mills having a container charged with the material to be disintegrated with or without special disintegrating members such as pebbles or balls with one or a few disintegrating members arranged in the container
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/24—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Food Science & Technology (AREA)
- Powder Metallurgy (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention relates to the field of metal bonding and the field of powder metallurgy, in particular to a nanometer diffusion bonding method for Cu and a CuCrZr alloy. The method comprises the steps that Cu-Mn alloy powder being 20-50 micrometers is prepared through a mechanical alloying method; the Cu-Mn alloy powder is deposited on the to-be-bonded face of a base material of the Cu and the CuCrZr alloy through a coating method or a spreading method; and diffusion bonding of the Cu and the CuCrZr alloy is carried out with the Cu-Mn alloy powder as an interlayer. According to the nanometer diffusion bonding method for the Cu and the CuCrZr alloy, the Cu-Mn alloy powder is nanometer alloy powder, and when the Cu-Mn alloy powder is used as powder of the interlayer for diffusion bonding, the temperature needed for bonding can be further reduced, and the diffusion bonding rate can be increased; and the Cu-Mn interlayer is added, the bonding process is adjusted, and therefore nanometer diffusion bonding of the Cu and the CuCrZr alloy can be achieved at a low temperature, damage of high temperature to the performance of the CuCrZr alloy is reduced, subsequent heat treatment processes are omitted, and the production cost is reduced.
Description
Technical field
The present invention relates to metal connection area and field of powder metallurgy, receiving of specially Cu and CuCrZr alloy
Rice diffusion connection method.
Background technology
CuCrZr alloy, owing to having good thermal conductivity, elevated temperature strength, the ability of radioresistance injury reinforcing, is core
Heat sink material important in fusion reactor device；Tungsten (W) has the tritium that fusing point is high, thermal shock resistance is good, low
The features such as anelasticity, are important facing plasma material.Realize being reliably connected of W with CuCrZr alloy
It is to prepare the key link towards plasma source components (PFC).But when W and CuCrZr is directly connected to, by
Relatively big in the difference of both thermal coefficient of expansions, big thermal stress can be produced, thus cause the generation of crackle, cause
Connecting elements lost efficacy.Use soft Cu as slow suitable layer, it is possible to be effectively improved the connection row of W Yu CuCrZr
For.First pass through the connection realizing W Yu Cu at a higher temperature, then by realizing Cu and CuCrZr
Metallurgical junction incompatible acquisition W Yu the CuCrZr alloy link block that alloy is good.
When using at present the connection that the techniques such as general melting welding, soldering carry out Cu Yu CuCrZr, connection temperature
Too high, the crystal grain being easily caused CuCrZr alloy is grown up, secondary phase particle accumulation is grown up so that CuCrZr
The hardness of alloy and intensity reduce, it is difficult to meet the PFC engine request to heat sink material.And connect temperature mistake
Height, the defect such as material easily cracks, deformation, and then reduce the intensity of connector.Diffusion connection is a kind of
Solid-phase welding means, connect temperature relatively low (generally 0.5～0.8 times of mother metal fusing point), it is possible to be prevented effectively from height
The temperature damage to mother metal performance.But Cu with CuCrZr directly spreads when being connected, required connection temperature is high,
And the intensity of fine copper is low, Cu/CuCrZr bonding strength can be weakened, be not suitable for large-scale application and height aborning
The occasion of requirement of strength.
Summary of the invention
For above-mentioned technical problem, the present invention provides the nanodiffusion connection side of a kind of Cu and CuCrZr alloy
Method, solves the low temperature of Cu and CuCrZr alloy, high efficiency, high intensity connectivity problem, and the present invention uses machine
Tool alloying prepares high-activity nano Cu-Mn alloy powder, utilizes nanodiffusion interconnection technique real at low temperatures
Show the good metallurgical binding of Cu and CuCrZr alloy and high bond strength.
For reaching above-mentioned purpose, scheme of the present invention is:
The nanodiffusion method of attachment of Cu and CuCrZr alloy, comprises the following steps:
(1) mechanical alloying method is used to prepare the Cu-Mn alloy powder of 20～50 μm；
(2) cladding process or method of sprawling is used to deposit on to be connected of mother metal Cu and CuCrZr alloy
Cu-Mn alloy powder；
(3) face to be connected of mother metal Cu and CuCrZr alloy is carried out mechanical grinding, remove surface film oxide；
Mother metal is put in acetone and dehydrated alcohol, carry out ultrasonic cleaning；Utilize pressurization Diffusion bonding techniques, with Cu-Mn
Alloy powder is the diffusion connection that intermediate layer carries out Cu and CuCrZr alloy.Diffusion connects pressure
5～50MPa, connecting temperature is 550 DEG C～850 DEG C, and temperature retention time is 1h～5h, it is thus achieved that Cu/CuCrZr even
Relay part.After Cu/CuCrZr connection member is carried out line cutting, carry out room temperature tensile, and linkage interface is entered
Row SEM and EDS detects.
Wherein, Cu-Mn alloy powder, by following raw material by weight: Cu powder 50～80 parts,
Mn powder 20～50 parts.
After Cu powder and the mixing of Mn powder, using argon is that protective gas carries out high-energy ball milling, and ratio of grinding media to material is 5～10:1,
Rotating speed is 300-500r/min, and Ball-milling Time is 10-60 hour；After ball milling, powder slurries is placed in vacuum and does
In dry case, in 40 DEG C of dry 20h；Dried powder is sieved through 80 mesh sieve, collects standby.
The nanodiffusion method of attachment of Cu and the CuCrZr alloy that the present invention provides, Cu-Mn alloy powder is
Alloy nano-powder, has fine size, activity is high, diffusivity is a strong feature, and it is used as intermediate layer powder
The temperature required for connection can be reduced when diffusion connects further and improve diffusion connection speed, by adding
Cu-Mn intermediate layer, regulation Joining Technology, can realize Cu and CuCrZr alloy at a lower temperature
Nanodiffusion connects, and decreases high temperature to the infringement of CuCrZr alloy property and follow-up Technology for Heating Processing,
Reduce the cost of production；The final tensile strength of sample that connects is up to more than 200MPa, and linkage interface atresia
The defect such as gap, crackle.
Detailed description of the invention
It is described in conjunction with the embodiments the detailed description of the invention of the present invention.
Embodiment 1
(1) by quality Cu powder 80g, Mn powder 20g proportioning powder, its milling parameters is as follows:
Powder after high-energy ball milling is vacuum dried, is intermediate layer alloy powder；
(2) face to be connected of mother metal Cu and CuCrZr alloy is carried out mechanical grinding, removes surface film oxide,
Make mother metal surface to be connected the most smooth.Sample is put in acetone and dehydrated alcohol subsequently, carry out ultrasonic
Clean, dry up standby.
(3) by dried for ball milling Cu-Mn alloy powder and dehydrated alcohol according to mass ratio 20:1 wiring solution-forming,
Ultrasonic agitation 2min in ultrasonic cleaning instrument, is allowed to the slip that is uniformly dispersed, and the slip configured is used coating skill
Art uniform deposition is in Cu and CuCrZr alloy.
(4) Cu with CuCrZr alloy is placed in pressurization to be connected in stove, in 30MPa, 800 DEG C of companies of being diffused
Connecing, temperature retention time is 3h, may finally obtain hot strength be 220MPa, linkage interface pore-free and crackle
Cu/CuCrZr connect sample.
Embodiment 2
(1) by quality Cu powder 67g, Mn powder 33g proportioning powder, its milling parameters is as follows:
Powder after high-energy ball milling is vacuum dried, is Cu-Mn alloy powder；
(2) face to be connected of mother metal Cu and CuCrZr alloy is carried out mechanical grinding, removes surface film oxide,
Make mother metal surface to be connected the most smooth.Sample is put in acetone and dehydrated alcohol subsequently, carry out ultrasonic
Clean, dry up standby.
(3) by dried for ball milling Cu-Mn alloy powder and dehydrated alcohol according to mass ratio 20:1 wiring solution-forming,
Ultrasonic agitation 2min in ultrasonic cleaning instrument, is allowed to the slip that is uniformly dispersed, and the slip configured is used coating skill
Art uniform deposition is in Cu and CuCrZr alloy.
(4) Cu with CuCrZr alloy is placed in pressurization to be connected in stove, in 30MPa, 800 DEG C of companies of being diffused
Connecing, temperature retention time is 1h, may finally obtain hot strength be 220MPa, linkage interface pore-free and crackle
Cu/CuCrZr connect sample.
Embodiment 3
(1) by quality Cu powder 50g, Mn powder 50g proportioning powder, its milling parameters is as follows:
Powder after high-energy ball milling is vacuum dried, is Cu-Mn alloy powder；
(2) face to be connected of mother metal Cu and CuCrZr alloy is carried out mechanical grinding, removes surface film oxide,
Make surface to be connected the most smooth.Sample is put in acetone and dehydrated alcohol subsequently, carries out ultrasonic cleaning,
Dry up standby.
(3) by Cu-Mn alloy powder good for ball milling and dehydrated alcohol according to mass ratio 20:1 wiring solution-forming,
Ultrasonic agitation 3min in ultrasonic cleaning instrument, is allowed to the slip that is uniformly dispersed, and the slip configured is used paint-on technique
Uniform deposition is in Cu and CuCrZr alloy.
(4) Cu with CuCrZr alloy is placed in pressurization to be connected in stove, in 30MPa, 800 DEG C of companies of being diffused
Connecing, temperature retention time is 4h, it is thus achieved that hot strength is the connection sample of 200MPa.
Embodiment 4
(1) by quality Cu powder 67g, Mn powder 33g proportioning powder, its milling parameters is as follows:
Powder after high-energy ball milling is vacuum dried, is Cu-Mn alloy powder；
(2) face to be connected of mother metal Cu and CuCrZr alloy is carried out mechanical grinding, removes surface film oxide,
Make surface the most smooth.Sample is put in acetone and dehydrated alcohol subsequently, carry out ultrasonic cleaning, dry up standby
With.
(3) by Cu-Mn alloy powder good for ball milling and dehydrated alcohol according to mass ratio 20:1 wiring solution-forming,
Ultrasonic agitation 3min in ultrasonic cleaning instrument, is allowed to the slip that is uniformly dispersed, and the slip configured is used paint-on technique
Uniform deposition is in Cu and CuCrZr alloy.
(4) Cu with CuCrZr alloy is placed in pressurization to be connected in stove, in 10MPa, 650 DEG C of companies of being diffused
Connecing, temperature retention time is 4h, it is thus achieved that hot strength is the connection sample of 200MPa.
Embodiment 5
(1) by quality Cu powder 67g, Mn powder 33g proportioning powder, its milling parameters is as follows:
Powder after high-energy ball milling is vacuum dried, is Cu-Mn alloy powder；
(2) face to be connected of mother metal Cu and CuCrZr alloy is carried out mechanical grinding, removes surface film oxide,
Make surface the most smooth.Sample is put in acetone and dehydrated alcohol subsequently, carry out ultrasonic cleaning, dry up standby
With.
(3) by Cu-Mn alloy powder good for ball milling and dehydrated alcohol according to mass ratio 20:1 wiring solution-forming,
Ultrasonic agitation 3min in ultrasonic cleaning instrument, is allowed to the slip that is uniformly dispersed, and the slip configured is used paint-on technique
Uniform deposition is in Cu and CuCrZr alloy.
(4) Cu with CuCrZr alloy is placed in pressurization to be connected in stove, in 40MPa, 850 DEG C of companies of being diffused
Connecing, temperature retention time is 3h, it is thus achieved that hot strength is the connection sample of 200MPa.
Embodiment 6
(1) by quality Cu powder 67g, Mn powder 33g proportioning powder, its milling parameters is as follows:
Powder after high-energy ball milling is vacuum dried, is Cu-Mn alloy powder；
(2) face to be connected of mother metal Cu and CuCrZr alloy is carried out mechanical grinding, removes surface film oxide,
Make surface the most smooth.Sample is put in acetone and dehydrated alcohol subsequently, carry out ultrasonic cleaning, dry up standby
With.
(3) by Cu-Mn alloy powder good for ball milling and dehydrated alcohol according to mass ratio 20:1 wiring solution-forming,
Ultrasonic agitation 3min in ultrasonic cleaning instrument, is allowed to the slip that is uniformly dispersed, and is used by the slip configured and sprawls technology
Uniform deposition is in Cu and CuCrZr alloy.
(4) Cu with CuCrZr alloy is placed in pressurization to be connected in stove, in 10MPa, 750 DEG C of companies of being diffused
Connecing, temperature retention time is 2h, it is thus achieved that hot strength is the connection sample of 200MPa.
Embodiment 7
(1) by quality Cu powder 67g, Mn powder 33g proportioning powder, its milling parameters is as follows:
Powder after high-energy ball milling is vacuum dried, is intermediate layer alloy powder；
(2) face to be connected of mother metal Cu and CuCrZr alloy is carried out mechanical grinding, removes surface film oxide,
Make surface the most smooth.Sample is put in acetone and dehydrated alcohol subsequently, carry out ultrasonic cleaning, dry up standby
With.
(3) by Cu-Mn alloy powder good for ball milling and dehydrated alcohol according to mass ratio 20:1 wiring solution-forming,
Ultrasonic agitation 3min in ultrasonic cleaning instrument, is allowed to the slip that is uniformly dispersed, and is used by the slip configured and sprawls technology
Uniform deposition is in Cu and CuCrZr alloy.
(4) Cu with CuCrZr alloy is placed in pressurization to be connected in stove, in 40MPa, 550 DEG C of companies of being diffused
Connecing, temperature retention time is 3h, it is thus achieved that hot strength is the connection sample of 200MPa.
Embodiment 8
(1) by quality Cu powder 67g, Mn powder 33g proportioning powder, its milling parameters is as follows:
Powder after high-energy ball milling is vacuum dried, is intermediate layer alloy powder；
(2) face to be connected of mother metal Cu and CuCrZr alloy is carried out mechanical grinding, removes surface film oxide,
Make surface the most smooth.Sample is put in acetone and dehydrated alcohol subsequently, carry out ultrasonic cleaning, dry up standby
With.
(3) by Cu-Mn alloy powder good for ball milling and dehydrated alcohol according to mass ratio 20:1 wiring solution-forming,
Ultrasonic agitation 3min in ultrasonic cleaning instrument, is allowed to the slip that is uniformly dispersed, and is used by the slip configured and sprawls technology
Uniform deposition is in Cu and CuCrZr alloy.
(4) Cu with CuCrZr alloy is placed in pressurization is connected in stove, 5MPa, 850 DEG C be diffused connection,
Temperature retention time is 1h, it is thus achieved that hot strength is the connection sample of 200MPa.
Claims (4)
- The nanodiffusion method of attachment of 1.Cu and CuCrZr alloy, it is characterised in that comprise the following steps:(1) mechanical alloying method is used to prepare the Cu-Mn alloy powder of 20～50 μm；(2) cladding process or method of sprawling is used to deposit on to be connected of mother metal Cu and CuCrZr alloy Cu-Mn alloy powder；(3) face to be connected of mother metal Cu and CuCrZr alloy is carried out mechanical grinding, remove surface film oxide； Mother metal is put in acetone and dehydrated alcohol, carry out ultrasonic cleaning；Utilize pressurization Diffusion bonding techniques, with Cu-Mn Alloy powder is the diffusion connection that intermediate layer carries out Cu and CuCrZr alloy.
- The nanodiffusion method of attachment of Cu and the CuCrZr alloy described in 1 the most as requested, it is characterised in that: Described Cu-Mn alloy powder, by following raw material by weight: Cu powder 50～80 parts, Mn Powder 20～50 parts.
- The nanodiffusion method of attachment of Cu and the CuCrZr alloy described in 2 the most as requested, it is characterised in that: After described Cu powder and the mixing of Mn powder, using argon is that protective gas carries out high-energy ball milling, and ratio of grinding media to material is 5～10:1, rotating speed is 300-500r/min, and Ball-milling Time is 10-60 hour；After ball milling, powder slurries is put In vacuum drying oven, in 40 DEG C of dry 20h；Dried powder is sieved through 80 mesh sieve, collects Standby.
- The nanodiffusion method of attachment of Cu and the CuCrZr alloy described in 1 to 3 any one the most as requested, its Being characterised by: it is 5～50MPa that the diffusion described in step (3) connects pressure, connecting temperature is 550 DEG C～850 DEG C, Temperature retention time is 1h～5h.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109175382A (en) * | 2018-08-16 | 2019-01-11 | 西安理工大学 | A kind of preparation method of CuCrZr-W bimetallic material |
| CN110306137A (en) * | 2019-06-28 | 2019-10-08 | 南京理工大学 | A kind of preparation method of stratiform copper chromium zirconium-fine copper composite board |
| CN110576252A (en) * | 2019-04-13 | 2019-12-17 | 天津大学 | Oxygen-free copper and chromium zirconium copper medium and low temperature direct diffusion connection method |
| CN114807795A (en) * | 2022-04-29 | 2022-07-29 | 中南大学 | Method for improving performance of brazed chromium-zirconium-copper alloy and chromium-zirconium-copper alloy workpiece |
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| CN1339613A (en) * | 2000-08-23 | 2002-03-13 | 中国科学院金属研究所 | Technological process for producing chromium-zirconium-copper rod material containing oxide dispersed and reinforced copper |
| CN101704160A (en) * | 2009-12-03 | 2010-05-12 | 西安交通大学 | Heterogeneous metal connecting method for tungsten, copper and alloy thereof |
| CN102626820A (en) * | 2012-04-17 | 2012-08-08 | 北京科技大学 | Method for vacuum hot-pressing welding of tungsten-diamond/copper-chromium zirconium copper |
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| JPS617062A (en) * | 1984-06-20 | 1986-01-13 | Sanyo Electric Co Ltd | Production of composite metallic plate |
| CN1030715A (en) * | 1987-07-23 | 1989-02-01 | 国营国光电子管总厂 | Contact-welding technology |
| CN1339613A (en) * | 2000-08-23 | 2002-03-13 | 中国科学院金属研究所 | Technological process for producing chromium-zirconium-copper rod material containing oxide dispersed and reinforced copper |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109175382A (en) * | 2018-08-16 | 2019-01-11 | 西安理工大学 | A kind of preparation method of CuCrZr-W bimetallic material |
| CN110576252A (en) * | 2019-04-13 | 2019-12-17 | 天津大学 | Oxygen-free copper and chromium zirconium copper medium and low temperature direct diffusion connection method |
| CN110306137A (en) * | 2019-06-28 | 2019-10-08 | 南京理工大学 | A kind of preparation method of stratiform copper chromium zirconium-fine copper composite board |
| CN114807795A (en) * | 2022-04-29 | 2022-07-29 | 中南大学 | Method for improving performance of brazed chromium-zirconium-copper alloy and chromium-zirconium-copper alloy workpiece |
| CN114807795B (en) * | 2022-04-29 | 2023-02-28 | 中南大学 | Method for improving performance of brazed chromium-zirconium-copper alloy and chromium-zirconium-copper alloy workpiece |
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| CN105728929B (en) | 2018-07-24 |
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Granted publication date: 20180724 Termination date: 20200421 |