CN105568047B - High strength and high flexibility high-conductivity copper alloy - Google Patents
High strength and high flexibility high-conductivity copper alloy Download PDFInfo
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Abstract
The chemical composition of high strength and high flexibility high-conductivity copper alloy disclosed by the invention includes：Cr：0.005wt%~2.0wt%, Zr：0.001wt%~0.5wt%, Ni：2.5wt%~5.0wt%, Co：0.1wt%~1.0wt%, Si：0.4wt%~1.6wt%, Mg：0.01wt%~0.2wt%, surplus is Cu.The superpower high-elastic high-conductivity copper alloy of the present invention, using copper, chromium, zirconium, nickel, cobalt, silicon, magnesium, titanium, lanthanum, cerium as major components, its yield strength reaches more than 50%IACS up to more than 800MPa, modulus of elasticity up to more than 130GPa, conductance, its combination property and environmental-protecting performance are superior to the common used material for being currently used for manufacturing electronic connector and lead frame, are the ideal materials for manufacturing electronic connector and lead frame.The present invention provides a kind of yield strength height, the copper alloy that modulus of elasticity is big, electric conductivity is excellent for the electronic connector and lead frame needed for the miniaturization, lighting, Highgrade integration of electronics and communication apparatus.
Description
Technical field
The present invention relates to high strength and high flexibility high-conductivity copper alloy field, and in particular to one kind has excellent yield strength, highly conductive
Rate and elastomeric copper alloy, its strip product are mainly used in electronic connector, lead frame etc..
Background technology
Electronic connector is also known as electric power connector, is widely used in electronics industry, and its function is by two on a loop
Individual conductor is linked up, and electric current or signal is flowed to another conductor from a conductor.Electronic connector widely should
For in various electric wirings, playing a part of connection or turn-off current or signal.This connection is probably temporary transient and conveniently
Plug at any time, it is also possible to permanent connection node between electrical equipment or wire, electronic connector can as between circuit, group
Electrical/electronic transmits connection member between part, between system, and the circulation for enabling power, signal, electric current reliable and stable facilitates product again
Assembling, maintenance, replacing.Such as：Power plug/socket, IC runners, telephone line plug etc. come under electronic connector.
With developing rapidly for electron and information technology, electronics and communication apparatus are to miniaturization, Highgrade integration, lighting
Direction is developed, the inner space of electronics and communication apparatus is less and less, integration degree more and more higher, cooling requirements increasingly
It is high.Therefore, its used electronic connector is sent out to small size, lightweight, many pins, highly conductive (>=50%IACS) performance direction
Exhibition.The miniaturization of electronic connector, lighting, many pins, high conduction performance are that copper is closed to the basic material of electronic connector
The thickness of gold ribbon material proposes higher and higher requirement with combination property, while copper alloy band slimming is met, surrender
Intensity reaches that more than 800MPa, conductance reach that more than 50%IACS, elastic performance reach more than 130GPa, so as to meet electronics
With communication apparatus, the miniaturization of lead frame, lighting and ensuring that its stable does not fail.
Known electronic connector common used material based on Cu-Ni-Si series copper alloys, the common trade mark be C70250 and
C70350.By taking C70250 as an example, composition：Ni：2.2-4.2wt%, Si：0.25-1.2wt%, Mg：0.05-0.3wt%, surplus
For Cu.The yield strength of its band aging state (TM00 states) only has 450MPa to 620MPa, and conductance only has 40%IACS.Because bending
Take intensity and conductance is relatively low, it is impossible to meet small-sized, frivolous, the high performance requirement of Current electronic connector and lead frame.
The electronic connector material that another known American Standard trade mark is C70350, composition is Ni：1.0-2.5wt%, Si：
0.5-1.2wt%, Co：1.0-2.0wt%, surplus is Cu.Its band TM02 states (carry out cold rolling processing hard again after Ageing Treatment
Change) conductance be more than 50%IACS, but its yield strength be 675MPa to 780MPa.Yield strength and conductance with
C70250 is compared and increased, but still does not reach the combination property requirement of current electronic connector and lead frame.
The another kind of known copper alloy for electronic connector is Cu-Be series alloys, by taking C17460 as an example, composition：
Be：0.15-0.5wt%, Ni：1.0-1.4wt%, remaining is Cu.Yield strength >=810MPa of its strip, modulus of elasticity >=
138GPa, conductance >=50%IACS, although its performance meets the requirement of Current electronic connector, but beallon contains beryllium,
During the manufacturing strong influence can be produced to the life and health of environment and people.
Another known lead frame common used material is CuCrZr alloys, and its American Standard trade mark is C18150, and composition is Cr
0.5wt%-1.5wt%, Zr 0.02wt%-0.20wt%, surplus are Cu.The performance of C18150 alloy aging states is：Tension is strong
Spend 550MPa-600MPa, yield strength 500MPa-550MPa, conductance 80%IACS-90%IACS.Although CuCrZr alloys
Conductance up to more than 80%IACS, but its yield strength is less than 600MPa, it is impossible to meets the electronics that develops rapidly and patches
Part and performance requirement of the lead frame to copper alloy band.
The copper alloy of the present invention is that the elements such as Cr, Zr, Ni, Co, Si, Mg, Ti are added in copper, and passes through solid solution, timeliness
Processing, realizes CrxZry、NixSiy、CoxSiyEach phase coordinated, to reach high yield strength (more than 800MPa), high lead
Electric rate (more than 50%IACS), high elastic performance (more than 130GPa), so that meeting Current electronic patches device and lead frame
Requirement of the lightweight, miniaturization, slimming of frame to the combination property of copper alloy band.
The content of the invention
The technical problems to be solved by the invention are that patch device, connector, lead frame for Current electronic closes to copper
The requirement of the combination property of gold, adds the elements such as Cr, Zr, Ni, Si, Co, Mg, Ti in copper, and by solid solution, Ageing Treatment,
Realize CrxZry、NixSiy、CoxSiyEach phase cooperative reinforcing realizes that high surrender is strong there is provided a kind of high strength and high flexibility high-conductivity copper alloy
The performance requirements such as degree, high conductivity, high resiliency.
The present invention solve the technical scheme that is used of above-mentioned technical problem for：High strength and high flexibility high-conductivity copper alloy, the alloy
Chemical composition includes：Cr：0.005wt%~2.0wt%, Zr：0.001wt%~0.5wt%, Ni：2.5wt%~5.0wt%,
Co：0.1wt%~1.0wt%, Si：0.4wt%~1.6wt%, Mg：0.01wt%~0.2wt%, surplus is Cu.
Cr, Zr are dissolved in by solid solution and Quenching Treatment forms supersaturated solid solution in Copper substrate, then pass through two-stage time effect
Processing separates out CrxZryIntermetallic compound, the intermetallic compound of precipitation plays dispersion-strengthened action, is closed so as to improve copper of the present invention
The yield strength of gold, modulus of elasticity, and because Cr and Zr atoms are separated out from Copper substrate, Cr, Zr solute atoms in Copper substrate
It is greatly reduced, so that the conductance of Copper substrate is improved.In addition, the Cr for not forming intermetallic compound is analysed by timeliness
Alloy strength can also be strengthened and improve by going out.When Cr contents are less than 0.005wt%, it is impossible to form enough CrxZryPhase, to improving
The yield strength of copper alloy is not helped with modulus of elasticity；And Cr contents are when being more than 2.0wt%, the thick Cr particles of precipitation will drop
The electric conductivity of dilute copper alloy, and the thick Cr phases pockety formed, can cause following process to crack
Tendency, is unfavorable for the shaping of alloy sheet strip.Therefore the controlled quentity controlled variable of chromium of the present invention is 0.005~2.0wt%.
Zr with Cr except forming CrxZryIntermetallic compound is improved outside the intensity of copper alloy, and Zr simple substance can also pass through timeliness
Separate out the intensity for improving alloy.When Zr contents are less than 0.001wt%, the Cr of formationxZryIntermetallic compound quantity is inadequate, it is impossible to
With NixSiyWith CoxSiyIntermetallic compound plays cooperative reinforcing；When Zr contents are more than 0.5wt%, the Zr of Precipitation
Simple substance can reduce the rolling machine-shaping property of copper alloy plate strip.In order to obtain yield strength, conductance and rolling machine-shaping
Optimal equalization, the content of zirconium controlled in 0.001~0.5wt%.
Ni, Co and Si atom are dissolved in by solid solution and Quenching Treatment in the present invention forms supersaturated solid solution in Copper substrate,
Then handled by two-stage time effect and separate out NixSiyWith CoxSiyIntermetallic compound, the intermetallic compound disperse of precipitation is strong
Change is acted on, so that the yield strength of copper alloy of the present invention, modulus of elasticity are improved, and because Ni, Co and Si atom are from Copper substrate
Separate out, Ni, Co and Si solute atoms in Copper substrate are greatly reduced, so that the conductance of Copper substrate is improved.As Ni, Co
With the contents of Si atoms it is less when (Ni contents are less than 0.4wt% less than 2.5wt%, Co content less than 0.1wt%, Si content),
The Ni separated out in copper alloyxSiyWith CoxSiyIntermetallic compound is less, the DeGrain of dispersion-strengtherning, the surrender of copper alloy
Intensity is less than 130GPa less than 800MPa, modulus of elasticity.And when the content of Ni, Co and Si atom is more, (Ni contents are more than
5.0wt%, Co content are less than 1.6wt% less than 1.0wt%, Si content), the dispersion-strengtherning of precipitation is mutually too many, second phase particles
Scattering process enhancing to electron waves, causes the conductance of copper alloy to decline and (be less than 50%IACS).Ni, Co and Si composition exist
It is optimal in the range of Ni 2.5wt%~5.0wt%, Co 0.1wt%~1.0wt%, Si 0.4wt%~1.6wt%.
Mg effect is mainly the deoxidation in fusion process, it is ensured that Cr, Zr, Ni, Co, Si, Ti are free of in copper alloy casting ingot
Oxide, Cr, Zr, Ni, Co, Si, Ti is sufficiently formed CrxZry、NixSiy、CoxSiyWith CuxTiyIntermetallic compound,
Dispersion-strengtherning phase CrxZry、NixSiy、CoxSiyCollaboration dispersion-strengthened action and CuxTiySupplement invigoration effect ensure copper alloy
Yield strength and modulus of elasticity be respectively higher than 800MPa and 130GPa.When Mg contents are less than 0.01wt%, it is impossible to rise abundant
The effect of deoxidation, yield strength and the modulus of elasticity of copper alloy can be reduced；When Mg contents are higher than 0.2wt%, due to unnecessary
Mg is solid-solubilized in Copper substrate, can reduce the electric conductivity of copper alloy.
The chemical composition of the high strength and high flexibility high-conductivity copper alloy also includes La：0.001wt%~0.1wt%, Ce：
0.001wt%~0.1wt%.
La and Ce elements mainly play a part of to purify copper alloy matrix.The copper alloy of the present invention, belongs to a kind of and contains a variety of members
The polynary complicated copper alloy of element, it is remaining solid when Cr, Zr, Ni, Co, Si, Mg element are not separated out completely in ag(e)ing process
The atom being dissolved in Copper substrate can be with La, Ce atom formation LaxNiy、CexNiy、CoxLay、CexCoy、MgxLay、MgxCeyDeng gold
Compound or Cr simple substance are separated out between category, so that scattering process of the foreign atom to electron waves in Copper substrate is reduced, so that it is guaranteed that copper
The electric conductivity of matrix reaches more than 50%IACS.When La, Ce content are less than 0.001wt%, the purification to Copper substrate is imitated
Fruit is not obvious, when its content is higher than 0.1wt%, and excessive La and Ce can scattered electron ripples, the conductance of reduction copper alloy.La
Optimum content scope with Ce is 0.001%~0.1wt%.
The chemical composition of the high strength and high flexibility high-conductivity copper alloy also includes Ti：0.005wt%~0.1wt%.
Ti atoms are dissolved in by solid solution and Quenching Treatment in the present invention forms supersaturated solid solution in Copper substrate, then pass through
Two-stage time effect processing separates out CuxTiyIntermetallic compound, the intermetallic compound Cu of precipitationxTiyTo CrxZry、NixSiy、
CoxSiyThree kinds of main collaboration dispersion-strengtherning phases play supplement invigoration effect, help further to improve bending for copper alloy of the present invention
Intensity, modulus of elasticity are taken, the precipitation of Ti atoms can improve the purity of Copper substrate, it can be ensured that to the conductance of copper alloy without too big shadow
Ring.
The high strength and high flexibility high-conductivity copper alloy contains CrxZry、NixSiyAnd CoxSiyBetween intermetallic compound, these three metals
The volume fraction content range of compound in the alloy is respectively：CrxZry：0.01%~1.6%, NixSiy：2.0%~
8.0%, CoxSiy：0.2%~2%.It is used as further preferred, CrxZryThe volume fraction content of intermetallic compound is labeled as
A, NixSiyThe volume fraction content of intermetallic compound is labeled as b, CoxSiyThe volume fraction content mark of intermetallic compound
For c, these three intermetallic compounds play cooperative reinforcing, and its volume fraction content meets relational expression：2.5<(a/c)+b<12.
Cr in alloy of the present inventionxZry、NixSiyWith CoxSiyPhase is need to strengthen based on intermetallic compound, it is quantitative using X-ray
Facies analysis learns that the volume fraction content range of these three intermetallic compounds is respectively：CrxZry0.01%-1.6%,
NixSiy2.0%-8.0%, CoxSiy0.2%-2%.The hardening constituent Cr contained in copper alloyxZryLabeled as a, hardening constituent
NixSiyLabeled as b, hardening constituent CoxSiyLabeled as c, these three hardening constituents play collaboration dispersion-strengthened action, its volume fraction symbol
Close relational expression 2.5<(a/c)+b<12.When its volume fraction relational expression (a/c)+b value is less than 2.5 or higher than 12, three's
Cooperate with dispersion-strengthened effect poor, yield strength, modulus of elasticity, the conductance of copper alloy can not reach simultaneously 800MPa,
130GPa, more than 50%IACS.
When the chemical composition of the high strength and high flexibility high-conductivity copper alloy includes Ti, it contains CrxZry、NixSiy、CoxSiyWith
CuxTiyIntermetallic compound.
When the chemical composition of the high strength and high flexibility high-conductivity copper alloy includes La and Ce, it contains CrxZry、NixSiy、
CoxSiy、LaxNiy、CexNiy、CoxLay、CexCoy、MgxLayAnd MgxCeyIntermetallic compound and Cr simple substance.
The chemical composition of the high strength and high flexibility high-conductivity copper alloy also includes one or more kinds of elements and is selected from：Sn：0.001wt%
~0.2wt%, Ag：0.001wt%~0.1wt%, Fe：0.001wt%~0.1wt%, Al：0.001wt%~0.1wt%,
Zn：0.001wt%~0.2wt%, Ca：0.001wt%~0.1wt%, B：0.001wt%~0.1wt%.Wherein Sn, Ag,
Al, Zn can improve the recrystallization temperature of copper alloy of the present invention, so as to improve the electronics prepared using the copper alloy plate strip of the present invention
The hot operation stability of connector, connector and lead frame；Fe, Ca, B can crystal grain thinning, improve copper alloy of the present invention
Processability.
The yield strength of the high strength and high flexibility high-conductivity copper alloy is more than 800MPa, and modulus of elasticity is more than 130GPa, conductive
Rate is more than 50%IACS.
The high strength and high flexibility high-conductivity copper alloy is applied to electronic connector and lead frame.
Technological process prepared by high strength and high flexibility high-conductivity copper alloy strip of the present invention is：Dispensing → founding → sawing → heating →
Hot rolling → solid solution and Quenching Treatment → milling face → once cold rolling → Secondary Solid Solution Treatment → secondary cold-rolling → time Ageing Treatment →
Three cold rolling → secondary ageing processing → straightenings.
The copper alloy of the present invention is a kind of ageing strengthening type alloy containing a variety of precipitated phases, the precipitation of each precipitated phase, point
Cloth and influence each other be the key factor for determining the alloy material performance, and ensures the precipitation and distribution of each precipitated phase
Major control means for the alloy solid solution and Quenching Treatment and Ageing Treatment twice.
High strength and high flexibility high-conductivity copper alloy strip of the present invention, hot-rolled temperature is 900 DEG C~1000 DEG C, and the heating and thermal insulation time is 3
Hour~6 hours.The hot-rolled temperature of copper alloy of the present invention is controlled in 900 DEG C~1000 DEG C, in the temperature range, copper of the present invention
The element of Cr, Zr, Ni, Co, Si, Mg, Ti, La, Ce and a Grain Refinement Effect in alloy can be all dissolved in Copper substrate, and copper is closed
Exist in gold without other particles, it is ensured that the deformation of copper alloy is not uniformly with ftractureing during hot rolling.When hot-rolled temperature is less than 900
DEG C, alloying element is not completely dissolved into Copper substrate, and the intermetallic chemical composition granule of these elements formation can influence deformation uniform
Property, or even Hot rolling craccking can be caused.When hot-rolled temperature is higher than 1000 DEG C, it may appear that overheat or burn-off phenomenon, make copper alloy
Excessive grain is thick or local melting phenomenon occurs.The heating and thermal insulation time is 3 hours~6 hours, it can be ensured that alloying element is abundant
Dissolve in Copper substrate and crystal grain is not grown up phenomenon.The heating and thermal insulation time is less than 3 hours, and part solute atoms is not filled due to diffusion
Divide and Copper substrate can not be dissolved in；Soaking time was more than 6 hours, and crystal grain can grow up, and influenceed the hot rolling cogging of copper alloy slab
Performance.
High strength and high flexibility high-conductivity copper alloy strip of the present invention, its solution heat temperature is 950 DEG C~1000 DEG C, and soaking time is
3h~5h, quenching mode is water quenching.Solution heat temperature setting is 950 DEG C~1000 DEG C by the present invention, and its effect is to ensure that heat
Roll the solute atoms separated out after the completion of cogging again solid solution enter Copper substrate in form supersaturated solid solution, be easy to follow-up timeliness mistake
The precipitation of dispersion-strengtherning phase in journey.Soaking time is 3h~5h, it is therefore an objective to which solute atoms has what is fully spread during making solid solution
Time, form supersaturated solid solution.
High strength and high flexibility high-conductivity copper alloy strip of the present invention, its one-level aging temp is 300 DEG C~550 DEG C, and soaking time is
2h~6h.One-level aging temp is set to 300 DEG C~550 DEG C by the present invention, and its effect is to make to separate out part in super saturated solid solution
Hardening constituent particle, in the follow-up cold rolling process of sheet material, forms a large amount of dislocations, when being second centered on these particles
Effect processing (secondary time effect) provides solute atoms diffusion admittance, is conducive to solute atoms during secondary time effect fully to separate out to be formed
CrxZry、NixSiy、CoxSiyWith CuxTiyDeng dispersion-strengtherning phase.When one-level aging temp is less than 300 DEG C, solute atoms diffusion speed
Degree is very slow, it is impossible to separated out from supersaturated solid solution；When one-level aging temp is higher than 550 DEG C, the solute of one-level Precipitation is former
Sub excessive and these solute atoms formation separated out intermetallic compounds can grow up, be unfavorable for subsequently carrying out cold rolling plus
Work and secondary time effect.Soaking time is that solute atoms has the time to spread when making one-level timeliness for 2h~6h purpose, so that
Dispersion-strengtherning phase in part is separated out from supersaturated solid solution.
High strength and high flexibility high-conductivity copper alloy strip of the present invention, secondly level aging temp is 350 DEG C~500 DEG C, soaking time is
2h~6h.After one-level timeliness and cold rolling processing, the particle periphery separated out in one-level timeliness can form substantial amounts of dislocation.The present invention
It it is 350 DEG C~500 DEG C by secondary time effect temperature setting, its effect is after one-level timeliness and cold rolling processing, to make super saturated solid solution
The dislocation passage of the particle periphery separated out when not having the remaining solute atoms separated out in body during one-level timeliness along one-level timeliness enters one
Step is separated out.Due to there is the presence of dislocation passage, therefore during secondary time effect, precipitation process is more complete, and the particle of precipitation is more equal
Even, tiny, disperse.When secondary time effect temperature is less than 350 DEG C, the precipitation process of solute atoms does not fill during secondary time effect
Point, substantial amounts of solute atoms can be remained in Copper substrate, the conductance of copper alloy plate strip is influenceed；When secondary time effect temperature is higher than 500
DEG C when, although separate out abundant, but the particle separated out can grow up, so as to influence dispersion-strengthened effect.During secondary time effect processing insulation
Between be less than 2h when, atoms permeating is insufficient, influence solute atoms complete precipitation；Secondary time effect processing soaking time is higher than 6h
When, the particle of precipitation can also grow up, influence reinforcing effect.
Compared with prior art, the advantage of the invention is that：
1st, the present invention is by the optimization to copper alloy progress composition and manufacturing procedure and technique, the high-strength height provided
High-conductivity copper alloy is played, its yield strength is up to more than 800MPa, modulus of elasticity up to more than 130GPa, conductance up to 50%
More than IACS.Compared with known electronic connector, connector, copper alloy for lead-wire frame, high strength and high flexibility height of the present invention leads copper
The combination property for the strip that alloy is made is more preferable, to environment and mankind's fanout free region.High strength and high flexibility high-conductivity copper alloy of the present invention is made
Strip, can more meet electronic connector, connector, the miniaturization of lead frame, lighting, many pins, highly conductive hair
Exhibition is required.
2nd, high strength and high flexibility high-conductivity copper alloy of the present invention, its yield strength is reachable up to more than 800MPa, modulus of elasticity
More than 130GPa, conductance are up to more than 50%IACS, mainly due to CrxZry、NixSiyWith CoxSiyIntermetallic compound rises
Cooperate with dispersion-strengthened action.The volume fraction content range of these three intermetallic compounds in the alloy is respectively：
CrxZry0.01%-1.6%, NixSiy2.0%-8.0%, CoxSiy0.2%-2%.CrxZryThe volume of intermetallic compound
Fractional content is labeled as a, NixSiyThe volume fraction content of intermetallic compound is labeled as b, CoxSiyThe body of intermetallic compound
Fraction content is labeled as c, and these three intermetallic compounds play cooperative reinforcing, and its volume fraction content meets relational expression：
2.5<(a/c)+b<12。
3rd, high strength and high flexibility high-conductivity copper alloy of the present invention, adds La and Ce and plays Copper substrate catharsis, can improve copper alloy
Conductance, while the La and Ce and La of part solute atoms formationxNiy、CexNiy、CoxLay、CexCoy、MgxLay、MgxCeyDeng
Intermetallic compound is to CrxZry、NixSiyWith CoxSiyThe collaboration dispersion-strengtherning of hardening constituent plays supplement reinforcing.
4th, alloy of the present invention, its strip product using hot rolling cogging technique, solid solution and quenching technical, cold rolling manufacturing procedure with
Technique and two-stage time effect handling process are conducive to the precipitation of solute atoms in copper alloy of the present invention, granular size, disperse point
Cloth situation, it is ensured that the combination property of copper alloy plate strip of the invention is better than existing, known electronic connector, connector, lead
Framework copper alloy plate strip.
5th, strip of the high strength and high flexibility high-conductivity copper alloy of the present invention through rolling machine-shaping, can be widely applied to electronics and patches
Part, connector and lead frame.
Brief description of the drawings
Fig. 1 is the transmission electron microscope photo of the representative microstructure of copper alloy band in the present invention.
Embodiment
The present invention is described in further detail with comparative example with reference to embodiments.
58 embodiment alloys and 1 comparative example alloy (C70250) are have chosen, using the preparation method point of the present invention
The strip finished product that thickness is 0.25mm is not processed into.Technique prepared by heretofore described high strength and high flexibility high-conductivity copper alloy strip
Flow is：Dispensing → founding → sawing → heating → hot rolling → solid solution and Quenching Treatment → milling face → once cold rolling → secondary solution treatment
Processing → secondary cold-rolling → time Ageing Treatment → tri- time are cold rolling → secondary ageing processing → straightening, specifically include following steps：
1) dispensing, founding：Raw material preparation and dispensing are carried out according to the chemical composition of alloy, using electromagnetic induction heating furnace
Melting is carried out, the addition sequence of alloy is：Cu is first added, is added after fusing after Ni, Co, 5~10min of insulation, adds CuCr
Intermediate alloy, CuSi intermediate alloys, CuMg intermediate alloys, CuTi intermediate alloys, CuZr intermediate alloys, CuLa intermediate alloys and
One or more element crystal grain thinnings in CuCe intermediate alloys, selectivity addition Sn, Ag, Fe, Al, Zn, Ca, B, through fully removing
Cast after gas, slagging-off, smelting temperature is 1250 DEG C, cast temperature is 1200 DEG C；
2) sawing：Sawing is carried out to ingot casting, the ingot casting that specification is 220 × 410mm is obtained；
3) hot rolling cogging：Ingot casting is heated at 950 DEG C, and being incubated 4h makes ingot structure uniform with composition, Ran Houjin
Row hot rolling cogging, pass reduction is 30%, and general working rate is 93.2%, and hot rolling cogging obtains specification for 15.0mm × 430mm
Made-up belt；
4) solid solution and Quenching Treatment, milling face：Solution treatment is carried out to made-up belt, solid solubility temperature scope is 950 DEG C -1000 DEG C,
Insulation 4 hours, water-filling of going forward side by side is quenched, milling face after quenching, obtains the sheet material that specification is 13.0mm × 430mm；
5) once cold rolling：Sheet material behind milling face is subjected to once cold rolling, its thickness is rolled to 2.0mm from 13.0mm；
6) Secondary Solid Solution Treatment：Sheet material after once cold rolling is subjected to solution treatment again, solid solubility temperature scope is 950
DEG C -1000 DEG C, soaking time is 4 hours, water quenching；
7) secondary cold-rolling：Sheet material after secondary solution treatment and Quenching Treatment is subjected to secondary cold-rolling, thickness is rolled to from 2.0mm
0.5mm；
8) Ageing Treatment：Band after secondary cold-rolling is subjected to an Ageing Treatment (one-level timeliness), aging temp
Scope is 300 DEG C -550 DEG C, and soaking time is 3h；
9) three times it is cold rolling：By after an Ageing Treatment band carry out three times it is cold rolling, thickness is rolled to 0.25mm from 0.5mm；
10) secondary ageing processing, straightening：Three bands after cold rolling are subjected to secondary ageing processing (secondary time effect), when
It is 350 DEG C -500 DEG C to imitate temperature range, and soaking time is 4h, and straightening (stretch-bending straightening) obtains high strength and high flexibility high-conductivity copper alloy plate
Band.
Carry out room temperature tensile mechanical property and conductance detection respectively to embodiment 1~50 and comparative example alloy finished product.
Tensile test at room temperature is according to GB/T 228.1-2010《Metal material stretching test part 1：Room temperature experiment side
Method》Carried out on electronic universal testing machine for mechanical properties, be 0.25mm to embodiment 1~50 and the equal adoption rate coefficient of comparative example
Sheet coupon, draw speed is 5mm/min.
Embodiment, the composition of comparative example, specific Technology for Heating Processing and the performance test results are shown in Table 1 and table 2.
The embodiment of table 1, the composition of comparative example
The embodiment of table 2, the performance of comparative example
The present invention is by controlling CrxZry、NixSiy、CoxSiyThe granularity of intermetallic compound, the uniformity of distribution are controlled
The performance of alloyage, when the particle size differences of intermetallic compound are larger, skewness when, the performance of copper alloy plate strip will under
Drop.3 are shown in Table corresponding to the influence of compound granularity, uniformity to alloy property between the different metal of the alloy of embodiment 51~58.
The influence of compound granularity, uniformity to performance between the different metal of table 3
Claims (8)
1. high strength and high flexibility high-conductivity copper alloy, it is characterised in that the chemical composition of the alloy includes：Cr：0.005wt%~
2.0wt%, Zr：0.001wt%~0.5wt%, Ni：2.5wt%~5.0wt%, Co：0.1wt%~1.0wt%, Si：
0.4wt%~1.6wt%, Mg：0.01wt%~0.2wt%, surplus is Cu；The alloy contains CrxZry、NixSiyAnd CoxSiy
Intermetallic compound, the volume fraction content range of these three intermetallic compounds in the alloy is respectively：CrxZry：0.01%
~1.6%, NixSiy：2.0%~8.0%, CoxSiy：0.2%~2%；CrxZryThe volume fraction content of intermetallic compound
Labeled as a, NixSiyThe volume fraction content of intermetallic compound is labeled as b, CoxSiyThe volume fraction of intermetallic compound contains
Amount is labeled as c, and these three intermetallic compounds play cooperative reinforcing, and its volume fraction content meets relational expression：2.5<(a/c)
+b<12。
2. high strength and high flexibility high-conductivity copper alloy according to claim 1, it is characterised in that the chemical composition of the alloy also includes
La：0.001wt%~0.1wt%, Ce：0.001wt%~0.1wt%.
3. high strength and high flexibility high-conductivity copper alloy according to claim 1 or 2, it is characterised in that the chemical composition of the alloy is also wrapped
Include Ti：0.005wt%~0.1wt%.
4. high strength and high flexibility high-conductivity copper alloy according to claim 3, it is characterised in that the alloy contains CrxZry、NixSiy、
CoxSiyAnd CuxTiyIntermetallic compound.
5. high strength and high flexibility high-conductivity copper alloy according to claim 2, it is characterised in that the alloy contains CrxZry、NixSiy、
CoxSiy、LaxNiy、CexNiy、CoxLay、CexCoy、MgxLayAnd MgxCeyIntermetallic compound and Cr simple substance.
6. high strength and high flexibility high-conductivity copper alloy according to claim 1 or 2, it is characterised in that the chemical composition of the alloy is also
It is selected from including one or more kinds of elements：Sn：0.001wt%~0.2wt%, Ag：0.001wt%~0.1wt%, Fe：
0.001wt%~0.1wt%, Al：0.001wt%~0.1wt%, Zn：0.001wt%~0.2wt%, Ca：0.001wt%~
0.1wt%, B：0.001wt%~0.1wt%.
7. high strength and high flexibility high-conductivity copper alloy according to claim 1, it is characterised in that the yield strength of the alloy is
More than 800MPa, modulus of elasticity is more than 130GPa, and conductance is more than 50%IACS.
8. the high strength and high flexibility high-conductivity copper alloy in claim 1 to 7 described in any one is on electronic connector and lead frame
Application.
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| JP6678757B2 (en) * | 2017-03-31 | 2020-04-08 | 古河電気工業株式会社 | Copper plate material for insulating substrate with copper plate and method of manufacturing the same |
| KR101810925B1 (en) * | 2017-10-18 | 2017-12-20 | 주식회사 풍산 | Copper alloy strips having high heat resistance and thermal dissipation properties |
| CN107828985A (en) * | 2017-11-30 | 2018-03-23 | 江西理工大学 | Cu Cr Zr Ni Al copper alloys, wire rod and preparation method thereof |
| CN108220664A (en) * | 2017-12-31 | 2018-06-29 | 安徽晋源铜业有限公司 | A kind of preparation process of high intensity copper wire |
| CN110205570B (en) * | 2019-04-15 | 2021-01-01 | 丰山(连云港)新材料有限公司 | Heat treatment method of copper alloy for electric and electronic parts |
| CN110512115B (en) * | 2019-09-29 | 2021-08-17 | 宁波金田铜业(集团)股份有限公司 | High-strength and high-elasticity conductive copper-titanium alloy rod and preparation method thereof |
| CN112281023B (en) * | 2020-11-23 | 2021-08-31 | 宁波博威合金材料股份有限公司 | Copper alloy material with excellent bending property and preparation method and application thereof |
| CN113106293B (en) * | 2021-03-25 | 2022-04-22 | 北京科技大学 | A low-cobalt content high-strength medium-conductivity Cu-Ni-Co-Si alloy and its preparation process |
| CN113234959A (en) * | 2021-05-18 | 2021-08-10 | 中国科学院宁波材料技术与工程研究所 | Multi-element composite microalloyed high-strength high-conductivity copper alloy material and preparation method thereof |
| CN113913642B (en) * | 2021-09-26 | 2022-07-05 | 宁波博威合金板带有限公司 | Copper alloy strip and preparation method thereof |
| CN116875921A (en) * | 2022-10-13 | 2023-10-13 | 中铜华中铜业有限公司 | Rolling method of copper-chromium-zirconium alloy plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1856588A (en) * | 2003-09-19 | 2006-11-01 | 住友金属工业株式会社 | Copper alloy and its manufacturing method |
| CN101166840A (en) * | 2005-02-28 | 2008-04-23 | 古河电气工业株式会社 | Copper alloy |
| CN103789571A (en) * | 2012-10-31 | 2014-05-14 | 同和金属技术有限公司 | Cu-Ni-Co-Si based copper alloy sheet material and method for producing the same |
-
2015
- 2015-12-29 CN CN201511008188.5A patent/CN105568047B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1856588A (en) * | 2003-09-19 | 2006-11-01 | 住友金属工业株式会社 | Copper alloy and its manufacturing method |
| CN101166840A (en) * | 2005-02-28 | 2008-04-23 | 古河电气工业株式会社 | Copper alloy |
| CN103789571A (en) * | 2012-10-31 | 2014-05-14 | 同和金属技术有限公司 | Cu-Ni-Co-Si based copper alloy sheet material and method for producing the same |
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