CN105552507A - Novel-structure chip-type wideband coupler - Google Patents
Novel-structure chip-type wideband coupler Download PDFInfo
- Publication number
- CN105552507A CN105552507A CN201510903691.0A CN201510903691A CN105552507A CN 105552507 A CN105552507 A CN 105552507A CN 201510903691 A CN201510903691 A CN 201510903691A CN 105552507 A CN105552507 A CN 105552507A
- Authority
- CN
- China
- Prior art keywords
- inner terminal
- wire coil
- post
- electrically connected
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
The invention discloses a novel-structure chip-type wideband coupler. The internal circuit layer of the coupler is of a laminated chip-type structure. The structure is based on the LTCC (Low-Temperature Co-fired Ceramic) technology, and coupled micro-strip line design is adopted to satisfy the special performance requirements of the laminated chip-type broadband coupler. By adopting the structure, a broadband coupling function is achieved effectively, and the coupler has the advantages of low loss, high reliability, low cost and applicability to large-scale production. In addition, the coupler adapts to the new development trend of miniaturization of electronic components.
Description
Technical field
The present invention discloses a kind of coupler, particularly a kind of new structure chip wideband coupler, can be used in mobile phone, panel computer and other various communication apparatus.
Background technology
LTCC (LowTemperatureCo-firedCeramic, LTCC) technology has unique advantage at electronic devices and components and encapsulation field, is widely used in the fields such as communication, automobile and medicine equipment.Frequency microwave element and the module of design and production based on LTCC technology comprise filter, duplexer, antenna, coupler, Ba Lun, receiving front-end module, duplexer module etc.Have the advantages such as high quality factor, high stability, high integration because of it, along with modern electronic equipment is to miniaturized, high frequency direction development, they apply to field of mobile phones in a large number.
Coupler is more common microwave device at mobile phone front end, and it can to sample of signal, so as to carry out measuring and monitor, signal distributes and synthesis.Along with the application of 4G technology, mobile phone front end frequency range gets more and more, and needs the signal frequency range of monitoring also constantly to increase, and be reply mobile phone front end small form factor requirements, wide band coupler has just become inevitable choice simultaneously.
Summary of the invention
For the shortcoming that the above-mentioned coupler volume of the prior art mentioned is larger, the invention provides a kind of new structure chip wideband coupler, this wideband coupler adopts the special construction of coupling line design, be coupled by transmission main line and transmission by-pass and form, structure of the present invention adopts LTCC forming technique to be integrated in identity element, then utilizes 900 DEG C low temperature co-firedly to form.
The technical scheme that the present invention solves the employing of its technical problem is: a kind of new structure chip wideband coupler, coupler comprises matrix, is arranged on the terminal stud of surrounding outside matrix and is arranged on the circuit layer of intrinsic silicon, and the circuit layer of intrinsic silicon is laminated construction:
Ground floor for be printed with one piece of first metal flat conductor on ceramic dielectric substrate, first metal flat conductor both sides stretch out an inner terminal respectively, be respectively the first inner terminal and the second inner terminal, first inner terminal is electrically connected with grounding ports, and the second inner terminal is also electrically connected with grounding ports;
The second layer for be printed with first wire coil and a first metallic conductor substrate on ceramic dielectric substrate, first wire coil is in " C " font, 3rd inner terminal of first wire coil one end is electrically connected with input port and is connected, the first wire coil other end is the 4th inner terminal, 4th inner terminal is connected with first post electricity, first metallic conductor substrate and the first wire coil mutually insulated, the first metallic conductor substrate is electrically connected with output port;
Third layer for be printed with the second wire coil and one piece of second metal flat conductor on ceramic dielectric substrate, second wire coil is L-shaped, second wire coil one end is the 5th inner terminal, 5th inner terminal is electrically connected with output port, the second wire coil other end is the 6th inner terminal, 6th inner terminal is electrically connected with first post, the second metal flat conductor and the second wire coil mutually insulated, and the second metal flat conductor is electrically connected with input port;
4th layer for be printed with two mutually insulated wire coils on ceramic dielectric substrate, be respectively the 3rd wire coil and the 4th wire coil, 3rd wire coil and the 4th wire coil are all in " U " shape, the two ends of the 3rd wire coil are respectively the 7th inner terminal and the 8th inner terminal, the centre position of the 3rd wire coil is provided with the 9th inner terminal, 7th inner terminal is electrically connected with isolated port, 8th inner terminal is electrically connected with second point post, and the 9th inner terminal is electrically connected with thirdly post; The two ends of the 4th wire coil are respectively the tenth inner terminal and the 11 inner terminal, and the tenth inner terminal is electrically connected with coupling port, and the 11 inner terminal is electrically connected with the 4th post;
Layer 5 for be printed with two mutually insulated wire coils on ceramic dielectric substrate, be respectively the 5th wire coil and the 6th wire coil, 5th wire coil and the 6th wire coil are all in " U " shape, the two ends of the 5th wire coil are respectively the 12 inner terminal and the 13 inner terminal, 12 inner terminal is electrically connected with the 7th post, 13 inner terminal is electrically connected with second point post, 5th wire coil is also provided with the 14 inner terminal, and the 14 inner terminal is electrically connected with thirdly post; The two ends of the 6th wire coil are respectively the 15 inner terminal and the 16 inner terminal, and the 15 inner terminal is electrically connected with the 4th post, and the 16 inner terminal is electrically connected with the 8th post;
Layer 6 for be printed with a 3rd metal flat conductor on ceramic dielectric substrate, 3rd metal flat conductor is respectively equipped with outwardly directed inner terminal, be respectively the 17 inner terminal and the 18 inner terminal, 17 inner terminal is electrically connected with grounding ports, and the 18 inner terminal is electrically connected with grounding ports;
Layer 7 is the metal flat conductor being printed with two mutually insulateds on ceramic dielectric substrate, be respectively the 4th metal flat conductor and five metals belongs to planar conductor, 4th metal flat conductor stretches out and is provided with the 19 inner terminal, 19 inner terminal is electrically connected with the 7th post, five metals belongs to planar conductor stretches out and is provided with the 20 internal heads, and the 20 internal heads is electrically connected with the 8th post;
8th Rotating fields is identical with layer 6 structure;
9th layer for being printed with the wire coil of two mutually insulateds on ceramic dielectric substrate, be respectively the 7th wire coil and the 8th wire coil, 7th wire coil and the 8th wire coil are all in " U " shape, 7th wire coil two ends are respectively equipped with the 21 internal heads and the 22 internal heads, 21 internal heads is electrically connected with the 5th post, and the 22 internal heads is electrically connected with the 7th post; 8th wire coil two ends are respectively equipped with the 23 internal heads and the 24 internal heads, and the 23 internal heads is electrically connected with the 8th post, and the 24 internal heads is electrically connected with the 6th post;
Tenth layer for be printed with the 9th wire coil on ceramic dielectric substrate, 9th wire coil is in " U " shape, 9th wire coil two ends are respectively the 25 internal heads and the 26 internal heads, 25 internal heads is electrically connected with the 5th post, and the 26 internal heads is electrically connected with the 6th post;
Eleventh floor structure is identical with ground floor structure.
The technical scheme that the present invention solves the employing of its technical problem further comprises:
Described terminal stud is provided with six, and six terminal studs distribute in matrix bilateral symmetry.
Described matrix adopts ceramic matrix.
Post is put by first described post, second point post, thirdly post, the 4th post, the 5th post and the 6th the post side of being respectively.
The 8th described post and the 9th post are respectively round dot post.
The invention has the beneficial effects as follows: structure of the present invention, based on LTCC (LTCC) technology, adopts coupled microstrip line design to realize the particular electrical requirement of lamination sheet type wide-band coupler.Structure of the present invention effectively achieves the coupling function in broadband, has low-loss, high reliability, low cost and is suitable for the advantages such as large-scale production, also adapted to new electronic component miniaturization trend in addition.
Below in conjunction with the drawings and specific embodiments, the present invention will be further described.
Accompanying drawing explanation
Fig. 1 constructional appearance structural upright of the present invention schematic diagram.
Fig. 2 is inside configuration structural representation of the present invention.
Fig. 3 is structure ground floor circuit layer planar structure schematic diagram of the present invention.
Fig. 4 is structure second layer circuit planes structural representation of the present invention.
Fig. 5 puts post to connect planar structure schematic diagram between second and third layer of structure of the present invention.
Fig. 6 is structure third layer circuit planes structural representation of the present invention.
Fig. 7 is structure of the present invention 4th layer of circuit planes structural representation.
Fig. 8 puts post to connect planar structure schematic diagram between fourth, fifth layer, structure of the present invention.
Fig. 9 is structure layer 5 circuit planes structural representation of the present invention.
Figure 10 is between 5th, six layers, structure of the present invention, between the 6th, seven layer, puts post and connect planar structure schematic diagram between the 7th, eight layer and between the 8th, nine layer.
Figure 11 is structure layer 6 of the present invention, the 8th layer of circuit planes structural representation.
Figure 12 is structure layer 7 circuit planes structural representation of the present invention.
Figure 13 is structure of the present invention 9th layer of circuit planes structural representation.
Figure 14 puts post to connect planar structure schematic diagram between structure of the present invention 9th, ten layers of circuit.
Figure 15 is structure of the present invention tenth layer of circuit planes structural representation.
Embodiment
The present embodiment is the preferred embodiment for the present invention, and other its principles all are identical with the present embodiment or approximate with basic structure, all within scope.
Please refer to accompanying drawing 1 and accompanying drawing 2, the present invention is mainly a kind of new structure chip wideband coupler, and it comprises matrix, is arranged on the terminal stud of surrounding outside matrix and is arranged on the circuit layer of intrinsic silicon, and the circuit layer of described intrinsic silicon is laminated construction.In the present embodiment, terminal stud is provided with six, and six terminal studs distribute in matrix bilateral symmetry, in the present embodiment, six terminal studs are respectively: P1 is input port, P2 and P5 is grounding ports, P3 is coupling port, and P4 is isolated port and load end, P6 output port.In the present embodiment, matrix adopts ceramic matrix, and interior circuit layers is divided into 11 layers.
Please refer to accompanying drawing 3, in the present embodiment, ground floor for be printed with one piece of first metal flat conductor 1 on ceramic dielectric substrate, first metal flat conductor 1 both sides stretch out an inner terminal respectively, be respectively the first inner terminal 1a and the second inner terminal 1b, first inner terminal 1a is electrically connected with grounding ports P2, and the second inner terminal 1b is electrically connected with grounding ports P5;
Please refer to accompanying drawing 4, in the present embodiment, the second layer for be printed with first wire coil 2 and a first metallic conductor substrate 2c on ceramic dielectric substrate, in the present embodiment, first wire coil 2 is in " C " font, or be called unsealed " mouth " font, the 3rd inner terminal 2a of first wire coil 2 one end is arranged on edge placement place, be electrically connected with input port P1 and be connected, first wire coil 2 other end is arranged on interior location, be the 4th inner terminal 2b, 4th inner terminal 2b is connected with first party point post 19 electricity, first metallic conductor substrate 2c and the first wire coil 2 mutually insulated, first metallic conductor substrate 2c is electrically connected with output port P6,
Please refer to accompanying drawing 6, in the present embodiment, third layer for be printed with the second wire coil 3 and one piece of second metal flat conductor 3c on ceramic dielectric substrate, in the present embodiment, second wire coil 3 is L-shaped, second wire coil 3 one end is arranged on edge placement place, be the 5th inner terminal 3a, 5th inner terminal 3a is electrically connected with output port P6, second wire coil 3 other end is arranged on interior location, be the 6th inner terminal 3b, 6th inner terminal 3b is that first party point post 19 is electrically connected, the second layer and third layer can be coupled together by first party point post 19, second metal flat conductor 3c and the second wire coil 3 mutually insulated, second metal flat conductor 3c is electrically connected with input port P1,
Please refer to accompanying drawing 7, in the present embodiment, 4th layer for be printed with two mutually insulated wire coils on ceramic dielectric substrate, be respectively the 3rd wire coil 17-1 and the 4th wire coil 17-2, in the present embodiment, 3rd wire coil 17-1 and the 4th wire coil 17-2 is all in long " U " shape (namely two parallel edges length are longer than middle fillet length), the two ends of the 3rd wire coil 17-1 are respectively the 7th inner terminal 17a and the 8th inner terminal 17d, the centre position of the 3rd wire coil 17-1 is provided with the 9th inner terminal 17e, 7th inner terminal 17a is electrically connected with isolated port P4, 8th inner terminal 17d is electrically connected with second party point post 16, 9th inner terminal 17e and third party put post 18 and are electrically connected, the two ends of the 4th wire coil 17-2 are respectively the tenth inner terminal 17b and the 11 inner terminal 17c, and the tenth inner terminal 17b is electrically connected with coupling port P3, and the 11 inner terminal 17c is electrically connected with cardinal points post 14,
Please refer to accompanying drawing 9, in the present embodiment, layer 5 for be printed with two mutually insulated wire coils on ceramic dielectric substrate, be respectively the 5th wire coil 15-1 and the 6th wire coil 15-2, in the present embodiment, 5th wire coil 15-1 and the 6th wire coil 15-2 is all in short " U " shape (namely two parallel edges are shorter in length than middle fillet length), the two ends of the 5th wire coil 15-1 are respectively the 12 inner terminal 15a and the 13 inner terminal 15d, 12 inner terminal 15a is electrically connected with the first round dot post 5, 13 inner terminal 15d is electrically connected with second party point post 16, 5th wire coil 15-1 is also provided with the 14 inner terminal 15e, 14 inner terminal 15e and third party put post 18 and are electrically connected, the two ends of the 6th wire coil 15-2 are respectively the 15 inner terminal 15b and the 16 inner terminal 15c, and the 15 inner terminal 15b is electrically connected with cardinal points post 14, and the 16 inner terminal 15c is electrically connected with the second round dot post 4,
Please refer to accompanying drawing 11, in the present embodiment, layer 6 for be printed with a 3rd metal flat conductor 13 on ceramic dielectric substrate, 3rd metal flat conductor 13 is respectively equipped with outwardly directed inner terminal, be respectively the 17 inner terminal 13a and the 18 inner terminal 13b, 17 inner terminal 13a is electrically connected with grounding ports P5, and the 18 inner terminal 13b is electrically connected with grounding ports P2;
Please refer to accompanying drawing 12, in the present embodiment, layer 7 is the metal flat conductor being printed with two mutually insulateds on ceramic dielectric substrate, be respectively the 4th metal flat conductor 6-1 and five metals belongs to planar conductor 6-2,4th metal flat conductor 6-1 stretches out and is provided with the 19 inner terminal 6a, 19 inner terminal 6a is electrically connected with the first round dot post 5, and five metals belongs to planar conductor 6-2 stretches out and is provided with the 20 internal heads 6b, and the 20 internal heads 6b is electrically connected with the second round dot post 4;
Please refer to accompanying drawing 11, in the present embodiment, the 8th Rotating fields and layer 6 structure just the same, repeat no more herein;
Please refer to accompanying drawing 13, in the present embodiment, 9th layer for being printed with the wire coil of two mutually insulateds on ceramic dielectric substrate, be respectively the 7th wire coil 7-1 and the 8th wire coil 7-2, in the present embodiment, 7th wire coil 7-1 and the 8th wire coil 7-2 is all in " U " shape, 7th wire coil 7-1 two ends are respectively equipped with the 21 internal heads 7a and the 22 internal heads 7b, 21 internal heads 7a is electrically connected with the 5th side's point post 11, and the 22 internal heads 7b is electrically connected with the first round dot post 5; 8th wire coil 7-2 two ends are respectively equipped with the 23 internal heads 7c and the 24 internal heads 7d, and the 23 internal heads 7c is electrically connected with the second round dot post 4, and the 24 internal heads 7d is electrically connected with the 6th side's point post 8;
Please refer to accompanying drawing 15, in the present embodiment, tenth layer for be printed with the 9th wire coil 10 on ceramic dielectric substrate, in the present embodiment, 9th wire coil 10 is in " U " shape, and the 9th wire coil 10 two ends are protruding formation internal heads respectively, is respectively the 25 internal heads 10a and the 26 internal heads 10b, 25 internal heads 10a is electrically connected with the 5th side's point post 11, and the 26 internal heads 10b is electrically connected with the 6th side's point post 8;
Please refer to accompanying drawing 3, in the present embodiment, eleventh floor structure and ground floor structure just the same, repeat no more herein.
Structure of the present invention, based on LTCC (LTCC) technology, adopts coupled microstrip line design to realize the particular electrical requirement of lamination sheet type wide-band coupler.Structure of the present invention effectively achieves the coupling function in broadband, has low-loss, high reliability, low cost and is suitable for the advantages such as large-scale production, also adapted to new electronic component miniaturization trend in addition.
Claims (5)
1. a new structure chip wideband coupler, is characterized in that: described coupler comprises matrix, is arranged on the terminal stud of surrounding outside matrix and is arranged on the circuit layer of intrinsic silicon, and the circuit layer of intrinsic silicon is laminated construction:
Ground floor for be printed with one piece of first metal flat conductor on ceramic dielectric substrate, first metal flat conductor both sides stretch out an inner terminal respectively, be respectively the first inner terminal and the second inner terminal, first inner terminal is electrically connected with grounding ports, and the second inner terminal is also electrically connected with grounding ports;
The second layer for be printed with first wire coil and a first metallic conductor substrate on ceramic dielectric substrate, first wire coil is in " C " font, 3rd inner terminal of first wire coil one end is electrically connected with input port and is connected, the first wire coil other end is the 4th inner terminal, 4th inner terminal is connected with first post electricity, first metallic conductor substrate and the first wire coil mutually insulated, the first metallic conductor substrate is electrically connected with output port;
Third layer for be printed with the second wire coil and one piece of second metal flat conductor on ceramic dielectric substrate, second wire coil is L-shaped, second wire coil one end is the 5th inner terminal, 5th inner terminal is electrically connected with output port, the second wire coil other end is the 6th inner terminal, 6th inner terminal is electrically connected with first post, the second metal flat conductor and the second wire coil mutually insulated, and the second metal flat conductor is electrically connected with input port;
4th layer for be printed with two mutually insulated wire coils on ceramic dielectric substrate, be respectively the 3rd wire coil and the 4th wire coil, 3rd wire coil and the 4th wire coil are all in " U " shape, the two ends of the 3rd wire coil are respectively the 7th inner terminal and the 8th inner terminal, the centre position of the 3rd wire coil is provided with the 9th inner terminal, 7th inner terminal is electrically connected with isolated port, 8th inner terminal is electrically connected with second point post, and the 9th inner terminal is electrically connected with thirdly post; The two ends of the 4th wire coil are respectively the tenth inner terminal and the 11 inner terminal, and the tenth inner terminal is electrically connected with coupling port, and the 11 inner terminal is electrically connected with the 4th post;
Layer 5 for be printed with two mutually insulated wire coils on ceramic dielectric substrate, be respectively the 5th wire coil and the 6th wire coil, 5th wire coil and the 6th wire coil are all in " U " shape, the two ends of the 5th wire coil are respectively the 12 inner terminal and the 13 inner terminal, 12 inner terminal is electrically connected with the 7th post, 13 inner terminal is electrically connected with second point post, 5th wire coil is also provided with the 14 inner terminal, and the 14 inner terminal is electrically connected with thirdly post; The two ends of the 6th wire coil are respectively the 15 inner terminal and the 16 inner terminal, and the 15 inner terminal is electrically connected with the 4th post, and the 16 inner terminal is electrically connected with the 8th post;
Layer 6 for be printed with a 3rd metal flat conductor on ceramic dielectric substrate, 3rd metal flat conductor is respectively equipped with outwardly directed inner terminal, be respectively the 17 inner terminal and the 18 inner terminal, 17 inner terminal is electrically connected with grounding ports, and the 18 inner terminal is electrically connected with grounding ports;
Layer 7 is the metal flat conductor being printed with two mutually insulateds on ceramic dielectric substrate, be respectively the 4th metal flat conductor and five metals belongs to planar conductor, 4th metal flat conductor stretches out and is provided with the 19 inner terminal, 19 inner terminal is electrically connected with the 7th post, five metals belongs to planar conductor stretches out and is provided with the 20 internal heads, and the 20 internal heads is electrically connected with the 8th post;
8th Rotating fields is identical with layer 6 structure;
9th layer for being printed with the wire coil of two mutually insulateds on ceramic dielectric substrate, be respectively the 7th wire coil and the 8th wire coil, 7th wire coil and the 8th wire coil are all in " U " shape, 7th wire coil two ends are respectively equipped with the 21 internal heads and the 22 internal heads, 21 internal heads is electrically connected with the 5th post, and the 22 internal heads is electrically connected with the 7th post; 8th wire coil two ends are respectively equipped with the 23 internal heads and the 24 internal heads, and the 23 internal heads is electrically connected with the 8th post, and the 24 internal heads is electrically connected with the 6th post;
Tenth layer for be printed with the 9th wire coil on ceramic dielectric substrate, 9th wire coil is in " U " shape, 9th wire coil two ends are respectively the 25 internal heads and the 26 internal heads, 25 internal heads is electrically connected with the 5th post, and the 26 internal heads is electrically connected with the 6th post;
Eleventh floor structure is identical with ground floor structure.
2. new structure chip wideband coupler according to claim 1, is characterized in that: described terminal stud is provided with six, and six terminal studs distribute in matrix bilateral symmetry.
3. new structure chip wideband coupler according to claim 1, is characterized in that: described matrix adopts ceramic matrix.
4. new structure chip wideband coupler according to claim 1, is characterized in that: post is put by first described post, second point post, thirdly post, the 4th post, the 5th post and the 6th the post side of being respectively.
5. new structure chip wideband coupler according to claim 1, is characterized in that: the 8th described post and the 9th post are respectively round dot post.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510903691.0A CN105552507B (en) | 2015-12-08 | 2015-12-08 | A kind of new structure chip wideband coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510903691.0A CN105552507B (en) | 2015-12-08 | 2015-12-08 | A kind of new structure chip wideband coupler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105552507A true CN105552507A (en) | 2016-05-04 |
| CN105552507B CN105552507B (en) | 2018-09-14 |
Family
ID=55831552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510903691.0A Active CN105552507B (en) | 2015-12-08 | 2015-12-08 | A kind of new structure chip wideband coupler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105552507B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109687081A (en) * | 2018-12-13 | 2019-04-26 | 南京理工大学 | Novel 3dB180 degree plane electric bridge based on LTCC |
| CN110165352A (en) * | 2019-05-20 | 2019-08-23 | 中国电子科技集团公司第十三研究所 | A kind of directional coupler and preparation method thereof |
| CN111010107A (en) * | 2019-12-23 | 2020-04-14 | 深圳市麦捷微电子科技股份有限公司 | Miniaturized laminated sheet type coupling band-pass filter |
| CN111010106A (en) * | 2019-12-20 | 2020-04-14 | 深圳市麦捷微电子科技股份有限公司 | Miniaturized lamination formula low pass filter |
| CN118117278A (en) * | 2024-04-16 | 2024-05-31 | 江苏飞特尔通信有限公司 | Mixed medium miniaturized high-isolation coupler based on lamination technology |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060238271A1 (en) * | 2005-04-25 | 2006-10-26 | Alexander Dornhelm | Low temperature co-fired ceramic 90 degree power splitter |
| CN2845193Y (en) * | 2005-10-31 | 2006-12-06 | 浙江正原电气股份有限公司 | Multiple layer ceramic filter with three openings |
| TWM331766U (en) * | 2007-10-05 | 2008-05-01 | Advanced Ceramic X Corp | Miniaturized power divider (combiner) |
| CN201430202Y (en) * | 2009-01-20 | 2010-03-24 | 深圳市麦捷微电子科技股份有限公司 | Laminated sheet type Balun band-pass filter |
| US20120032836A1 (en) * | 2010-08-09 | 2012-02-09 | King Abdullah University Of Science And Technology | Gain Enhanced LTCC System-on-Package for UMRR Applications |
| CN104241737A (en) * | 2014-09-03 | 2014-12-24 | 华南理工大学 | LTCC filtering Balun based on resonator coupling |
-
2015
- 2015-12-08 CN CN201510903691.0A patent/CN105552507B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060238271A1 (en) * | 2005-04-25 | 2006-10-26 | Alexander Dornhelm | Low temperature co-fired ceramic 90 degree power splitter |
| CN2845193Y (en) * | 2005-10-31 | 2006-12-06 | 浙江正原电气股份有限公司 | Multiple layer ceramic filter with three openings |
| TWM331766U (en) * | 2007-10-05 | 2008-05-01 | Advanced Ceramic X Corp | Miniaturized power divider (combiner) |
| CN201430202Y (en) * | 2009-01-20 | 2010-03-24 | 深圳市麦捷微电子科技股份有限公司 | Laminated sheet type Balun band-pass filter |
| US20120032836A1 (en) * | 2010-08-09 | 2012-02-09 | King Abdullah University Of Science And Technology | Gain Enhanced LTCC System-on-Package for UMRR Applications |
| CN104241737A (en) * | 2014-09-03 | 2014-12-24 | 华南理工大学 | LTCC filtering Balun based on resonator coupling |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109687081A (en) * | 2018-12-13 | 2019-04-26 | 南京理工大学 | Novel 3dB180 degree plane electric bridge based on LTCC |
| CN110165352A (en) * | 2019-05-20 | 2019-08-23 | 中国电子科技集团公司第十三研究所 | A kind of directional coupler and preparation method thereof |
| CN111010106A (en) * | 2019-12-20 | 2020-04-14 | 深圳市麦捷微电子科技股份有限公司 | Miniaturized lamination formula low pass filter |
| CN111010106B (en) * | 2019-12-20 | 2023-02-28 | 深圳市麦捷微电子科技股份有限公司 | Miniaturized lamination formula low pass filter |
| CN111010107A (en) * | 2019-12-23 | 2020-04-14 | 深圳市麦捷微电子科技股份有限公司 | Miniaturized laminated sheet type coupling band-pass filter |
| CN111010107B (en) * | 2019-12-23 | 2023-07-21 | 深圳市麦捷微电子科技股份有限公司 | Miniaturized lamination sheet type coupling band-pass filter |
| CN118117278A (en) * | 2024-04-16 | 2024-05-31 | 江苏飞特尔通信有限公司 | Mixed medium miniaturized high-isolation coupler based on lamination technology |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105552507B (en) | 2018-09-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8937578B2 (en) | High isolation antenna system | |
| CN104579220B (en) | Multiple layer ceramic dielectric chip low pass filter | |
| CN105552507A (en) | Novel-structure chip-type wideband coupler | |
| KR101661011B1 (en) | Sandwich structure for directional coupler | |
| CN108649914B (en) | LTCC laminated sheet type duplexer | |
| CN109462411A (en) | RF Amplifier Module and communication terminal | |
| CN104577338A (en) | Antenna component and radio communication device with antenna component | |
| CN110768640B (en) | Multilayer ceramic dielectric sheet type duplexer | |
| CN103618124B (en) | A kind of lamination sheet type duplexer | |
| CN103794838A (en) | LTCC-based S-waveband high-performance micro band-pass balanced filter | |
| CN103066348B (en) | Novel low temperature co-fired ceramic (LTCC) duplexer | |
| CN102545942A (en) | Wireless communication device | |
| CN211557238U (en) | Multilayer ceramic dielectric sheet type duplexer | |
| CN203660024U (en) | Novel lamination-sheet-type duplexer | |
| CN103762407B (en) | A kind of Miniaturization multi-layer ceramic bridge | |
| CN107395224A (en) | Sender unit with three minor matters coupling microstrip cable architectures of loading | |
| CN102956991B (en) | Antenna | |
| CN103606722B (en) | Lamination medium triplexer | |
| CN204669717U (en) | Jumper wire construction and electronic equipment | |
| CN111130480B (en) | Laminated low-pass filter | |
| CN209088930U (en) | RF Amplifier Module and communication terminal | |
| CN203491378U (en) | Pluggable external antenna of handset | |
| CN203707302U (en) | Miniaturized multilayer ceramic bridge | |
| CN205564932U (en) | Novel super broadband band -pass filter of LTCC | |
| JP2010081310A (en) | Substrate for radio communication module, and radio communication module using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |