CN105419724B - 多种碳材料掺杂高导热有机硅胶粘剂及其制备方法 - Google Patents
多种碳材料掺杂高导热有机硅胶粘剂及其制备方法 Download PDFInfo
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- CN105419724B CN105419724B CN201510955356.5A CN201510955356A CN105419724B CN 105419724 B CN105419724 B CN 105419724B CN 201510955356 A CN201510955356 A CN 201510955356A CN 105419724 B CN105419724 B CN 105419724B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
Abstract
Description
导热系数 | 室温粘接强度 | 200℃老化后粘接强度 | 250℃老化后粘接强度 |
3.6W/(m·K) | 3.67MPa | 2.83MPa | 2.75MPa |
导热系数 | 室温粘接强度 | 200℃老化后粘接强度 | 250℃老化后粘接强度 |
4.5W/(m·K) | 3.18MPa | 2.64MPa | 2.43MPa |
Claims (4)
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CN201510955356.5A CN105419724B (zh) | 2015-12-16 | 2015-12-16 | 多种碳材料掺杂高导热有机硅胶粘剂及其制备方法 |
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CN201510955356.5A CN105419724B (zh) | 2015-12-16 | 2015-12-16 | 多种碳材料掺杂高导热有机硅胶粘剂及其制备方法 |
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CN105419724A CN105419724A (zh) | 2016-03-23 |
CN105419724B true CN105419724B (zh) | 2018-07-06 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105802565B (zh) | 2016-04-27 | 2019-01-08 | 京东方科技集团股份有限公司 | 封框胶及其制备方法、显示面板及其制备方法、显示装置 |
CN107216850A (zh) * | 2017-06-20 | 2017-09-29 | 东莞市联洲知识产权运营管理有限公司 | 一种高导热高导电有机硅胶粘剂及其制备方法 |
CN109868113A (zh) * | 2019-03-28 | 2019-06-11 | 张建华 | 一种电机灌封胶及其制备方法 |
CN113957707B (zh) * | 2021-09-24 | 2023-06-30 | 国网冀北电力有限公司电力科学研究院 | 一种复合导热填料及其制备方法、导热塑料材料与应用 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101017067A (zh) * | 2006-02-11 | 2007-08-15 | 鸿富锦精密工业(深圳)有限公司 | 散热板及其制备方法 |
CN103665882A (zh) * | 2012-09-19 | 2014-03-26 | 浙江三元电子科技有限公司 | 一种导热硅橡胶复合材料、导热硅胶片及其制备方法 |
CN104559149A (zh) * | 2014-12-16 | 2015-04-29 | 惠州力王佐信科技有限公司 | 一种碳素复合高导热塑料材料及其制备方法 |
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- 2015-12-16 CN CN201510955356.5A patent/CN105419724B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101017067A (zh) * | 2006-02-11 | 2007-08-15 | 鸿富锦精密工业(深圳)有限公司 | 散热板及其制备方法 |
CN103665882A (zh) * | 2012-09-19 | 2014-03-26 | 浙江三元电子科技有限公司 | 一种导热硅橡胶复合材料、导热硅胶片及其制备方法 |
CN104559149A (zh) * | 2014-12-16 | 2015-04-29 | 惠州力王佐信科技有限公司 | 一种碳素复合高导热塑料材料及其制备方法 |
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