CN105393650B - 导电布线的制造方法以及导电布线 - Google Patents
导电布线的制造方法以及导电布线 Download PDFInfo
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Abstract
导电布线的制造方法,具有:以成为规定的图案的方式将墨(2)印刷于绝缘基板(1)的工序(S1)、在被印刷的墨(2)干燥之前将导电性粉末(3)载置(散布)于墨(2)(成为规定的图案)的工序(S2)、将所载置的导电性粉末(3)向绝缘基板(1)按压而压缩的工序(S3)以及对被压缩的导电性粉末(3)加热而使其烧结的工序(S4),通过这样的一系列的工序(S1~S4)来制造导电布线(20)。
Description
技术领域
本发明涉及导电布线的制造方法以及导电布线,特别是涉及通过导电性粉体形成的导电布线的制造方法以及导电布线。
背景技术
以往,作为在绝缘基材上形成导电布线的方法,有在对形成于绝缘基材上的铜箔进行蚀刻之后进行烧结的照相平版印刷工作方案、在将导电膏丝网印刷、喷墨印刷在绝缘基材上之后进行烧结的印刷工作方案。
而且,公开了目标为同时消除照相平版印刷工作方案中工序数多的问题还有在印刷工作方案中使用于导电膏的金属粒子容易表面氧化的问题、使用含有作为具有微米量级粒径的金属材料的金属微米粒子和作为具有纳米量级粒径的金属材料的金属纳米粒子的导电膏的电路基板制造方法(例如参照专利文献1)。
现有技术文献。
专利文献。
专利文献1:特开2007-53212号公报(第6页、图1)。
发明内容
发明要解决的课题
在专利文献1公开的发明是将含有金属微米粒子和金属纳米粒子的导电膏通过丝网印刷供给至绝缘基板,在低氧包围气下烧制而使金属纳米粒子烧结的发明。因此,存在难以选定满足对适合于丝网印刷的流动性的确保以及对电阻值的增大的抑制这两方的导电膏的问题。即,为了与形成于绝缘基板上的导电布线的特性相应地设定金属微米粒子的材质和粒径、金属纳米粒子的材质和粒径、溶剂的种类以及各自的量(各自在导电膏中所占的比例)而需要大量的试验和很长的时间。
本发明是消除上述问题的发明,在于提供一种在没有通过丝网印刷将导电膏供给至绝缘基板的情况下就能够容易地在绝缘基板上形成期望特性的导电布线的导电布线的制造方法以及利用该导电布线的制造方法形成的导电布线。
用于解决课题的方案
(1)本发明的导电布线的制造方法具有:以成为规定的图案的方式将墨印刷于绝缘基板的工序;在所述所印刷的墨干燥之前,将导电性粉末载置于所述墨上的工序;将所述所载置的导电性粉末向所述绝缘基板按压而压缩的工序;以及对所述所压缩的导电性粉末加热而使其烧结的工序。
(2)另外,朝向所述所压缩的导电性粉末照射紫外线或激光来进行所述加热。
(3)另外,所述导电性粉末为1~50微米的细粒。
(4)另外,所述绝缘基板为白色或透明,所述激光为YAG激光。
(5)进一步地,通过在所述(1)~(4)中的任一项记载的导电布线的制造方法来形成本发明的导电布线。
发明的效果
(i)在通过丝网印刷等将导电膏供给至绝缘基板的方法中,处于墨内的导电性粉末使印刷精度恶化且也不能提高导电粉末的密度,与此相对,本发明的导电布线的制造方法由于能够容易地选定适合于规定的图案的印刷的墨,因此能够提高印刷精度。另外,能够提高导电布线的密度并能够使导电性良好,而且还没有以往那样的选定满足丝网印刷性和电传导性这两方的导电膏的麻烦,作业变得迅速。
(ii)另外,由于通过紫外线或激光的照射来进行烧结,因此能够廉价地制造导电布线。此外,导电性粉末的材质不是限定的材质,是铜、铜合金、或者银、银合金等。
(iii)另外,由于导电性粉末是1~50微米(μm)的细粒,因此能够促进烧结、进一步提高导电布线的密度,能够进一步地使导电性良好。
(iv)另外,由于使绝缘基板为白色或透明、向白色或透明的绝缘基板照射具有通过白色或透明的基材的性质的YAG激光,因此能够抑制绝缘基板的发热。因而,成为不需要将绝缘基板限定为具有耐热性的材料(例如陶瓷板等),因此绝缘基板的选择分支扩大,通过使用廉价的绝缘基板,能够廉价地制造导电布线。
(v)另外,由于本发明的导电布线是通过具有在所述(i)~(iv)中的任一个记载的效果的导电布线制造方法而形成的,因此具有良好的导电率,价格便宜。
附图说明
图1是说明本发明的实施方式1的导电布线的制造方法的流程图。
图2A是示意性地示出本发明的实施方式1的导电布线的制造方法中的绝缘基板的侧视截面图。
图2B是示意性地示出本发明的实施方式1的导电布线的制造方法中的各工序的侧视截面图。
图2C是示意性地示出本发明的实施方式1的导电布线的制造方法中的对导电性粉末进行载置(散布)的工序的侧视截面图。
图2D是示意性地示出本发明的实施方式1的导电布线的制造方法中的将导电性粉末向绝缘基板按压而压缩的工序的侧视截面图。
图2E是示意性地示出本发明的实施方式1的导电布线的制造方法中的对所压缩的导电性粉末3加热而使其烧结的工序的侧视截面图。
图3是示意性地示出本发明的实施方式2的导电布线的侧视截面图。
具体实施方式
[实施方式1]
图1和图2是对本发明的实施方式1的导电布线的制造方法以及通过这样的导电布线的制造方法制造出的导电布线进行说明的图,图1是流程图,图2A~图2E是示意性地示出各工序的侧视截面图。此外,图2A~图2E是示意性地将一部分夸大示出的图,本发明并不是限定于图示的方式(大小、数量)的发明。
在图1以及图2A~图2E中,导电布线的制造方法具有:以成为规定的图案的方式将墨2印刷于绝缘基板1(图2A)的工序(图1的S1、图2B)、在印刷的墨2干燥之前将导电性粉末3载置(散布)于墨2(成为规定的图案)的工序(图1的S2、图2C)、将所载置的导电性粉末3向绝缘基板1按压而压缩的工序(图1的S3、图2D)以及对被压缩的导电性粉末3加热而使其烧结的工序(图1的S4、图2E),通过这样的一系列的工序(S1~S4)来制造导电布线20。
此外,在本发明中,压缩的工序(S3)和加热并烧结的工序(S4)不是限定于连续地进行的工序,也可以同时进行。
此时,导电性粉末3例如是铜、铜合金的细粒,例如平均粒径为1~200微米,但是本发明并不是限定导电性粉末3的平均粒径的范围的发明。但是,当使导电性粉末3为平均粒径为1~50微米的范围的细粒时,能够促进烧结、进一步提高导电布线20的密度,能够使导电性进一步良好。
而且,在所印刷的墨2干燥之前将导电性粉末3散布于绝缘基板1,因此导电性粉末3附着于干燥之前的墨2(用单斜线示出),成为附着于墨2的导电性粉末3描绘规定的图案。
另外,朝向被压缩的导电性粉末3照射激光(例如YAG激光)30来进行所述加热。
此外,在激光照射之前,由于附着于墨2的导电性粉末3被压缩(使墨2和导电性粉末3在一起用复斜线示出),因此导电性粉末3彼此的间隔(准确地为空孔(pore)的大小)变小而密度提高,由此能够促进烧结,能够在更低温下更迅速地实施加热作业(涂布烧结的导电性粉末4而示出)。此外,关于加热,也可以代替激光30而照射紫外线(标准光)。
即,由于本发明的导电布线的制造方法不是通过丝网印刷等将导电膏供给至绝缘基板1的方法,因此能够容易地选定适合于规定的图案的印刷的墨2,另外,由于能够容易地选定与导电布线的特性相应的导电性粉末3,因此能够提高印刷精度、提高烧结的导电粉末4的密度,能够使导电性良好。另外,没有如以往那样的选定满足丝网印刷性和电传导性这两方的导电膏的麻烦,作业变得迅速。
另外,当使导电性粉末3为1~50微米的细粒时,通过紫外线或激光的照射来促进烧结,因此能够廉价地制造高导电性的导电布线(烧结的导电粉末4)。
此时,使绝缘基板1为白色或透明,如果作为激光照射YAG激光,则由于YAG激光具有通过白色或透明的基材的性质,因此能够抑制绝缘基板1的发热。因而,不需要将绝缘基板1限定为具有耐热性的材料(例如陶瓷板等),因此绝缘基板的选择分支扩大,通过使用廉价的绝缘基板,从而能够廉价地制造导电布线20(参照实施方式2)。
此外,在图2D 中,颗粒状的导电性粉末3附着于附有复斜线的部分(墨2和导电性粉末3)之上,各个厚度成为大致相同,但是本发明并不是被限定于此的发明,也可以使各个厚度中的任一个变厚,另外,附着于附有复斜线的部分之上的导电性粉末3不是被限定于一层的粉末。进一步地,也可以没有附着于附有复斜线的部分之上的导电性粉末3,而仅为附有复斜线的部分。
[实施方式2]
图3是示出本发明的实施方式2的导电布线的侧视截面图。此外,对与图2相同的部分附加相同的附图标记,省略一部分的说明。
在图3中,导电布线20呈由烧结在绝缘基板1上的导电性粉末4描绘的规定的图案。此时,导电布线20是利用导电布线的制造方法形成的导电布线,因此具有良好的导电率且价格便宜。
此外,绝缘基板1不是限定于平面的绝缘基板,也可以是曲面。另外,由导电性粉末3描绘的图案不是被限定的图案,导电性粉末3的材质(成分)也不是被限定的材质(成分)。
产业上的可利用性
根据本发明,能够容易且廉价地制造期望的图案的导电布线,因此能够作为在各种形状的绝缘基板上制造导电布线的方法而广泛地利用。
附图标记的说明
1:绝缘基板;2:墨;3:导电性粉末;4:烧结的导电性粉末;20:导电布线;30:激光。
Claims (3)
1.一种导电布线的制造方法,其特征在于,具有:
以成为规定的图案的方式将墨(2)印刷于绝缘基板(1)的工序;
在被印刷的所述墨(2)干燥之前,将导电性粉末(3)载置于所述墨(2)上的工序;
将所载置的所述导电性粉末(3)向所述绝缘基板(1)按压而压缩的工序;以及
对被压缩的所述导电性粉末(3)加热而使其烧结的工序,
将所述绝缘基板(1)设为白色或透明的基材,
朝向被压缩的所述导电性粉末(3)照射YAG激光来进行所述加热。
2.根据权利要求1所述的导电布线的制造方法,其特征在于,
所述导电性粉末(3)为1~50微米的细粒。
3.一种导电布线,其特征在于,通过在权利要求1到2中的任一项记载的导电布线的制造方法来形成。
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