CN105193246A - Cooling system and electric pressure cooker - Google Patents
Cooling system and electric pressure cooker Download PDFInfo
- Publication number
- CN105193246A CN105193246A CN201510681057.7A CN201510681057A CN105193246A CN 105193246 A CN105193246 A CN 105193246A CN 201510681057 A CN201510681057 A CN 201510681057A CN 105193246 A CN105193246 A CN 105193246A
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- Prior art keywords
- air
- cooling system
- cooling
- air inlet
- semiconductor chilling
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- 238000001816 cooling Methods 0.000 title claims abstract description 98
- 239000004065 semiconductor Substances 0.000 claims abstract description 52
- 239000007788 liquid Substances 0.000 claims abstract description 30
- 238000010411 cooking Methods 0.000 claims description 24
- 230000005611 electricity Effects 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 12
- 230000017525 heat dissipation Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 235000016709 nutrition Nutrition 0.000 description 1
- 230000035764 nutrition Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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- Cookers (AREA)
Abstract
The invention relates to the technical field of heat dissipation devices, in particular to a cooling system and an electric pressure cooker. The cooling system comprises an air inlet device, an air exhaust device and a liquid cooling circulating device; the air inlet device and the air exhaust device form cooling circulating air; the liquid cooling circulating device comprises a semiconductor refrigerating sheet, a radiator, a refrigerating pipe and a cooling pipe; the refrigerating pipe is connected with the cooling pipe through a connecting pipeline to form a liquid circulation pipeline; the semiconductor refrigeration piece is arranged at an air inlet of the air exhaust device through the radiator, the semiconductor refrigeration piece comprises a cold end and a hot end, the cold end of the semiconductor refrigeration piece is arranged to be attached to the refrigeration pipe, and the hot end of the semiconductor refrigeration piece is arranged to be attached to the radiator. Meanwhile, the invention also provides the electric pressure cooker adopting the cooling system. The cooling system has higher cooling efficiency by matching cooling circulating air with liquid circulating cooling, and the semiconductor refrigerating sheet continues to work after the cooled object is cooled to the room temperature due to the refrigeration of the semiconductor refrigerating sheet, so that the refrigerating function is realized.
Description
Technical field
The present invention relates to heat abstractor technical field, particularly relate to a kind of cooling system and electric pressure cooking saucepan.
Background technology
Electric pressure cooking saucepan because of can fast cooking and in cooking process food nutrition loss be subject to people and like less.But after electric pressure cooking saucepan culinary art end-of-job, because having high pressure in pot, user can not open pot cover at once, and pressure limiting valve exhausting step-down must be unpluged, or allow food in pot naturally cool, just can open lid after waiting pot inner pressure to reduce and take out food, use convenient and swift not.In addition, unplug in the process of pressure limiting valve exhausting step-down user, if the interior culinary art of pot is slop, then the slop in pot is easily sprayed from exhaust ports by gases at high pressure, brings danger to user, also can pollute pot body outer surface and environment simultaneously.
For the problems referred to above, make some to electric pressure cooking saucepan in prior art to improve, such as add water cooling equipment, as Chinese patent application provides a kind of electric pressure cooking saucepan of quick cooling, comprise pot body and pot cover, inner bag is provided with in described pot body, described pot cover comprises upper cover and inner cap, flying height is provided with between described inner cap and described upper cover, the height of described flying height is less than 3.5mm, described inner cap and described inner bag are formed cooks cavity, cooling chamber is covered with in described, described cooling chamber is communicated with water inlet and delivery port, wherein, the top of described inner cap is also provided with the intermediate plate floated together with inner cap, described intermediate plate is provided with water supply connector and water out adapter, described water supply connector and water inlet Butt sealing, described water out adapter and delivery port Butt sealing.
Although aforesaid way can improve the radiating efficiency of electric pressure cooking saucepan to a certain extent, although above-mentioned water-cooling system can cool electric pressure cooking saucepan, its complicated structure, water source as external in needs and discharge pipe line, and cooling effectiveness is lower.
For the problems referred to above, we need the simple structure of a kind of employing, and have cooling system and the electric pressure cooking saucepan of higher cooling effectiveness.
Summary of the invention
The object of the invention is to propose a kind of cooling system, the structural load that existing radiator structure cooling structure exists, the problem that radiating efficiency is low can be solved.
Another object of the present invention is to propose a kind of electric pressure cooking saucepan adopting above-mentioned cooling system.
For reaching this object, the present invention by the following technical solutions:
A kind of cooling system, it comprises air-intake device, air exhausting device and liquid cools EGR;
Described air-intake device and air exhausting device form cool cycles wind;
Described liquid cools EGR comprises semiconductor chilling plate, radiator, refrigerator pipes and cooling tube;
Described refrigerator pipes is connected to form liquid circulation line by connecting line and cooling tube;
Described semiconductor chilling plate is arranged on the air inlet of air exhausting device by radiator, and described semiconductor chilling plate comprises cold junction and hot junction, and its cold junction is close to refrigerator pipes and is arranged, and its hot junction held against heat sink is arranged.
As a kind of preferred version of above-mentioned cooling system, also comprise temperature difference electricity generation device, and the quantity of air exhausting device is at least two;
Described temperature difference electricity generation device comprises thermo-electric generation sheet and generating sheet heat radiator;
The side of described generating sheet heat radiator and the cold junction of thermo-electric generation sheet are fitted and are arranged, and the other end is arranged on the upper end of air exhausting device;
Described thermo-electric generation sheet is electrically connected with semiconductor chilling plate, and powers for semiconductor chilling plate.
As a kind of preferred version of above-mentioned cooling system, described air exhausting device comprises exhaust outlet and is arranged on the air ejector fan at exhaust outlet place, and described semiconductor chilling plate is arranged on the air inlet of air ejector fan by radiator;
Described air-intake device comprises air inlet and is arranged on the air inlet fan of air inlet.
As a kind of preferred version of above-mentioned cooling system, the air inlet of described air-intake device and the exhaust outlet interval of air exhausting device are arranged, and are provided with grid at the air inlet of air-intake device and the exhaust outlet place of air exhausting device.
As a kind of preferred version of above-mentioned cooling system, described refrigerator pipes and cooling tube are coiled structure.
As a kind of preferred version of above-mentioned cooling system, described refrigerator pipes and cooling tube are copper pipe or aluminum pipe.
As a kind of preferred version of above-mentioned cooling system, the connecting line between described refrigerator pipes and cooling tube is provided with liquid circulation pump.
As a kind of preferred version of above-mentioned cooling system, between described semiconductor chilling plate and radiator, be provided with heat-conducting medium.
As a kind of preferred version of above-mentioned cooling system, also comprise control device, described control device is electrically connected with semiconductor chilling plate, to control the duty of semiconductor chilling plate.
A kind of electric pressure cooking saucepan, comprises shell, outer pot, interior pot, heating element and cooling system as previously discussed;
Described cooling tube is arranged between outer pot and interior pot, for the cooling of interior pot;
The air inlet of described air-intake device, the exhaust outlet of air exhausting device is all opened on enclosure bottom, and there is spacing between refrigerator pipes and outer pot.
Beneficial effect of the present invention is: the present invention by the refrigeration of semiconductor chilling plate for liquid circulation line provides cold, cool cycles wind can be formed between air-intake device and air exhausting device, what cool cycles wind and liquid-circulating cooled has higher cooling effectiveness with the use of cooling system, owing to there is the refrigeration of semiconductor chilling plate after cooled object cool to room temperature, semiconductor chilling plate works on, and realizes refrigerating function.
Accompanying drawing explanation
Fig. 1 is the structural representation of the cooling system that the specific embodiment of the invention provides;
Fig. 2 is the decomposing state schematic diagram of the refrigeration system that the specific embodiment of the invention provides;
Fig. 3 is the internal structure schematic diagram of the electric pressure cooking saucepan that the specific embodiment of the invention provides;
Fig. 4 is the structural representation that fluid circulation system that the specific embodiment of the invention provides coordinates with outer pot;
Fig. 5 is the structural representation that cooling tube that the specific embodiment of the invention provides coordinates with outer pot, interior pot;
Fig. 6 is the structural representation of the drain pan that the specific embodiment of the invention provides.
Wherein:
1: semiconductor chilling plate; 2: radiator; 3: refrigerator pipes; 4: cooling tube; 5: connecting line; 6: exhaust outlet; 7: air ejector fan; 8: air inlet; 9: air inlet fan; 10: liquid circulation pump; 11: shell; 12: outer pot; 13: interior pot; 14: heating element; 15: drain pan;
101: cold junction; 102: hot junction.
Detailed description of the invention
Technical scheme of the present invention is further illustrated by detailed description of the invention below in conjunction with accompanying drawing.
As shown in Figures 1 to 6, present embodiments provide for a kind of cooling system, this cooling system comprises air-intake device, air exhausting device and liquid cools EGR, forms cool cycles wind between air-intake device and air exhausting device.Liquid cools EGR comprises semiconductor chilling plate 1, radiator 2, refrigerator pipes 3 and cooling tube 4, and refrigerator pipes 3 is connected to form liquid circulation line by connecting line 5 and cooling tube 4.Semiconductor chilling plate 1 is arranged on the air inlet of air exhausting device by radiator 2, and semiconductor chilling plate 1 comprises cold junction 101 and hot junction 102, and its cold junction 101 is close to refrigerator pipes 3 and is arranged, and its hot junction 102 held against heat sink 2 is arranged.
Present embodiment is by the refrigeration of semiconductor chilling plate 1 for liquid circulation line provides cold, and semiconductor chilling plate 1 is by improving its radiating efficiency with coordinating of air exhausting device.Cool cycles wind can be formed between air-intake device and air exhausting device, what cool cycles wind and liquid-circulating cooled has higher cooling effectiveness with the use of cooling system, owing to there is the refrigeration of semiconductor chilling plate 1 after cooled object cool to room temperature, semiconductor chilling plate 1 works on, and realizes refrigerating function.
Cooling system also comprises temperature difference electricity generation device (not shown), and the quantity of air exhausting device is at least two, and the air inlet of part air exhausting device is provided with semiconductor chilling plate 1, and the air inlet of part air exhausting device is provided with temperature difference electricity generation device.
Temperature difference electricity generation device comprises thermo-electric generation sheet and generating sheet heat radiator, the generating side of sheet heat radiator and the cold junction of thermo-electric generation sheet are fitted and are arranged, the other end is arranged on the upper end of air exhausting device, and thermo-electric generation sheet is electrically connected with semiconductor chilling plate, and powers for semiconductor chilling plate.Concrete, hot junction and the thing to be cooled of thermo-electric generation sheet are fitted, and thus, the raw heat of produce to be cooled can be utilized to carry out generating for semiconductor chilling plate 1, saved the use of the energy.
With reference to Fig. 3, Fig. 6, air exhausting device comprises exhaust outlet 6 and is arranged on the air ejector fan 7 at exhaust outlet 6 place, and semiconductor chilling plate 1 is arranged on the air inlet of air ejector fan 7 by radiator 2, air-intake device comprises air inlet 8 and is arranged on the air inlet fan 9 at air inlet 8 place.
In order to prevent the air inlet/outlet between air inlet 8 and exhaust outlet 6 from mutually disturbing, air inlet 8 and exhaust outlet 6 interval are arranged.In order to prevent foreign material from entering air-intake device and air exhausting device, be provided with grid at air inlet 8 and exhaust outlet 6 place.
With reference to Fig. 4, in order to improve the heat exchange efficiency between refrigerator pipes 3 and semiconductor chilling plate 1, heat exchange efficiency between cooling tube 4 and thing to be cooled, refrigerator pipes 3 and cooling tube 4 are coiled structure, and the making material that refrigerator pipes 3 and cooling tube 4 adopt is copper pipe or aluminum pipe.
In order to improve the efficiency of liquid-circulating in liquid circulation line, the connecting line between refrigerator pipes 3 and cooling tube 4 is provided with liquid circulation pump 10.
In order to improve the heat exchange efficiency between semiconductor chilling plate 1 and radiator 2, between semiconductor chilling plate 1 and radiator 2, be provided with heat-conducting medium.As preferably, semiconductor chilling plate 1 is fitted on radiator 2 by heat conductive silica gel.
Cooling system also comprises control device, and control device is electrically connected with semiconductor chilling plate 1, thermo-electric generation sheet, air inlet fan 9, air ejector fan 7, to control the duty of semiconductor chilling plate 1, thermo-electric generation sheet, air inlet fan 9, air ejector fan 7.
Above-mentioned cooling system may be used for the equipment cooling that computer, electromagnetic oven, electric pressure cooking saucepan etc. need cooling, in the present embodiment, be applied on electric pressure cooking saucepan for cooling system and be described in detail, specifically as described below: with reference to Fig. 3 to Fig. 6, a kind of electric pressure cooking saucepan, comprise shell 11, outer pot 12, interior pot 13, heating element 14, and cooling system as previously discussed.Cooling tube 4 is arranged between outer pot 12 and interior pot 13, and for the cooling of interior pot 13, the air inlet 8 of air-intake device, the exhaust outlet 6 of air exhausting device is all opened on enclosure bottom, and there is spacing between refrigerator pipes 3 and outer pot 12.
Concrete further, the bottom of shell 11 is drain pan 15, air-intake device comprises air inlet 8 and air inlet fan 9, air exhausting device comprises exhaust outlet 6 and air ejector fan 7, the quantity of air-intake device and air exhausting device can set according to actual needs, in the present embodiment, be described in detail for an air-intake device and an air exhausting device.Air inlet 8 and exhaust outlet 6 are opened on drain pan 15 bottom surface, air inlet fan 9 and air ejector fan 7 are arranged on corresponding position, the air of drain pan 15 inside forms air with the air in the electric pressure cooking saucepan external world and circulates under the effect of air-intake device and air exhausting device, can internally be lowered the temperature by pot 13 by air circulation.Semiconductor chilling plate 1 is arranged on air inlet 8 place of air ejector fan by radiator 2, and semiconductor chilling plate 1 comprises cold junction 101 and hot junction 102, and its cold junction 101 is close to refrigerator pipes 3 and is arranged, and its hot junction 102 held against heat sink 2 is arranged.Refrigerator pipes 3, cooling tube 4, liquid circulation pump 10 form liquid circulation line by pipeline, and the liquid in circulation line, under the driving of liquid circulation pump 10, circulates, and form liquid-circulating cooling system.Cooling tube 4 is close to outer pot 12 inwall and is arranged, and interior pot 13 is set in outer pot 12, interior pot 13 is put into pot 13 after outer pot 12 and contacts with cooling tube 4, is cooled by the liquid-circulating internal pot 13 that flows.Liquid circulation pump 10 is arranged on the outer wall of outer pot 12, and outer pot 12 is provided with the mouth of pipe, and connecting line 5 passes the mouth of pipe to connect cooling tube 4, refrigerator pipes 3 and liquid circulation pump 10.
The concrete cooling procedure of above-mentioned electric pressure cooking saucepan is: natural wind enters in electric pressure cooking saucepan by drain pan 15 air inlet 8 under the ordering about of air inlet fan 9, hot blast in electric pressure cooking saucepan is discharged outside electric pressure cooking saucepan by drain pan 15 exhaust outlet 6 under the ordering about of air ejector fan 7, hot-air and cool exterior air in electric pressure cooking saucepan is made to carry out alternately flowing, take away unnecessary heat, a pot body fast cooling cooling can be realized.Under the ordering about of liquid circulation pump 10, cooling tube 4 flows with the liquid-circulating of refrigerator pipes 3 li, and wherein liquid is when cooling tube 4, the heat heating of pot 13 in the liquid absorption in cooling tube 4, liquid, when refrigerator pipes 3, is cooled under the refrigeration of semiconductor chilling plate 1.The cooperation cooled by circulated air cooling and liquid-circulating can realize the quick cooling of interior pot 13, and meanwhile, when temperature is down to normal temperature, semiconductor chilling plate 1 can continue cooling and realize refrigerating function.
Below know-why of the present invention is described in conjunction with specific embodiments.These describe just in order to explain principle of the present invention, and can not be interpreted as limiting the scope of the invention by any way.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other detailed description of the invention of the present invention, and these modes all will fall within protection scope of the present invention.
Claims (10)
1. a cooling system, is characterized in that, comprises air-intake device, air exhausting device and liquid cools EGR;
Described air-intake device and air exhausting device form cool cycles wind;
Described liquid cools EGR comprises semiconductor chilling plate (1), radiator (2), refrigerator pipes (3) and cooling tube (4);
Described refrigerator pipes (3) is connected to form liquid circulation line by connecting line (5) and cooling tube (4);
Described semiconductor chilling plate (1) is arranged on the air inlet of air exhausting device by radiator (2), described semiconductor chilling plate (1) comprises cold junction (101) and hot junction (102), its cold junction (101) is close to refrigerator pipes (3) and is arranged, and its hot junction (102) held against heat sink (2) is arranged.
2. cooling system according to claim 1, it is characterized in that, also comprise temperature difference electricity generation device, and the quantity of air exhausting device is at least two, and the air inlet of part air exhausting device is provided with semiconductor chilling plate (1), the air inlet of part air exhausting device is provided with temperature difference electricity generation device;
Described temperature difference electricity generation device comprises thermo-electric generation sheet and generating sheet heat radiator;
The side of described generating sheet heat radiator and the cold junction of thermo-electric generation sheet are fitted and are arranged, and the other end is arranged on the upper end of air exhausting device;
Described thermo-electric generation sheet is electrically connected with semiconductor chilling plate (1), and is semiconductor chilling plate (1) power supply.
3. cooling system according to claim 1 and 2, it is characterized in that, described air exhausting device comprises exhaust outlet (6) and is arranged on the air ejector fan (7) at exhaust outlet (6) place, and described semiconductor chilling plate (1) is arranged on the air inlet of air ejector fan (7) by radiator (2);
Described air-intake device comprises air inlet (8) and is arranged on the air inlet fan (9) at air inlet (8) place.
4. cooling system according to claim 3, it is characterized in that, the air inlet (8) of described air-intake device and exhaust outlet (6) interval of air exhausting device are arranged, and are provided with grid at the air inlet (8) of air-intake device and exhaust outlet (6) place of air exhausting device.
5. cooling system according to claim 1 and 2, is characterized in that, described refrigerator pipes (3) and cooling tube (4) are coiled structure.
6. cooling system according to claim 1 and 2, is characterized in that, described refrigerator pipes (3) and cooling tube (4) are copper pipe or aluminum pipe.
7. cooling system according to claim 1 and 2, is characterized in that, the connecting line between described refrigerator pipes (3) and cooling tube (4) is provided with liquid circulation pump (10).
8. cooling system according to claim 1 and 2, is characterized in that, is provided with heat-conducting medium between described semiconductor chilling plate (1) and radiator (2).
9. cooling system according to claim 1 and 2, is characterized in that, also comprises control device, and described control device is electrically connected with semiconductor chilling plate (1), to control the duty of semiconductor chilling plate (1).
10. an electric pressure cooking saucepan, comprises shell (11), outer pot (12), interior pot (12) and heating element (14), it is characterized in that, also comprise the cooling system as described in claim 1 to 9 any one;
Described cooling tube (4) is arranged between outer pot (12) and interior pot (13), for the cooling of interior pot (12);
The air inlet (8) of described air-intake device, the exhaust outlet (6) of air exhausting device is all opened on shell (11) bottom surface, and there is spacing between refrigerator pipes (3) and outer pot (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510681057.7A CN105193246B (en) | 2015-10-19 | 2015-10-19 | Cooling system and electric pressure cooker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510681057.7A CN105193246B (en) | 2015-10-19 | 2015-10-19 | Cooling system and electric pressure cooker |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105193246A true CN105193246A (en) | 2015-12-30 |
| CN105193246B CN105193246B (en) | 2018-05-01 |
Family
ID=54941501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510681057.7A Active CN105193246B (en) | 2015-10-19 | 2015-10-19 | Cooling system and electric pressure cooker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105193246B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105476448A (en) * | 2016-02-02 | 2016-04-13 | 广东天际电器股份有限公司 | Anti-sticking method and device for electric cooker |
| CN107836987A (en) * | 2016-09-21 | 2018-03-27 | 佛山市顺德区美的电热电器制造有限公司 | Humidity control system and cooking apparatus |
| CN110432758A (en) * | 2018-05-03 | 2019-11-12 | 宁波方太厨具有限公司 | Steam box steam heat recovery structure and steam box with the structure |
| CN110547675A (en) * | 2019-10-15 | 2019-12-10 | 珠海格力电器股份有限公司 | Pot courage cooling subassembly and electric pressure cooker |
| CN111671298A (en) * | 2020-06-28 | 2020-09-18 | 福清市诚冠科技有限公司 | Autoclave with cooling function |
| CN114305059A (en) * | 2020-09-30 | 2022-04-12 | 佛山市顺德区美的电热电器制造有限公司 | Cooking apparatus, control method of cooking apparatus, and computer-readable storage medium |
| CN114337375A (en) * | 2021-12-22 | 2022-04-12 | 北京化工大学 | Passive radiator, thermoelectric power generation device and thermoelectric power generation system |
| CN114938914A (en) * | 2021-11-05 | 2022-08-26 | 广东美芝制冷设备有限公司 | Refrigeration control method, control device and cooking appliance |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105476448A (en) * | 2016-02-02 | 2016-04-13 | 广东天际电器股份有限公司 | Anti-sticking method and device for electric cooker |
| CN107836987A (en) * | 2016-09-21 | 2018-03-27 | 佛山市顺德区美的电热电器制造有限公司 | Humidity control system and cooking apparatus |
| CN110432758A (en) * | 2018-05-03 | 2019-11-12 | 宁波方太厨具有限公司 | Steam box steam heat recovery structure and steam box with the structure |
| CN110547675A (en) * | 2019-10-15 | 2019-12-10 | 珠海格力电器股份有限公司 | Pot courage cooling subassembly and electric pressure cooker |
| CN111671298A (en) * | 2020-06-28 | 2020-09-18 | 福清市诚冠科技有限公司 | Autoclave with cooling function |
| CN114305059A (en) * | 2020-09-30 | 2022-04-12 | 佛山市顺德区美的电热电器制造有限公司 | Cooking apparatus, control method of cooking apparatus, and computer-readable storage medium |
| CN114938914A (en) * | 2021-11-05 | 2022-08-26 | 广东美芝制冷设备有限公司 | Refrigeration control method, control device and cooking appliance |
| CN114337375A (en) * | 2021-12-22 | 2022-04-12 | 北京化工大学 | Passive radiator, thermoelectric power generation device and thermoelectric power generation system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105193246B (en) | 2018-05-01 |
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