CN104942858B - The method for dividing and break-up device of resin sheet - Google Patents
The method for dividing and break-up device of resin sheet Download PDFInfo
- Publication number
- CN104942858B CN104942858B CN201410798905.8A CN201410798905A CN104942858B CN 104942858 B CN104942858 B CN 104942858B CN 201410798905 A CN201410798905 A CN 201410798905A CN 104942858 B CN104942858 B CN 104942858B
- Authority
- CN
- China
- Prior art keywords
- resin sheet
- platform
- disjunction
- box
- shaped body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/141—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter for thin material, e.g. for sheets, strips or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The present invention relates to the method for dividing of resin sheet and break-up device, project adequately disjunction resin sheet.Resin sheet (33) are kept on the adhesive tape (32) that stretching, extension is held in cut ring (31), and cut ring (31) is fixed on the platform (16) of break-up device.Relatively move scribe head (27) relative to platform (16), roll stitch marker (28) on resin sheet (33), it crosses to resin sheet (33), thus separation resin piece (33).In this way, can be with high precision by resin sheet disjunction at required shape due to using stitch marker.
Description
Technical field
The present invention relates to a kind of method for dividing and break-up device for resin sheets such as disjunction silicone sheets.
Background technique
Patent Document 1 discloses a kind of methods that thermoplastic resin sheet is cut off using cutter blades.It will when cutting
Blade heating, and make cutter blades biting direction back and forth movement and cut off.In addition, Patent Document 2 discloses one
Kind method, when cutting off one piece of resin sheet, is cut off to remove flash when cutting using upper and lower two blades.
[background technology document]
[patent document]
[patent document 1] Japan Patent examined patent publication 61-10280 bulletin
No. 3625146 bulletins of [patent document 2] Japan Patent
Summary of the invention
[problems to be solved by the invention]
It is to cut off cutter blades biting direction back and forth movement in the past in disjunction resin sheet, it is therefore, in distress
The problem of accurately carrying out disjunction etc with high precision.In addition, being difficult in the method cut off using upper and lower two blades
The problem of keeping upper and lower cutter blades accurately consistent etc.
The purpose of the present invention is to provide a kind of method for dividing for capableing of accurately disjunction resin sheet.
[technical means to solve problem]
In order to solve described problem, the method for dividing of resin sheet of the invention be by keeping resin sheet on platform, it is right
The resin sheet applies loading and rolls stitch marker, and disjunction resin sheet.
In order to solve described problem, the method for dividing of resin sheet of the invention is by being held on the inside of box-shaped body in stretching, extension
Adhesive tape upper surface adhere and keep resin sheet, the box-shaped body is kept on platform, to the institute being held on the box-shaped body
Stating resin sheet and applying loading and rolls stitch marker, and disjunction resin sheet, and is made and opening the adhesive tape from lower surface point
The resin sheet separation having no progeny.
In order to solve described problem, break-up device of the invention is used for the disjunction of resin sheet, and includes: box-shaped body, in glue
Take the resin sheet for being maintained as scribing line object；Platform keeps the box-shaped body；Scribe head makes stitch marker relative to described flat
The resin sheet that is kept on platform and go up and down；And relative mobile unit, relatively move the scribe head and the platform；And by making
The stitch marker rolls on the resin sheet, and disjunction resin sheet.
In this, the resin sheet can be silicone resin piece.
In this, the stitch marker can have 100 ° of point of a knife angles below.
[invention effect]
According to the present invention with such a feature, by the way that resin sheet is being held on adhesive tape and is being fixed on the shape on platform
State underscore and carry out disjunction, and make adhesive tape expand and separated.Therefore, can get can be with specific shape accurately disjunction
The effect of resin sheet.
Detailed description of the invention
Fig. 1 is the approximate stereogram of the break-up device of embodiments of the present invention.
Fig. 2 is the perspective view of the details for the resin sheet for indicating platform and being held in platform upper.
Fig. 3 is the side view for indicating to keep the state of cut ring on platform.
Fig. 4 is the perspective view for indicating to remain the state of cut ring on platform.
Fig. 5 (a), (b) are the perspective view and side view for the state for pressing adhesive tape from below after indicating scribing line and expanding.
Specific embodiment
Then, illustrate the break-up device of embodiments of the present invention.As shown in Figure 1, the break-up device 10 of present embodiment
In, mobile station 11 is remained along a pair of guide rails 12a, 12b and move freely in the y-axis direction.Ball screw 13 and movement
Platform 11 screws togather.Ball screw 13 is rotated by the driving of engine 14, makes mobile station 11 along guide rail 12a, 12b is in y-axis side
It moves up.Engine 15 is equipped in the upper surface of mobile station 11.Engine 15 rotates platform 16 in x/y plane, and is positioned to
Special angle.As described below, the mounting scribing line object substrate on the platform 16, and utilize vacuum suction unit (not shown) etc.
It is kept.
In break-up device 10, in a manner of the platform 16 across mobile station 11 and upper part, using pillar 21a, 21b and
Pontic 20 is set up along the x-axis direction.Bridge (beam) 22 is transversely provided on pontic 20, bridge 22 is equipped with driving portion 23.Driving
Portion 23 moves slide 24 along the x-axis direction, and includes engine 25 and feed screw 26, which, which is linked to, starts
Machine 25 and the flanking central for being rotatably freely held in bridge 22.Moreover, as shown in Figure 1, being installed with scribing line on slide 24
First 27.Chip carrier is installed in the lower end of scribe head 27.Disk-shaped stitch marker 28 is rotatably freely held in down by chip carrier
Portion.In the inside of scribe head 27, cylinder or Electronic control equipped with the lifting unit, such as pressure control that chip carrier can be made to go up and down
Linear motor etc..In present embodiment, use the stitch marker that apex angle is 100 ° as stitch marker 28.In addition, the shifting of platform 16
Motivation structure and the driving portion for keeping slide 24 mobile constitute relative mobile unit, which makes scribe head relative to platform
And it relatively moves.
Fig. 2 is the perspective view of the details for the resin sheet for indicating platform 16 and being held in 16 top of platform, and Fig. 3 is the side of Fig. 2
View.In present embodiment, disjunction object uses cut ring 31, the cut ring for silicone resin piece in order to keep the resin sheet
31 be the annulus box-shaped body used when semiconductor wafer to be separated into chip.As shown, the inside of cut ring 31 upward
It is pasted with the adhesive tape 32 with sticky material.The adhesive tape 32 is the adhesive tape of double-layer structure, with substrate layers such as vinyl chloride and thereon
The sticky material layer on surface.Substrate layer is for example 20 μm with a thickness of 80 μm, sticky material layer, and aggregate thickness is 100 μm.Moreover,
The upper face center of the adhesive tape 32 attaches disjunction object resin sheet 33, such as silicone resin piece.Resin sheet 33 has elasticity, in the past
It is not regarded as that disjunction can be carried out by scribing line.In present embodiment, resin sheet 33 is 0.005~1mm of thickness, in this such as thickness
The silicone resin piece of the substantially square shape of 0.1mm.By the resin sheet 33 accurately disjunction at 1 × 1mm square it is multiple just
Rectangular small resin sheet.
As shown in Fig. 2, loading the thin glass of protection of such as thickness 0.3mm or so on the platform 16 of the break-up device 10
Glass plate 34.Moreover, on platform 16, the configuration cuts ring 31 in such a way that resin sheet 33 is located at the top of glass plate 34.Moreover, from
Resin sheet 33 is kept using vacuum suction unit (not shown) etc. below platform 16.In this way, as shown in figure 3, the following table of adhesive tape 32
Face is adsorbed, and the resin sheet 33 of glass plate 34, adhesive tape 32 and its upper surface can be held on platform 16.
Next, illustrating the method for dividing of resin sheet 33.Firstly, being located at the side of the underface of stitch marker 28 with resin sheet 33
Formula moving sliding base 24 and platform 16.Then, decline scribe head 27, reach stitch marker 28 in the outside of resin sheet 33 and compare resin
The position of the upper surface of piece 33 slightly on the lower.It moves slide 24 along the x-axis direction, thus faces stitch marker 28
Resin sheet 33 applies loading one side and rolls and cross.In this way, can be by crossing come the resin sheets such as disjunction silicone resin 33.
Then, increase scribe head 27, after moving platform 16 slightly along the y-axis direction with specific spacing, make scribe head
27 declines, move stitch marker 28 in x-axis direction along bridge 22, repeat to cross in the same way.If x-axis direction
Scribing line all terminate, just using engine 15 make platform 16 rotate and change cutting direction, be repeated in the same manner scribing line.Then,
Stitch marker is set to rotate and roll from top, thus clathrate as shown in Figure 4 ground disjunction resin sheet 33.
Moreover, taking out the resin sheet 33 of cut ring 31 and upper part from platform 16 as shown in Fig. 5 (a), (b), keeping cutting
It cuts ring 31 and from its central lower, pushes away adhesive tape 32 upward from below using above pushing away component 35 as shown in Fig. 5 (b).At this time may be used
To use chip expansion device.In this way, adhesive tape 32 is expanded, the resin sheet of each square shape of disjunction divides from adhesive tape 32
From and can confirm piece, and be easy to take out each chip.
In present embodiment, it is that stretching, extension attaches adhesive tape in cyclic annular cut ring, adheres at an upper portion thereof and keep resin sheet, because
This, the operation of resin sheet becomes easy.In addition, the resin after separation can be easily taken out after disjunction and above pushing away adhesive tape
Piece.In this way, the cut ring for being used for semiconductor fabrication processes can be effectively utilized in resin sheet disjunction.
In addition, in present embodiment, with disjunction object resin sheet be include the resin sheet of silicone resin the case where carry out
Illustrate, but other resin sheets, such as carbamate resins piece are equally applicable to the present invention.
It is thin glass plate 34 to be loaded on platform 16, and keep stretching, extension to keep on glass plate 34 in present embodiment
In the resin sheet 33 in cut ring 31, but since glass plate 34 is only intended to protecting platform 16, so not necessarily using glass
Plate 34.
In addition, in present embodiment, be use apex angle to be 100 ° wheel as stitch marker, but apex angle also can be used more
Small stitch marker.If apex angle greatly if stitch marker service life it is long, if but apex angle is small can increase accuracy.Such as it is using apex angle
30 ° of stitch marker can carry out disjunction resin sheet likewise by scribing line.Therefore, in the range of at least 30~100 °, which uses
The stitch marker of kind apex angle can disjunction resin sheet.
Moreover, being resin sheet to be held in stretching, extension to be maintained on the adhesive tape of frame-shaped cut ring, but only have in present embodiment
For box-shaped body, so being not limited to cut ring.Furthermore, it is possible to box-shaped body is not used, it is flat by the way that resin sheet to be held in
It is crossed on platform and carrys out disjunction resin sheet.
[industrial utilizability]
Break-up device accurately disjunction resin sheet can be used in the present invention, therefore is suitable for the disjunction of critically disjunction resin sheet
Device.
[symbol description]
10 break-up devices
14,15,25 engine
16 platforms
24 slides
26 feed screws
27 scribe heads
28 stitch markers
31 cut ring
32 adhesive tapes
33 resin sheets
34 glass plates
Claims (6)
1. a kind of method for dividing of resin sheet, the adhesive tape upper surface on the inside of box-shaped body is held in stretching, extension and adheres and keeps with bullet
The resin sheet of property,
It willPlatform protection is positioned on platform with plate, and the box-shaped body is maintained on the protection plate, by holding
Apply loading in the resin sheet on the box-shaped body and move scribe head relatively to the platform, thus makes stitch marker
It rolls, and rolls the stitch marker and disjunction resin sheet on the resin sheet, and by expanding the adhesive tape from lower surface
And separate the resin sheet after disjunction.
2. a kind of method for dividing of resin sheet adheres in the upper surface that stretching, extension is held in the adhesive tape on the inside of box-shaped body and keeps having
The resin sheet of elasticity,
The box-shaped body is held on platform,
Loading is applied to the resin sheet kept on the box-shaped body and moves scribe head relatively to the platform, thus
Roll stitch marker, by rolling the stitch marker and disjunction resin sheet on the resin sheet, and by expanding from lower surface
It opens the adhesive tape and separates the resin sheet after disjunction.
3. the method for dividing of resin sheet according to claim 1 or 2, wherein the resin sheet is silicone resin piece.
4. a kind of break-up device is used for the flexible resin sheet of disjunction, and includes:
Box-shaped body keeps scribing line object resin sheet on adhesive tape；
Platform keeps the box-shaped body；
Scribe head goes up and down stitch marker relative to the resin sheet that the platform is kept；
Relative mobile unit moves the scribe head and the platform relatively；And
Unit is expanded, expands the adhesive tape from lower surface；
And
By rolling the stitch marker on the resin sheet, and disjunction resin sheet, and by expanding the glue from lower surface
Band and separate the resin sheet after disjunction.
5. break-up device according to claim 4, wherein the resin sheet is silicone resin piece.
6. break-up device according to claim 4 or 5, wherein the stitch marker has 100 ° of point of a knife angles below.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014067662A JP6528356B2 (en) | 2014-03-28 | 2014-03-28 | Cutting method of resin sheet |
| JP2014-067662 | 2014-03-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104942858A CN104942858A (en) | 2015-09-30 |
| CN104942858B true CN104942858B (en) | 2019-11-29 |
Family
ID=54158183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410798905.8A Expired - Fee Related CN104942858B (en) | 2014-03-28 | 2014-12-19 | The method for dividing and break-up device of resin sheet |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6528356B2 (en) |
| KR (1) | KR20150112738A (en) |
| CN (1) | CN104942858B (en) |
| TW (1) | TWI676539B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6699196B2 (en) * | 2016-01-22 | 2020-05-27 | 三星ダイヤモンド工業株式会社 | Break device |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49119883U (en) * | 1973-02-12 | 1974-10-14 | ||
| JPS53146185U (en) * | 1977-04-22 | 1978-11-17 | ||
| JPS6110280A (en) * | 1984-06-26 | 1986-01-17 | Nec Corp | Junction type fet |
| JPH0518075Y2 (en) * | 1987-07-27 | 1993-05-13 | ||
| JPH0215999A (en) * | 1988-06-30 | 1990-01-19 | Komatsu Ltd | Cutter blade receiving face for cutting plotter |
| US5243890A (en) * | 1992-11-03 | 1993-09-14 | Frank Ober | Cutter assembly |
| JP4249809B2 (en) * | 1997-08-07 | 2009-04-08 | 三菱電機株式会社 | Manufacturing method of semiconductor device |
| JP3625146B2 (en) * | 1999-02-09 | 2005-03-02 | 朝日松下電工株式会社 | Cutting method of resin sheet |
| JP2005199414A (en) * | 2004-01-19 | 2005-07-28 | Nippon Sheet Glass Spacia Co Ltd | Method for cutting resin plate |
| CN100428418C (en) * | 2004-02-09 | 2008-10-22 | 株式会社迪斯科 | Method for cutting wafer |
| JP2007075903A (en) * | 2005-09-09 | 2007-03-29 | Matsushita Electric Works Ltd | Cutting method for sheet member |
| JP2007251098A (en) * | 2006-03-20 | 2007-09-27 | Seiko Epson Corp | Manufacturing method of semiconductor chip |
| JP2008280447A (en) * | 2007-05-11 | 2008-11-20 | Bridgestone Corp | Polyurethane foam and electroconductive roller using the same |
| JP5122911B2 (en) * | 2007-10-25 | 2013-01-16 | 株式会社ディスコ | Manufacturing method of semiconductor device |
| JP4918064B2 (en) * | 2008-05-23 | 2012-04-18 | 三星ダイヤモンド工業株式会社 | Laminate cutting method |
| JP5457014B2 (en) * | 2008-11-19 | 2014-04-02 | 三星ダイヤモンド工業株式会社 | Resin film cutting method and apparatus, and cutter used therefor |
| JP2010186879A (en) * | 2009-02-12 | 2010-08-26 | Fuji Xerox Co Ltd | Device and method for forming conductive or semiconductive film |
| JP5067457B2 (en) * | 2010-07-29 | 2012-11-07 | 三星ダイヤモンド工業株式会社 | Scribing wheel, scribing device, and scribing method |
| JP2013033801A (en) * | 2011-08-01 | 2013-02-14 | Disco Abrasive Syst Ltd | Method of cutting workpiece |
| JP5548172B2 (en) * | 2011-08-26 | 2014-07-16 | 三星ダイヤモンド工業株式会社 | Brittle material substrate breaker |
| JP5783873B2 (en) * | 2011-10-04 | 2015-09-24 | 三星ダイヤモンド工業株式会社 | Glass substrate scribing method |
-
2014
- 2014-03-28 JP JP2014067662A patent/JP6528356B2/en not_active Expired - Fee Related
- 2014-11-25 TW TW103140866A patent/TWI676539B/en not_active IP Right Cessation
- 2014-12-12 KR KR1020140179197A patent/KR20150112738A/en active Search and Examination
- 2014-12-19 CN CN201410798905.8A patent/CN104942858B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015188969A (en) | 2015-11-02 |
| KR20150112738A (en) | 2015-10-07 |
| CN104942858A (en) | 2015-09-30 |
| TWI676539B (en) | 2019-11-11 |
| JP6528356B2 (en) | 2019-06-12 |
| TW201536497A (en) | 2015-10-01 |
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