CN104582279B - Pcb board turmeric technique - Google Patents
Pcb board turmeric technique Download PDFInfo
- Publication number
- CN104582279B CN104582279B CN201410748091.7A CN201410748091A CN104582279B CN 104582279 B CN104582279 B CN 104582279B CN 201410748091 A CN201410748091 A CN 201410748091A CN 104582279 B CN104582279 B CN 104582279B
- Authority
- CN
- China
- Prior art keywords
- pcb
- electrical measurement
- turmeric
- cell boards
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1361—Coating by immersion in coating bath
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- ing And Chemical Polishing (AREA)
Abstract
A kind of pcb board turmeric technique, it is characterised in that comprise the following steps：(1), milling plate, milling profile processing is carried out to PCB whole plates, forms each independent PCB cell boards；(2), electrical measurement, carries out electrical measurement processing to every PCB cell boards, after electrical measurement, the pcb board unit not by electrical measurement is rejected, prevents defective work to be flowed into subsequent processing；Step (3), pretreatment；(4), surface activation process, the PCB cell boards by electrical measurement are immersed in activation preserved material 0.5~1 hour, and the component of the activation preserved material is：Sulfuric acid 7% 10%, sodium chloride 1% 5%, surfactant 0.2% 1%, water 84% 91.8%；(5), turmeric, PCB cell boards are immersed in metal ion solution, and turmeric is carried out to the surface of PCB cell boards.The beneficial effects of the present invention are：Electrical measurement is first carried out to PCB cell boards, then carries out turmeric processing, without carrying out turmeric on the underproof PCB cell boards of electrical measurement, gold salt is saved, reduces production cost.
Description
Technical field
The present invention relates to a kind of pcb board production technology, more particularly to a kind of pcb board turmeric technique.
Background technology
In current printed wiring board turmeric technique, flow is first turmeric electrical measurement again, before electrical measurement, is also needed to monoblock circuit
Plate carries out milling plate processing, therefore, also referred to as whole plate turmeric.In whole technique, electrical measurement is carried out after turmeric, if by electrical measurement
It is located at before turmeric, the qualified circuit board of electrical measurement exists in the processing of follow-up turmeric and oozes golden problem, cause electrical measurement qualified
Circuit board is scrapped, so that previously electrical measurement does not have detection effect, causes bad plate to flow into next process.
However, as the manufacturing cost pressures of PCB are increasing, in the case that especially price of gold remains high, saving
Gold salt turns into the key of reduction board production cost, current printed wiring board turmeric technique, the electrical measurement again of first turmeric, turmeric
Afterwards because it is interior open, the interior electrical measurement failure cause such as short equally exist it is a number of scrap plate, the circuit board of electrical measurement failure is scrapped
Rate is 5% or so, because the circuit board scrapped has completed plating, it is impossible to come into operation again, necessarily causes plating on circuit boards
Gold salt waste, increase production cost, reduce enterprise profit margin.
The content of the invention
Based on this, it is produced into view of the above-mentioned deficiencies in the prior art, it is an object of the present invention to provide a kind of gold salt, reduction of saving
This pcb board turmeric technique.
A kind of pcb board turmeric technique, it is characterised in that comprise the following steps：(1), milling plate, is carried out outside milling to PCB whole plates
Shape processing, forms each independent PCB cell boards；(2), electrical measurement, electrical measurement processing is carried out to every PCB cell boards, after electrical measurement, will
Do not rejected by the pcb board unit of electrical measurement, prevent defective work to be flowed into subsequent processing；Step (3), pretreatment；
(4), surface activation process, 0.5~1 hour, the activation preserved material in activation preserved material are immersed in by the PCB cell boards by electrical measurement
Component be：Sulfuric acid 7%-10%, sodium chloride 1%-5%, surfactant 0.2%-1%, water 84%-91.8%；(5), sink
Gold, PCB cell boards are immersed in metal ion solution, are carried out turmeric to the surface of PCB cell boards, are attached to metal ion
On PCB cell boards.
Further, in step (3), the PCB cell boards by electrical measurement are sequentially passed through into oil removing, microetch, acidleach, DI water
The PROCESS FOR TREATMENT wash, presoaked.
Further, in step (3), the PROCESS FOR TREATMENT of oil removing is carried out in alkaline solution.
Further, in step (3), the PROCESS FOR TREATMENT of the microetch is carried out in micro-corrosion liquid, the group of the micro-corrosion liquid
It is divided into H2SO4 and APS.
Further, in step (3), solution compolision during acidleach is NH2SO3H, and DI washings solution used is deionization
Water.
Further, the surfactant is nonionic surface active agent.
The beneficial effects of the present invention are：Electrical measurement first is carried out to PCB cell boards, then carries out turmeric processing, without in electrical measurement
Turmeric is carried out on underproof PCB cell boards, gold salt is saved, production cost is reduced, in addition, before turmeric, using activation preserved material
Surface activation process is carried out to PCB cell boards, effectively prevent from oozing during turmeric golden phenomenon lean on into circuit board open, it is interior short
Etc. bad phenomenon, pcb board can be transferred in another procedure after turmeric is handled without carrying out electrical measurement again again, it is ensured that production
The qualification rate of product.
Brief description of the drawings
Fig. 1 is pcb board turmeric technological process of the present invention.
Embodiment
In order that technical scheme can more clearly show, further is made to the present invention below in conjunction with the accompanying drawings
Explanation.
Fig. 1 is refer to, the present invention provides a kind of pcb board turmeric technique, for carrying out turmeric processing, the PCB to PCB whole plates
Whole plate includes some PCB cell boards, is connected by dowel between two adjacent PCB cell boards, pcb board turmeric technique include with
Lower step：
Step (1), milling plate carries out milling profile processing to PCB whole plates, forms each independent PCB cell boards；
Step (2), electrical measurement carries out electrical measurement processing to every PCB cell boards, after electrical measurement, will not pass through the pcb board list of electrical measurement
Member is rejected, and prevents defective work to be flowed into subsequent processing；
PCB cell boards by electrical measurement are sequentially passed through oil removing, microetch, acidleach, DI washings, pre- by step (3), pretreatment
The PROCESS FOR TREATMENT of leaching, wherein, the PROCESS FOR TREATMENT of oil removing is carried out in alkaline solution, and the PROCESS FOR TREATMENT of microetch is in micro-corrosion liquid
Carry out, the component of the micro-corrosion liquid is H2SO4 and APS (Ammoniumpersulfate, ammonium persulfate), solution compolision during acidleach
For NH2SO3H；DI washings solution used is deionized water, the short-circuit risks that Ion transfer is caused when effectively reduction PCB is used, and
The PROCESS FOR TREATMENT of preimpregnation then makes substrate surface catalyst, so that being set up well between non-conductor hole wall, bottom copper and deposition copper
Attached work power；
PCB cell boards by electrical measurement are immersed in activation preserved material 0.5~1 hour by step (4), surface activation process,
It is described activation preserved material component be：Sulfuric acid (7%-10%), sodium chloride (1%-5%), surfactant (0.2%-1%), water
(84%-91.8%)；Surfactant is nonionic surface active agent, includes the organic amphiprotic point of hydrophilic and hydrophobic grouping
The group of son, wherein hydrophilic radical often for polarity, such as carboxylic acid, sulfonic acid, sulfuric acid, amino or amido and its salt or hydroxyl,
Amide groups, ehter bond etc.；And hydrophobic group is nonpolar hydrocarbon chain, such as 8 carbon atom above hydrocarbon chains.
PCB cell boards are immersed in metal ion solution by step (5), turmeric, and the surface of PCB cell boards is sunk
Gold, makes metal ion be attached on PCB cell boards.
The beneficial effects of the present invention are：Electrical measurement first is carried out to PCB cell boards, then carries out turmeric processing, without in electrical measurement
Turmeric is carried out on underproof PCB cell boards, gold salt is saved, production cost is reduced, in addition, before turmeric, using activation preserved material
Surface activation process is carried out to PCB cell boards, effectively prevent from oozing during turmeric golden phenomenon lean on into circuit board open, it is interior short
Etc. bad phenomenon, pcb board can be transferred in another procedure after turmeric is handled without carrying out electrical measurement again again, it is ensured that production
The qualification rate of product.
Embodiment described above only expresses one embodiment of the present invention, and it describes more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
1. a kind of pcb board turmeric technique, it is characterised in that comprise the following steps：
Step (1), milling plate carries out milling profile processing to PCB whole plates, forms each independent PCB cell boards；
Step (2), electrical measurement carries out electrical measurement processing to every PCB cell boards, after electrical measurement, the pcb board unit not by electrical measurement is entered
Row is rejected, and prevents defective work to be flowed into subsequent processing；
Step (3), pretreatment；
PCB cell boards by electrical measurement are immersed in activation preserved material 0.5~1 hour by step (4), surface activation process, described
Activation preserved material component be：Sulfuric acid 7%-10%, sodium chloride 1%-5%, surfactant 0.2%-1%, water 84%-
91.8%；
PCB cell boards are immersed in metal ion solution by step (5), turmeric, are carried out turmeric to the surface of PCB cell boards, are made
Metal ion is attached on PCB cell boards.
2. pcb board turmeric technique according to claim 1, it is characterised in that：In step (3), the PCB of electrical measurement will be passed through
Cell board sequentially passes through oil removing, microetch, acidleach, DI washings, the PROCESS FOR TREATMENT of preimpregnation.
3. pcb board turmeric technique according to claim 2, it is characterised in that：In step (3), the PROCESS FOR TREATMENT of oil removing
It is to be carried out in alkaline solution.
4. pcb board turmeric technique according to claim 2, it is characterised in that：In step (3), the technique of the microetch
Processing is carried out in micro-corrosion liquid, and the component of the micro-corrosion liquid is H2SO4 and APS.
5. pcb board turmeric technique according to claim 2, it is characterised in that：In step (3), solution during acidleach into
Part is NH2SO3H, and DI washings solution used is deionized water.
6. pcb board turmeric technique according to claim 1, it is characterised in that：The surfactant is non-ionic table
Face activating agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410748091.7A CN104582279B (en) | 2014-12-08 | 2014-12-08 | Pcb board turmeric technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410748091.7A CN104582279B (en) | 2014-12-08 | 2014-12-08 | Pcb board turmeric technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104582279A CN104582279A (en) | 2015-04-29 |
| CN104582279B true CN104582279B (en) | 2017-09-29 |
Family
ID=53097172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410748091.7A Active CN104582279B (en) | 2014-12-08 | 2014-12-08 | Pcb board turmeric technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104582279B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109152234A (en) * | 2018-09-04 | 2019-01-04 | 江门市奔力达电路有限公司 | A kind of turmeric processing method for saving gold |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102893709A (en) * | 2010-05-26 | 2013-01-23 | 住友电木株式会社 | A method for manufacturing a base material having gold-coated metallic fine pattern, a base material having gold-coated metallic fine pattern, a printed wiring board, an interposer and a semiconductor device |
| CN103619124A (en) * | 2013-11-25 | 2014-03-05 | 广东依顿电子科技股份有限公司 | Method for producing circuit board thin plates |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004095715A (en) * | 2002-08-30 | 2004-03-25 | Toshiba Corp | Cap for chip component, and structure for packaging chip component into printed circuit board |
-
2014
- 2014-12-08 CN CN201410748091.7A patent/CN104582279B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102893709A (en) * | 2010-05-26 | 2013-01-23 | 住友电木株式会社 | A method for manufacturing a base material having gold-coated metallic fine pattern, a base material having gold-coated metallic fine pattern, a printed wiring board, an interposer and a semiconductor device |
| CN103619124A (en) * | 2013-11-25 | 2014-03-05 | 广东依顿电子科技股份有限公司 | Method for producing circuit board thin plates |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104582279A (en) | 2015-04-29 |
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| CB03 | Change of inventor or designer information |
Inventor after: Zhao Gangjun Inventor after: Xu Yunpeng Inventor after: Li Haomin Inventor before: Zhao Gangjun |
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| GR01 | Patent grant |