CN104409655B - 有机发光二极管器件封装干燥剂及其封装应用方法 - Google Patents
有机发光二极管器件封装干燥剂及其封装应用方法 Download PDFInfo
- Publication number
- CN104409655B CN104409655B CN201410679362.8A CN201410679362A CN104409655B CN 104409655 B CN104409655 B CN 104409655B CN 201410679362 A CN201410679362 A CN 201410679362A CN 104409655 B CN104409655 B CN 104409655B
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- CN
- China
- Prior art keywords
- film
- chloride
- desiccant
- coating liquid
- drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002274 desiccant Substances 0.000 title claims abstract description 82
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000011248 coating agent Substances 0.000 claims abstract description 75
- 238000000576 coating method Methods 0.000 claims abstract description 75
- 239000007788 liquid Substances 0.000 claims abstract description 44
- 238000001035 drying Methods 0.000 claims abstract description 41
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000000292 calcium oxide Substances 0.000 claims abstract description 39
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 33
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims abstract description 27
- 239000013081 microcrystal Substances 0.000 claims abstract description 24
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000002245 particle Substances 0.000 claims abstract description 13
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 20
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 claims description 18
- 239000000243 solution Substances 0.000 claims description 17
- 238000005538 encapsulation Methods 0.000 claims description 10
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 claims description 10
- 229910001629 magnesium chloride Inorganic materials 0.000 claims description 9
- 239000012047 saturated solution Substances 0.000 claims description 8
- 238000004528 spin coating Methods 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 6
- 239000001110 calcium chloride Substances 0.000 claims description 6
- 229910001628 calcium chloride Inorganic materials 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims description 5
- 239000011592 zinc chloride Substances 0.000 claims description 5
- 235000005074 zinc chloride Nutrition 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229920002857 polybutadiene Polymers 0.000 claims description 4
- 229920006264 polyurethane film Polymers 0.000 claims description 4
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 4
- 239000011118 polyvinyl acetate Substances 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical group Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 239000007888 film coating Substances 0.000 claims 1
- 238000009501 film coating Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 8
- 238000010521 absorption reaction Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 6
- 238000003860 storage Methods 0.000 abstract description 5
- 239000002994 raw material Substances 0.000 abstract description 4
- 150000002576 ketones Chemical class 0.000 abstract 1
- 239000010408 film Substances 0.000 description 19
- 238000002156 mixing Methods 0.000 description 12
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000035699 permeability Effects 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 229910052791 calcium Inorganic materials 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims (21)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410679362.8A CN104409655B (zh) | 2014-11-24 | 2014-11-24 | 有机发光二极管器件封装干燥剂及其封装应用方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410679362.8A CN104409655B (zh) | 2014-11-24 | 2014-11-24 | 有机发光二极管器件封装干燥剂及其封装应用方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104409655A CN104409655A (zh) | 2015-03-11 |
CN104409655B true CN104409655B (zh) | 2020-01-03 |
Family
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Family Applications (1)
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CN201410679362.8A Expired - Fee Related CN104409655B (zh) | 2014-11-24 | 2014-11-24 | 有机发光二极管器件封装干燥剂及其封装应用方法 |
Country Status (1)
Country | Link |
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CN (1) | CN104409655B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111781120B (zh) * | 2020-06-24 | 2021-06-18 | 吉林大学 | 薄膜封装的测试方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1762572A (zh) * | 2005-09-23 | 2006-04-26 | 浙江大学 | 含硅纳米氧化钙高温二氧化碳吸附剂和该吸附剂的制备方法以及在制氢工艺中的应用 |
CN1832222A (zh) * | 2004-11-08 | 2006-09-13 | 三星Sdi株式会社 | 有机电致发光器件及其制造方法 |
CN103264014A (zh) * | 2013-04-22 | 2013-08-28 | 陕西科技大学 | 一种利用可涂覆有机电致发光器件干燥剂的涂覆方法 |
CN104119810A (zh) * | 2013-04-25 | 2014-10-29 | 京东方科技集团股份有限公司 | 封框胶及其封合方法、显示面板及显示装置 |
-
2014
- 2014-11-24 CN CN201410679362.8A patent/CN104409655B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1832222A (zh) * | 2004-11-08 | 2006-09-13 | 三星Sdi株式会社 | 有机电致发光器件及其制造方法 |
CN1762572A (zh) * | 2005-09-23 | 2006-04-26 | 浙江大学 | 含硅纳米氧化钙高温二氧化碳吸附剂和该吸附剂的制备方法以及在制氢工艺中的应用 |
CN103264014A (zh) * | 2013-04-22 | 2013-08-28 | 陕西科技大学 | 一种利用可涂覆有机电致发光器件干燥剂的涂覆方法 |
CN104119810A (zh) * | 2013-04-25 | 2014-10-29 | 京东方科技集团股份有限公司 | 封框胶及其封合方法、显示面板及显示装置 |
Also Published As
Publication number | Publication date |
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CN104409655A (zh) | 2015-03-11 |
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C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 014010 Inner Mongolia Baotou equipment manufacturing industry park new planning area, 2 building, 2 building, Beijing Science and technology park. Applicant after: BAOTOU INNOVATION INSTITUTE, PEKING University Address before: 014010 Room 403, block B, management committee, Qingshan equipment manufacturing park, Baotou, the Inner Mongolia Autonomous Region Applicant before: BAOTOU RESEARCH INSTITUTE College OF ENGINEERING PKU |
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CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 014010 Inner Mongolia Baotou equipment manufacturing industry park new planning area, 2 building, 2 building, Beijing Science and technology park. Applicant after: BAOTOU INNOVATION INSTITUTE, PEKING University Address before: 014010 Room 403, block B, management committee, Qingshan equipment manufacturing park, Baotou, the Inner Mongolia Autonomous Region Applicant before: BAOTOU RESEARCH INSTITUTE College OF ENGINEERING PKU |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200103 |