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CN104253200A - Light emitting assembly and manufacturing method thereof - Google Patents

Light emitting assembly and manufacturing method thereof Download PDF

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Publication number
CN104253200A
CN104253200A CN201410298192.9A CN201410298192A CN104253200A CN 104253200 A CN104253200 A CN 104253200A CN 201410298192 A CN201410298192 A CN 201410298192A CN 104253200 A CN104253200 A CN 104253200A
Authority
CN
China
Prior art keywords
light
emitting diode
transparent
blue
led component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410298192.9A
Other languages
Chinese (zh)
Other versions
CN104253200B (en
Inventor
刘弘智
郭怡婷
郑子淇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaistar Lighting Xiamen Co Ltd
Epistar Corp
Original Assignee
Huga Optotech Inc
Interlight Optotech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huga Optotech Inc, Interlight Optotech Corp filed Critical Huga Optotech Inc
Priority to CN202010156075.4A priority Critical patent/CN111457260B/en
Publication of CN104253200A publication Critical patent/CN104253200A/en
Application granted granted Critical
Publication of CN104253200B publication Critical patent/CN104253200B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
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    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
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    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
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    • F21—LIGHTING
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    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The invention discloses a light-emitting component and a manufacturing method thereof. The LED assembly comprises a transparent substrate, a plurality of LED chips, a circuit, a transparent package, and two electrode plates. The transparent substrate has a first surface and a second surface facing opposite directions. The plurality of light emitting diode chips are fixed on the first surface. The circuit is electrically connected with the plurality of light emitting diode chips. The transparent packaging body is arranged on the first surface and approximately wraps the plurality of light emitting diode chips and the circuit. The two electrode plates are arranged on the first surface or the second surface, and are electrically connected to the plurality of light-emitting diode chips through the circuit to serve as two power supply input ends of the light-emitting diode component.

Description

Luminescence component and manufacture method
Technical field
The present invention relates to a light-emitting diode (light emitting diode, LED) assembly and manufacture method, especially relate to and the LED component of all-round light field and relevant manufacture method can be provided.
Background technology
The application can having seen LED commodity of all kinds in life at present, such as traffic sign motor taillight, auto bulb, street lamp, computer indicating lamp, flashlight, LED backlight etc.These commodity, except the chip fabrication technique of front end, nearly all have to pass through the canned program of rear end.
The major function of LED is to provide the necessity in LED chip electricity, light, heat to support.The semiconductor product that LED chip is such, if long term exposure in an atmosphere, can be subject to chemical substance in steam or environment and aging, cause the decline in characteristic.In LED, the conventional coated LED chip of epoxy resin is with effectively isolated air.In addition, in order to reach the target of brighter more power saving, LED also needs good thermal diffusivity and light extraction efficiency.If the heat produced when LED chip is luminous does not shed in time, be accumulated in the heat in LED chip and all can exert an adverse impact to the characteristic of element, life-span and reliability.Optical design is also a ring important in LED manufacture craft, and how more effectively light-output, lighting angle and direction are all the emphasis in design.
The encapsulation technology of white light LEDs, except will considering the problem of heat, also needs to consider colour temperature (color temperature), drill the problems such as colour system number (color rendering index), fluorescent material.And, if white light LEDs is when adopting blue-light LED chip collocation yellow-green fluorescence powder, because the wavelength of blue light is shorter, larger to the injury of human eye, therefore need blue light to be effectively denial among encapsulating structure, avoid blue light to leak outside.
In order to LED commodity commercially can have competitiveness, how allowing the manufacture craft of LED is firm, low cost, high yield, is also the target that LED is pursued.
Summary of the invention
For solving the problem, embodiments of the invention disclose a light-emitting diode component, and it comprises a transparency carrier, several light-emitting diode chip for backlight unit, a circuit, a transparent encapsulating body, two battery lead plates.This transparency carrier has in the face of a rightabout first surface and a second surface.The plurality of light-emitting diode chip for backlight unit, is fixed on this first surface.This line electricity connects the plurality of light-emitting diode chip for backlight unit.This transparent encapsulating body (capsule), is located on this first surface, roughly wraps up the plurality of light-emitting diode chip for backlight unit and this circuit.These two battery lead plates are attached at this first surface or this second surface, are connected to the plurality of light-emitting diode chip for backlight unit by this line electricity, as two power inputs of this package structure for LED.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of the LED component of one embodiment of the invention;
Fig. 2 A is the top view of LED component 100a;
Fig. 2 B is the lower view of LED component 100a;
Fig. 3 A and Fig. 3 B is respectively AA and BB generalized section in Fig. 2 A;
Fig. 4 is the schematic diagram that LED component 100 is arranged at a bulb;
Fig. 5 A is the schematic diagram with scolding tin fixed L ED assembly 100;
Fig. 5 B is the schematic diagram with metal intermediate plate fixed L ED assembly 100;
Fig. 6 is the schematic diagram of the process for making of the LED component formed in Fig. 3 A and Fig. 3 B;
Fig. 7 A and Fig. 7 B is respectively the top view of LED component 100b and lower view;
Fig. 8 A and Fig. 8 B is AA and BB generalized section in Fig. 7 A;
Fig. 8 C and Fig. 8 D is two cutaway views of LED component 100c;
Fig. 9 is the schematic diagram of the process for making of LED component 100b;
Figure 10 is the schematic perspective view of the light-emitting diode component 400 of one embodiment of the invention;
Figure 11 A and Figure 11 B is the top view of LED component 400a and lower view;
Figure 12 A and Figure 12 B is respectively AA and the BB generalized section of LED component 400a in Figure 11 A;
Figure 12 C is the schematic diagram of another LED component 400b;
Figure 13 is the schematic perspective view of LED component 200;
Figure 14 and Figure 15 is respectively a top view and a side view of LED component 200a;
Figure 16 and Figure 17 is the schematic diagram of another LED component 200b;
Figure 18 is the schematic diagram of another LED component 200c;
Figure 19 is the schematic diagram of a kind of process for making of LED component 200c;
Figure 20 is the schematic perspective view of the LED component 300 of another embodiment of the present invention;
Figure 21 A and Figure 21 B is the top view of a LED component 300a and lower view;
Figure 22 is a cutaway view of LED component 300a;
Figure 23 is a side view of LED component 300b;
Figure 24 is the schematic perspective view of LED component 600;
Figure 25 A and Figure 25 B is the top view of LED component 600a and 600b;
Figure 26 A is the schematic perspective view of the LED component 700 of another embodiment of the present invention;
Figure 26 B and Figure 26 C is respectively top view and the cutaway view of LED component 700;
Figure 27 A and Figure 27 B is respectively using LED component 300 and 600 as the schematic diagram of two LED bulb of wick.
Symbol description
100,100a, 100b, 100c LED component
102 upper surfaces
104 lower surfaces
106 transparency carriers
107,107A, 107B via
108,108a, 108b blue-light LED chip
110 bonding wires
112 transparent colloids
114,116 terminals
118 conductive electrode plates
119 conductive electrode plates
120 conductive electrode plates
122 conductive electrode plates
130 vertical conducting elements
131 fluorescence coatings
132,133 transparent adhesion coatings
148,150,151,152,154,154a, 155,155a, 156,157,158 steps
No. 160 substrates
180 lampshades
182 cooling mechanisms
183 electrical connection mechanisms
190 scolding tin
192 circuit boards
194 metal intermediate plates
196,198 conductive electrode plates
200,200a, 200b, 200c LED component
300,300a, 300b LED component
400,400a, 400b LED component
402 buss
500a, 500b LED bulb
502 fixtures
600,600a, 600b, 700 LED component
Embodiment
Fig. 1 is the schematic perspective view of light-emitting diode (light-emitting diode, the LED) assembly 100 according to one embodiment of the invention.LED component 100 includes a transparency carrier 106, in one embodiment, is a nonconducting glass substrate.Transparency carrier 106 has in the face of rightabout upper surface 102 and lower surface 104.As shown in Figure 1, transparency carrier 106 is roughly a strip, has two terminals 114 and 116.In this description, transparent be only used for expression can by light, it may be completely transparent (transparent) or translucent (translucent, or semitransparent).In another embodiment, the material of transparency carrier 106 can be that sapphire or ceramic material (aluminium oxide or nitrogen oxide), carborundum or class bore carbon.It is noted that transparency carrier 106 also can comprise conductive particle or other can to reduce the composition of manufacture craft temperature in manufacture process.
Fig. 2 A shows the top view of LED component 100a.Please also refer to Fig. 1.On upper surface 102, be fixed with several blue-light LED chip 108, each other by bonding wire (bonding wire) 110 form circuit to be electrically connected.Each blue-light LED chip 108 can be single LED, its forward voltage be about 2 ~ 3V (calling in the following text " low voltage chip "), such as, or having several light-emitting diode is cascaded and forward voltage is greater than low voltage chip, 12V, 24V, 48V etc. (calling in the following text " high voltage chip ").In specific words, be different from routing mode, high voltage chip forms the light emitting diode (namely at least having the light emitting diode construction of luminescent layer) of several electrical ties each other by semiconductor fabrication process on a common substrate, and this common substrate can be long brilliant substrate or the brilliant substrate of non-length.In Fig. 1 and Fig. 2 A, blue-light LED chip 108, along the both sides of a longitudinal axis of two terminals 114 and 116 of connection transparency carrier 106, is lined up two row, is cascaded each other with bonding wire 110, electrically, and the light-emitting diode becoming a high forward voltage of equivalence.But the present invention is not limited thereto, in other embodiments, blue-light LED chip 108 on upper surface 102 can be arranged in arbitrary pattern, and electrical connection each other can have, series, parallel, simultaneously have series and parallel mix or the connected mode of bridge architecture.
Shown in Fig. 2 A, near terminal 114, transparency carrier 106 has a via 107.Via 107 has a through hole, and it runs through transparency carrier 106 and to go directly upper surface 102 and lower surface 104, and is wherein formed with the inwall that conducting objects fills up through hole or only cover through hole, to form via 107.Conducting objects in through hole can provide via 107 two ends to be electrically connected.At the upper surface 102 near terminal 114, be provided with a conductive electrode plate 118.Conductive electrode plate 118 does not directly touch via 107, that is the conducting objects in not direct contact through hole.Blue-light LED chip 108 one of them (being denoted as 108a) near terminal 114 is electrically connected to conductive electrode plate 118 with a bonding wire 110.Near the blue-light LED chip 108 one of them (being denoted as 108b) of terminal 114, be electrically connected to via 107 with another bonding wire 110.
Be positioned at all bonding wires on upper surface 102 110 with blue-light LED chip 108 all cover by transparent colloid 112, be used for the aging and infringement preventing the moisture in air or chemical substance may cause bonding wire 110 and blue-light LED chip 108.The main composition thing of transparent colloid 112 can be epoxy resin or silica gel (silicone).Transparent colloid 112 includes at least one fluorescent material, the some blue light (for example its crest value is 430nm-480nm) that can send by blue-light LED chip 108 is excited, and produces gold-tinted (for example its crest value is 570nm-590nm) or green-yellow light (for example its crest value is 540nm-570nm).And gold-tinted or green-yellow light and remaining blue light are when suitably blending together, human eye can be considered as white light.In one embodiment, transparent colloid 112 comprises two kinds of fluorescent material.The some blue light (for example its crest value is 430nm-480nm) that one of them fluorescent material can send by blue-light LED chip 108 is excited, and produces gold-tinted or green-yellow light or green glow (for example its crest value is 520nm-590nm); The some blue light (for example its crest value is 430nm-480nm) that another fluorescent material can send by blue-light LED chip 108 is excited, and produces ruddiness (for example its crest value is 610nm-680nm).Fig. 1 is a schematic diagram.In an example, as previously mentioned, transparently only be used for expression and can pass through light, it may be completely transparent (transparent) or translucent (translucent, or semitransparent), therefore transparent colloid 112 can be completely transparent or semitransparent, clear or indistinctly can see the bonding wire 110 under transparent colloid 112 and blue-light LED chip 108.In another example, the LED component 100 in Fig. 1, because the fluorescent material in transparent colloid 112, possibly cannot see that bonding wire 110 under transparent colloid 112 makes transparent colloid 112 present the color of fluorescent material with blue-light LED chip 108 as shown in Figure 1.
Fig. 2 B shows the lower view of LED component 100a.Shown in Fig. 2 B, on lower surface 104, without arranging any LED chip.On the lower surface 104 near terminal 114, be provided with another conductive electrode plate 120, its part overlaps with via 107, and conducting objects directly in contact through hole and being electrically connected to each other with it.But in another embodiment, conductive electrode plate 120 can not directly be connected with via 107, and by another conductor, as bonding wire 110, formed with via 107 and be electrically connected.On the lower surface 104 near terminal 116, optionally can be provided with another conductive electrode plate 122.Such design, can make conductive electrode plate 122 and conductive electrode plate 120 copline, and thus, LED component 100a places can be relatively more firm, can avoid the infringement of transporting or turning in processing procedure and causing.In this embodiment, conductive electrode plate 122 can be the suspension joint on circuit, is not electrically connected to electronic component any in LED component 100a, circuit or other battery lead plates, because its main purpose makes LED component 100a can place steadily.
As Fig. 2 A and Fig. 2 B embodiment shown in, the border of conductive electrode plate 120 and 118 is positioned within lower surface 104 and upper surface 102, is namely roughly no more than the border of lower surface 104 and upper surface 102.The shape of conductive electrode plate 120,118 and 122 does not need to be about rectangle, and size does not need roughly the same yet.In another embodiment, conductive electrode plate 120 and 118 one of them be roughly rectangle, another is roughly circular, to facilitate the both positive and negative polarity identifying LED component 100a.
From electrically, blue-light LED chip 108 and via 107 are serially connected with between conductive electrode plate 120 and 118.Conductive electrode plate 120 and 118 can as two of a LED component 100a power input.The positive power source terminal of one driving power (not shown) and negative power end can be electrically connected to conductive electrode plate 120 and 118 respectively, to drive blue-light LED chip 108, make it luminous.
Fig. 3 A shows the AA generalized section of LED component 100a in Fig. 2 A; And Fig. 3 B is the BB generalized section of LED component 100a in Fig. 2 A.
With previous described similar, in figure 3 a, blue-light LED chip 108b is electrically connected to via 107 by a bonding wire 110, and it is connected to the conductive electrode plate 120 of lower surface 104; In figure 3b, blue-light LED chip 108a is electrically connected to the conductive electrode plate 118 on upper surface 102 by another bonding wire 110.Fig. 4 shows LED component 100 and is arranged in a bulb, and bulb comprises a lampshade 180, LED component 100, circuit board 192, cooling mechanism 182 and electrical connection mechanism 183 (such as: Edison base).The terminal 114 of LED component 100 is fixed on circuit board 192; Circuit board 192 is connected with cooling mechanism 182, in order to the torrid zone that LED component 100 produced from bulb; Electrical connection mechanism 183 is connected with cooling mechanism 182.Because be used for driving the conductive electrode plate 120 and 118 of blue-light LED chip 108a to lay respectively at upper surface 102 and the lower surface 104 of same terminal 114 side of transparency carrier 106, so the electric conductor of scolding tin and so on can be used, conductive electrode plate 120 and 118 is welded on a circuit board, shown in Fig. 5 A simultaneously.Scolding tin 190 not only can provide the electrical connection of driving power to make LED component 100 luminous, also provides mechanical support to terminal 114 simultaneously, makes LED component 100 stand upright on circuit board 192 to luminous all around, can provide the light field of all-round light.In fig. 5, LED component 100 only by the mechanism supports of scolding tin 190, can be substantially vertical stand on circuit board 192, circuit board 192 is powered by scolding tin 190 pairs of LED component 100 simultaneously.Fig. 5 B is the clip formed with metal intermediate plate 194, LED component 100 is clamped and is approximately vertically fixed on circuit board 192.Metal intermediate plate 194 provides power supply and mechanism to fix two functions simultaneously, also can reach the effect reducing Making programme complexity and cost.But, LED component 100 also can non-perpendicular fashion oblique cutting on circuit board 192.
In the embodiment in fig. 3 a, on via 107 position of upper surface 102, a vertical conducting element 130 can be provided with, as the electrical connection between via 107 and a bonding wire 110.For example, vertical conducting element 130 is a pn junction rectifier (such as: vertical type light emitting diode, Schottky diode or zener diode), resistance or a metal derby, is adhered on via 107 with conductive silver glue.In another embodiment, vertical conducting element 130 and conductive silver glue can omit, and a bonding wire 110 directly can contact via 107, produce electrical connection.
In Fig. 3 A and Fig. 3 B, each blue-light LED chip has a transparent adhesion coating 132 for 108 times, in order to be bonded on the upper surface 102 of transparency carrier 106 by blue-light LED chip 108.In Fig. 3 A and Fig. 3 B, each blue-light LED chip has a corresponding transparent adhesion coating 132 for 108 times, is man-to-man relation each other, but the present invention is not limited thereto.In one embodiment, upper surface 102 has several transparent adhesion coating 132, and on each transparent adhesion coating 132, adhesion there is several blue-light LED chip 108; In another embodiment, upper surface 102 only has the transparent adhesion coating 132 of single one, it carries all blue-light LED chips 108.Transparent adhesion coating 132 area is larger, better to blue-light LED chip 108 radiating effect on it, but but may produce because the larger shortcoming of the stress (shear) that causes of thermal expansion coefficient difference.Therefore, the size of transparent adhesion coating 132, and the quantity of carrying blue-light LED chip 108, determined by practical application.In one embodiment, the heat conduction particle of some high thermal conductivity coefficients is mixed with in transparent adhesion coating 132, for example alumina powder, class bore carbon (diamond-like carbon) or carborundum (SiC), its conductive coefficient is greater than 20W/mK, except improving except radiating effect, the effect of light scattering also can be had.
In Fig. 3 A and Fig. 3 B, the material of transparent adhesion coating 132, for example, can be epoxy resin (epoxy resin) or silica gel (silicone), and be mixed with fluorescent material identical, similar or different in transparent colloid 112.For example, fluorescent material can be YAG or TAG fluorescent material.As previously described, the transparent colloid 112 with fluorescent material covers surrounding and the top of bonding wire 110 and blue-light LED chip 108, and transparent adhesion coating 132 is positioned at the below of blue-light LED chip 108.In other words, each blue-light LED chip 108 just by transparent colloid 112 and transparent adhesion coating 132 sandwich, also haply completely by transparent colloid 112 and transparent adhesion coating 132 the transparent encapsulating body (capsule) that formed wrap up.The blue light that blue-light LED chip 108 sends, is not converted to green-yellow light by fluorescent material, is exactly with green-yellow light mixing.Therefore, the LED component 100a in Fig. 3 A and Fig. 3 B, can prevent the problem that blue light leaks outside.
Fig. 6 shows the process for making of the LED component 100a formed in Fig. 3 A and Fig. 3 B.First, a transparency carrier 106 is provided.Transparency carrier 106 is pre-formed with via 107 (step 148).For example, a through hole can be melted out with laser from the transparency carrier 106 of glass material, then insert conducting objects in through-holes to form via 107.Step 150 pre-cut transparency carrier 106.Transparency carrier 106 first forms some grooves, has generally pre-defined each position of LED component 100 on transparency carrier 106, with cutting after facilitating.Conductive electrode plate 118 and 120 is attached to transparency carrier 106 by step 152 respectively, on the upper surface 102 of terminal 114 and the position of lower surface 104.If there is conductive electrode plate 112, step 152 is also formed on transparency carrier 106.In another embodiment, conductive electrode plate is formed on upper surface 102 or lower surface 104 by the mode of printing.Step 154 forms the transparent adhesion coating 132 with fluorescent material in upper surface 102, its position first designs to place blue-light LED chip 108 thereon.The formation method of transparent adhesion coating 132, for example, by a glue, printing or the mode of spraying, can be formed in transparent adhesion coating 132 on upper surface 102.
Blue-light LED chip 108 is bonded on transparent adhesion coating 132 by step 155.For example, blue-light LED chip 108 picks up by vacuum available suction nozzle on blue film (blue tape), is positioned on transparent adhesion coating 132.The placement location of blue-light LED chip 108 preferably completely by the periphery of a transparent adhesion coating 132 institute around, that is the area of transparent adhesion coating 132 is greater than the area of blue-light LED chip 108, the problem leaked outside to avoid blue light.Vertical conducting element 130 can at this moment, be adhered on the via 107 of upper surface 102 with conductive silver glue.Step 156 forms bonding wire 110, is electrically connected a blue-light LED chip 108 to another blue-light LED chip 108, blue-light LED chip 108a to conductive electrode plate 118 and blue-light LED chip 108b to vertical conducting element 130.The transparent colloid 112 with fluorescent material with some glue (dispense) or mode of printing, can be formed on upper surface 102, covers bonding wire 110 and blue-light LED chip 108 by step 157.Step 158 can with manually pull split or the mode of machine cutting along previous preformed groove, will LED component 100 be independent one by one.
From the process for making of Fig. 6, in the forming process of LED component, except forming conductive electrode plate 120 or 122 except lower surface 104, other step is roughly all process for upper surface 102.Because lower surface 104 only has the such large area of conductive electrode plate, and be not easy the pattern that is scraped off, so manufacture craft carrier with absorption or can hold the mode observing lower surface 104, carry or fixing transparency carrier 106, the injury being subject to the mechanical stresses such as friction, scratch to avoid the fine and smooth structure be positioned on upper surface 102 and producing.Manufacture craft yield can considerably promote.
In embodiment in Fig. 3 A, Fig. 3 B and Fig. 6, the light emission direction of blue-light LED chip 108 is not subject to any restriction.For below, blue-light LED chip 108 can pass through transparent adhesion coating 132 and transparency carrier 106, and provides the light blended together; For surrounding and top, by transparent colloid 112, blue-light LED chip 108 also can provide the light blended together.Therefore, LED component 100a can be considered a kind of can provide six luminous light-emitting components, and has the bulb of LED component 100 in Fig. 4, then can be considered a kind of all-round light (Omnidirectional) lighting device.
In Fig. 2 A, Fig. 2 B, Fig. 3 A and Fig. 3 B, blue-light LED chip 108 is directly adhered on transparency carrier 106 with transparent adhesion coating 132, but the present invention is not limited to this.Fig. 7 A and Fig. 7 B shows respectively, in another embodiment, and the top view of LED component 100b and lower view.Two cutaway views of LED component 100b are then shown in Fig. 8 A and Fig. 8 B.Fig. 9 shows the process for making of LED component 100b.Fig. 7 A, Fig. 7 B, Fig. 8 A, Fig. 8 B and Fig. 9 are similar to corresponding diagram 2A, Fig. 2 B, Fig. 3 A, Fig. 3 B and Fig. 6 respectively, and wherein identical symbol or the element corresponding to mark, device or step, for having similar or identical element, device or step.For succinct event, its explanation may be omitted in this description.
Be different from Fig. 2 A, Fig. 7 A is a many time substrate (submount) 160, it is sandwiched between blue-light LED chip 108 and transparent adhesion coating 132 within being positioned over the periphery of transparent adhesion coating 132.The material of secondary substrate 160 can be that clear glass, sapphire, carborundum or class bore carbon.Different from Fig. 3 B with Fig. 3 A, in the blue-light LED chip 108 in Fig. 8 A and Fig. 8 B is partly or entirely be bonded on time substrate 160, and secondary substrate 160 is bonded on transparency carrier 106 with transparent adhesion coating 132.
In Fig. 9, step 154a and step 155a instead of step 154 in Fig. 6 and step 155 respectively.Secondary substrate 160 is fixed on transparency carrier 106 with the transparent adhesion coating 132 with fluorescent material by step 154a.In one embodiment, transparent adhesion coating 132 is first formed at the back side of time substrate 160, and then secondary substrate 160 is just attached on transparency carrier 106; In another embodiment, transparent adhesion coating 132 is first coated with and is formed on the upper surface 102 of transparency carrier 106, and then secondary substrate 160 is just attached on transparent adhesion coating 132.Blue-light LED chip 108 is then then bonded on time substrate 160 by step 155a.
In embodiment in Fig. 7 A, Fig. 7 B, Fig. 8 A, Fig. 8 B and Fig. 9, blue-light LED chip 108 with the same or similar material with transparent adhesion coating 132, can be bonded on time substrate 160.But the present invention is not limited to this, in one embodiment, blue-light LED chip 108 with transparent adhesive tape or the eutectic metal not containing fluorescent material, can be bonded on time substrate 160.In another embodiment, secondary substrate 160 is printed with bus, and blue-light LED chip 108 is with upside-down mounting (flip chip), and mode set thereon, therefore the step 156 in Fig. 9 may be able to be omitted, but blue-light LED chip 108b still needs by bonding wire 100 to be electrically connected with via 107; And blue-light LED chip 108a also needs by bonding wire 100 to be electrically connected with conductive electrode plate 118.In another embodiment, blue-light LED chip 108 is with anisotropic conductive macromolecule or anisotropic conductive film (anisotropic conductive Polymer, ACP; Anisotropic conductive film, ACF) be bonded on time substrate 160.
LED component 100b in Fig. 7 A, Fig. 7 B, Fig. 8 A, Fig. 8 B and Fig. 9, enjoys with the same benefit of the LED component 100a in Fig. 2 A, Fig. 2 B, Fig. 3 A, Fig. 3 B and Fig. 6.For example, the terminal 114 of LED component 100b only can fixedly stand in scolding tin an electrical connection circuit board also side by side providing driving power; The lower surface 104 of LED component 100b compares is not afraid of scratch, and manufacture craft yield can effectively promote; LED component 100b goes for being an all-round illuminating apparatus; LED component 100b can alleviate or prevent the problem of blue light leak.
Fig. 8 C and Fig. 8 D shows two cutaway views of LED component 100c, is respectively the distortion of Fig. 8 A and Fig. 8 B.Adopt single transparent adhesion coating 132 in LED component 100b (in Fig. 8 A and Fig. 8 B), secondary substrate 160 is bonded on transparency carrier 106.Different with LED component 100b, secondary substrate 160, with two transparent adhesion coatings 132 and 133, is bonded on transparency carrier 106 by LED component 100c (in Fig. 8 C and Fig. 8 D).At least transparent adhesion coating 132 and 133 one of them include fluorescent material.In the embodiment of Fig. 8 C and Fig. 8 D, transparent adhesion coating 132 has fluorescent material, and transparent adhesion coating 133 does not have.The material of transparent adhesion coating 133 for example, can be epoxy resin (epoxy resin) or silica gel (silicone).Because transparent adhesion coating 133 does not have fluorescent material, so reasonable adhesion effect can be provided, be attached on transparency carrier 106.Transparent adhesion coating 132,133 can be identical or different material.In another embodiment, another transparent adhesion coating 133 can also be formed between secondary substrate 160 and transparent adhesion coating 132 in wherein, to increase adherence each other.
Blue-light LED chip 108 in the light-emitting diode component 100 of Fig. 1 is be electrically connected to each other by bonding wire 110 each other, but the present invention is not limited thereto.Figure 10 is the schematic perspective view of the light-emitting diode component 400 according to one embodiment of the invention, and blue-light LED chip 108 is wherein bonded on upper surface 102 in upside-down mounting mode.Figure 11 A and Figure 11 B shows the top view of LED component 400a and lower view.Figure 12 A shows the AA generalized section of LED component 400a in Figure 11 A; And Figure 12 B is the BB generalized section of LED component 400a in Figure 11 A.Figure 10, Figure 11 A, Figure 11 B, Figure 12 A and Figure 12 B is similar to corresponding diagram 1, Fig. 2 A, Fig. 2 B, Fig. 3 A and Fig. 3 B respectively, and wherein identical symbol or the element corresponding to mark, device or step, for having similar or identical element, device or step.For succinct event, its explanation may be omitted in this description.
Figure 12 A and Figure 12 B is different from Fig. 3 A and Fig. 3 B, is, in Figure 12 A and Figure 12 B, transparency carrier 106 to be printed with bus 402, and blue-light LED chip 108 is be electrically connected by bus 402 each other.So the blue-light LED chip 108 in Figure 12 A and Figure 12 B is for surrounding and upper and lower, can emit beam, therefore LED component 400a can be considered a kind of can provide six luminous light-emitting components.Figure 12 C shows another LED component 400b, lower surface 104 is wherein coated with a fluorescence coating 131, has fluorescent material in fluorescence coating 131, and the light that blue-light LED chip 108 can be sent, converts the light of another kind of color to.So, the chance of leaking blue light from lower surface 104 can be reduced.In another embodiment, the blue-light LED chip 108 in LED component 400a can replace with White-light LED chip, and each White-light LED chip is essentially the blue-light LED chip that surface is formed with a fluorescence coating.So, problem blue light can being avoided to leak outside.
Although LED component 100a and the 100b in preceding embodiment has via 107, as a part for a circuit, make the conductive electrode plate 120 and 118 in the upper and lower surface 102 and 104 of transparency carrier 106 as the two driving power inputs of LED component 100a and 100b, but can the invention is not restricted to there is via.
Figure 13 shows the schematic perspective view of the LED component 200 according to one embodiment of the invention.Figure 14 and Figure 15 is respectively a top view and a side view of LED component 200a.Different with LED component 100a and 100b, the LED component 200a in Figure 14 and Figure 15, in two terminals 114 and 116 of the upper surface 102 of transparency carrier 106, is formed with conductive electrode plate 118 and 119 respectively.In LED component 200a, conductive electrode plate 118 and 119 has part to step out or extend beyond two terminals 114,116 of transparency carrier 106.And LED component 200a does not have via 107.LED component 200 in Figure 13, Figure 14 and Figure 15 or the manufacture method of 200a and step can be known by inference with reference to aforementioned explanation, therefore are not repeated.
In LED component 200a, each blue-light LED chip has the transparent adhesion coating 132 that single-phase is corresponding for 108 times, but the present invention is not limited thereto.As previously described, in other examples, many blue-light LED chips 108 can share a transparent adhesion coating 132, or all blue-light LED chips 108 are only adhered on transparency carrier 106 by a transparent adhesion coating 132.
Figure 16 and Figure 17 shows another LED component 200b, LED component 200a in itself and Figure 14 and Figure 15 is similar, but each blue-light LED chip 108 in Figure 16 and Figure 17 is bonded on a substrate 160, and secondary substrate 160 is bonded on transparency carrier 106 by transparent adhesion coating 132.Details in LED component 200b, can LED component 100b in reference diagram 8A and Fig. 8 B and associated description and know by inference, is not repeated.
Figure 18 shows the end view of another LED component 200c.Figure 19 then shows a kind of process for making of LED component 200c.Figure 18 and Figure 17 is similar to, and the top view of Figure 18 can be similar to Figure 16, and Figure 19 and Fig. 9 is similar to, and wherein something in common is not repeated.Different from Figure 17, in figure 18, conductive electrode plate 118 and 119 is attached on transparent adhesion coating 132.Process for making in Figure 19, is inserted with step 151 between step 150 and 152, and it is coated with transparent adhesion coating 132 on transparency carrier 106.In other words, the formation of transparent adhesion coating 132, just can carry out before conductive electrode plate 118 and 119 attaches.Transparent adhesion coating 132 can be epoxy resin (epoxy resin) or silica gel (silicone), and is mixed with fluorescent material identical or similar in transparent colloid 112.For example, fluorescent material can be YAG or TAG fluorescent material.
LED component 200b and 200c in Figure 17 and Figure 18 adopts single transparent adhesion coating 132, is bonded on transparency carrier 106 by secondary substrate 160.But the present invention is not limited to this.In other embodiments, LED component 200b and 200c can be changed, and adopts the two-layer transparent adhesion coating 132 and 133 in 8C and 8D figure, is bonded on transparency carrier 106 by secondary substrate 160.In another embodiment, another transparent adhesion coating 133 can also be formed between secondary substrate 160 and transparent adhesion coating 132 in wherein, to increase adherence each other.
The lower surface 104 of LED component 200a, 200b and 200c does not have pattern completely, does not have the problem of lower surface 104 scratch completely.LED component 200a, 200b and 200c equally go for the application of all-round light field, and comparatively without blue light leak problem.For example, a bulb can use scolding tin or conductive fixture, fixes in LED component 200a, 200b or 200c, is positioned at the conductive electrode plate 118 and 119 of two terminals 114 and 116, and is provided the electrical connection of driving power simultaneously by this two battery lead plate.
Figure 20 shows the schematic perspective view of the LED component 300 of another embodiment of the present invention.Figure 21 A and Figure 21 B shows the top view of a LED component 300a and lower view.Figure 22 shows a cutaway view of LED component 300a.LED component 300a, in two terminals 114 and 116 of the lower surface 104 of transparency carrier 106, is formed with conductive electrode plate 120 and 122 respectively.In Figure 21 A, Figure 21 B and Figure 22, LED component 300a has the position that two via 107A, 107B are respectively formed at close terminal 114,116.Conductive electrode plate 120 is by via 107A, and conductive electrode plate 122 is by via 107B, is electrically connected to the blue-light LED chip 108 being positioned at upper surface 102.Blue-light LED chip 108 arranges and is connected between via 107A and 107B electrically, also arranges and is electrically connected between conductive electrode plate 120 and 122.Details in LED component 300a and possible change, can know by inference with reference to the description of other embodiments in this specification, be not repeated.
Figure 23 shows a side view of LED component 300b.Wherein, secondary substrate 160 is sandwiched between blue-light LED chip 108 and transparent adhesion coating 132.Details in LED component 300b and possible change, can know by inference with reference to the description of other embodiments in this specification, be not repeated.
Although in LED component 200 and 300, the conductive electrode plate being positioned at two terminals has part to step out or extend beyond two terminals 114,116 of transparency carrier 106, the present invention is not limited thereto.Figure 24 shows the schematic perspective view of LED component 600.Figure 25 A shows LED component 600a, and it is a kind of possible top view of LED component 600.In Figure 25 A, conductive electrode plate 118 and 119 has and trims with the edge of transparency carrier 106.Figure 25 B shows LED component 600b, and it is the possible top view of the another kind of LED component 600.In Figure 25 B, conductive electrode plate 118 and 119 is seated within transparency carrier 106 completely.
Figure 26 A shows the schematic perspective view of the LED component 700 of another embodiment of the present invention.Figure 26 B shows the top view of LED component 700.Figure 26 C shows the cutaway view of LED component 700.LED component 700 in Figure 26 A has two conductive electrode plates 118 and 123, and it is positioned on the side and upper surface 102 of terminal 114, and the lower surface 104 of transparency carrier 106 does not have other LED element.Bus 198 and 196 extends from conductive electrode plate 118 and 123 towards the direction of terminal 116 respectively.Blue-light LED chip 108 is fixed on upper surface 102 and between bus 198 and 196.The anode of each blue-light LED chip 108 and negative electrode utilize bonding wire 110 to be electrically connected to bus 198 and 196.Therefore, the blue-light LED chip 108 in Figure 26 A, Figure 26 B and Figure 26 C is connected in parallel with each other between bus 198 and 196.Bus 198 and 196 can as two of LED component 700 power input.In one embodiment, blue-light LED chip 108 can utilize upside-down mounting mode to be electrically connected to bus 198 and 196, does not namely need to be electrically connected to bus 198 and 196 by bonding wire 110.As shown in Figure 26 C, blue-light LED chip 108 in fact by transparent adhesion coating 132 and transparent colloid 112 wrap up, and transparent adhesion coating 132 and transparent colloid 112 all comprise at least one fluorescent material is scattered in wherein.Preferably, blue-light LED chip 108 is completely coated by the material of upper and lower, and right bonding wire 110 still may have the chance be revealed in outside transparent adhesion coating 132 and transparent colloid 112.Transparent adhesion coating 132 and transparent colloid 112 all comprise at least one fluorescent material.In one embodiment, transparent colloid 112 comprises two kinds of fluorescent material.The some blue light (for example its crest value is 430nm-480nm) that one of them fluorescent material can send by blue-light LED chip 108 is excited, and produces gold-tinted or green-yellow light or green glow (for example its crest value is 520nm-590nm); The some blue light (for example its crest value is 430nm-480nm) that another fluorescent material can send by blue-light LED chip 108 is excited, and produces ruddiness (for example its crest value is 610nm-680nm).The composition of yellowish green fluorescent powder is such as aluminum oxide (YAG or TAG), silicate, vanadate, alkaline-earth metal selenides or metal nitride.The composition of red fluorescence powder is such as silicate, vanadate, alkaline earth sulfide, metal oxynitride or tungsten hydrochlorate race mixture.Manufacture method and the step of the LED component 700 in Figure 26 A, Figure 26 B and Figure 26 C can be known by inference with reference to aforementioned explanation, therefore are not repeated.
LED component 700 can be done to change according to embodiment of the present invention.Such as, blue-light LED chip 108 can be fixed on a carrier.Secondary carrier is bonded to transparency carrier 106 by least one transparent adhesion coating 132, and wherein, transparent adhesion coating 132 can comprise or not comprise fluorescent material.
Figure 27 A shows the LED bulb 500a using LED component 300 as a wick.LED bulb 500a has two fixtures 502.Fixture 502 can be V-type or Y type.In one embodiment, fixture 502 can be rectangle and has a groove, in order to fixed L ED assembly 300.Each fixture 502 formed with conducting objects, and with two tips of fixture 502, the conductive electrode plate of strangulation fixed L ED assembly 300 liang of terminals, and the upper surface 102 making LED component 300 upward (direction of Z).Fixture 502 also makes the conductive electrode plate at LED component 300 two ends be electrically connected to the Edison base of LED bulb 500a, to provide LED component 300 electric energy that luminescence needs.Figure 27 category-B is like Figure 27 A, but the LED bulb 500b using LED component 600 as a wick.Different from LED bulb 500a, in LED bulb 500b, the upper surface 102 of LED component 600 is towards the direction of Y, roughly follows the rotating shaft (Z-direction) of LED bulb 500b vertical.Certain, the LED component 300 or 600 in 27A and 27B figure, can replace by previous introduced LED component 200, its details and possible change, can know by inference, be not repeated with reference to the description of other embodiments in this specification.
The lower surface 104 of LED component 300a and 300b only has large area, not too fears the conductive electrode plate 120 and 122 of scratch, and manufacture craft yield can obtain suitable improvement.The lower surface 104 of LED component 600a and 600b does not have pattern completely, is not more afraid of scratch.LED component 300a, 300b, 600a and 600b equally go for all-round light field application, comparatively without blue light leak problem.
Although above embodiment all adopts blue-light LED chip 108 as light source, the present invention is not limited thereto.In other embodiments, there are some or whole LED chips is not blue light, but ruddiness or green glow.
Some embodiments of the present invention, because the existence having transparency carrier 106 and transparent adhesion coating 132, can towards luminous from all directions, so be applicable to the application of all-round light.In certain embodiments, all blue-light LED chips 108 all roughly by transparent adhesion coating 132 and transparent colloid 112 wrap up, so there is no blue light leak problem.As long as the LED component in some embodiments can fix a terminal just can accept Power supply and mechanism supports simultaneously; LED component in some embodiments can mechanism fix two terminals time, simultaneously accept Power supply from two terminals; The lower surface of the LED component in some embodiments does not have careful pattern or circuit, compares and is not afraid of scratch, can facilitate taking or fixing in manufacture process, improve manufacture craft yield.
The foregoing is only several embodiment of the present invention, but each embodiment each other not mutually under conflict when can each other with reference to, merge or replace, all equalization changes done according to the claims in the present invention with modify, all should belong to covering scope of the present invention.

Claims (10)

1. a light-emitting diode component, includes:
Transparency carrier, has in the face of rightabout first surface and second surface;
Multiple light-emitting diode chip for backlight unit, is fixed on this first surface;
Circuit, is electrically connected the plurality of light-emitting diode chip for backlight unit;
Transparent encapsulating body, has fluorescent material, and this transparent encapsulating body is located on this first surface, roughly wraps up the plurality of light-emitting diode chip for backlight unit and this circuit; And
Two battery lead plates, are attached at this first surface or this second surface, are connected to the plurality of light-emitting diode chip for backlight unit by this line electricity, as two power inputs of this light-emitting diode component.
2. light-emitting diode component as claimed in claim 1, wherein, this transparent encapsulating body includes transparent adhesion coating, has fluorescent material and is located between the plurality of light-emitting diode chip for backlight unit one of them and this transparency carrier.
3. light-emitting diode component as claimed in claim 1, wherein, this transparent encapsulating body includes multiple transparent adhesion coating, and the plurality of light-emitting diode chip for backlight unit is located at one to one on the plurality of transparent adhesion coating.
4. light-emitting diode component as claimed in claim 1, wherein, this transparent encapsulating body comprises single transparent adhesion coating, and all the plurality of light-emitting diode chip for backlight unit are all located on this transparent adhesion coating.
5. light-emitting diode component as claimed in claim 1, wherein, this transparent encapsulating body includes transparent colloid, and be coated on top and the surrounding of the plurality of light-emitting diode chip for backlight unit, this transparent colloid has fluorescent material.
6. light-emitting diode component as claimed in claim 2, separately includes time substrate, is located between the plurality of light-emitting diode and this transparent adhesion coating.
7. light-emitting diode component as claimed in claim 6, wherein, the plurality of light-emitting diode chip for backlight unit, in upside-down mounting mode, is bonded on this substrate.
8. light-emitting diode component as claimed in claim 1, wherein, this circuit includes at least one bonding wire, be electrically connected the plurality of light-emitting diode chip for backlight unit wherein two.
9. light-emitting diode component as claimed in claim 1, wherein, this transparency carrier is one rectangular, and have first terminal and the second terminal, these two battery lead plates are located at this first surface and this second surface of this first terminal respectively.
10. light-emitting diode component as claimed in claim 1, wherein, this transparency carrier is one rectangular, and have first terminal and the second terminal, these two battery lead plates are located at this first terminal and this second terminal respectively.
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US20230142465A1 (en) 2023-05-11
US20210054972A1 (en) 2021-02-25
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US20150003038A1 (en) 2015-01-01
CN111457260B (en) 2022-06-07

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