CN104193995A - Organic silicon packaging material for 3D printing devices and preparation method thereof - Google Patents
Organic silicon packaging material for 3D printing devices and preparation method thereof Download PDFInfo
- Publication number
- CN104193995A CN104193995A CN201410410962.4A CN201410410962A CN104193995A CN 104193995 A CN104193995 A CN 104193995A CN 201410410962 A CN201410410962 A CN 201410410962A CN 104193995 A CN104193995 A CN 104193995A
- Authority
- CN
- China
- Prior art keywords
- silane
- type printer
- phenyl
- acryloxy
- encapsulating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Silicon Polymers (AREA)
Abstract
The invention relates to an organic silicon packaging material for 3D printing devices and a preparation method thereof. The method comprises the following steps: uniformly mixing vinyl silane, phenyl silane and acryloyloxy silane, dropwisely adding water and a catalyst, and heating for condensation to obtain an organic silicon low polymer containing vinyl and acryloyloxy groups; adding the catalyst into an organic solvent, slowly and dropwisely adding sulfhydryl silane, and carrying out hydrolytic rearrangement to obtain sulfhydryl silsesquioxane; and mixing the organic silicon low polymer containing vinyl and acryloyloxy groups with the sulfhydryl silsesquioxane and an initiator, and carrying out ultraviolet irradiation and thermosetting to obtain the organic silicon packaging material which is used for liquid bath packaging in 3D printing devices. The acryloyloxy, vinyl and sulfhydryl groups are simultaneously introduced into the organic silicon polymer; the ultraviolet setting and thermosetting are used for crosslinking to enhance the light transmittance and mechanical properties of the material; and thus, the material has the advantages of no yellowing, high solvent resistance, high hydrolytic stability and the like, and satisfies the ever-developing 3D printing industry.
Description
?
technical field
The present invention relates to the packaged material that a kind of 3D type printer is used, particularly a kind of organosilicon encapsulating material and preparation method thereof, belongs to organosilicon applied technical field.
background technology
3D prints has become a kind of trend, 3D printer is a kind of machine of rapid shaping technique, it is that a kind of digital model file is basis, use powdery metal or the plastics etc. can jointing material, build the technology of object by the mode of successively printing, and start to be widely used in design field, especially industrial design, digital product die sinkings etc. can complete the printing of a mould within a few hours, have saved the development time of a lot of products to market.
Along with 3D prints the flourish of industry, packaged material performance requriements to liquid pool in print apparatus is also more and more higher, therefore, exploitation one has good insulation and anti-seismic performance, and good solubility-resistence is strong, not xanthochromia, has good stability to hydrolysis and the packaged material that returns reducing property, and market outlook are wide.
summary of the invention
Poor in order to overcome the good solubility-resistence that in existing 3D type printer, liquid pool packaged material exists, high temperature produces the shortcomings such as xanthochromia and poor mechanical property, the object of the present invention is to provide a kind of organosilicon encapsulating material for 3D type printer and preparation method.
Object of the present invention realizes by following proposal:
For an organosilicon encapsulating material for 3D type printer, prepared by following methods:
(1) by vinyl silanes, phenyl silane, acryloxy silane mixture in organic solvent, drip water and catalyzer, be heated to 60-120 DEG C, carry out condensation reaction 1-12h, static extraction separatory, organic layer is washed to neutrality, after being dried, carries out underpressure distillation except desolventizing, obtains the silicone oligomer containing vinyl and acryloxy;
(2) catalyzer is joined in organic solvent, then slowly drip hydrosulphonyl silane, the rearrangement reaction that is hydrolyzed at-5-30 DEG C, after reaction 24-240h, filters and obtains after drying sulfydryl silsesquioxane;
(3) the sulfydryl silsesquioxane of preparing containing vinyl and acryloxy silicone oligomer, step (2) that will be prepared by step (1) mixes with organic solvent, after stirring and dissolving is even, drip initiator, uv irradiating 10-20min, be heated to 40-100 DEG C of curing 1-3h, obtain the organosilicon encapsulating material for 3D type printer.
Vinyl silanes described in step (1), phenyl silane and its mass ratio of acryloyl-oxy base silane are 4-1.0: 3-1.0: 1; Catalyst quality is the 2-5% of silane total mass; Quality is 1-5 times of silane total mass; Organic solvent quality is 2-4 times of silane total mass;
Vinyl silanes described in step (1) is the one in vinyltrimethoxy silane, vinyltriethoxysilane, methyl ethylene diethoxy silane or methyl ethylene dimethoxy silane;
Phenyl silane described in step (1) is the one in phenylbenzene diethoxy silane, dimethoxydiphenylsilane, aminomethyl phenyl diethoxy silane or aminomethyl phenyl dimethoxy silane;
Acryloyl-oxy base silane described in step (1) is 3-(methacryloxy) propyl trimethoxy silicane, 3-(methacryloxy) propyl-triethoxysilicane, 3-(acryloxy) propyl trimethoxy silicane, 3-(acryloxy) propyl-triethoxysilicane, 3-(acryloxy) propyl group methyl dimethoxysilane, 3-(acryloxy) propyl group methyldiethoxysilane, 3-(methacryloxy) propyl group methyl dimethoxysilane, or 3-(methacryloxy) one in propyl group methyldiethoxysilane,
Catalyst quality described in step (2) is the 1-5% of hydrosulphonyl silane quality; The quality of organic solvent is 5-50 times of hydrosulphonyl silane quality;
Hydrosulphonyl silane described in step (2) is the one in 3-mercaptopropyltriethoxysilane, 3-mercaptopropyl trimethoxysilane;
Catalyzer described in step (1) and step (2) is the one in hydrochloric acid, sulfuric acid, phosphoric acid or acetic acid;
Described in step (3) to contain vinyl and acryloxy silicone oligomer and sulfydryl silsesquioxane mass ratio be 1.2-4: 1, the 3-5% that initiator quality is total mass;
Described in step (3) contain vinyl and its viscosity of acryloxy silicone oligomer is 100-10000Pa
˙s;
Initiator described in step (3) is for to be made up of light trigger and thermal initiator; Described light trigger is 1-hydroxy-cyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-acetone, 2-hydroxy-2-methyl-1-[4-(2-hydroxyl-oxethyl) phenyl]-1-acetone, 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl) phenyl]-1-butanone, 2,4,6-trimethylbenzoyl phenyl-phosphonic acid ethyl ester, 2,4,6-trimethylbenzoyl-diphenyl phosphine oxide or 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio group) phenyl] one in-1-acetone; Described thermal initiator is the one in benzoyl peroxide, isopropyl benzene hydroperoxide, Diisopropyl azodicarboxylate, 2,2'-Azobis(2,4-dimethylvaleronitrile), di-t-butyl peroxide, peroxidized t-butyl perbenzoate or di-isopropyl peroxydicarbonate;
Organic solvent described in step (1), step (2) and step (3) is the one in toluene, dimethylbenzene, benzene, ethanol, methyl alcohol, acetone, tetrahydrofuran (THF), ether or methylene dichloride.
The organosilicon material of above-mentioned preparation not only can be applied to the encapsulation of liquid pool in 3D type printer, can also continue to expand it and be applied in the field such as light and electron device package.
The present invention has following advantage and effect with respect to prior art:
The present invention has introduced the functional groups such as acryloxy, thiazolinyl, sulfydryl in organosilicon polymer, adopt thermofixation and two kinds of crosslinking technologicals of ultraviolet light polymerization, in structure, introduced the polyhedral silsesquioxane with nano-scale simultaneously and improved mechanical property, good solubility-resistence energy and the stability of material.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail, but embodiments of the present invention are not limited to this.
Embodiment 1
For a preparation method for the organosilicon encapsulating material of 3D type printer, comprise the following steps:
(1) by 30g vinyltrimethoxy silane, 20g dimethoxydiphenylsilane, 10g3-(methacryloxy) propyl trimethoxy silicane is mixed in 125g toluene solvant, drip 120g water and 3.0g hydrochloric acid, be heated to 60 DEG C, reaction 4h, static extraction separatory, organic layer is washed to neutrality, after being dried, carries out underpressure distillation except desolventizing, obtains the water white silicone oligomer A containing vinyl and acryloxy
1;
(2) 0.5g hydrochloric acid is joined in 300g methanol solvate, then slowly drip 20g 3-mercapto propyl-triethoxysilicane, the rearrangement reaction that is hydrolyzed at 10 DEG C, after reaction 120h, filters and obtains after drying sulfydryl silsesquioxane;
(3) 40g is contained to vinyl and acryloxy silicone oligomer A
1, 12g sulfydryl silsesquioxane mixes, stirring and dissolving evenly after, drip 1.3g 1-hydroxy-cyclohexyl phenyl ketone and 1.3 benzoyl peroxide initiators, uv irradiating 10min, is heated to 80 DEG C of curing 2h, obtains the organosilicon encapsulating material for 3D type printer.
Embodiment 2
For a preparation method for the organosilicon encapsulating material of 3D type printer, comprise the following steps:
(1) by 20g vinyltriethoxysilane, 15g phenylbenzene diethoxy silane, 10g3-(acryloxy) propyl trimethoxy silicane is mixed in 90g xylene solvent, drip 180g water and 2.0g sulfuric acid, be heated to 80 DEG C, carry out condensation reaction 6h, static extraction separatory, organic layer is washed to neutrality, after being dried, carries out underpressure distillation except desolventizing, obtains the silicone oligomer A2 containing vinyl and acryloxy;
(2) 1.2g sulfuric acid is joined in 300g ether solvent, then slowly drip 30g 3-mercapto propyl trimethoxy silicon, the rearrangement reaction that is hydrolyzed at 30 DEG C, after reaction 240h, filters and obtains after drying sulfydryl silsesquioxane;
(3) 30g is contained to vinyl and acryloxy silicone oligomer A
2, 7.5g sulfydryl silsesquioxane mix, after stirring and dissolving is even, drip 0.75g 2-hydroxy-2-methyl-1-[4-(2-hydroxyl-oxethyl) phenyl]-1-acetone and 0.75 Diisopropyl azodicarboxylate initiator, uv irradiating 20min, be heated to 100 DEG C of curing 1h, obtain the organosilicon encapsulating material for 3D type printer.
Embodiment 3
For a preparation method for the organosilicon encapsulating material of 3D type printer, comprise the following steps:
(1) by 30g methyl ethylene diethoxy silane, 18g aminomethyl phenyl diethoxy silane, 10g3-(methacryloxy) propyl-triethoxysilicane is mixed in 240g acetone solvent, drip 300g water and 1.2g hydrochloric acid, be heated to 120 DEG C, carry out condensation reaction 2h, static extraction separatory, organic layer is washed to neutrality, after being dried, carries out underpressure distillation except desolventizing, obtains the silicone oligomer A containing vinyl and acryloxy
3;
(2) 0.3g phosphoric acid is joined in 250g tetrahydrofuran solvent, then slowly drip 30g 3-mercapto propyl-triethoxysilicane, the rearrangement reaction that is hydrolyzed at 5 DEG C, after reaction 48h, filters and obtains after drying sulfydryl silsesquioxane;
(3) 12g is contained to vinyl and acryloxy silicone oligomer A
3, 10g sulfydryl silsesquioxane mix, after stirring and dissolving is even, drip 0.825g2-hydroxy-2-methyl-1-phenyl-acetone and 0.275 di-t-butyl peroxide initiator, uv irradiating 15min, be heated to 80 DEG C of curing 1h, obtain the organosilicon encapsulating material for 3D type printer.
Embodiment 4
For a preparation method for the organosilicon encapsulating material of 3D type printer, comprise the following steps:
(1) by 15g methyl ethylene dimethoxy silane, 20g aminomethyl phenyl dimethoxy silane, 10g3-(acryloxy) propyl-triethoxysilicane is mixed in 90g alcohol solvent, drip 90g water and 3.0g hydrochloric acid, be heated to 100 DEG C, carry out condensation reaction 8h, static extraction separatory, organic layer is washed to neutrality, after being dried, carries out underpressure distillation except desolventizing, obtains the silicone oligomer A containing vinyl and acryloxy
4;
(2) 0.3g acetic acid is joined in 250g tetrahydrofuran solvent, then slowly drip 30g 3-mercapto propyl trimethoxy silicon, the rearrangement reaction that is hydrolyzed at 5 DEG C, after reaction 48h, filters and obtains after drying sulfydryl silsesquioxane;
(3) 30g is contained to vinyl and acryloxy silicone oligomer A
4, 10g sulfydryl silsesquioxane mixes, stirring and dissolving evenly after, drip 0.8g 2; 4,6-trimethylbenzoyl phenyl-phosphonic acid ethyl ester and 0.8 peroxidized t-butyl perbenzoate initiator, uv irradiating 10min; be heated to 60 DEG C of curing 1h, obtain the organosilicon encapsulating material for 3D type printer.
Embodiment 5
For a preparation method for the organosilicon encapsulating material of 3D type printer, comprise the following steps:
(1) by 30g vinyltrimethoxy silane, 15g aminomethyl phenyl diethoxy silane, 10g 3-(acryloxy) propyl group methyl dimethoxysilane is mixed in 165g toluene solvant, drip 110g water and 2.2g hydrochloric acid, be heated to 120 DEG C, carry out condensation reaction 10h, static extraction separatory, organic layer is washed to neutrality, after being dried, carries out underpressure distillation except desolventizing, obtains the silicone oligomer A containing vinyl and acryloxy
5;
(2) 0.3g hydrochloric acid is joined in 250g dichloromethane solvent, then slowly drip 30g 3-mercapto propyl-triethoxysilicane, the rearrangement reaction that is hydrolyzed at-5 DEG C, after reaction 240h, filters and obtains after drying sulfydryl silsesquioxane;
(3) 40g is contained to vinyl and acryloxy silicone oligomer A
5, 10g sulfydryl silsesquioxane mix, after stirring and dissolving is even, drip 0.75g2-methyl-2-(4-morpholinyl)-1-[4-(methylthio group) phenyl]-1-acetone and 0.75 di-isopropyl peroxydicarbonate initiator, uv irradiating 20min, be heated to 100 DEG C of curing 2h, obtain the organosilicon encapsulating material for 3D type printer.
Claims (12)
1. for an organosilicon encapsulating material for 3D type printer, it is characterized in that, described material is prepared by following methods:
(1) by vinyl silanes, phenyl silane, acryloxy silane mixture in organic solvent, drip water and catalyzer, be heated to 60-120 DEG C, carry out condensation reaction 1-12h, static extraction separatory, organic layer is washed to neutrality, after being dried, carries out underpressure distillation except desolventizing, obtains the silicone oligomer containing vinyl and acryloxy;
(2) catalyzer is joined in organic solvent, then slowly drip hydrosulphonyl silane, the rearrangement reaction that is hydrolyzed at-5-30 DEG C, after reaction 24-240h, filters and obtains after drying sulfydryl silsesquioxane;
(3) the sulfydryl silsesquioxane of preparing containing vinyl and acryloxy silicone oligomer and step (2) that will be prepared by step (1) mixes, after stirring and dissolving is even, drip initiator, uv irradiating 10-20min, be heated to 40-100 DEG C of curing 1-3h, obtain the organosilicon encapsulating material for 3D type printer.
2. a kind of organosilicon encapsulating material for 3D type printer according to claim 1, is characterized in that: the vinyl silanes described in step (1), phenyl silane and its mass ratio of acryloyl-oxy base silane are 4-1.0: 3-1.0: 1; Catalyst quality is the 2-5% of silane total mass; Quality is 1-5 times of silane total mass; Organic solvent quality is 2-4 times of silane total mass.
3. a kind of organosilicon encapsulating material for 3D type printer according to claim 1, is characterized in that: the vinyl silanes described in step (1) is the one in vinyltrimethoxy silane, vinyltriethoxysilane, methyl ethylene diethoxy silane or methyl ethylene dimethoxy silane.
4. a kind of organosilicon encapsulating material for 3D type printer according to claim 1, is characterized in that: the phenyl silane described in step (1) is the one in phenylbenzene diethoxy silane, dimethoxydiphenylsilane, aminomethyl phenyl diethoxy silane or aminomethyl phenyl dimethoxy silane.
5. a kind of organosilicon encapsulating material for 3D type printer according to claim 1, it is characterized in that: the acryloyl-oxy base silane described in step (1) is 3-(methacryloxy) propyl trimethoxy silicane, 3-(methacryloxy) propyl-triethoxysilicane, 3-(acryloxy) propyl trimethoxy silicane, 3-(acryloxy) propyl-triethoxysilicane, 3-(acryloxy) propyl group methyl dimethoxysilane, 3-(acryloxy) propyl group methyldiethoxysilane, 3-(methacryloxy) propyl group methyl dimethoxysilane, or 3-(methacryloxy) one in propyl group methyldiethoxysilane.
6. a kind of organosilicon encapsulating material for 3D type printer according to claim 1, is characterized in that: described in step (2), catalyst quality is the 1-5% of hydrosulphonyl silane quality; Organic solvent quality is 5-50 times of hydrosulphonyl silane quality.
7. a kind of organosilicon encapsulating material for 3D type printer according to claim 1, is characterized in that: the hydrosulphonyl silane described in step (2) is the one in 3-mercaptopropyltriethoxysilane, 3-mercaptopropyl trimethoxysilane.
8. a kind of organosilicon encapsulating material for 3D type printer according to claim 1, is characterized in that: the catalyzer described in step (1) and step (2) is the one in hydrochloric acid, sulfuric acid, phosphoric acid or acetic acid.
9. a kind of organosilicon encapsulating material for 3D type printer according to claim 1, it is characterized in that: described in step (3) to contain vinyl and acryloxy silicone oligomer and sulfydryl silsesquioxane mass ratio be 1.2-4: 1, the 3-5% that initiator quality is total mass.
10. a kind of organosilicon encapsulating material for 3D type printer according to claim 1, is characterized in that: described in step (3) contain vinyl and its viscosity of acryloxy silicone oligomer is 100-10000Pa ˙ S.
11. a kind of organosilicon encapsulating materials for 3D type printer according to claim 1, is characterized in that: the initiator described in step (3) is for to be made up of light trigger and thermal initiator; The mass ratio of light trigger and thermal initiator is 1:1; Described light trigger is 1-hydroxy-cyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-acetone, methyl benzoylformate, 2-hydroxy-2-methyl-1-[4-(2-hydroxyl-oxethyl) phenyl]-1-acetone, 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl) phenyl]-1-butanone, 2,4,6-trimethylbenzoyl phenyl-phosphonic acid ethyl ester, 2,4,6-trimethylbenzoyl-diphenyl phosphine oxide or 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio group) phenyl] one in-1-acetone; Described thermal initiator is the one in benzoyl peroxide, isopropyl benzene hydroperoxide, Diisopropyl azodicarboxylate, 2,2'-Azobis(2,4-dimethylvaleronitrile), di-t-butyl peroxide, peroxidized t-butyl perbenzoate or di-isopropyl peroxydicarbonate.
12. a kind of organosilicon encapsulating materials for 3D type printer according to claim 1, is characterized in that: in step (1), step (2), the organic solvent described in step (3) is the one in toluene, dimethylbenzene, benzene, ethanol, methyl alcohol, acetone, tetrahydrofuran (THF), ether or methylene dichloride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410410962.4A CN104193995B (en) | 2014-08-20 | 2014-08-20 | A kind of organosilicon encapsulating material for 3D printing equipment and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410410962.4A CN104193995B (en) | 2014-08-20 | 2014-08-20 | A kind of organosilicon encapsulating material for 3D printing equipment and preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104193995A true CN104193995A (en) | 2014-12-10 |
| CN104193995B CN104193995B (en) | 2016-06-29 |
Family
ID=52079384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410410962.4A Active CN104193995B (en) | 2014-08-20 | 2014-08-20 | A kind of organosilicon encapsulating material for 3D printing equipment and preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104193995B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105511006A (en) * | 2016-02-03 | 2016-04-20 | 京东方科技集团股份有限公司 | Polaroid, display substrate, liquid crystal display panel and making method thereof |
| CN106317412A (en) * | 2016-08-17 | 2017-01-11 | 广东工业大学 | Mercaptopropyl polysiloxane with photoreaction activity and preparation method thereof |
| CN106317898A (en) * | 2016-08-17 | 2017-01-11 | 广东工业大学 | Photocured organosilicone elastomer and preparation method and application thereof |
| WO2017124065A1 (en) | 2016-01-15 | 2017-07-20 | Hrl Laboratories, Llc | Resin formulations for polymer-derived ceramic materials |
| CN107814934A (en) * | 2017-11-29 | 2018-03-20 | 四会市兴源再生资源有限公司 | A kind of silsesquioxane and preparation method thereof |
| CN110343251A (en) * | 2019-07-12 | 2019-10-18 | 深圳职业技术学院 | A kind of silicone photonic resin |
| CN112909292A (en) * | 2021-01-15 | 2021-06-04 | 苏州泰仑电子材料有限公司 | Sealing film for fuel cell membrane electrode and preparation method thereof |
| CN117080320A (en) * | 2023-08-21 | 2023-11-17 | 广州满坤电子有限公司 | LED lamp panel and production process thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1696179A (en) * | 2005-06-03 | 2005-11-16 | 哈尔滨工业大学 | Method for grafting modifying silicone resin |
-
2014
- 2014-08-20 CN CN201410410962.4A patent/CN104193995B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1696179A (en) * | 2005-06-03 | 2005-11-16 | 哈尔滨工业大学 | Method for grafting modifying silicone resin |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017124065A1 (en) | 2016-01-15 | 2017-07-20 | Hrl Laboratories, Llc | Resin formulations for polymer-derived ceramic materials |
| EP3402767A4 (en) * | 2016-01-15 | 2019-07-17 | HRL Laboratories, LLC | Resin formulations for polymer-derived ceramic materials |
| EP4026817A1 (en) * | 2016-01-15 | 2022-07-13 | HRL Laboratories, LLC | Resin formulations for polymer-derived ceramic materials |
| CN105511006A (en) * | 2016-02-03 | 2016-04-20 | 京东方科技集团股份有限公司 | Polaroid, display substrate, liquid crystal display panel and making method thereof |
| CN105511006B (en) * | 2016-02-03 | 2018-09-07 | 京东方科技集团股份有限公司 | Polaroid, display base plate, liquid crystal display panel and preparation method thereof |
| CN106317412A (en) * | 2016-08-17 | 2017-01-11 | 广东工业大学 | Mercaptopropyl polysiloxane with photoreaction activity and preparation method thereof |
| CN106317898A (en) * | 2016-08-17 | 2017-01-11 | 广东工业大学 | Photocured organosilicone elastomer and preparation method and application thereof |
| CN107814934A (en) * | 2017-11-29 | 2018-03-20 | 四会市兴源再生资源有限公司 | A kind of silsesquioxane and preparation method thereof |
| CN110343251A (en) * | 2019-07-12 | 2019-10-18 | 深圳职业技术学院 | A kind of silicone photonic resin |
| CN112909292A (en) * | 2021-01-15 | 2021-06-04 | 苏州泰仑电子材料有限公司 | Sealing film for fuel cell membrane electrode and preparation method thereof |
| CN117080320A (en) * | 2023-08-21 | 2023-11-17 | 广州满坤电子有限公司 | LED lamp panel and production process thereof |
| CN117080320B (en) * | 2023-08-21 | 2024-01-12 | 广州满坤电子有限公司 | LED lamp panel and production process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104193995B (en) | 2016-06-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104193995A (en) | Organic silicon packaging material for 3D printing devices and preparation method thereof | |
| CN105331115B (en) | A kind of preparation method of 3D printing ultraviolet curing transparent silicone resin composite material and application | |
| CN102719100B (en) | Low-volatile silicone rubber compound and preparation method thereof | |
| CN102146272B (en) | Radiation curing sealant for packaging eyeglass nameplate or ornament | |
| CN104672402B (en) | A kind of 3D printing conductive photosensitive resin and preparation method thereof | |
| CN103992650A (en) | Ultraviolet ray/wet gas double curing organosilicon resin composition | |
| WO2009021249A4 (en) | Polar polydimethylsiloxane molds, methods of making the molds, and methods of using the molds for pattern transfer | |
| CN106957631B (en) | A kind of dealcoholized silicone rubber sealant | |
| CN105038522A (en) | Photocureable coating and preparation method thereof | |
| CN104559686B (en) | A kind of preparation method of UV-Curable Epoxy Acrylate Coating | |
| CN113583188A (en) | High-weather-resistance high-toughness photocuring material for laser 3D printing and preparation method thereof | |
| CN106753217B (en) | A kind of preparation method of novel heat cure liquid silastic | |
| CN108250838A (en) | A kind of composition for ink for direct write method 3D printing silicone structure | |
| CN107759750A (en) | Photosensitive resin and preparation method thereof | |
| Yu et al. | Silicone elastomer with high elongation at break used in digital light processing 3D printing | |
| CN104449551A (en) | LED packaging silica gel with high refractive index and yellowing resistance | |
| JP5650888B2 (en) | Thermosetting composition and molded product | |
| CN104087000A (en) | Organosilicon material for LED (Light-Emitting Diode) package and preparation method thereof | |
| CN105368068A (en) | High-temperature-resistant, high-breakdown-voltage and filler-free organic silicone rubber for sleeve | |
| CN106146754A (en) | 3D prints by the preparation method and applications of silicon-containing nano gel light-cured resin | |
| CN102259398B (en) | Heat-conducting composite material and preparation method thereof as well as manufacturing method of product encapsulated with heat-conducting composite material | |
| CN106832958A (en) | Photocuring add-on type organopolysiloxane composition and its application in LED element encapsulation | |
| CN106674946B (en) | A kind of waste printed circuit board nonmetal powder nonloaded silica hydridization filler and the preparation method and application thereof | |
| CN105754541A (en) | UV/moisture dual-cured organic silicon resin composition | |
| CN105949966B (en) | The special UV coating of PP base materials |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |