CH447760A - Verfahren zum Reinigen verunreinigter Oberflächen von Halbleitermaterialien mittels inverser Kathodenzerstäubung - Google Patents
Verfahren zum Reinigen verunreinigter Oberflächen von Halbleitermaterialien mittels inverser KathodenzerstäubungInfo
- Publication number
- CH447760A CH447760A CH1534466A CH1534466A CH447760A CH 447760 A CH447760 A CH 447760A CH 1534466 A CH1534466 A CH 1534466A CH 1534466 A CH1534466 A CH 1534466A CH 447760 A CH447760 A CH 447760A
- Authority
- CH
- Switzerland
- Prior art keywords
- inverse
- semiconductor materials
- cathode sputtering
- contaminated surfaces
- cleaning contaminated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US502986A US3410774A (en) | 1965-10-23 | 1965-10-23 | Method and apparatus for reverse sputtering selected electrically exposed areas of a cathodically biased workpiece |
Publications (1)
Publication Number | Publication Date |
---|---|
CH447760A true CH447760A (de) | 1967-11-30 |
Family
ID=24000292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1534466A CH447760A (de) | 1965-10-23 | 1966-10-21 | Verfahren zum Reinigen verunreinigter Oberflächen von Halbleitermaterialien mittels inverser Kathodenzerstäubung |
Country Status (7)
Country | Link |
---|---|
US (1) | US3410774A (nl) |
BE (1) | BE688703A (nl) |
CH (1) | CH447760A (nl) |
DE (1) | DE1621599C2 (nl) |
FR (1) | FR1501165A (nl) |
GB (1) | GB1157989A (nl) |
NL (1) | NL154560B (nl) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3502562A (en) * | 1967-04-19 | 1970-03-24 | Corning Glass Works | Multiple cathode sputtering fixture |
US3507774A (en) * | 1967-06-02 | 1970-04-21 | Nat Res Corp | Low energy sputtering apparatus for operation below one micron pressure |
US3528906A (en) * | 1967-06-05 | 1970-09-15 | Texas Instruments Inc | Rf sputtering method and system |
US3708418A (en) * | 1970-03-05 | 1973-01-02 | Rca Corp | Apparatus for etching of thin layers of material by ion bombardment |
US3676317A (en) * | 1970-10-23 | 1972-07-11 | Stromberg Datagraphix Inc | Sputter etching process |
FR2128140B1 (nl) * | 1971-03-05 | 1976-04-16 | Alsthom Cgee | |
DE2117199C3 (de) * | 1971-04-08 | 1974-08-22 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Verfahren zur Herstellung geätzter Muster in dünnen Schichten mit definierten Kantenprofilen |
US4157465A (en) * | 1972-01-10 | 1979-06-05 | Smiths Industries Limited | Gas-lubricated bearings |
US3897324A (en) * | 1973-06-25 | 1975-07-29 | Honeywell Inc | Material deposition masking for microcircuit structures |
US4012307A (en) * | 1975-12-05 | 1977-03-15 | General Dynamics Corporation | Method for conditioning drilled holes in multilayer wiring boards |
JPS5582781A (en) * | 1978-12-18 | 1980-06-21 | Ibm | Reactive ion etching lithography |
US4277321A (en) * | 1979-04-23 | 1981-07-07 | Bell Telephone Laboratories, Incorporated | Treating multilayer printed wiring boards |
US4340461A (en) * | 1980-09-10 | 1982-07-20 | International Business Machines Corp. | Modified RIE chamber for uniform silicon etching |
US4391034A (en) * | 1980-12-22 | 1983-07-05 | Ibm Corporation | Thermally compensated shadow mask |
US4426274A (en) | 1981-06-02 | 1984-01-17 | International Business Machines Corporation | Reactive ion etching apparatus with interlaced perforated anode |
US4654118A (en) * | 1986-03-17 | 1987-03-31 | The United States Of America As Represented By The Secretary Of The Army | Selectively etching microstructures in a glow discharge plasma |
US4824544A (en) * | 1987-10-29 | 1989-04-25 | International Business Machines Corporation | Large area cathode lift-off sputter deposition device |
US5341980A (en) * | 1990-02-19 | 1994-08-30 | Hitachi, Ltd. | Method of fabricating electronic circuit device and apparatus for performing the same method |
CA2032763C (en) * | 1990-12-20 | 2001-08-21 | Mitel Corporation | Prevention of via poisoning by glow discharge induced desorption |
US5340015A (en) * | 1993-03-22 | 1994-08-23 | Westinghouse Electric Corp. | Method for applying brazing filler metals |
US5415753A (en) * | 1993-07-22 | 1995-05-16 | Materials Research Corporation | Stationary aperture plate for reactive sputter deposition |
US5527438A (en) * | 1994-12-16 | 1996-06-18 | Applied Materials, Inc. | Cylindrical sputtering shield |
JP3523405B2 (ja) * | 1996-01-26 | 2004-04-26 | 株式会社日立製作所 | 荷電ビーム処理によるパターン形成方法及び荷電ビーム処理装置 |
US6287977B1 (en) | 1998-07-31 | 2001-09-11 | Applied Materials, Inc. | Method and apparatus for forming improved metal interconnects |
US6193855B1 (en) | 1999-10-19 | 2001-02-27 | Applied Materials, Inc. | Use of modulated inductive power and bias power to reduce overhang and improve bottom coverage |
US6350353B2 (en) | 1999-11-24 | 2002-02-26 | Applied Materials, Inc. | Alternate steps of IMP and sputtering process to improve sidewall coverage |
US6344419B1 (en) | 1999-12-03 | 2002-02-05 | Applied Materials, Inc. | Pulsed-mode RF bias for sidewall coverage improvement |
US6554979B2 (en) | 2000-06-05 | 2003-04-29 | Applied Materials, Inc. | Method and apparatus for bias deposition in a modulating electric field |
US6521897B1 (en) * | 2000-11-17 | 2003-02-18 | The Regents Of The University Of California | Ion beam collimating grid to reduce added defects |
US6746591B2 (en) | 2001-10-16 | 2004-06-08 | Applied Materials Inc. | ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature |
US20030077910A1 (en) * | 2001-10-22 | 2003-04-24 | Russell Westerman | Etching of thin damage sensitive layers using high frequency pulsed plasma |
JP4710774B2 (ja) * | 2005-11-09 | 2011-06-29 | 株式会社日立製作所 | 研磨定盤の製造方法 |
US9779643B2 (en) | 2012-02-15 | 2017-10-03 | Microsoft Technology Licensing, Llc | Imaging structure emitter configurations |
US9578318B2 (en) | 2012-03-14 | 2017-02-21 | Microsoft Technology Licensing, Llc | Imaging structure emitter calibration |
US11068049B2 (en) | 2012-03-23 | 2021-07-20 | Microsoft Technology Licensing, Llc | Light guide display and field of view |
US10191515B2 (en) | 2012-03-28 | 2019-01-29 | Microsoft Technology Licensing, Llc | Mobile device light guide display |
US9558590B2 (en) | 2012-03-28 | 2017-01-31 | Microsoft Technology Licensing, Llc | Augmented reality light guide display |
US9717981B2 (en) | 2012-04-05 | 2017-08-01 | Microsoft Technology Licensing, Llc | Augmented reality and physical games |
US10502876B2 (en) | 2012-05-22 | 2019-12-10 | Microsoft Technology Licensing, Llc | Waveguide optics focus elements |
US10192358B2 (en) | 2012-12-20 | 2019-01-29 | Microsoft Technology Licensing, Llc | Auto-stereoscopic augmented reality display |
US20160035539A1 (en) * | 2014-07-30 | 2016-02-04 | Lauri SAINIEMI | Microfabrication |
US10324733B2 (en) | 2014-07-30 | 2019-06-18 | Microsoft Technology Licensing, Llc | Shutdown notifications |
US10678412B2 (en) | 2014-07-31 | 2020-06-09 | Microsoft Technology Licensing, Llc | Dynamic joint dividers for application windows |
US10592080B2 (en) | 2014-07-31 | 2020-03-17 | Microsoft Technology Licensing, Llc | Assisted presentation of application windows |
US10254942B2 (en) | 2014-07-31 | 2019-04-09 | Microsoft Technology Licensing, Llc | Adaptive sizing and positioning of application windows |
US9787576B2 (en) | 2014-07-31 | 2017-10-10 | Microsoft Technology Licensing, Llc | Propagating routing awareness for autonomous networks |
US9414417B2 (en) | 2014-08-07 | 2016-08-09 | Microsoft Technology Licensing, Llc | Propagating communication awareness over a cellular network |
US11086216B2 (en) | 2015-02-09 | 2021-08-10 | Microsoft Technology Licensing, Llc | Generating electronic components |
US10018844B2 (en) | 2015-02-09 | 2018-07-10 | Microsoft Technology Licensing, Llc | Wearable image display system |
US9827209B2 (en) | 2015-02-09 | 2017-11-28 | Microsoft Technology Licensing, Llc | Display system |
US10317677B2 (en) | 2015-02-09 | 2019-06-11 | Microsoft Technology Licensing, Llc | Display system |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2702274A (en) * | 1951-04-02 | 1955-02-15 | Rca Corp | Method of making an electrode screen by cathode sputtering |
US3087838A (en) * | 1955-10-05 | 1963-04-30 | Hupp Corp | Methods of photoelectric cell manufacture |
DE1083617B (de) * | 1956-07-27 | 1960-06-15 | Gen Motors Corp | Verfahren zum Herstellen poroeser Oberflaechen auf chromierten Zylinderbuechsen von Verbrennungsmotoren |
GB1054660A (nl) * | 1963-09-16 | |||
US3361659A (en) * | 1967-08-14 | 1968-01-02 | Ibm | Process of depositing thin films by cathode sputtering using a controlled grid |
-
1965
- 1965-10-23 US US502986A patent/US3410774A/en not_active Expired - Lifetime
-
1966
- 1966-09-20 GB GB41823/66A patent/GB1157989A/en not_active Expired
- 1966-09-27 NL NL666613583A patent/NL154560B/nl unknown
- 1966-10-19 DE DE1621599A patent/DE1621599C2/de not_active Expired
- 1966-10-21 BE BE688703D patent/BE688703A/xx unknown
- 1966-10-21 CH CH1534466A patent/CH447760A/de unknown
- 1966-11-20 FR FR8091A patent/FR1501165A/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL6613583A (nl) | 1967-04-24 |
FR1501165A (fr) | 1967-11-10 |
GB1157989A (en) | 1969-07-09 |
NL154560B (nl) | 1977-09-15 |
BE688703A (nl) | 1967-03-31 |
US3410774A (en) | 1968-11-12 |
DE1621599B1 (de) | 1973-05-24 |
DE1621599C2 (de) | 1973-12-06 |
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