CA2016367A1 - Method of manufacturing resin overlay plate - Google Patents

Abstract

ABSTRACT OF THE DISCLOSURE
In forming a polyolefin resin film on the surface of a wood plate, the polyolefin resin film is first formed on a non woven fabric, to manufacture a composite sheet having the polyolefin resin film formed on the non woven fabric.
Then, this composite sheet is superimposed on the wood plate through adhesive with the non woven fabric being on the side of the wood plate and then, pressed to bond the composite sheet to the wood plate.
The composite sheet having the polyolefin resin film formed on the non woven fabric is manufactured, and this composite sheet on the side of the non woven fabric is bonded to the wood plate. Accordingly, reactive curing adhesive commonly employed can be utilized for bonding the composite sheet to the wood plate. Furthermore, in bonding the composite sheet to the wood plate by heating, the non woven fabric, on the side of which the composite sheet is bonded, in the composite sheet becomes an escape route of water vapor emitted from the wood plate, thereby causing no bubble troubles. Consequently, in the processes of manufacturing the wood plate such as plywood, a particle board or a wafer board, the composite sheet can be bonded to the wood plate simultaneously with the manufacture of the wood plate.

Description

2l~1~'3~

TITL~ OF T~IE INVENTION
Method o~ Manu~acturing Re~ln Overlay Plate B~CKGROUND OF TH13 INVENTION
Field of th~ Inventlon The pre~ent invention relates ~en0rally to a method of manufacturing a re~ln overlay plate havlng polyolefin re~in overlaid on its ~urface, and more particularly, to a method of manufacturing a re~in overlay plate u3ed a3 a concrete framework.
De~cription o~ the Prlor Art It ha3 been heretofore known that polyolefin resin having ~uperior properties a~ a ~urface mater$al of a concrete framework i~ overlaid Dn the 3urface of a plate for a framework, a~ disclo~ed ln, for exa~ple, Japane~e Paten-t Publication Nos. 22334/1983, 32109~1987, ll9B4/lg88 and 533~3/198~.
The above de~cribed Jap~ne~e Patent Publication No~.
~2334!19~3, 32109/1987 and ll9B4/198B disolo~e a method of manufacturin~ a plate for a ~ramework by thermally welding a polyolefin re~ln shcet to a ~ub3trate u~in~ ra31n for hot melt adh~slve, The above dascrib~d Japane~e Patent Publication No.
~3343/198~ di~clo~e~ a me-thod of bondln~ a pol~olefin re~in film to plywood by sub~eoting one side thereof to corona dl3charge machining and then, applying adh~sive thereto.

2~ 367 polyolefin resin lnhere~tly ha~ the property of not adhering to materials other than polyolefln becau~e ~t iB
non polar. Therefor~, in order to overlay the polyolefin resin film on a wood ba~e material, it i3 nece~ary to sub~ect the ~ide on which the polyolefin re~in film ls bonded to corona di3charge machining to polarlze a part o~
~urface molecul~s and apply r~lativ~ly e~cpen~lv~ adhe~iv~
~uch a~ epo~y denaturated acrylic re3in adhesive thereon as adheslve. However, thi~ method ha~ the disadvantage in that the adhe~lve strength between the polyolefin re~in fllm and t he wood base material i~ not ~ t i ll ~ati 8 factory.
Furthermore, in order to ~oin the polyolefin re~ln fllm to a wood plat~, a method of thermally welding the polyolefln re~in film to the wood plate u~in~ re~in for hot ~elt adhe~ive ha3 been known. Thi~ methnd i~ advantageous in term3 of the adherin~ C09t and the adhe~lve strength.
~owev2r, thl~ method ha~ the disadvantage in that lt 1~
difficul~ ~o manufacture a resin overlay plate becau~e water in the wood plate rapidly evaporate~ by heatlng, water vapor expand3 at the ~lme o~ relea~.~n~ hot pre~slng to form vapor bubbles on the lower side o~ molten re~ln ~or adhesive, and the bubbles push up the polyolefln resln ~il~ to expand the ~ur~ace o~ the polyolefin re~ ilm.
Addltionally, ln th~ oonventlonal overlay plat~ for concrete framework, natural wood 1~ used wlthout any 3 ~ 7 modifica-tion. ~ccordingly, in many ca~es, cracking, nibbling or the like occur~ on the surface o~ the ba3e m~-terial. Wlth re~pect to th~ quality of th~ ~urfac~ of fir~t-clas~ plywood for a concrete fra~ework in the Japane3e Agricultural Standard ~JAS3, crac~ing 1.5 mm in width, nibbling 10 mm in long diame~er or th~ like i~ reco~nlzecl.
I~ such a concave portion Yuch a~ cracking or nibbling i~
directly overlaid, the concave portlon becomes a bridge of only the polyole~in re~ln sheet, result1ng ln lowered phy-~ical ~tren~th.
Moreover, any one of the above de~cribed conventional method~ is not a method o~ subJecting a polyoleSin re~in fllm to overlay proces~ing in the 3tep of primary proce~sing ~or manu~actur~ng a wood plate such a3 plywood or a partlal~
board but a method of ~ub~tin~ a polyolefin resin fil~ to overlay proca~sin~ a~ain a8 ~eoondary proce~ln~ on a wood plate suoh a~; plywood o~ a particle board com~ercialized once .
5UMMARY OF THE INV~NTION
An obJect oE the pre~ent invention 1~ to provide a method oS manuiacturin~ a re~irl overlay plate in which polyolefln re~in ~an be ~irmly ~i~ed to a wood plate.
Another ob~ect of the pre~e:nt inventlon i3 to prc~vide a method o~ marlufacturing a resin overlay plate ln whlch no bubble3 are formed betwesn a wood plate and a polyolef ln 2 ~ 6 7 re~ln layer in the proces~ o~ ~orming -the polyolefin resin layer on the wood pla-te.
Still another object o~ the pre~ent invention i~ to provide a method of manu~acturing a resin overlay plate high in ~trength of a sur~ace layer.
A further ob~ect of the present lnvention i9 to provlde a method of manufacturin~ a re~in overlay plate in whiah polyolefin re~in can be overlaid in the ~tep of primary proces~ing for manu~ac-turing a wood plate 3uch a~ plywood or a particle board, thereby allowlng the manufacturing cost to be reduced.
A fir3t method o~ ~anufacturing a re~ln overlay plate according to the pre~ent lnvention i~ ch~racterized by f~edlng adhe~lve polyole~in copolymerlzation re~in i~ a molten state between a polyols~in re~in film and a non woven ~abric, af~ixln~ tha above polyolefin resin film and the abov2 non woven ~abrlc by applying pres~ure, ~ollowed by oooling to mQke a composite ~heet havin~ the above non woven ~abrlc bonded to one ~ide oP the above polyole~in re~in fil~
through th~ above adhesive polyolofln copoly~erization re~in, ~uperimpo~in0 th~ ~bove composite ~heet on a wood plat~ through adheslve with the above non woven ~abria b~ing on the slde o~ the above wood plat~, and pres~in~ the aompo3ite ~heet to bond the above co~po~ite 3heet to the above wood plA~e.

2~16367 Reactlve curing adhe~lve ~uch as wood adhe~lve commonly emp]oyed, for example, urea re~in, mela~ine resin, phenol resin, urethane resin, epoxy re3in, ultraviolet curing resin, their mixtures or resln formed by co-condensation i~
u~d a~ the above de~crlbed adhe~ive. In addltion, polyvinyl acetate emul~ion re~in, flour or thQ like may be u~ed ~or purpo~e~ such ag increase in quantity~
The re3in overlay plate i~ ~pecifically manufactured in, for example, the following manner.
First, a polyolefin resln fllm and a non woven fabric are continuou~ly fed toward a pre~sure roll, re~pectively.
The above polyolefin resin fllm and thè above non wove~
~abric are affixed by applyin~ pressure u~ing the pre3~ure roll while di~charging adhe~ive polyolefin copolymerization re~in in a molten ~tate ln a curta~n shape between the polyole~in re~in ~ilm and ^the non woven fabrlc u~ing ~n extruder and a T die. Consequently, the adhe~ive polyole~ln copolymerization resin in a molten ~tate melt~ on ~he ~urface of ^the polyolefin re~in film to be welded to the polyolefin re~in ~ilm, whlle penetratin~ into ~ap~ between fiber~ of the non woven ~abrlc to be firmly bonded to the ~ibQr~. Thereafter, the adhesive polyolefln copolymerization re3in i8 3011difled by coolin~, to obtaln a composlte ~heet.
In manufacturing the compo3ite ~heet, the temperature of the adhe~ive polyolefin copolymerization resin, the pre~sure loadingl the time period during whlch pre~ure i~
applied and the like are ad~usted in consideration of the relation between the melt propertie~ of the adhe~i~e polyolefin copolymerizatlon resin and the degree o~ the gap~
between the fibers of the non woven ~abric ~o that the adhe~ive polyolefin copolymerization re~in 3uitably penQtrate~ into the non woven ~abric. If the adhe~ive polyolefin copolymerization re3in in~u~iciently penetrate~
into the non woven fabric, sufflcient anchor e f ~ ect i ~ not obtalned, resulting in lowered adhe3ive stren~th. On the other hand, lf it exce~sively penetrate~ into the non woven ~abric, the adhe31ve polyole~in copolymeriza-tion re~ln ~
forced out on the rever~e ~ide of the non woven flber, which i~ a problem ln bondin~ the compo~te 3heet to a wood plate.
The compo~ite sheet is bonded to the wood plate ~uch a~
plywood, a parti~le board or a wafer board in, ~or example, tha following manner.
~ lr~t, the reactive curinç~ adhe~ive is applied to the 3urEace o~ th~ wood plate, and ths composite sheet i9 ~uperimpo~ed thareon wi th the non woven ;Eabric being on the ~lde of the wood plate. The co~po~ite ~heet 1~ hot-pres~ed at a temper~tura not exceeding the mel-ting point of re~in con~:ti~utlny the composite !3heet u~3inçl hot pres~3ing or i~3 pre~ed at ord1nary temperature u3in~ cold pre~ln~.

2~1~3~l Consequently, the adhe~lve penetrate3 into the gaps between the flber~ of -the non woven fabric. The adhe~ive 1~ then hardened by reaction. ~ccordingly, when the hot pre~3in0 i~
relea~e~, the adhesion of the adhesive i9 e~serted.
Co~equently, even lf water vapor 1~ emltted Pro~ the wood plate, no bubbleR are formed ln3ide of the compo~ite ~heet, to obtai~ a re~in overlay plate hlgh in adhe~ive strength.
The present invention i~ to firmly connect and bond the polyole~in resin and the wood plate whlch are not inherently bonded ea~ily in molecular ~tructure by the ~iber~ of the non woven fabric. It is considered that the polyole~in re~in and the wood plate are bonded in a method of heatin~
the adhe~ive poly~le~in copolymerization re~in to be bro~ht into a ~olten ~tate and u in~ the same a~ adhesive.
~owever, if it is de~ired to overlay the polyolaf~n re~in film on the wood plate in this method, the overlay become~
di~icult becau~ water in the wood plate evaporate~ in a larye a~ount o~ vapor, the v~por pull~ up the adhesive polyole~in copolymerization re~in in a molten ~-tate at the ti~e o~ r~lea~ln~ the hot pres~ing, to form bubbles.
Acaording to the pre~ent inven-tlon, -the cnmpo~ite ~heet ¢ompri~ing the polyolefin resin and the non woven fabric i~
bonded to th~ wood plate. Accordingly, bubble~ can be prevented ~rom being ~ormed at the time o~ releasing the pre3~ing, ther~by allowin~ the polyole~in re~in to ~e ~irmly 2~ J ~7 bonded -to the wood pla~e. More ~peci~icall~, when -the non woven fRbrlc and the polyolefin r~sin film are bonded u~lny the adh~ive polyole~in copoly~erization re~in to manufacture the compo~ite sheet, the non wove~ fabric and the polyolefin re~in ~ilm are firmly bonded to eaah other by the penetration of the adh~siv~ polyolefin oopolymerlzation resin into the 0ap~ between th~ fiber~ o~ thQ no~ woven fabric. When the composite ~hee-t is bonded to the wood plate u~ing the reactive curing adhe~ive, the reactlon cùring adhe~ive ea~ily penetrate~ into the gap~ between the fibers o~ the non woven fabric, to be hardened through re~ctivn.
In thi~ manner, the adhesive polyol~fln copolymerization resin penetrate~ into the non woven fabr Ic from one 31de, whlle the reactiv~ curin~ adhe~ive penatrate~
therQlnto ~ro~ the other slde. ~ccordlngly, the non woven fabrlc per~orm~ ~uc:h a Punct ion that the~ fiber~ thereof connect both the re~in and the adha~iv~ to each other ln a st~te in which almo~t all the gap~ are fllled with the adhesive polyole~ln copolymerlzatlon re~in and the reactive curing adheslve~
Furthermore, wh~n the eompo~lte ~heet 19 bonded to tha wood plate, wRt0r vapor 1~ emitted in~ide of the co~posite sheet from the wood plate in the process of the hot pre~sin~. In the pre~ent invention, however, the water 2l)~ ~3~7 vapor can be d~aerated by the non woven ~abric in the composi-te ~heet. Mor~ ~peclfically, a few gap~ remain in the vicinity of f.ine fiber~, although almost all -the gap~
between the flbers of the non woven fabrlc ~re lmpregnated with the adhe~iv2 polyolefin copolvmerlzat~on resin and th~
reactive curing adhe~ive. The remaining gap become3 an e~cape route of water vapor. Accordlngly, water vapor remaining inside oP the compo~lte ~heet i~ ~lgnifi.cantly decreased, thereby to avoid the occurrence of troubl~ ~uch as expanslon and puncture of the ¢ompo~ite ~heet at the -time o~ releaslng the hot pres~lng.
Thu~, the non woven ~abrlc has a deaeration functlonO
Accordingly, the wood plate can be eubjected to overlay proce~in~ u~lng the composite ~heet in the proce~se~ of manufacturing the wood plate ~uch a~ plywood, a particle board or a wafer board.
Furthermore, even in A ca~e where there exl~t coneave portlons such a~ crackin0 and nlbbling on the surface o~ the wosd plate, the concave portion~ are covered with the compo~ite ~heet integrated with the non woven fabric, thereby to obtain a re~in overlay plate high in physical ~trength, particularly rigidity.
More ~peol~ically, accordin~ to the present lnvention, adhe~ive commonly employed can be utilized ~or bonding th~
composite ~heet to the wood plate, and the eomposite ~heet _ g _ 20:~63~

and the wood plat0 are firmly bonded to each other at a temperature lower than that in a hot melt method.
Furthermore, in bonding the composlte ~heet -to the wood pla~e by heating, the non woven fabric, on the slde of which the composite sheet i~ bonded, in the composite 3heet becomes an e3cape route of water vapor emitted from the wood plate, thereby causing no bubble troubles.
Furthermore, the resin overlay plate manufactured in thi~ method ha~ polyolefin r~in on its ~urface.
Accordingly, the composition in wood which affects the hardenin~ reaction of ready-mixed concrete ls interrupted by resin on the sur~ace, thereby eliminatin~ the po~sibility of harmin~ -the concrete. In addition, the re~in overlay plate serving as a framework i9 easlly removed from the concrete without adherin~ to the concrete aft~r hardenln~ the conarete becau3e the polyolefin resin is non-polar, there~y causing no hard to a molded concrete product. Furthermore, th~ polyole~n re~in i~ chemically ~table. Accordingly, the resln overlay plate ha~ the superior property of being able to be repeatedly used a large number of time~ without ~han~in~ even i~ it is aub~Qcted to alkalie~, water, heat generatlon or the like of the ready-mixed concrete for a long ti~e.
Morsover, the fibrou3 non woven fabric l-~ formed lnside of the polyole~in resin ~ilm. Aacordingly, the 3tr~ngth of ~0 1 ~7 the ~ur~ace layer i3 hlgh. Even i~ -there are some di~adv~ntages on the ~urface of the wood plate, the ~trength can be kept relatlvely high.
Additionally, a ~cond method of ~anufacturln~ a re~in overlay plate accordin~ to the present invention i~
characterized by sub~ecting one sid~ of a polyole~in re~in film to oxidation proces~ing and then, a~fixin~ a non woven fabric to the side, which i3 sub~ected to oxidation proces~ing, of the above polyolefin resin film u~ing fir3t adhesive to make a composite 3heet, ~uperimpo~lng the above compo3ite ~heet on a wood plate with the abo~e non woven fabric belng on the ~ide o~ the above wood plate, and p~e~lng the compo~lte sheet to bond the above composite ~heet to the above wood pl~te.
A bi~lally oriented polypropylene fllm i8 u~ed, for ex2lmple, ag the abovQ polyolefin re~in film.
Aquatic vlnyl polyur~thane adhesive, epoxy denaturated acrylic emul~lon type adhe~ive, polye~ter polyurethan~
ela~tomeric adhe~ive or the like i~ u~ed a~ the above fir~t adhe~lve. It i~ de~irable that the thickness to whlch the adhe31Ve i9 applied i~ ~llghtly larg~r in con~ider~tion o~

the penetratlon to fibers of th~ non woven fabric, that i8, 3~ ~0 50 g/~2~
Reactive curlny adhe31ve 3uch a~ wood adhe31ve com~only ~mployed, for example, urea re31n, ~Qlamlne re~ln, phenol ~6~7 re~in, urethane re~ln, epoxy resin, ultrav;olet curing resin, thelr mix-ture~ or re~in formed by co-condensation i~
used a~ the above second adheslve. If the r~in overlay plate is us~d as a concrete framework, adhe~ive rela-tively high in wa-ter resistance i5 used as the above reactlve curing adhesive.
Th~ reRin o~erlay plate i~ ~peciflcally manufactured ln, for example, the ~ollowing mannex.
Fir~t, the polyolefln resin film and the non woven fabric are continuously fed toward a pre~sure roll, respectively. The side on which the polyolefin resin fllm i8 bonded 1~ previously subJeoted to oxidation proces3ing ~uch a~ corona discharge machinin~, to polarize the surface thereo~.
Then, th~ ~irst adhe~i~e i~ applied to the side on which the polyole~in resln film i~ bonded and ~he non woven ~bric i~ superimposed thereon, followed by heating and pre~ing by nip roll~. Consequently, a compo~lte sheet i~
obtalned.
The compo3ite sheet i~ bonded to the wood plate such a~
plywood, a partlcle board or a wafer board in, ~or example, the ~ollowing manner.
First, the second adhe~lve ls applied to the 3urface o~
the wood pla~e, ~nd the composlte ~heet is ~uperimposed thereon with the non woven ~abric bein~ on the side of the 20~3~7 wood plate and i~ pres~ed by pre~slng at ordinary temperature. Con~equently, the reactive curing adhe~lve peiletrates in-to gap~ betwee~ the fiber~ of the non woven fabric.
Thereafter, the compo~ite sheet is heated and pres~ed using ho-t pre33ing. Consequently, the adhe~i~e i8 hardened by reaction. Accordin01y, when the hot pressing i9 released, the adhe3ion of the adhe31~e i9 exerted.

There~ore, even i~ water vapor i~ emitted from the wood plate, no bubble~ are ~or~ed inside of the compo~ite sheet, thereby to obtain a re~in overlay plate high in adhe~ive ~trength.
If the type o~ the reactive curing adhe~ive ls ~uitably ~eleoted, the composite ~hee-t can be al~o bonded to the wood pl~te by only cold pre~ing. In addltion, the resin overlay plate can be al~o continuously manufactured using the pre~ure roll.
If ~t i~ desired to ~1r~ly bond the polyole~ln resin directly to the wood plate, which both are not inher~ntly bonded ea~lly in molecular ~ruc~ure, it i~

difflault to obtain ideal adhe~ion conditions becau~e there are many factor~ limited such a~ temperature condition~, wat~r contained ln the wood plate or the shape of the wood plate.
Accordin~ to the present inventlon, the polyolefin .

20:1~367 re~in film ~nd the non-woven fabric are ~irst bonded to manufacture a compo~ite ~heet. Since -the composite sheet on the ~ide of the non woven fabric is bonded to the wood plate, sufficient adhe~ive s-trength 1~ obtained eve~ u~ing cheap wood adhesi~e. In addition, water vapor emitted from the wood plate i~ cau~ed to escape to the exterior through the gap~ between the fiber~ of the non woven fabrlc at the time of adhe3ion proce~sing, thereby allowing vapor troubles at the time o~ adhe3ion proce3sin~ -to be avoided.
Thu~, the non woven fabrlc ha~ a deaeratlon ~unction.
Accordingly, in the processes of manufacturing the wood plate such a~ plywood, a particle board or a w~fer board, the wood plate can be 3ub~ected to o~erlay proce~lng u~ing the co~posite ~heet.
Furthermore, ~ven in a ca3e where there exi~t concave portlon~ ~uch a~ cracking and nibbling on the ~urface of the wood pl~te, the conca~e portions are oovered w~th the compo31te ~heet lntegrated wlth the non ~oven fabrla, thereby to obtain a resin overl ay plate hl~h in phy~lcal ~trength, particularly rigldity.
More speci~loally, ~ccording to the present invention, in bondin~ the composite 3heet to the wood plate by heatin~, the non woven ~abric, on the ~ide o~ which the composite sheet 19 bonded, in the compo~ite ~heet become~ an e~cape route o~ water vapor emitted from the wood plate, thereby 2~ 3~7 causlny no bubble troubles. Con~equently, in the processes of manufacturing the wood plate, the composite sheet can be bonded to the wood plate 3~multaneou-qly wi-th the manufactur0 of the wood plate. In addltion, the wood plate and the compo~ite sheet can be bonded utilizing adhesive com~only employed. I'herefors, there can be provided a low-prlced resin overlay plate ~uperior ln quality.
Fur-thermore, 1~ the resln overlay plate manufactured ln this method, the ~ibrous non woven fabric i5 formed inside of the polyolefin re~in film. Accordlngly, the 3trength of the ~urface material i~ high. ~ven if there are some disadvantage~ on the surface o~ the wood plate, the strength can be ~ept relatively high.
Additionally, a third method of manufacturlng a resln overlay plate according to the present invention i~
characterized by ~eedlng polyolefin resln onto one ~lde of a non woven fabric usin~ a laminator, affixing the polyole~in resin and the non woven f~bric by applying pre~ure, Pollow~d by cooling to make a compo~ite ~heet having a polyolefin resin layer on one ~ide of the above non woven fabric, superimpo~ing the above composite sheet on a wood plate through adhesive with the above non woven fabric being on the side o~ the above wood plate, and pre~ing the composite ~heet to bond the above compo~ite ~heet to the above wood plate.

3 ~ 7 A non woven fabric manufac-tured by a dry method, a span bond method, a wet method or the like 1~ used a~ the above non woven fabric. The non woven fabric manufactured by the wet method i~ ~lightly inf-erior in water re~istance but i~
cheap. Furthermore, in order to improve the water resistance of the non woven fabric and~increa~e the adhe~ion of the non woven fabrlc to the polyolefin re~in, the non woven fabric ~ay be previou~ly impregnated with ethylene vinyl ace-tate re3in by a method ~uch as ~cattering or dipping.
~ polyolefin re~in, resin for applications i~ selected from polypropylene resin, high den~ity polyethylene re3in, low den3ity polyethylene re~in, ethylene vinyl acetate re~in and the like. A~ the polyolefin re~in, resin havin~ hi~h meltlng fluldity i~ pre~erable.
Reactive curing adhe3ive such a~ wood adhe~ive commonly employed, for example, urea reRln, melamine re~in, phenol r~in, urethana re~in, epoxy re~in, ultraviolet curin~
re~in, their mixtures or resin formed by co-condensation is u3ed as the above de3crlbed adhe~ive. If the re~in overlay plate 1~ u~ed a~ a concrete framework, adhe~ive relatively hiyh in water re3i~tancs i~ u~e~ a~ the above reactiv2 curin~ adhesive.
The re~in overlay plate 19 ~3pecifically manufactured in, ~or example, the ~ollowing manner.

.

~63~'~

The polyolefin re~in i~ dl~charged ln a curtain shape from a T die onto the non woven fabric continuously fed u~ing an e~trusion laminator commonly employed and i9 pre3~ed by a pre~sure roll. Consequently, the polyolefin re~in pene-trate~ into the non woven fabric and i~ cooled after hea-t therein is carried away by the roll, thereby to obtain a compo~ite ~hee-t compri~ing the polyoleEin re3ln layer and the non woven fabric impregnated with the polyolefin re~in.
The polyolefin resln does not inharently have polarity.
However, if the temperature oP the polyolefin re3in di~charged from the T die i~ Ret to be considerably hlgh, the sur~ace of the polyolefin re~in in a curtain shape come~
into contact with air after the di~charge. Con~equently, oxidation proaeed~. In order to make longer the tlme period during which thls oxldation react~on proceeds, it i~
preferable to set the air gap between a re~in discharge opening of the r dle and the surfaee of the above non woven Pabric to be larger. More specific~lly, it i~ pref~rable to set this alr gap to approximately 160 to 180 mm.
In ~anu~acturing the compo~ite ~heet, the ~01ectlon o~
the polyolefin re3in, the speed o~ lamin~tion, the pre~ure lsadlng and the like are Rd~usted in consideration of the relatlon between the melt propertie~ of the polyolefin re~in and the degree of gap~ between f iber~ oP the non woven ~0~636~

fabric ~o th~t -the polyolefin rein ~ultably penetrates into the non woven fabric. If the polyolefin re~in insufficiently pene-trate~ into the non woven fabric, ~fficlent anchor effect is not obtaine~, resulting in lowored adh0sive ~tre~gth. On the other hand, if it excesRively penetrate~ into the non woven ~abric, the polyolefin re~in i~ ~orced out on the reverse ~ide of the non woven ~abric, which i9 a problem in bonding the compo~ite sheet to the wood plate.
The compo~lte sheet i~ bonded to the wood plate ~uch a3 plywood, a particle board or a wafer board in, for example, the following manner.
Fir~t, the reactive curing adhe~lve 1~ applied to the surface o~ the wood plate, and the compo~ite sheet is superimposed thereon with the non woven fabric being on the side o~ the wood plate and i~ pressed by pressing at ordinary temperature. Cons2quently, the reactive curing adhe~lvq penetrates into the gaps between the flber~ of the non woven fabric.
Thereafter, the compo~lte ~heet i~ heated and pre~ed u~ing hot pre~sing. Consequently, the adhe~ive i~ hardened through reaction. Accordin~ly, when the hot pressing is relea~ed, the adhe~ion o~ the adhe~ive is exerted.
Therefore, eve~ if water vapor i~ emitted from the wood plate, no bubble~ are formed in~ide of the compo3ite ~heet, " ,. , ~, , ~o obtain ~ resin overlay plate hiyh in adhe~ive ~trength.
If the type of the reactive curing adhesive i~ ~uitably ~elected, the compo~ite ~heet can he al~o bonded to the wood plate by only colcl pre~sing. Irl additlon, the re~in overlay pla-te can be al~o continuou~ly manufactured u3ing the pressure roll.
If it is deslred to ~irmly bond the polyole~ln resin film directly to th~ wood plate, which both are not inherently bonded easily ln molecular structure, it i9 difflcult to obtain ideal adhe~ion conditions becau~e there are many factors limited ~uch a~ temperature c~nditlons, water contained in the wood plate or the ~hape o~ the wood plate.
Accordin~ to the pres~nt invention, one ~ide o~ the non woven abric ls first coated with the polyole~in re~in, to manufacture the compo~lte ~heet. Since the compo~ite ~heet on the ~ide o~ the non woven fabric i9 bonded to the wood plate, suf~icient adhe~ive strength i~ obtained even u~in~
cheap wood adhesive. In addition, water vapor emit~ed fro~
the wood pl~te i~ cau~ed to escape to the exterior ~hrough th~ ~ap3 between the Plber3 of the non woven fabric at the tlme o~ adhe~ion proaesslng, thereby allowlng vapor trouble~
at the tlme of adhe~lon prooos~ing to be avolded.
Thus, the non woven ~abric ha~ a deaeration ~unction.
Accordin~ the proce~ses oX manu~acturing the wood 2~ ~ 6~67 plate such ~ plywoo~, a particle b~ard or a wafer board, the wood plate can be ~ub~ected to overlay proce3sing using -th~ composite sheet Furthermore, even ln a case where there exist concave portion~ such a~ crack$ng and nibbling on the ~ur~ace of the wood plate, the concave portions are covered with the composite sheet lntegrated wlth the non woven f~bric, thereby to obtain a re~in overlay plate high in phy~ical ~trength, particularly ri~idity.
In manufacturing the composlte ~heet, the o~idation of the surface oP the polyolefin re~in film i~ 3peeded up to increase acid radlcal~ by rai~ing the te~perature o~ the polyolefln resin discharged Prom the T die and setti~g the air gap between the di~char~e openlng of the T die ~nd the ~ur~ace of the non woven fabric to be large, rç~ultlng in lmproved adhe~ive ~trength of the polyolefin resin ~ilm to a ~ilament oP the non woven .~abric.
Furthermor~, if the Pilament o~ the non woven f~bric i~
previou~ly coated with ethylene vinyl acetate emul~ion ln a method such ~ ~aatterin~ and dipping, th* adhQ~lve ~trength of the polyole~in re~in film to the filament of the non woven fabric i~ improved becau~e there i~ compatib~lity o~
the ethylene vlnyl acetate emul~ion with the polyolefln re~ln .
More speci~lcally, accordin~ to the prç~ent invention, 2~ ~36~

in bonding the composite ~heet to -the wood plate by heatlng, the non woven fabric, on -the side of whlch the composite ~hee-t is bonded, in -the composite ~heet b~co~es an e~cape route of wa-t~r vap~r emltted from the wood plate, thereby causing no bubble troubles. Consequently, in the proce~ses of manufacturing the wood plate, the compo~ite ~heet can be bonded -to the wood plat~ ~imultaneou~ly with the manufacture of th0 wood plate. In addition, the wood plate and the composite sheet can be bonded utilizing adhe~lve commonly employed.
Furthermore, in the re~in overlay plate manu~actured in thi~ method, the fibrou~ non wo~en fabric i formed in~ide of the polyolefin resin film. Accordingly, the strength of the ~urface material i3 high. ~ven if ther~ are some disadvantage~ on the sur~ace of the wood plate, the ~trength can be kept relativ~ly high.
~ dditionally, even if no expensive adhe~lve copolymerization resln i used in manu~acturing the oomposite sheet, the adhesive ~trength can be ensur~d and thc water re~ ance can be maintalned. Consequen-tly, the co~t of the raw material i~ reduced, thereby allowing a low-priced re~in overlay plate ~uperior in quality to be provided .
Furthermore, a ~ourth method of manufacturing a resin overlay plate accord~ng -to the present invention i~

characterized by feeding adhesive polyole~in copolymerlzation resin and polyolefin resln onto one aide of a non-wov~n ~abric using a two-coat extrus~on l~mina-tor, affi~ing the re~ln3 and the non woven fabric by applying pre~ure, followed by coolin~ to make a compo~ite Rhe~t re~pectively having an adhe~ive polyole~in copolymerlzation resin layer ~ormed on one ~ide of the above non woven fabric and a polyolefin re3in layer formed thereon, superi~po~ing the above compo~ite she~t on a ~ood plate with the above non woven fabrlc being on the above wood plate, and pre~slng the compo~lte ~heet to bond the above composite sheet to the above wood plate.
Reactive curing adhesive ~uch as wood adhesive commonly employed, for example, ure~ re~ln, melamine re~in, phenol re~in, ureth~ne re3in, epoxy re31n, ultraviolet curln~
re~in, their mixture~, re~in formed by co-condensation i3 u~ed a~ th~ above described adhesive. If the resin overlsr plate 1~ u~ed as a concrete framework, adhe~ive relatively hl~h in water r~si2tanc~ i~ u3ed as the above reactive curin~ adha~ive.
The rs3in overlay plate is speci~ically mad~ in, for example, the following mann~r.
The adhesive polyoleEin copoly~erization resin and tAe polyolefin re~in are di~charged in a curtain shape ~rom a T
die onto the non woven ~abric continuou31y fed using the two-2~3~7 coat e~tru~ion lamina-tor, ancl are pre~ed by a pres~lre roll. Consequently, the adhe~ive polyolefin copolymerization resin penetrates into the non woven fabric and ig cooled a~t~r heat thercin i~ carried away by the roll, thereby to obtain a compo3ite ~heet respectively having the adheRive polyolefin copolymerization resln layer ~ormed on onc side of -the non woven fabric and -the polyolefin resin layer formed thereon.
In manufacturing the compo~ite ~heet, the sel~ction o~
the adhe3ive polyolefin copolymerization re3in~ the ~peed of lamination, the pre3~ure loading and the like are ad~u~ted in con~ideration of the relation between the melt propertle~
of the adhe~ive polyolefin copolymerization resin and the degree of gap~ between fibers o~ the non woven ~abric ~o that the polyolefin re~in ~uitably penetrate3 in-to the non woven fabrlc. If tha adhesive polyolefin copolymerlzation re~in in~ufflclently penetrates into the non woven fabric, su~icient anchor effect i9 not obtained, resultlng in lowered adhe~ive strength. On the other hand, i it excesslvely p~netrate into the non wov~n fabric, -the adhesive polyole~in copolymerization resin 1~ forced out on ~he reverse side of the non woven abric, which i~ a problem in bondiny the composite ~heet to the wood plate.
Meanwhile, a compo~ite sheet respectively haviny the adhesive polyolefin copolymerization re~in layor formed on 2~1~3~7 one ~ide of the non woven fabric and the polyolefin re~in layer formed thereon may be manufactured by forming the adhe~ive polyolefin copolymerizatlon resin and the polyolefir, re~in into ~ilm~ and then, ~uperimpo~lrlg the xe3in layers on the non woven ~abric, and heating and melting the resln layers by hot presslng.
The compo~ite ~heet i~ bonded to the wood plate ~uch as plywood, a particle bo~rd or a wafer board ln, for e~ample, the following manne~.
Fir~t, the reactive curin~ adhesive i3 applied to the ~urface of the wood plate, and the composlte sheet i~
superlmposed thereon wlth the non woven fahric being on the side o~ the wood plate and is pre~ed by pre~sing at ordinary temperature. Con3equently, the reactlve curing adhe~ive penetrate~ into the gaps between the fiber~ of the non woven fabrlc.
Thereafter, the co~po~lte shee-t is heated and pressed using hot pre33ing. Consequently, the adhesive 19 hardened by reaction. Accordlngly, when the pressing 1~ released, the adhesion of the adhe~ive is exerted. Therefore, even i~
a little water vapor remain~ inside of the compo~lte 3heet, no bubbles are formed, thereby to obtain a re3in overlay plate high in adhe3ive ~trength.
If the type o~ the react~ve curlng adhe~ive is ~uitably ~elected, the composite ~heet can be al50 bonded -to the wood - 2~ -~6~'7 plate by only cold pressing. In additlon, the resin overlay plate can be al~o continuou~ly manufactured uRing the pressure roll.
If it i3 d0~ired to firmely bond the polyolefln re~in f.ilm directly to t:he wood plate, which both are not inherently bonded easlly in ~olecular structure, lt i3 dif-~icult to obtain ideal adhesion condition~ becau3e there are ~any factor~ limited ~uch a temperaturc condition~, water contained in the wood plate or the shape of the wood plate.
According to the pre~en-t invention, one ~ide of the non woven fabric i~ coated with the adhesive polyolef1n copolymerization re~in and the polyolefin resin, to manufacture the compo~ite sheet. Since the composite sheet on the ~ide of the non woven fabric is bonded to the wood plate, sufPicient adhe3ive ~trenyth 1~ obtained even using cheap wood adhesive. In addltlon, water vapor emltted from the wood plate i~ caused to e~cape to the exterior through the gaps between the fiber~ of the non woven fabrlc at the time of adhesio~ proce~lng, thereby allowing vapor troubles at the time of adhe~ion processlng to be avoided.
Thu~, the non woven fabrlc has a deaeratlon function.
Accordln01y, ln the proces~e~ oP manuEacturing the wood plata ~uch as plywood, a partlcle board or a wafer board, the wood plate can be ~ub~ected to overlay processing uslng 201~67 the composlte sheet.
Fur-thermore, even in a case where there exist concave portio~s ~uch a~ crack~n~ and nibbling on the surface of the wood plate, -the concave portions are ccvered wlth the compo3ite -~heet integrated wi-th the non woven fabric, thereby to obtain a re~ln overaly plate high in phy~ical ~-trength, particularly rigidity.
More ~pecifically, accordlng to the pre~ent invention, in bonding the composite ~heet to the wood plate by heating, the non woven fabric, on the ~ide of which the composite ghe~-t i9 bo~ded, in the composite sheet become~ an e3cape route of water vapor emitted from the wood plate, thereby cau~ing no bubbl~ troubles. Con~eque~tly, in the proce~ses o~ manufacturing the wood plate, the compo~ite sheet can be bonded to the wood plate simultaneou~ly with the manufacture of the wood plate. In addition, the wood plate and the compo~ite sheet can be bonded utili~ing adhesive commonly employed.
Additionally, in the re~in overlay plats manufactured in this method, th~ fibrou~ non woven fabric iB formed in3ide of the polyolef~n re~in film. ~ccordinyly, the stren~th o~ the sur~ace material i~ high. ~ven i~ there are ~ome dlsadvantage~ on the ~ur~ace of the wood plate, the ~trength can be kep~ relatively high.
In the above de~cribed first -to fourth m0-thod~ of 20163~7 m~nufac-turirlg the ov~rlay plate according to -the present invention, if the above describ~d wood plate :1~ plywood havin~ a plurality of veneer~ laminated, the composite ~heet may be superimposed on the outermo~t surface of ~ group of the veneer~ laminated through thermo~etting adhesive and hot-pre~sed in the a~sembly proces~ out of the processeR of manufacturing the above plywood, to bond the above compo~i-te ~h~et to the above plywood simultaneou~ly with bondlng o~
the veneers to each o~her. Thermo~ettlng adhes1ve employed for plywood can be used as the above thermosetting adhesive.
Thi~ manu~acturing method will be ~pecifically de~crlbed. In the a~sembly proce~s out of the manufacturing processes of the plywood, the composite sheet i9 superimposed on the out~rmo~t surface of the group of the veneer~ laminated through the adhe~ive for plywood through the ~ame type of adhesive ~or plywood with the non woven fabric belng on the side of the out~rmo~t sur~ace o~ the yroup of the veneer~ and then, 1~ heated and pre~ed using hot preYsing in the ~ame manner as that in manu~acturing ordinary plywood. The heatin~ temperature i8 ~et to a te~perature not exceedlng the ~elting point o~ re~in con~tituting the composite sheet. In thi~ method, the composit~ ~heet is bonded to the group o~ the veneer~
simultaneou~ly with bonding of the veneer~ to each other, thereby allowing a re~in overlay plate which can be - 2~ -2~1~3~

manufactured by simple processes and lowered ln cost to be provided.
In the above de3cribed first to fourth method~ of manufacturing the overlay plate according to the present invention, if the above describ~d wood pl~te 19 a particle board or a wafer board having a plurality o~ wood pieces solidified, the composite sheet may be superimpo3ed on the surface of a layer compri~ing a group of the wood piece~
through the thermosetting adheslve and hot-pressed in the hardenlng and moldiny proce~ out of the processe~ of manufacturing the above particle board or wafer board, to bond the above compo~ite sheet to the above particle board or wafer board simultaneou~ly wlth hardening and molding of the partl~le board or the wa~er board.
Thi~ manufacturing method will be specifically described. The tharmoset-ting adhe~i~e is applied ta the surface of the compo~lte ~heet on the -~ide of the non woven fabric, a chip or wafer is ~ormed thereon, and the composite ~heet is hot~pre~ed and ormed u~ng hot pressing at a temperatur~ not exceeding the melting point of re~in con~tituting the compo~ite sheet. In this method, ~he compo~ite eheet is bonded to a group of veneer~
~lmultaneously wlth hardening and molding of the particle board or the wafer board, thereby allowing a re~in ov~rlay plate which can be manu~actured by ~imple proces~e~ and - 2~ -3 ~ 7 lowered .in co~t to be provided.
The foregoing and other ob~ect3, features, aspect3 and advantages of the pre~ent invention wlll become more apparent from the following detailed deqcription of the pre.eent invention when taken in conJunction with the accompanylng drawings.
~RIE.F DESCRIPTXON OF TEI~ DRAWING5 Fig. 1 i3 a d~agram of the ~chematic constructlon 3howing a method of manufacturlng a composite ~heet;
Fig. 2 i~ a cro~ 3ectional view 3howing a re~in overlay plate manufactured u~in~ the compo~ite sheet made in the me-tbod ~hown in Fiy. l;
Fig. 3 i~ a cros~ ~ectional view ~howlng another re~in overlay plate manu~actured u~ing the compo~ite ~heet made in th~ method Qhown in F~y. l;
Fig. 4 i~ a diagram o~ th~ 3chematic con~truction showing another method of manufacturing a compo~ite ~heet Fi~. 5 i3 a cro~s 3ectional view showing a re3in overlay plate m~nu~actured u~ing the compo~ite sheet made in the me~hod shown in Fl~. 4;
Fig. 6 i3 a cro~s sectional view showing another re~in overlay plate manufactured u~ing the composite sheet made in the method ~hown in Fig. 4;
~ ig. 7 i~ a diagram o~ the schematic con3truction ~howing still another method o~ manufacturing a compo~ite 2l~367 sheet;
Fig. a is a cros~ sectional view showin~ a re~in overlay plate manufactured u3ing the co~po3i te ~heet made in the method shown in Flg. 7; and Fig. ~ is a cros~ ~ectional vlew showlng another re3in overlay plate manuPactured using the compo~ite sheet macle in the me-thod 3hown in Fig. ~.
DESCRIPTION OF THE PREF~RRED EMBODIM~NTS
(Bmbodiment 1) Referring now to Fig. 1, description 1~ made of a method of manuPacturlng a composite ~heet.
A fllm 40 ~m thick oP SHOLEX 2010HF made of SHOWA D~N~O
KABUSHIKI KAISHA is used a~ a polyolefin re3in film 1.
~LT~S N-5040 made oP ~SAHI C~MICA1 INDUSTRY CO., LTD. i3 used a3 a non woven fabric 2. ~R RFSIN ~R523L made of S~IOWA
D~NRO KABUSHIKI RAISHA is used as an adhe~ive polyolefin copoly~erization re~in 3. The te~peraturQ and the thickneQs of the copolymerization resin 3 dl~charged Prom an extruder 4 wlth a T dle are respectiv~ly ~et to 240C and 20 ~m.
The copolymerization re~in 3 ~ dischargad onto the film 1 while respeotlvely delivering the polyolePln res~n Pilm 1 and the non woven fabric 2 at a 3peed of 15 m per ~inute. The polyolePln resin Pllm 1 and the non woven fabrio 2 are aP~ixed by applying pressure betweQn a pre3~ure roll 5 and a coolln~ roll 6 while interpo3in~ thi~

3 6 ~

copolymerizatlon re~ln 3 between the film 1 and the non woven fabric 2. Con~equently, the copolymerizatio~ ré~in 3 in a mol-ten state is welded to the film 1 and cooled whlle penetrating in-to gap~ between fibers o~ the non woven fabric 2, and i~ further cooled by cooling roll~ 7, thereby to make a composite aheet 8 havin~ the polyolefin re~in film 1 and the non v~oven ~abric 2 firmly integrated w~th each other.
The composite ~heet 8 is wounded by a wind-up roll 9.
Descrlption i~ now made of a method of manu~acturlng a re~in overlay plate u~ed for a concrete framework using the compo~ite she2t 8 thu~ made.
Five-ply plywood for a framework 12 mm thick commercially available i-~ used as a wood plate 10. A
mlxture of 20 % flour wlth melamlne urea resln adhesive UM-82 made o~ AICA KOGYO CO., LTD. is used a~ adhe~ive 11.
The adhesive ll i9 applied to the upper ~urface of the plywood lO at a rate of 200 g/m2, ~nd the compo~lte sheet 8 i~ mount~d on the plywood lO with the non woven ~abric 2 in the composlte ~heet 8 being on the side of the plywood lO.
The composlte ~heet 8 is cold-pressed ~or twenty minutes and then, hot-pressed ~or ~ive minute~ under conditlons, that i~, at a temp~rature o~ 105C and at a pre3sure o~ ~ kg/c~2.
Ag a result, a resin overlay plate having the compo~ite sheet ~ and the plywood 10 fir~ly bonded to each o~her i~
obtained. In additlon, no bubbles ars ~ormed at the time of 2~36'7 relea~in~ the hot pres~ing.
(Embodlment 2~
Adhe~lve ohtained by m1xing 20 ~ flour with phenol resin adhe~ive P-82 made o~ ~ICA KOGYo CO., LTD. i~ applled to -the upper surface of wafer wood made of LOUISIANA-PACIFIC
CORPORATION at a rate of 250 ~/m . A composite sheet obtained in the ~ame manner as that i~l the embodiment 1 i9 mounted on the wafer wood with the non woven fabric therein being on the ~ide of the wafer w~od. Th~ co~posite sheet is cold-pres~ed for twenty minutes and then, hot-pre~ed for ~even minutes under conditions, that i9, at a temperature ~f 110C and at a pre33ure of 5 ~g/cm2. A~ a re~ult, a re-~in overlay wood plate for a ~oncrete framework havin~ the compo~ite ~heet ~ a~d tbe wafer wood 10 firmly bonded to e~ch other and haYing a ~mooth and tou~h ~ur~ace i~
obtained. I~ addltion, no bubbles are ~ormed at the time of releasing the hot pre~in~.
~mbodlment 3) Adhe~iva obtained by mixing 10 % flour with urea re~in adhasive UC-120 mad~ o~ AIC~ KOGYO CO., LTD. is applied to both ~urface~ of nlne 50uth-Sea lauan veneers 1.3 mm thick.
The veneers are superlmpo~ed on a curve woode~ pattern o~
R6gO such that their respec~ive fiber~ cros~ at right angles. In addition, composite ~heet~ ~ obtained in the ~a~e manner a~ that in the embodi~ent 1 are superimpo3ed on 3 ~ 7 both outer e,urface3 of a group 10 of the veneer~ throuyh the same adhesive 11 with non woven .fabric~ 2 therein being on the side of -the group 10 of the veneer~. The compo~lte ~heets 8 are bo~ded to the curve wooden patter~ by applying pre3Yure with electrode pla-tes for high-frequen~y heating applied to their outer sur~ace3, heated at high frequencies while being pre3sed to at a pre~ure of approximately 5 kg/cm , and hot-pres~ed for twenty mi~utes with the interior temperature being approximately BO to lOO~C.
~ s a re~ult, the adhe.Rive 11 i5 completely hardened, to obtain re~in overlay plywood of R600 approximataly 12 mm thlck who~e both surPaces are overlaid with polyol~fin re~in sheet~ 1, as shown in Fiy. 3.
(E.mbodiment 4) Re~in overlay plywood .t3 manufactured in the same manner as that in -the embodiment 1 exc~pt that E.LTAS E-5340 made oP ASAHI CHE.MICAL INDUSTRY CO., LTD. ls usF~d a~ a non woven fabric. A3 a result, re3in o~rlay plywood h~ving ~uperior properties a~ a plate for a concrate ~ramework is obtained.
~E.mbodiment 5) A compo~ite 3heet i9 manufactured in the same manner a~
that in the embodiment I e~cept that a ~ilm 30 ~m thick of SHO-A~LO~R F~201 made of SHOWA DENKO KABUSHIKI K~ISH~ i~
u3ed as a polyolefin r~in ~ilm, B~.MLI~.SE'. JF-601 made o~

~ 33 2~:16367 f~Sl~llI CHEMIC~L INDU5TRY CO., I.TO. is u~ed as a non woven fabrlc, E~ R5SIN ER 321P made of SHOWA D~NKO KABUSHIKI
~AI~HA i3 u~ed as adhe~ive polyolefin copolymerization re3in, and the temperature and the thickness of copolymeriza~ion resin di~charged from an ex-truder with a T
die are respectively set to 2flOC and 30 ~m.
Adhe~ive obtalned by mixlng 15 % flour with phenol melamine re~in adhesive P~85 made of AIC~ KOGYO CO., LTD. is applied to the ~ur~ace o~ this compo~ite sheet on the ~ide of the non woven fabric at a rate of laO g~m2.
Furthermore, a chlp covered wlth adhesive i5 mounted on the ~urface coated with the same adhe~ive o~ the compo~i~e sheet by formin~ for each particle ~i~e, and the co~po~it~
sheet i9 hot-pres~ed for fifteen minute~ under condition~, that is, at a temperature of 146C and at a pre~sure of 15 kg/cm2. A~ a re~ult, a re~in overlay particle board 12 mm thick havlng superior propertie~ as a plate for a concre-te framework i~ obtained.
~mbodlment 6) A resin overlay wafer board i~ manufactured in the same manner as that in the above desaribed embodlment 5 except that a wafer 1~ used in place of the chlp. A9 a re~ult, a resln overlay wafer board having superior propertie~ a3 a plate for a concrete fr~mework i~ obtained.
(~mbodiment ~

201636r~) ~ dheslve obtained by mixing 20 ~ flour with melamine urea re~in adhesive UM-82 made o~ AICA KOGYO CO., LTD. 13 applied to both ~ur~aces of five South-Se~ lauan veneer~ 2.4 mm thick at a rate of 200 g/m2. The veneers are overlapped with each other ~uch that their re~pectlve fiber~ cros~ at right angle~, the ~ame adhesive 1~ further applied to the outer ~urface~ of a group oi th~ veneer~ at the same rate and then, composlte she~ts manu~ac-tured ln the ~ame manner as that in the embodiment 5 are superlmposed thereon with non woven fabric~ therein being on the ~ide of the group of the veneer~. The composlte ~he~ts are hot-pressed ~or four minutes under condition~, that 1~, at a temperature of 120C
and at a pre~ure o~ 15kg~cm2.
A~ a re~ult, resin overlay plywood having ~uperior properties as a plate for a ooncret~ framework i3 obtained.
In addition, no bubble trouble~ due to wa-ter vapor occur at the time of releasing the hot pre~ing.
(~mbodiment 8) Referring now to Fi5l. 4, description i~ made o~ a method of manufacturing a compo~ite sheet.
A film 30 ~m thlck obtalned by sub~ecting one ~ide of a biaxially oriented an.d reln~oraed polypropylene film commercially available to oxidation proce~inS~ by corona dl~charge machlning i~ used a~ a polyolefin re~in film 1.
Polye~ter polyurethane adheslve fcr dry lamlnate made of ~ 35 -~IC~ KOGYO CO., LTD. is used as adhesive 23. B~MLIES~ JF-601 made of ~SAHI CHEMICAL INDUSTRY CO., LT~. 60 g/m thick is used as a non woven fabrlc 2.
The polyolefln re~in film 1 1~ dellver~d with the ~urface sub;~ected to oxidation proce~lng being on the lower ~ide, and the adhesive 23 i3 applied -to the ~urface ~ub~ected to o~ldation processlng of the polyolefin re~ln film 1 between a gravure roll 12 and a rubb~r roll 13. The adhe~lve 23 19 made to adhere to the ~urface of the gravure roll 12 a~ the gravure roll 12 i~ rota-ted, an e~ce~s of -the adhesive ls ~craped away by a doctor blade 14 and then, the adhes~ve 23 1~ made to adhere to the polyolefln re~in fllm 1, thereby to apply the adhesive 23 on the polyolefin resln film 1 at a rate of 50 g/m .
The polyolefin re~in film 1 coated with the adhe3ive 23 i~ heated and half-dried by a radiant dryer 15 and then, i~
superlmpo~ed on the non woven fabric 2. The polyolefin re~in fllm 1 and the non woven fabric 2 are affixed by applying pre~sure between a rubber roll 5 and a prq~3ure roll 6, to be a composi-te sheet 28. The compo~ite ~heet 28 1~ wound by a wind-up roll 9.
Referring now to Fi~. 5, de~cription is made of a method of manufacturing a resin overlay plate used for a concre-te framework u~lng the composite 3heet 28 thu~ made.
Five-ply plywood for a framework 12 mm thlck 3 ~ '7 commercially available is used as a wood plate 10. Adhesive obtalned by mi~cing 10 % f lour wi th melamine urea resln adh~ive ~M-~2 made of ~IC~ KOGYO Co., LTD. is used as adhe 9 i ve 11.
The adhe~lve 11 i~ applied to the upper surface of the plywood 10 at a rate o~ 200 g/m2, and the compo~ite sheet 28 is mounted on the plywood 10 with a non woven fabric 2 i.n the compo~ite sheet 28 being on the side of the plywood 10.
The composite sheet 28 i~ cold-pressed for twenty minutes and then, hot-pressed for five minutes under conditions, that i~, at a temperature of 105C and at a pressure of 5 kg~cm . A~ a re~ult, resin overlay plywood having the composite ~heet 28 and the plywood 10 firmly bonded to each other i~ obtained. In addition, no bubble~ are formed at the t ime o~ relea~in~ the hot pre~ing .
~Bmbodlment 9) Adhe~ive obtained by mixing 20 % ~lour with phenol re~ln adhe31ve P-~2~ made of ~ICA KOGYO CO., L~D. is appl.ied to the upper surface o wafer wood 17.2 mm thlck made of LOUISI~NA-P~CIFIC CORPORATIOn at a rate of 250 g/m . A
composite sheet obtained ln the s~me manner a3 that in the embodiment ~ i3 mounted on the wafer wood with a non wov~n fabric thereln being on the ~ide o~ the wafer wood.
The compo~ite sheet i~ cold-Fressed or twenty minute~
and then, hot-pre~ed for ~even minute~ under conditions, 2~163~7 that is, a;t a -temperature of llOnC and a-t a pressure of 5 kg/cm2. As a re~ult, a resin overlay wood plate having the composite sheet and the wafer wood firmly bonded to each other and having a 3mooth and tough surface ls obta~ned. In addition, no bubble~ are formed at the tlme of relea~ing the pres~lng.
(~mbodiment 10) ~ dhesive obtained by mlxing 20 % flour with melamine urea re~in adhe~ive ~M-82 made of AICA KOGYO CO., LT~. i3 applied to nine South-Sea lauan veneers 1.3 mm thick at a rate of 200 g~m . The veneers are superimposed on a curve wooden pattern of R600 ~uch that their respective fiber~
C~09~ at right angle$, and compo~ite shee-ts 28 obtained in the ~me ~anner as that in the embodiment 8 are ~uperimpo~ed on both outer ~urfaces of a group 10 of the veneers throu~h the same adhe~ive 11 with non woven abric3 2 therein being on the side of the veneers. The compo~ite ~heet~ 28 are bonded to the curve wooden pattern by applying pre~3ure with electrode plates for hlgh-frequency heating applied to thelr outer ~urfaces, heated at hi~h ~requencie3 whlle beiny pre~ed to a pressure o~ approximately 5 kg/cm~. and hot-pre~sed for twenty mlnutes with the interior temperature bein~ approximately 80 to 100C.
A~ a result, the adhesive 11 is completely hardened, to obtain re3in overlay plywood of R600 approximatel~ 12 mm ~ 3~ -~0~63~

thick who3e both surface~ are overlaid with polyolefi~ re~in sheets 1, as shown in Fig. 6.
~Embodlment 11) ~ e~lr~ overlay plywood i~ manufactured in the ~ame manner a~ that in -the embodlment ~ except that a non woven ~abrlc B05-20 made of MIKI TOKUSHU P~PER MFG. CO., LTD. 20 y/m -thick i~ used as a non woven fabric. A9 a re~ult, re~in overlay plywood having superior properties a~ a plate ~or a concrete framework i~ obtained.
(Embodiment 12) Adhesive obtained by mixing 20 % flour wlth phenol melamine resin adhe~ive P-85 made of AICA KOGYO CO., LTD. i~
applied to the ~urface of a composlte sheet manufactured in the same manner as -that in the embodiment ~ on th* side o~ a non woven fabric at a rate of 200 g/m2.
Furthermore, a chlp covered with adhesive l~ mounted on th~ surface coated with the same adhqsive of the composite ~heet.by forming for each partiole size, and the compo~ite she~t is hot-pre~sed for fifteen minutes under conditlon~, that is, at a tempera-ture o~ 1~5C and at a pres~ure of 15 kg~cm . As a re~ult, a resin overlay partlcle board 15 mm thick having ~uperior propertie3 a~ a plate for a concrete framewor~ is obtained.
(E,mbodiment 13) A re~in overlay wafer board i~ manufactured ln the same - 3~ -2 ~ 3 ~ P~

manner a~ that in the above described embodlment 12 ~cept that a wafer is u~ed in place of the chip. A~ a result, a re3in overlay wa~er board 15 mm thick havlng superior properties a~ a plate for a concrete framework ls obtained.
~Bmbodiment 14) Adhe~lve obtained by mixincg 10 % flour with melamine urea re~in adhe~lve UM-a2 made of AICA KOGYO CO., LTD. i3 applied to both ~urfaces of ~ive South-Sea lauan veneers 2.4 mm thick at a rate of 200 g/m . The veneers are overlapped with each other ~uch that the~r re~pectiv~ fiber~ cro~s at rlght angle~, the ~ame adhe~ive is further applied to the outer surface of a group o~ the veneer~ and then, compo~lt~
~heet~ manufactured in the ~ame manner as that in the embodiment 8 are ~uperimpo~ed thereon with non woven fabric3 2 ther~in being on the 31de ~f the veneers. The compo3ite sheet~ ar~ hot-press2d ~or ~our minutes under condition~, that is, ~t a temperature of 120C and at a pre3~ure of 15 kg/cm .
As a re~ult, resin overlay plywood having superlor propertie~ as a plate for a concrete framework i~ obtained.
In additlon, no bubble troubles due to water vapor occur at the time of relea~ing the pres~ing.
(~mbodlment 153 Re~erring now to Fig. ~, descrlption is made of a method of manufacturing a compusite sheet.

, . .

2~63~7 l~igh den~ity polyet}lylene LZ0139 made of S~IOWA D~NKO
~ABUSE~IKI K~ISHA is used as polyolefin re~in 31. ~LTAS N-5040 made of A5~I CHEMICAL INDUSTRY CO., LTD. is used as a non woven fabric 2.
The polyole~in re~in 31 i~ di~char~ed in a curtain ~hape onto the non woven ~abric 2 through an e~-truder 4 with a T dle at a temperature of 310C and with a thickne~s o~ 50 ~m wlllle delivering the non woven fabric 2 at a ~peed of 50 m per minute. The polyolefin re31n 31 and the non woven fabric 2 are pre3sed between a pressure roll 5 and a cooling/pressure roll 6. Consequently, the polyolefin resin 31 in a molten ~tate is cooled and solidified whlle penetrating lnto gaps between fiber~ of the non woven fabrlc 2, and i9 $urther cooled by cooling rolls 7, thereby to make a composite sheet 3B having the sheet-~haped polyolefin re~ln 31 and the non woven fabric 2 firmly lntegrated with e~ch other. The compo~ite ~heet 38 i5 wound by a wind-up roll 9.
Re~erring now to F1~. 8, de~cription i~ made o~ a method o~ ma~u~acturing a xe~ln overlay plate u~ed ~or a concrete ~ramework using the composite ~heet 3~ thu~ made.
Five-ply plywood 12 mm -thick commerc~ially available i3 used as a wood plate 10. Adhesive obtained by mixing 10 %
~lour wlth melam~ne urea re~in adhesive UM-~2 made o~ AICA
~0~0 C0., LTD. ia u~ed a~ reactive curlng adhe~ive 11.

3 ~ ~1 The ~he3ive 11 i~ applied to -the upper ~urface of the plywood 10 at a rate of 200 g/m2, and the composite sheet 38 is mounted on the plywood 10 with the non woven fabric 2 in the compo~ite ~heet 3a being on the side of the plywood 10.
The composite ~h~e~ 3a i~ ~old-pre~sed ~or twen-ty minute~
and then, bot-pressed for flve mlnutes under condition~, that is, at a temperature o~ 105nC and a-t a pre~aure of 5 kg/cm2. A~ a reault, re~ln overlay plywood having -the compoaite sheet 38 and the plywood 10 firmly bonded to each other ls obtalned. In addltion, no bubbles are formed at the time of releasing the hot pressing.
~Rmbodiment 16) Adhe~lve obtained by mlxing 20 % flour wlth phenol re~in adhesive P-~H ~ade of AIC~ KOBYO CO., LTD. ls applied to the upper ~urEace of wafer wood 17.2 mm thick made of LOUISIANA-PACIFIC CORPORATION at a rate of 250 g~m2.
composite ~heet obtalned in th~ same manner as that in the e~bodiment 15 i~ mounted on the wafer wood with a non woven fabric therein being on the 31de of the wafer wood. The compo~lte ~heet i9 cold-pre~3ed ~or twenty minute~ and then, hot-pre33ed ~or seven minutes under conditions, that i~, at a temperature of 110C and at a pre~3ure of 5 kg/cm2. A~ a re3ult, a resin ~verlay wood plate having the compo3ite 3heet and the wafer wood flrml~ bonded to each other and h~ving a smooth and tou~h ~ur~ace i~ obtained. In addition, ~0~636'7 no bubbles are formed at the time of relQasing the pre~siny.
(Embodlment 1'~) Adheslve obtalned by mixing 20 % flour with melamine urea re~i~ adhe~ive VM-82 made o~ AIC~ KOGYO CO., LTD. 1~
applied to both ~urfaces of nine South-Sea lauan ~eneer~ 1.3 mm thlck at a rate of 200 g/mZ. The veneers are ~uperimposed on a ourved wooden pattern o~ R600 with their r~peotive ~iber~ cro~s at right angle~, and compo~lte ~heets 3n ob-talned in the same manner as that in the embodiment 15 are further ~uperimpo~ed on both outer surfaoe~ o~ a ~roup 10 of ~he veneer~ through the ~ame adhe~ive~ 11 with non woven fabrio~ 2 therein being on ~he ~ide of the group of the veneer~.
The compo~ite ~heets 38 are bonded to the curve wooden pattern by applying pres~urs with electrode plate~ ~or high-fre~uency heating applled to their outer surface~, heated at high fre~ue~cie~ while being pre~sed to a pres~ure of approximately 5 ~g/cm2, and hot-pres~ed for twenty minutes with the interior temperature being approximately 80 to lOUC.
A~ a re~ult, the adhes.ive 11 1~ oomple-tely har~ened, to obtain resin overlay plywood o~ R~OO approxlmately 12 mm thick whose both ~urface~ are overlald wlth polyolefin re~in 3 1, as ~howrl in Fig . ~ .
~mbodlmen-t 18) 2~367 Re~in overlay plywood i~ man~factured in the same manner a~ that in the embodiment 15 except that ~EMLIES~ JF-404 mad~ of I~SI~HI CHEMICAL INDUSTRY CO., LTD. 40 g/m thick i~ used as a non woven fabric. A~ a re~ult, re~.tn overlay plywood having ~uperior propertie~ a~ a plate for a concrete ~ramework i~ obtained.
~mbodiment 19) Wet non woven fabric 805-20 made of MIKI TOKVSHU PAPER
MFG. CO., LTD. 20 g/m thick i~ u~ed as a non woven fabric 2. Polypropylene LR510 made o~ SHOWA DENRO RABUSHIKI ~AISHA
ig u~ed as polyolefin resin 31.
~ shown in Fig. ~, the polyol~fin resin 31 i9 discharged in a curtain ~hape onto the non woven fabric 2 through an extruder 4 with a T die at a temperature of 300nc and with a thickne~ o~ 70 ~m whlle dellvering the non woven ~abric 2 at a ~peed of 50 m per minute. The polyolePln re~in 31 and the non woven fabriQ 2 are pre3sed between a pre~ure roll 5 and a cooling/pressure roll 6.
Con~equently, the polyolefln resin 31 in a molten ~tate i~
cooled and ~olldified while penetrating into gap~ between fiber~ o~ the non woven fabrlo 2, and is ~urther cooled by cooling roll~ ~, thereby to make a composite ~heet 3~ having the ~heet-~haped polyolefin resin 31 and the non woven fabrlc 2 ~irmly integratQd with eaoh other. The compo~lte sheet 38 1~ wounded by a wind-up roll g.

3 ~ 7 Adheslve obtalned by mi~ing 20 % flour wlth phenol melamine resin adhesive P-85 made of AICA ~OGYO CO., LTD. ls applied to th~ s~r-face of -th~ compo~i te ~heet thus made on the side of th~ non woven fabrlc at a rate of 200 g/m2.
Furthermore, a chip covered with adhe~lve i~ mo~nted on th~ surface coated with the same adhesive of the composite ~heet by for~in0 for each partlcle ~ize, and the composite sheet is hot-pre~sed for ~ifteen minutes under condition~, that i9, at a temperature of 145C and at a pressure of 15 kg/cm . A~ a result, an under-floor particle board, whose ~urface l~ not per~eable to water, covered with the composite sheet i5 obtained. In addition, no bubble~ are formed at -the time oP rel~a~ing the pres~ing.
(~mbodl~ent 20) A r~in overlay wafer board i3 ~anufactured in the same manner as that ln the above described embodiment 19 except that a wafer i~ u3ed in place of the chip. As a result, a re~in overlay wafer bo~rd 15 mm thick having superior properties as a plate for a concrete Pramework 19 obtained.
(~mbodiment 21) A re~in overlay wafer board is manu~actured in the Rame manner a~ that in the ~mbodl~ent 20 except that a non woven fabric obtalned by spraying a 20-fold dilute 901ution of ethylene vinyl acetate resin e~ulsion ~F200 made of S~OWA
HIGHPOLYM~R CO., LTD. on a wet non woven fabrlc 805-20 made - 4~ -20~367 of MIKI TOKUS~U PAPER MF~. CO., LTD. 2u g/m thick at a rate of 20 g/m2 and then, drying the same l~ used a~ a non woven fabric. A~ a re~ult, a resln overlay wafer board having water resistance further strengthened i~. obtained.
(Embodiment Z2) ~ dhesive obtained by m1~1n~ 10 ~ flour with melamine urea resin adhesive UM-82 made of AICA KOGYO CO., LTD. is applied to both surfa~e~ o~ five South-Sea lauan veneers 2.4 mm thick at a rate of 200 g/m2, the veneer~ are overlapped with each other such that their re3pective fiber~ cro~s at ri~ht angle~, the same adhesi~e is further applied to the outer ~urface3 of a group o~ the veneers at the same rate and then, composite ~heets manufactured ln the ~ame manner a~ that in the embodiment 19 are superlmpo~ed ther~o~ wlth non woven ~abrics therein being on the side o~ the group of the veneer~. The compo~ite ~heet~ are bot-pressed for fou~
minute~ under conditions, that iB, at a temperature of 120~C
and at a pre~sure of 15 kg/cm .
As a re~ult, resin overlay plywood having ~uperior propertie~ a~ a plate for a concrete framework i~ obtainQd.
In addition, no bubble trouble~ due to water vapor occur at the time of relea~ing the pre~sing.
(~mbodiment ~3~
two-coat extrusion type extruder i~ u~ed ln place of - 46 ~

-- :

2~163~

-the extru~er ~hown in Fig. 'I, to di~charge adhe~ive polyolefil1 copolymerization re~in and polyolefin resin onto a non wo~en fabric by th:1~ extruder.
SHOI.E~ I,ZOl3s made of SHO~A DENKO K~BUS}~IKI KAISHA i~
used a3 the polyolefln resin. ~ R~SIN ~R 420H made of S~lOWA D~NKO ~ABUSHIKI K~ISli~ i~ used a~ the ~dhe~ive polyolefin copolymerlzation re~in. B~MLIE.S~ WP252 made of AS~II CHEMIC~L INDUSTRY CO., LTD. is u~ed as the non woven fabric.
The adhesive polyolefin copolymerization resin 30 ~m thick and the polyolefin re~in ~0 ~m thic~ are di~charyed in a curtain ~hape onto the non woven fabric through the two-coat extrusion type extruder with the total thickne~ of lO0 ~m and at a temperature of 290~C with the adhesive polyolefin copolymerizatlon resln being on the ~ide of the non woven fabric while dellvering the non woven fabrlc at a 3peed of 50 m per minute, and are pre~sed between a pressure roll and a cooling/pre~ure roll. Con~equently, the adhe~ive polyole~in copolymerization resin in a molten state 19 cooled and qolldified while penetratiny into yap~ between fibers of the non woven ~abric, and i3 ~urther cooled by cooling roll~, thereby to make a compo~lte ~heet h~lng the ~heet-~haped polyolefin resin and the non woven fabric firmly integrated with each other through the adhesive polyole~in copolymerlzation resin. The compo~ite sheet i~

~L6367 wount-l by a wlnd-up roll.
De3cription is now made of a method of ~anufacturing ~
resin overlay plate u~ed for a concrete framework using the composi te s~leet thu~ made .
Adhesive obtained by mixing 10 % ~lour with melamine urea resin aclhe~ive UM-82 made of AICA ROGYO CO., LTD. at a rate of ~00 g/m2 is appli0d to both ~urface~ of five South-Sea lauan veneer~ 2.4 mm thick at a rate of Z00 g/m2. The veneer~ are overlapped with each other ~uch that -their re~pective fibers cross at right angle~, the ~ame adhesive is further applied to the ou-ter surfaces of a group of the veneers at the 3ame rate and th~n, the composite ~hee-ts made in the foregoing manner are superimposed thereon with the non woven fabric~ therein being on the side of the veneers.
The composite ~heet3 are hot-pre~ed for four minute3 under conditions, that i~, at a temperature of 110C and a-t a pre~ure of 1~ kg/cm~.
~ s a re~ult, re3in overlay plywood having superior properties as a plate for a concrete ~ramework i~ obtained.
No troubles due to water vapor occur at the time of relea~in~ the pressin~.
Althou~h the pre3ent ~nvention ha~ been de~cribed and lllustrated in detail, it i9 clearly under~tood that the ~ame i9 by way of illustratlon and example only and iB not to be taken by way of limitation, the spirit and scope o~

- ~8 --the present inven-tion belng limited only by the -term~ of the appended claim~.

_ ~9 _

Claims (16)

1. A method of manufacturing a resin overlay plate, characterized by feeding adhesive polyolefin copolymerization resin in a molten state between a polyolefin resin film and a non woven fabric, affixing said polyolefin resin film and said non woven fabric by applying pressure, followed by cooling to make a composite sheet having said non woven fabric bonded to one side of said polyolefin resin film through said adhesive polyolefin copolymerization resin, superimposing said composite sheet on a wood plate through adhesive with said non woven fabric being on the side of said wood plate, and pressing the composite sheet to bond said composite sheet to said wood plate .

2. The method of manufacturing a resing overlay plate according to claim 1, characterized is that said wood plate comprises plywood having a plurality of veneers laminated, and characterized by superimposing said composite sheet on the outermost surface of a group of the veneers laminated through thermosetting adhesive and hot-pressing the same in the assembly process out of the processes of manufacturing said plywood, to bond said composite sheet to said plywood simultaneously with bonding of said veneers to each other.

3. The method of manufacturing a resin overlay plate according to claim 1, characterized in that said wood plate comprises a particle board or a wafer board having a plurality of wood pieces solidified, and characterized by superimposing said composite sheet on the surface of a layer comprising a group of said wood pieces through the thermosetting adhesive and hot-pressing the same in the hardening and molding process out of the processes of manufacturing the particle board or the wafer board, to bond said composite sheet to said particle board or wafer board simultaneously with hardening and molding of said particle board or wafer board.

4. A method of manufacturing a resin overlay plate, characterized by subjecting one side of a polyolefin resin film to oxidation processing and then, affixing a non woven fabric to the side subjected to oxidation processing of said polyolefin resin film using first adhesive to make a composite sheet, superimposing said composite sheet on a wood plate through second adhesive with said non woven fabric being on the side of said wood plate, and pressing the composite sheet to bond said composite sheet to said wood plate.

5. The method of manufacturing a resin overlay plate according to claim 4, characterized in that said polyolefin resin film comprises a biaxially oriented polypropylene film.

6. The method of manufacturing a resin overlay plate according to claim 4, characterized in that said wood plate comprises plywood having a plurality of veneers laminated, and characterized by superimposing said composite sheet on the outermost surface of a group of the veneers laminated through thermosetting adhesive and hot pressing the same in the assembly process out of the processes of manufacturing said plywood, to bond said composite sheet to said plywood simultaneously with bonding of said veneers to each other.

7. The method of manufacturing a resin overlay plate according to claim 4, characterized in that said wood plate comprises a particle board or a wafer board having a plurality of wood pieces solidified, and characterized by superimposing said composite sheet on the surface of a layer comprising a group of the wood pieces through the thermosetting adhesive and hot-pressing the same in the hardening and molding process out of the processes of manufacturing said particle board or wafer board, to bond said composite sheet to said particle board or wafer board simultaneously with hardening and molding of said particle board or wafer board.

8. A method of manufacturing a resin overlay plate, characterized by feeding polyolefin resin onto one side of a non woven fabric using a laminator, affixing the polyolefin resin and the non woven fabric by applying pressure, followed by cooling to make a composite sheet having a polyolefin resin layer formed on the side of said non woven fabric, superimposing said composite sheet on a wood plate through adhesive with said non woven fabric being on the side of said wood plate, and pressing the composite sheet to bond said composite sheet to said wood plate.

9. The method of manufacturing a resin overlay plate according to claim 8, characterized in that the air gap between a resin extrusion hole of said laminator and the surface of said non woven fabric is set to such size that the oxidation of said polyolefin resin extruded from the resin extrusion hole of said laminator is speeded up.

10. The method of manufacturing a resin overlay plate according to claim 8, characterized in that said non woven fabric comprises a wet non woven fabric.

11. The method of manufacturing a resin overlay plate according to claim 8, characterized in that said non woven fabric comprises a non woven fabric impregnated with ethylene vinyl acetate resin emulsion.

12. The method of manufacturing a resin overlay plate according to claim 8, characterized in that said wood plate comprises plywood having a plurality of veneers laminated, and characterized by superimposing said composite sheet on the outermost surface of a group of the veneers laminated through thermosetting adhesive and hot-pressing the same in the assembly process out of the processes of manufacturing said plywood, to bond said composite sheet to said plywood simultaneously with bonding of said veneers to each other.

13. The method of manufacturing a resin overlay plate according to claim 8, characterized in that said wood plate comprises a particle board or a wafer board having a plurality of wood pieces solidified, and characterized by superimposing said composite sheet on the surface of a layer comprising a group of the wood pieces through the thermosetting adhesive and hot-pressing the same in the hardening and molding process out of the processes of manufacturing said particle board or wafer board, to bond said composite sheet to said particle board or wafer board simultaneously with hardening and molding of said particle board or wafer board.

14. A method of manufacturing a resin overlay plate, characterized by feeding adhesive polyolefin copolymerization resin and polyolefin resin onto one side of a non woven fabric using a two-coat extrusion laminator, affixing the resins and the non woven fabric by applying pressure, followed by cooling to make a composite sheet respectively having an adhesive polyolefin copolymerization resin layer formed on one side of said non woven fabric and a polyolefin resin layer formed thereon, superimposing said composite sheet on a wood plate through adhesive with said non woven fabric being on the side of said wood plate, and pressing the composite sheet to bond said composite sheet to said wood plate.

15. The method of manufacturing a resin overlay plate according to claim 14, characterized in that said wood plate comprises plywood having a plurality of veneers laminated, and characterized by superimposing said composite sheet on the outermost surface of a group of the veneers laminated through thermosetting adhesive and hot-pressing the same in the assembly process out of the processes of manufacturing said plywood, to bond said composite sheet to said plywood simultaneously with bonding of said veneers to each other.

16. The method of manufacturing a resin overlay plate according to claim 14, characterized in that said wood plate comprises a particle board or a wafer board having a plurality of wood pieces solidified, and characterized by superimposing said composite sheet on the surface of a layer comprising a group of the wood pieces through the thermosetting adhesive and hot-pressing the same in the hardening and molding process out of the processes of manufacturing said particle board or wafer board, to bond said composite sheet to said particle board or wafer board simultaneously with hardening and molding of said particle board or wafer board.