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BRPI0606914A2 - materiais de moldagem termoplásticos, uso dos mesmos, e, fibras, filmes e peça moldada de qualquer tipo - Google Patents

materiais de moldagem termoplásticos, uso dos mesmos, e, fibras, filmes e peça moldada de qualquer tipo

Info

Publication number
BRPI0606914A2
BRPI0606914A2 BRPI0606914-2A BRPI0606914A BRPI0606914A2 BR PI0606914 A2 BRPI0606914 A2 BR PI0606914A2 BR PI0606914 A BRPI0606914 A BR PI0606914A BR PI0606914 A2 BRPI0606914 A2 BR PI0606914A2
Authority
BR
Brazil
Prior art keywords
weight
films
fibers
thermoplastic molding
molded parts
Prior art date
Application number
BRPI0606914-2A
Other languages
English (en)
Inventor
Peter Eibeck
Jochen Engelmann
Ralf Neuhaus
Michael Fischer
Bernd Bruchmann
Original Assignee
Basf Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Ag filed Critical Basf Ag
Publication of BRPI0606914A2 publication Critical patent/BRPI0606914A2/pt
Publication of BRPI0606914B1 publication Critical patent/BRPI0606914B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02—Polyamines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Artificial Filaments (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

MATERIAIS DE MOLDAGEM TERMOPLáSTICOS, USO DOS MESMOS, E, FIBRAS, FILMES E PEçA MOLDADA DE QUALQUER TIPO. São divulgados materiais de moldagem termoplásticos que contêm: A) desde 10 até 99% em peso de pelo menos uma poliamida termoplástica; B) desde 0,1 até 5% em peso de pelo menos um homo- ou copolímero de polietilenoimina; C) desde 0,05 até 3% em peso de um lubrificante; D) desde 0,05 até 3% em peso de um estabilizador que contém cobre ou de um fenol impedido estericamente ou misturas dos mesmos; E) desde O até 60% em peso de outros aditivos, a percentagem total em peso dos componentes A) a E) chegando a 100 por cento.
BRPI0606914A 2005-02-08 2006-02-08 materiais de moldagem termoplásticos, uso dos mesmos, e, fibras, filmes e peça moldada de qualquer tipo BRPI0606914B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005005847A DE102005005847A1 (de) 2005-02-08 2005-02-08 Wärmealterungsbeständige Polyamide
PCT/EP2006/050763 WO2006084862A1 (de) 2005-02-08 2006-02-08 Wärmealterungsbeständige polyamide

Publications (2)

Publication Number Publication Date
BRPI0606914A2 true BRPI0606914A2 (pt) 2009-12-01
BRPI0606914B1 BRPI0606914B1 (pt) 2017-04-04

Family

ID=36636651

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0606914A BRPI0606914B1 (pt) 2005-02-08 2006-02-08 materiais de moldagem termoplásticos, uso dos mesmos, e, fibras, filmes e peça moldada de qualquer tipo

Country Status (12)

Country Link
US (2) US20080262133A1 (pt)
EP (1) EP1851265B1 (pt)
JP (1) JP5118976B2 (pt)
KR (2) KR101278734B1 (pt)
CN (1) CN101115786B (pt)
AT (1) ATE398645T1 (pt)
BR (1) BRPI0606914B1 (pt)
DE (2) DE102005005847A1 (pt)
ES (1) ES2306429T3 (pt)
MY (1) MY139749A (pt)
PL (1) PL1851265T3 (pt)
WO (1) WO2006084862A1 (pt)

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EP1683830A1 (en) 2005-01-12 2006-07-26 DSM IP Assets B.V. Heat stabilized moulding composition
EP1681313A1 (en) 2005-01-17 2006-07-19 DSM IP Assets B.V. Heat stabilized moulding composition
WO2008071801A1 (de) 2006-12-15 2008-06-19 Basf Se Polymerdispersionen, die hochverzweigte polycarbonate enthalten
CN101903469B (zh) * 2007-12-18 2014-08-20 巴斯夫欧洲公司 含有聚醚胺的热塑性聚酰胺
US7902287B2 (en) * 2008-01-21 2011-03-08 Basf Aktiengesellschaft Polyamide resin composition and method of preparing
EP2254949A1 (de) * 2008-03-18 2010-12-01 Basf Se Polyamid-nanokomposite mit hyperverzweigten polyethyleniminen
BRPI0909787B1 (pt) * 2008-03-18 2019-05-14 Basf Se Composição de moldagem termoplástica, usos da combinação de polieteraminas com óxidos amorfos, e de composições de moldagem trermoplásticas, fibra, folha ou moldagem, e, combinação dos componentes.
CN105153688A (zh) * 2008-11-11 2015-12-16 巴斯夫欧洲公司 稳定的聚酰胺
DE102008058246A1 (de) 2008-11-19 2010-05-20 Basf Se Hochmolekulare Polyamide
BRPI0922909B1 (pt) * 2008-12-16 2019-06-25 Basf Se Material de moldagem termoplástico, uso de materiais de moldagem termoplásticos, e, fibras, folhas ou corpo moldado de qualquer tipo
DE102010062538A1 (de) 2009-12-17 2011-06-22 Basf Se, 67063 Verfahren zur Herstellung geschweisster Formkörper aus Polyamid-6.10
US20120181487A1 (en) * 2011-01-18 2012-07-19 Basf Se Thermoplastic molding composition
JP5759532B2 (ja) * 2011-02-22 2015-08-05 株式会社ブリヂストン ポリアミド樹脂組成物及びその製造方法並びに冷媒輸送用ホース
EP2570448A1 (de) * 2011-09-13 2013-03-20 Basf Se Verwendung von Polyethyleniminen in der Herstellung von Polyamiden
JP6416756B2 (ja) 2012-06-13 2018-10-31 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ アミノ酸熱安定剤を含む熱可塑性溶融混合組成物
EP2861667A1 (en) 2012-06-13 2015-04-22 E.I. Du Pont De Nemours And Company Thermoplastic melt-mixed composition with polyetherol heat stabilizer
US20130338260A1 (en) 2012-06-13 2013-12-19 E I Du Pont De Nemours And Company Thermoplastic melt-mixed composition with epoxy-carboxylic acid compound heat stabilizer
US8871874B2 (en) 2012-06-13 2014-10-28 E I Du Pont De Nemours And Company Thermoplastic melt-mixed composition with epoxy-amino acid compound heat stabilizer and processes for their preparation
PL2719726T3 (pl) * 2012-10-10 2017-09-29 Lanxess Deutschland Gmbh Kompozycje do formowania
ES2655856T3 (es) * 2013-08-21 2018-02-21 Basf Se Parte plástica compuesta con resistencia mejorada al envejecimiento por calor
EP3036276B1 (de) * 2013-08-21 2017-10-11 Basf Se Verfahren zur herstellung eines compositkunststoffteils (ck)
EP3036275B1 (de) * 2013-08-21 2018-03-07 Basf Se Compositkunststoffteil mit verbesserter adhäsion zwischen den enthaltenen kunststoffkomponenten
JP2015199938A (ja) * 2014-04-03 2015-11-12 旭化成ケミカルズ株式会社 ポリアミド樹脂組成物及び成形品
CN104045922A (zh) * 2014-07-16 2014-09-17 苏州新区华士达工程塑胶有限公司 一种改良性epdm
JP6724368B2 (ja) * 2015-02-23 2020-07-15 東レ株式会社 成形品およびポリアミド樹脂組成物
KR102421887B1 (ko) 2016-10-18 2022-07-18 어센드 퍼포먼스 머티리얼즈 오퍼레이션즈 엘엘씨 열 노화에 내성이 있는 저할로겐 난연제 폴리아마이드 조성물
EP3896112B1 (en) * 2018-12-10 2024-07-03 Nippon Soda Co., Ltd. Polyalkyleneimine-modified polyamide 4
EP3670576B8 (de) 2018-12-19 2020-12-09 Ems-Chemie Ag Polyamid-formmassen für glasverbunde
BR112021015562A2 (pt) * 2019-03-06 2021-10-05 Basf Se Material de modelagem termoplástico, processo de produção de materiais de modelagem, usos e filme ou artigo moldado
WO2021170715A1 (en) * 2020-02-26 2021-09-02 Basf Se Heat-aging resistant polyamide molding compositions
CN115335456B (zh) 2020-03-25 2024-10-29 巴斯夫欧洲公司 耐热老化聚酰胺模塑组合物
JPWO2023033043A1 (pt) * 2021-09-01 2023-03-09
CN115594966B (zh) * 2022-09-30 2024-01-02 上海金发科技发展有限公司 一种聚酰胺复合材料及其制备方法和应用

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JPH04202357A (ja) * 1990-11-29 1992-07-23 Toray Ind Inc 耐熱安定性の優れた難燃性ポリアミド樹脂組成物
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DE4305166A1 (de) * 1993-02-19 1994-08-25 Bayer Ag Thermostabile kupferhaltige Polyamidformmassen
DE4339509A1 (de) * 1993-11-22 1995-05-24 Basf Ag PPE/PA-Frommassen zur Herstellung von Formkörpern mittels Blasformen, Profilextrusion und Rohrextrusion
DE19519820A1 (de) * 1995-05-31 1996-12-05 Bayer Ag Thermostabile, witterungsbeständige Polyamidformmassen
JP3714788B2 (ja) * 1998-02-13 2005-11-09 旭化成ケミカルズ株式会社 成形特性に優れるポリアミド樹脂組成物のペレットの製造方法
JP2000344960A (ja) * 1999-03-31 2000-12-12 Chisso Corp 難燃性樹脂組成物、それを用いた難燃性シートおよびフィルム成形物
ATE250642T1 (de) * 1999-06-29 2003-10-15 Degussa Hochverzweigte polyamid-pfropfcopolymere
DE10030553A1 (de) * 2000-06-29 2002-01-10 Basf Ag Stabilisierte thermoplastische Formmassen
DE10064333A1 (de) * 2000-12-21 2002-06-27 Degussa Mehrschichtverbund mit einer EVOH-Schicht
JP4245327B2 (ja) * 2002-10-25 2009-03-25 旭化成ケミカルズ株式会社 ポリアミド樹脂組成物
EP1498445A1 (en) * 2003-07-18 2005-01-19 DSM IP Assets B.V. Heat stabilized moulding composition

Also Published As

Publication number Publication date
ES2306429T3 (es) 2008-11-01
PL1851265T3 (pl) 2008-11-28
EP1851265B1 (de) 2008-06-18
ATE398645T1 (de) 2008-07-15
EP1851265A1 (de) 2007-11-07
KR20130041392A (ko) 2013-04-24
US20080262133A1 (en) 2008-10-23
KR101278734B1 (ko) 2013-06-25
JP2008530290A (ja) 2008-08-07
MY139749A (en) 2009-10-30
CN101115786B (zh) 2012-06-20
CN101115786A (zh) 2008-01-30
KR20070102739A (ko) 2007-10-19
DE102005005847A1 (de) 2006-08-10
BRPI0606914B1 (pt) 2017-04-04
WO2006084862A1 (de) 2006-08-17
JP5118976B2 (ja) 2013-01-16
DE502006000958D1 (de) 2008-07-31
US20120149817A1 (en) 2012-06-14

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Legal Events

Date Code Title Description
B06G Technical and formal requirements: other requirements [chapter 6.7 patent gazette]

Free format text: SOLICITA-SE A REGULARIZACAO DA PROCURACAO, UMA VEZ QUE BASEADO NO ARTIGO 216 1O DA LPI, O DOCUMENTO DE PROCURACAO DEVE SER APRESENTADO EM SUA FORMA AUTENTICADA; OU SEGUNDO MEMO/INPI/PROC/NO 074/93, DEVE CONSTAR UMA DECLARACAO DE VERACIDADE, A QUAL DEVE SER ASSINADA POR UMA PESSOA DEVIDAMENTE AUTORIZADA A REPRESENTAR O INTERESSADO, DEVENDO A MESMA CONSTAR NO INSTRUMENTO DE PROCURACAO, OU NO SEU SUBSTABELECIMENTO.

B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]