AU2002367224A1 - Apparatus and method for electroplating a wafer surface - Google Patents

Apparatus and method for electroplating a wafer surface

Info

Publication number: AU2002367224A1
Authority: AU; Australia
Prior art keywords: electroplating; wafer surface; wafer
Prior art date: 2001-12-24
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2002367224A

Other versions

AU2002367224A8 (en

Inventor

Daan L. De Kubber

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Koninklijke Philips NV

Original Assignee

Koninklijke Philips Electronics NV

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-12-24

Filing date

2002-12-12

Publication date

2003-07-15

2002-12-12 Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV

2003-07-15 Publication of AU2002367224A1 publication Critical patent/AU2002367224A1/en

2003-07-15 Publication of AU2002367224A8 publication Critical patent/AU2002367224A8/en

Status Abandoned legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Organic Chemistry (AREA)
Metallurgy (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Physics & Mathematics (AREA)
Life Sciences & Earth Sciences (AREA)
Sustainable Development (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Electroplating Methods And Accessories (AREA)
Electrodes Of Semiconductors (AREA)

AU2002367224A 2001-12-24 2002-12-12 Apparatus and method for electroplating a wafer surface Abandoned AU2002367224A1 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
EP01205083		2001-12-24
EP01205083.7		2001-12-24
PCT/IB2002/005396 WO2003056609A2 (en)	2001-12-24	2002-12-12	Apparatus and method for electroplating a wafer surface

Publications (2)

Publication Number	Publication Date
AU2002367224A1 true AU2002367224A1 (en)	2003-07-15
AU2002367224A8 AU2002367224A8 (en)	2003-07-15

Family

ID=8181506

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2002367224A Abandoned AU2002367224A1 (en)	2001-12-24	2002-12-12	Apparatus and method for electroplating a wafer surface

Country Status (7)

Country	Link
US (1)	US20050072680A1 (en)
EP (1)	EP1527215A2 (en)
JP (1)	JP2005520930A (en)
CN (1)	CN1630739A (en)
AU (1)	AU2002367224A1 (en)
TW (1)	TW200411089A (en)
WO (1)	WO2003056609A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102007026633B4 (en) *	2007-06-06	2009-04-02	Atotech Deutschland Gmbh	Apparatus and method for the electrolytic treatment of plate-shaped goods
CN102268719B (en) *	2010-06-03	2013-10-30	台湾积体电路制造股份有限公司	Vertical electroplating equipment and electroplating method thereof
CN104233410A (en) *	2013-06-24	2014-12-24	马悦	Device for electrochemically depositing metals on substrate
EP3176288A1 (en) *	2015-12-03	2017-06-07	ATOTECH Deutschland GmbH	Method for galvanic metal deposition

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5670034A (en) *	1995-07-11	1997-09-23	American Plating Systems	Reciprocating anode electrolytic plating apparatus and method
JP2001316890A (en) *	2000-05-08	2001-11-16	Tokyo Electron Ltd	Method and equipment for plating

2002
- 2002-12-12 CN CNA028259785A patent/CN1630739A/en active Pending
- 2002-12-12 AU AU2002367224A patent/AU2002367224A1/en not_active Abandoned
- 2002-12-12 EP EP02805861A patent/EP1527215A2/en not_active Withdrawn
- 2002-12-12 JP JP2003557031A patent/JP2005520930A/en active Pending
- 2002-12-12 WO PCT/IB2002/005396 patent/WO2003056609A2/en not_active Application Discontinuation
- 2002-12-12 US US10/499,270 patent/US20050072680A1/en not_active Abandoned
- 2002-12-19 TW TW091136661A patent/TW200411089A/en unknown

Also Published As

Publication number	Publication date
JP2005520930A (en)	2005-07-14
WO2003056609A2 (en)	2003-07-10
AU2002367224A8 (en)	2003-07-15
US20050072680A1 (en)	2005-04-07
TW200411089A (en)	2004-07-01
WO2003056609A3 (en)	2005-03-10
EP1527215A2 (en)	2005-05-04
CN1630739A (en)	2005-06-22

Similar Documents

Publication	Publication Date	Title
SG90780A1 (en)	2002-08-20	Method and apparatus for dechucking a substrate
GB9914484D0 (en)	1999-08-18	Polishing apparatus and method for polishing a substrate
AU3521700A (en)	2000-10-09	Method and apparatus for processing a wafer
AU2001270205A1 (en)	2002-01-08	Method and apparatus for wafer cleaning
SG117403A1 (en)	2005-12-29	Method and apparatus for assembling substrate
SG125056A1 (en)	2006-09-29	Single wafer type substrate cleaning method and apparatus
GB0211641D0 (en)	2002-07-03	Apparatus and method for cleaning a surface
EP1460678A4 (en)	2010-01-06	Method and apparatus for cleaning and method and apparatus for etching
EP0999012A3 (en)	2003-01-29	Method and apparatus for polishing substrate
SG108820A1 (en)	2005-02-28	Method and apparatus for forming a metallic feature on a substrate
AU2003238305A1 (en)	2004-01-06	Method and apparatus for supporting a substrate
AU2002345688A1 (en)	2003-01-21	Method and apparatus for controlling a plating process
AU2002354143A1 (en)	2003-07-09	Substrate processing method and substrate processing apparatus
AU2002330118A1 (en)	2003-04-14	Method and apparatus for coating a substrate
AU2002360593A1 (en)	2003-07-09	Method and apparatus for nano-sensing
AU4175800A (en)	2000-10-09	Method and apparatus for wafer metrology
AU2002329860A1 (en)	2003-03-18	Method and apparatus for sensing a wafer in a carrier
AU2002367224A1 (en)	2003-07-15	Apparatus and method for electroplating a wafer surface
AU1196001A (en)	2001-04-23	Method and apparatus for etching and deposition using micro-plasmas
AU2002258658A1 (en)	2002-10-15	Method and apparatus for improved scheduling technique
IL141300A0 (en)	2002-03-10	A method and apparatus for flat surface treatment
AU2002353387A1 (en)	2003-07-09	Apparatus and method for decorating objects
SG93932A1 (en)	2003-01-21	Method and apparatus for drying a substrate
AU2002234847A1 (en)	2002-09-12	Method and apparatus for printing patterns on substrates
AU2002309315A1 (en)	2003-01-02	Apparatus and method for cleaning the surface of a substrate

Legal Events

Date	Code	Title	Description
2004-09-16	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase