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AU2002232889A1 - Polishing platen with pressurized membrane - Google Patents

Polishing platen with pressurized membrane

Info

Publication number
AU2002232889A1
AU2002232889A1 AU2002232889A AU3288902A AU2002232889A1 AU 2002232889 A1 AU2002232889 A1 AU 2002232889A1 AU 2002232889 A AU2002232889 A AU 2002232889A AU 3288902 A AU3288902 A AU 3288902A AU 2002232889 A1 AU2002232889 A1 AU 2002232889A1
Authority
AU
Australia
Prior art keywords
polishing platen
pressurized membrane
pressurized
membrane
platen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002232889A
Inventor
John Boyd
Rod Kistler
Alek Owczarz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/747,745 external-priority patent/US6321947B2/en
Application filed by Lam Research Corp filed Critical Lam Research Corp
Priority claimed from PCT/US2001/050625 external-priority patent/WO2002049805A1/en
Publication of AU2002232889A1 publication Critical patent/AU2002232889A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08—Circular back-plates for carrying flexible material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2002232889A 2000-12-21 2001-12-21 Polishing platen with pressurized membrane Abandoned AU2002232889A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/747,844 2000-12-21
US09/747,844 US20020081945A1 (en) 2000-12-21 2000-12-21 Piezoelectric platen design for improving performance in CMP applications
US09/747,845 2000-12-21
US09/747,745 US6321947B2 (en) 2000-02-11 2000-12-22 Multiple dispensing valve closure with threaded attachment to a container and with a twist-open spout
PCT/US2001/050625 WO2002049805A1 (en) 2000-12-21 2001-12-21 Polishing platen with pressurized membrane

Publications (1)

Publication Number Publication Date
AU2002232889A1 true AU2002232889A1 (en) 2002-07-01

Family

ID=25006879

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002232889A Abandoned AU2002232889A1 (en) 2000-12-21 2001-12-21 Polishing platen with pressurized membrane

Country Status (4)

Country Link
US (1) US20020081945A1 (en)
EP (1) EP1349704B1 (en)
CN (1) CN1209228C (en)
AU (1) AU2002232889A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7824244B2 (en) * 2007-05-30 2010-11-02 Corning Incorporated Methods and apparatus for polishing a semiconductor wafer
US8522801B2 (en) * 2003-06-27 2013-09-03 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
WO2007018391A1 (en) * 2005-08-05 2007-02-15 Seung-Hun Bae Chemical mechanical polishing apparatus
SG154438A1 (en) * 2005-12-30 2009-08-28 Lam Res Corp Cleaning compound and method and system for using the cleaning compound
KR100900225B1 (en) * 2006-10-31 2009-06-02 주식회사 하이닉스반도체 Copper wiring formation method of semiconductor device using damascene process
JP2014501455A (en) * 2011-01-03 2014-01-20 アプライド マテリアルズ インコーポレイテッド Pressure controlled polishing platen
CN102632452A (en) * 2012-04-24 2012-08-15 浙江金瑞泓科技股份有限公司 Polishing method for silicon wafer by utilizing water ring
JP5956287B2 (en) * 2012-08-23 2016-07-27 株式会社ディスコ Grinding equipment
CN102990491A (en) * 2012-11-29 2013-03-27 江苏宜达光电科技有限公司 Grinding jig of spherical glass
JP2017037918A (en) * 2015-08-07 2017-02-16 エスアイアイ・セミコンダクタ株式会社 Polishing head, cmp polishing device having the same, and method of manufacturing semiconductor integrated circuit using the device
JP7227137B2 (en) 2017-01-20 2023-02-21 アプライド マテリアルズ インコーポレイテッド Thin plastic abrasive article for CMP applications
US11717936B2 (en) 2018-09-14 2023-08-08 Applied Materials, Inc. Methods for a web-based CMP system
EP4171874A4 (en) 2020-06-24 2024-11-27 Applied Materials, Inc. POLISHING CARRIER HEAD WITH PIEZOELECTRIC PRESSURE CONTROL

Also Published As

Publication number Publication date
CN1209228C (en) 2005-07-06
EP1349704A1 (en) 2003-10-08
US20020081945A1 (en) 2002-06-27
EP1349704B1 (en) 2004-08-11
CN1481295A (en) 2004-03-10

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