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ATE539381T1 - Materialzusammensetzung für nano- und mikrolithografie - Google Patents

Materialzusammensetzung für nano- und mikrolithografie

Info

Publication number
ATE539381T1
ATE539381T1 AT05856776T AT05856776T ATE539381T1 AT E539381 T1 ATE539381 T1 AT E539381T1 AT 05856776 T AT05856776 T AT 05856776T AT 05856776 T AT05856776 T AT 05856776T AT E539381 T1 ATE539381 T1 AT E539381T1
Authority
AT
Austria
Prior art keywords
material composition
component
microlithography
nano
polymerizable functional
Prior art date
Application number
AT05856776T
Other languages
English (en)
Inventor
Peng-Fei Fu
Lingjie Guo
Xing Cheng
Original Assignee
Dow Corning
Univ Michigan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning, Univ Michigan filed Critical Dow Corning
Application granted granted Critical
Publication of ATE539381T1 publication Critical patent/ATE539381T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing
    • Y10T428/31612—As silicone, silane or siloxane

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Epoxy Resins (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
AT05856776T 2004-06-01 2005-06-01 Materialzusammensetzung für nano- und mikrolithografie ATE539381T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US57595304P 2004-06-01 2004-06-01
PCT/US2005/019340 WO2006083284A2 (en) 2004-06-01 2005-06-01 A material composition for nano- and micro-lithography

Publications (1)

Publication Number Publication Date
ATE539381T1 true ATE539381T1 (de) 2012-01-15

Family

ID=36777646

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05856776T ATE539381T1 (de) 2004-06-01 2005-06-01 Materialzusammensetzung für nano- und mikrolithografie

Country Status (7)

Country Link
US (1) US7648767B2 (de)
EP (1) EP1794655B1 (de)
JP (1) JP2008501825A (de)
KR (1) KR20070044392A (de)
CN (1) CN101084468B (de)
AT (1) ATE539381T1 (de)
WO (1) WO2006083284A2 (de)

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CA2309002A1 (en) * 2000-05-23 2001-11-23 Jonathan Martin Shekter Digital film grain reduction
US7456630B2 (en) * 2005-09-22 2008-11-25 U Chicago Argonne Llc NMR characterization of thin films
JP5309436B2 (ja) * 2006-10-16 2013-10-09 日立化成株式会社 樹脂製微細構造物、その製造方法及び重合性樹脂組成物
JP5269449B2 (ja) * 2007-03-24 2013-08-21 株式会社ダイセル ナノインプリント用硬化性樹脂組成物
US8027086B2 (en) * 2007-04-10 2011-09-27 The Regents Of The University Of Michigan Roll to roll nanoimprint lithography
JP5435879B2 (ja) * 2008-02-14 2014-03-05 株式会社ダイセル ナノインプリント用硬化性樹脂組成物
US8293354B2 (en) * 2008-04-09 2012-10-23 The Regents Of The University Of Michigan UV curable silsesquioxane resins for nanoprint lithography
JP5651676B2 (ja) 2009-03-16 2015-01-14 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 熱伝導性グリース、並びに、該グリースを用いる方法及びデバイス
US20100255427A1 (en) * 2009-04-02 2010-10-07 Taiwan Semiconductor Manufacturing Company, Ltd. Conformal photo-sensitive layer and process
EP2564247A2 (de) 2010-04-27 2013-03-06 The Regents Of The University Of Michigan Anzeigevorrichtung mit plasmonischen farbfiltern und photovoltaikfunktionen
JP2012114157A (ja) * 2010-11-22 2012-06-14 Toshiba Corp ドロップレシピ作成方法およびデータベース作成方法
KR20140031899A (ko) 2011-04-20 2014-03-13 더 리젠츠 오브 더 유니버시티 오브 미시건 최소의 각 의존성을 갖는 표시 장치들 및 이미징을 위한 스펙트럼 필터링
KR20150030654A (ko) * 2012-06-07 2015-03-20 도쿄엘렉트론가부시키가이샤 인프린트 장치 및 템플릿
US9478765B2 (en) 2012-09-18 2016-10-25 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Electro-optical device stack, having patches covering layer breaches
US10053597B2 (en) 2013-01-18 2018-08-21 Basf Se Acrylic dispersion-based coating compositions
US9547107B2 (en) 2013-03-15 2017-01-17 The Regents Of The University Of Michigan Dye and pigment-free structural colors and angle-insensitive spectrum filters
KR102056902B1 (ko) 2013-05-29 2019-12-18 삼성전자주식회사 와이어 그리드 편광판 및 이를 구비하는 액정 표시패널 및 액정 표시장치
KR102089661B1 (ko) 2013-08-27 2020-03-17 삼성전자주식회사 와이어 그리드 편광판 및 이를 구비하는 액정 표시패널 및 액정 표시장치
CN103513511A (zh) * 2013-10-25 2014-01-15 无锡英普林纳米科技有限公司 一种纳米压印方法
EP3379565B1 (de) * 2015-11-16 2020-10-14 Mitsui Chemicals, Inc. Halbleiterschichtzusammensetzung, verfahren zur herstellung einer halbleiterschichtzusammensetzung, verfahren zur herstellung eines halbleiterbauelements, verfahren zur herstellung von verarbeitungsmaterial für einen halbleiter und halbleiterbauelement
MX2020014067A (es) 2018-07-20 2021-05-27 Illumina Inc Composicion de resina y celdas de flujo que incorporan la misma.
WO2020018801A1 (en) 2018-07-20 2020-01-23 Illumina, Inc. Resin composition and flow cells incorporating the same
US11549020B2 (en) 2019-09-23 2023-01-10 Canon Kabushiki Kaisha Curable composition for nano-fabrication

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US5863970A (en) * 1995-12-06 1999-01-26 Polyset Company, Inc. Epoxy resin composition with cycloaliphatic epoxy-functional siloxane
DE19648283A1 (de) * 1996-11-21 1998-05-28 Thera Ges Fuer Patente Polymerisierbare Massen auf der Basis von Epoxiden
US20030157414A1 (en) * 1997-11-13 2003-08-21 Pradeep K. Dhal Holographic medium and process for use thereof
SG77689A1 (en) * 1998-06-26 2001-01-16 Ciba Sc Holding Ag New o-acyloxime photoinitiators
FR2784024B1 (fr) * 1998-10-02 2002-10-31 Rhodia Chimie Sa Composition dentaire a base d'une silicone fonctionnalisee reticulable/polymerisable par voie cationique en presence d'un borate d'un complexe organometallique
FR2784025B1 (fr) * 1998-10-02 2002-10-31 Rhodia Chimie Sa Composition dentaire a base d'une silicone fonctionnalisee reticulable/polymerisable par voie cationique
US6828404B2 (en) 2000-10-20 2004-12-07 Rensselaer Polytechnic Institute Polymerizable siloxanes
JP2004002631A (ja) * 2002-03-28 2004-01-08 Fuji Photo Film Co Ltd 染料含有硬化性組成物、並びに、これを使用したカラーフィルターおよびその製造方法
JP2004126193A (ja) * 2002-10-02 2004-04-22 Fuji Photo Film Co Ltd 染料含有硬化性組成物、並びに、これを使用したカラーフィルターおよびその製造方法

Also Published As

Publication number Publication date
WO2006083284A3 (en) 2007-08-16
US20070196589A1 (en) 2007-08-23
WO2006083284A2 (en) 2006-08-10
US7648767B2 (en) 2010-01-19
CN101084468B (zh) 2012-11-07
EP1794655A2 (de) 2007-06-13
JP2008501825A (ja) 2008-01-24
KR20070044392A (ko) 2007-04-27
EP1794655B1 (de) 2011-12-28
CN101084468A (zh) 2007-12-05

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