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ATE298128T1 - Elektrisches bauelement und verfahren zu dessen herstellung - Google Patents

Elektrisches bauelement und verfahren zu dessen herstellung

Info

Publication number
ATE298128T1
ATE298128T1 AT01957747T AT01957747T ATE298128T1 AT E298128 T1 ATE298128 T1 AT E298128T1 AT 01957747 T AT01957747 T AT 01957747T AT 01957747 T AT01957747 T AT 01957747T AT E298128 T1 ATE298128 T1 AT E298128T1
Authority
AT
Austria
Prior art keywords
base body
intermediate layer
solution
electrical component
fluid
Prior art date
Application number
AT01957747T
Other languages
English (en)
Inventor
Roland Peinsipp
Franz Schrank
Original Assignee
Epcos Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Ag filed Critical Epcos Ag
Application granted granted Critical
Publication of ATE298128T1 publication Critical patent/ATE298128T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49098—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Insulating Bodies (AREA)
AT01957747T 2000-08-30 2001-08-02 Elektrisches bauelement und verfahren zu dessen herstellung ATE298128T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10042636A DE10042636C1 (de) 2000-08-30 2000-08-30 Elektrisches Bauelement und Verfahren zu dessen Herstellung
PCT/DE2001/002931 WO2002019348A1 (de) 2000-08-30 2001-08-02 Elektrisches bauelement und verfahren zu dessen herstellung

Publications (1)

Publication Number Publication Date
ATE298128T1 true ATE298128T1 (de) 2005-07-15

Family

ID=7654326

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01957747T ATE298128T1 (de) 2000-08-30 2001-08-02 Elektrisches bauelement und verfahren zu dessen herstellung

Country Status (7)

Country Link
US (2) US7145430B2 (de)
EP (1) EP1314171B1 (de)
JP (2) JP5294528B2 (de)
AT (1) ATE298128T1 (de)
AU (1) AU2001279578A1 (de)
DE (2) DE10042636C1 (de)
WO (1) WO2002019348A1 (de)

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JP4430422B2 (ja) * 2004-02-06 2010-03-10 株式会社日立製作所 温度センサ
CN102277231A (zh) * 2004-07-16 2011-12-14 丹尼斯科公司 用酶使油脱胶的方法
DE102005021551A1 (de) * 2005-05-10 2006-11-16 BSH Bosch und Siemens Hausgeräte GmbH Kältegerät mit einer Wasserleitung
JP4744947B2 (ja) * 2005-06-23 2011-08-10 本田技研工業株式会社 電子制御ユニット及びその製造方法
JP2007035766A (ja) * 2005-07-25 2007-02-08 Hitachi Ltd 温度感知素子
US7276839B1 (en) * 2005-11-30 2007-10-02 The United States Of America Represented By The Secretary Of The Navy Bondable fluoropolymer film as a water block/acoustic window for environmentally isolating acoustic devices
US7875812B2 (en) * 2008-07-31 2011-01-25 Ge Aviation Systems, Llc Method and apparatus for electrical component physical protection
JP2010141180A (ja) * 2008-12-12 2010-06-24 Nichicon Corp 固体電解コンデンサおよびその製造方法
US8684705B2 (en) * 2010-02-26 2014-04-01 Entegris, Inc. Method and system for controlling operation of a pump based on filter information in a filter information tag
KR101008310B1 (ko) * 2010-07-30 2011-01-13 김선기 세라믹 칩 어셈블리
DE102012109704A1 (de) * 2012-10-11 2014-04-17 Epcos Ag Keramisches Bauelement mit Schutzschicht und Verfahren zu dessen Herstellung
JP6723690B2 (ja) * 2015-06-01 2020-07-15 株式会社村田製作所 被覆リードタイプ電子部品およびその製造方法
DE102023104467A1 (de) * 2023-02-23 2024-08-29 Tdk Electronics Ag Keramisches Bauelement und Verfahren zur Herstellung eines keramischen Bauelements

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US2741687A (en) * 1953-08-21 1956-04-10 Erie Resistor Corp Pyrolytic carbon resistors
US2885523A (en) * 1954-02-25 1959-05-05 Sprague Electric Co Molded resistors
US2883502A (en) * 1955-01-28 1959-04-21 Us Gasket Company Electrical resistors and other bodies with negligible temperature coefficient of expansion
US3666551A (en) * 1967-12-08 1972-05-30 Corning Glass Works Impregnating and coating composition for porous ceramic insulation
US3562007A (en) * 1968-04-25 1971-02-09 Corning Glass Works Flame-proof,moisture resistant coated article and process of making same
US3599139A (en) * 1969-03-14 1971-08-10 Blh Electronics Strain gage protective cover
US3655610A (en) * 1970-05-21 1972-04-11 Du Pont Fluoropolymer coating compositions
US3793716A (en) * 1972-09-08 1974-02-26 Raychem Corp Method of making self limiting heat elements
US3824328A (en) * 1972-10-24 1974-07-16 Texas Instruments Inc Encapsulated ptc heater packages
US4001655A (en) * 1974-01-10 1977-01-04 P. R. Mallory & Co., Inc. Compressible intermediate layer for encapsulated electrical devices
IT1199770B (it) 1986-12-16 1988-12-30 Ausimont Spa Resine epossidiche ottenute mediante coreticolazione di prepolimeri epossidici fluorurati e prepolimeri epossidici non fluorurati
JPS63137901U (de) * 1987-03-03 1988-09-12
JPS63317730A (ja) * 1987-06-22 1988-12-26 Hitachi Heating Appliance Co Ltd サ−ミスタユニツト
US4804805A (en) * 1987-12-21 1989-02-14 Therm-O-Disc, Incorporated Protected solder connection and method
JP2578888B2 (ja) * 1988-03-15 1997-02-05 松下電器産業株式会社 酸化亜鉛形バリスタ
JPH02152206A (ja) * 1988-12-03 1990-06-12 Fujikura Ltd 電気素子の絶縁被覆方法
JPH02303101A (ja) * 1989-05-18 1990-12-17 Tdk Corp セラミック電子部品
JP3152352B2 (ja) * 1990-11-14 2001-04-03 三菱マテリアル株式会社 サーミスタ素子
JPH04224896A (ja) * 1990-12-26 1992-08-14 Nippon Kouyu:Kk 油分の拡散防止法及び油分の拡散防止剤
JP2839739B2 (ja) * 1991-03-13 1998-12-16 日本碍子株式会社 抵抗素子
JPH07201502A (ja) * 1993-12-28 1995-08-04 Japan Gore Tex Inc 基板実装型電子部品
JPH08273912A (ja) * 1995-03-30 1996-10-18 Matsushita Electric Ind Co Ltd 電子部品の製造方法
JPH08335502A (ja) * 1995-06-07 1996-12-17 Tdk Corp 電圧非直線抵抗体およびその製造方法
JPH0992662A (ja) * 1995-09-25 1997-04-04 Chochi Sai シリコン半導体ダイオード、その回路モジュールおよび絶縁体を備える構造物ならびにそれらの製作方法
US5661618A (en) * 1995-12-11 1997-08-26 International Business Machines Corporation Magnetic recording device having a improved slider
JP3344684B2 (ja) 1996-05-20 2002-11-11 株式会社村田製作所 電子部品
JPH10233303A (ja) * 1996-09-30 1998-09-02 Mitsubishi Materials Corp Ｎｔｃサーミスタ
JPH10335114A (ja) 1997-04-04 1998-12-18 Murata Mfg Co Ltd サーミスタ素子
JP3922761B2 (ja) * 1997-06-04 2007-05-30 フクビ化学工業株式会社 白色高反射性塗料を用いた計器用ポインター
JPH11116278A (ja) * 1997-10-20 1999-04-27 Central Glass Co Ltd フッ素樹脂被覆体の製造方法
JP3331953B2 (ja) * 1998-03-19 2002-10-07 株式会社村田製作所 高圧コンデンサ
JPH11326689A (ja) * 1998-05-18 1999-11-26 Asahi Glass Co Ltd プラスチック光ファイバ先端部の加工方法
DE19851869B4 (de) * 1998-11-10 2007-08-02 Epcos Ag Heißleiter-Temperaturfühler
US6800176B1 (en) * 1999-06-17 2004-10-05 E. I. Du Pont De Nemours And Company Preservation of paper and textile materials

Also Published As

Publication number Publication date
JP5340350B2 (ja) 2013-11-13
JP2011223030A (ja) 2011-11-04
JP2004508702A (ja) 2004-03-18
DE10042636C1 (de) 2002-04-11
US7430797B2 (en) 2008-10-07
AU2001279578A1 (en) 2002-03-13
US20070040646A1 (en) 2007-02-22
US7145430B2 (en) 2006-12-05
WO2002019348A1 (de) 2002-03-07
US20040026106A1 (en) 2004-02-12
EP1314171B1 (de) 2005-06-15
EP1314171A1 (de) 2003-05-28
JP5294528B2 (ja) 2013-09-18
DE50106534D1 (de) 2005-07-21

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