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ATE291650T1 - Lösung zum galvanischen abscheiden einer zinn- indium-legierung - Google Patents

Lösung zum galvanischen abscheiden einer zinn- indium-legierung

Info

Publication number
ATE291650T1
ATE291650T1 AT00309300T AT00309300T ATE291650T1 AT E291650 T1 ATE291650 T1 AT E291650T1 AT 00309300 T AT00309300 T AT 00309300T AT 00309300 T AT00309300 T AT 00309300T AT E291650 T1 ATE291650 T1 AT E291650T1
Authority
AT
Austria
Prior art keywords
tin
indium alloy
solution
indium
alloy plating
Prior art date
Application number
AT00309300T
Other languages
English (en)
Inventor
Takaaki Tamura
Kyoko Tsunoda
Original Assignee
Nippon Macdermid Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Macdermid Co Ltd filed Critical Nippon Macdermid Co Ltd
Application granted granted Critical
Publication of ATE291650T1 publication Critical patent/ATE291650T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
AT00309300T 2000-01-17 2000-10-23 Lösung zum galvanischen abscheiden einer zinn- indium-legierung ATE291650T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000010288A JP2001200387A (ja) 2000-01-17 2000-01-17 錫−インジウム合金電気めっき浴

Publications (1)

Publication Number Publication Date
ATE291650T1 true ATE291650T1 (de) 2005-04-15

Family

ID=18538325

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00309300T ATE291650T1 (de) 2000-01-17 2000-10-23 Lösung zum galvanischen abscheiden einer zinn- indium-legierung

Country Status (8)

Country Link
US (1) US6331240B1 (de)
EP (1) EP1116804B1 (de)
JP (1) JP2001200387A (de)
CN (1) CN1165639C (de)
AT (1) ATE291650T1 (de)
DE (1) DE60018893T2 (de)
ES (1) ES2235790T3 (de)
TW (1) TW538144B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005060822A (ja) * 2003-08-08 2005-03-10 Rohm & Haas Electronic Materials Llc 複合基体の電気メッキ
JP5497261B2 (ja) 2006-12-15 2014-05-21 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． インジウム組成物
US20090188808A1 (en) * 2008-01-29 2009-07-30 Jiaxiong Wang Indium electroplating baths for thin layer deposition
EP2848714B1 (de) * 2008-04-22 2016-11-23 Rohm and Haas Electronic Materials LLC Verfahren zum Nachfüllen von Indiumionen in Indium-Elektroplattierzusammensetzungen
RU2458188C1 (ru) * 2011-06-16 2012-08-10 Георгий Иосифович Медведев Способ электроосаждения сплава олово-индий
CN102424995A (zh) * 2011-12-17 2012-04-25 张家港舒马克电梯安装维修服务有限公司镀锌分公司 一种锡-铟合金电镀液
US10879156B2 (en) 2016-03-08 2020-12-29 Washington State University Mitigation of whisker growth in tin coatings by alloying with indium
US9809892B1 (en) 2016-07-18 2017-11-07 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium
US11686007B2 (en) 2017-12-18 2023-06-27 New Mexico Tech University Research Park Corporation Tin-indium alloy electroplating solution
RU2769855C1 (ru) * 2021-06-30 2022-04-07 Федеральное государственное бюджетное образовательное учреждение высшего образования "Чувашский государственный университет имени И.Н. Ульянова" Безфлюсовый способ получения луженой медной проволоки с покрытием сплавом на основе олова и индия
RU2768620C1 (ru) * 2021-06-30 2022-03-24 Федеральное государственное бюджетное образовательное учреждение высшего образования "Чувашский государственный университет имени И.Н. Ульянова" Способ получения медной проволоки с покрытием на основе сплава олово-индий

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1176787A (en) * 1968-04-08 1970-01-07 Vandervell Products Ltd Improvements in or relating to Methods of Electrolytically Plating a Substrate With Indium.
JP3279353B2 (ja) * 1992-09-25 2002-04-30 ディップソール株式会社 錫−亜鉛合金電気めっき浴
US6210556B1 (en) * 1998-02-12 2001-04-03 Learonal, Inc. Electrolyte and tin-silver electroplating process

Also Published As

Publication number Publication date
EP1116804B1 (de) 2005-03-23
DE60018893T2 (de) 2005-07-28
EP1116804A3 (de) 2004-01-28
CN1314501A (zh) 2001-09-26
CN1165639C (zh) 2004-09-08
ES2235790T3 (es) 2005-07-16
US6331240B1 (en) 2001-12-18
JP2001200387A (ja) 2001-07-24
TW538144B (en) 2003-06-21
EP1116804A2 (de) 2001-07-18
DE60018893D1 (de) 2005-04-28

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Legal Events

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