NO963827L - Optisk og/eller elektrooptisk forbindelse og fremgangsmåte for tilveiebringelse - Google Patents
Optisk og/eller elektrooptisk forbindelse og fremgangsmåte for tilveiebringelse Download PDFInfo
- Publication number
- NO963827L NO963827L NO963827A NO963827A NO963827L NO 963827 L NO963827 L NO 963827L NO 963827 A NO963827 A NO 963827A NO 963827 A NO963827 A NO 963827A NO 963827 L NO963827 L NO 963827L
- Authority
- NO
- Norway
- Prior art keywords
- components
- carrier plate
- optical
- component
- electromagnetic radiation
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 13
- 230000005670 electromagnetic radiation Effects 0.000 claims description 25
- 239000000835 fiber Substances 0.000 claims description 21
- 230000005855 radiation Effects 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 238000003384 imaging method Methods 0.000 claims description 4
- 238000013519 translation Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims description 3
- 238000005304 joining Methods 0.000 claims description 3
- 238000012634 optical imaging Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000012780 transparent material Substances 0.000 claims 2
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 239000011521 glass Substances 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/255—Splicing of light guides, e.g. by fusion or bonding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/255—Splicing of light guides, e.g. by fusion or bonding
- G02B6/2551—Splicing of light guides, e.g. by fusion or bonding using thermal methods, e.g. fusion welding by arc discharge, laser beam, plasma torch
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
- G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73257—Bump and wire connectors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optical Couplings Of Light Guides (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19546443A DE19546443A1 (de) | 1995-12-13 | 1995-12-13 | Optische und/oder elektrooptische Verbindung und Verfahren zur Herstellung einer solchen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NO963827D0 NO963827D0 (no) | 1996-09-13 |
| NO963827L true NO963827L (no) | 1997-06-16 |
Family
ID=7779943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO963827A NO963827L (no) | 1995-12-13 | 1996-09-13 | Optisk og/eller elektrooptisk forbindelse og fremgangsmåte for tilveiebringelse |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6181855B1 (fr) |
| EP (1) | EP0779526A3 (fr) |
| CA (1) | CA2192781A1 (fr) |
| DE (1) | DE19546443A1 (fr) |
| NO (1) | NO963827L (fr) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19746204A1 (de) * | 1997-10-18 | 1999-04-29 | Deutsche Telekom Ag | Halbleiterlaserchip |
| US6471419B1 (en) * | 1999-06-07 | 2002-10-29 | International Business Machines Corporation | Fiber optic assembly |
| US6628865B2 (en) | 2000-12-15 | 2003-09-30 | Intel Corporation | Alignment of optical fibers to an etched array waveguide |
| US6707970B2 (en) | 2000-12-15 | 2004-03-16 | Intel Corporation | Alignment of fiber optic bundle to array waveguide using an epoxy |
| US6886989B2 (en) * | 2000-12-15 | 2005-05-03 | Intel Corporation | Alignment of fiber optic bundle to array waveguide using pins |
| TWI226139B (en) | 2002-01-31 | 2005-01-01 | Osram Opto Semiconductors Gmbh | Method to manufacture a semiconductor-component |
| DE10243757A1 (de) * | 2002-01-31 | 2004-04-01 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von Halbleiterchips |
| US8524573B2 (en) | 2003-01-31 | 2013-09-03 | Osram Opto Semiconductors Gmbh | Method for separating a semiconductor layer from a substrate by irradiating with laser pulses |
| WO2004068567A1 (fr) * | 2003-01-31 | 2004-08-12 | Osram Opto Semiconductors Gmbh | Composant semi-conducteur a couche mince et son procede de production |
| DE10314494B3 (de) * | 2003-03-27 | 2004-11-18 | Infineon Technologies Ag | Elektrooptisches Modul |
| US20050031186A1 (en) * | 2003-08-10 | 2005-02-10 | Luu Victor Van | Systems and methods for characterizing a three-dimensional sample |
| US7231153B2 (en) * | 2005-01-13 | 2007-06-12 | Xerox Corporation | Systems and methods for monitoring replaceable units |
| WO2007086837A1 (fr) | 2006-01-24 | 2007-08-02 | Welldynamics, Inc. | Commande de la position d’actionneurs en fond de trou |
| US20080166122A1 (en) * | 2007-01-08 | 2008-07-10 | Inventec Multimedia & Telecom Corporation | Optical network backup channel switching control device |
| DE202007017386U1 (de) * | 2007-12-13 | 2008-02-28 | CCS Technology, Inc., Wilmington | Kopplungseinrichtung zum Koppeln von Lichtwellenleitern |
| JP5224845B2 (ja) * | 2008-02-18 | 2013-07-03 | 新光電気工業株式会社 | 半導体装置の製造方法及び半導体装置 |
| US20110164848A1 (en) * | 2010-01-07 | 2011-07-07 | Alcatel-Lucent Usa Inc. | Ball Lens Holder For A Planar Lightwave Circuit Device |
| JP7211235B2 (ja) * | 2019-04-15 | 2023-01-24 | 日本電信電話株式会社 | 光接続構造 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4065203A (en) * | 1975-12-10 | 1977-12-27 | International Telephone And Telegraph Corporation | Couplers for electro-optical elements |
| US4341942A (en) * | 1978-10-31 | 1982-07-27 | International Business Machines Corporation | Method of bonding wires to passivated chip microcircuit conductors |
| GB8417911D0 (en) * | 1984-07-13 | 1984-08-15 | British Telecomm | Connecting waveguides |
| DE3433717A1 (de) * | 1984-09-14 | 1986-03-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum koppeln optischer bauelemente und anordnung zur durchfuehrung des verfahrens |
| SE453334B (sv) * | 1985-09-13 | 1988-01-25 | Ericsson Telefon Ab L M | Anordning for centrering av optiska fibrer vid svetsning |
| US4752109A (en) * | 1986-09-02 | 1988-06-21 | Amp Incorporated | Optoelectronics package for a semiconductor laser |
| DE3809396A1 (de) * | 1988-03-21 | 1989-10-05 | Siemens Ag | Optischer sende- und empfangsmodul |
| DE58905432D1 (de) * | 1988-07-01 | 1993-10-07 | Siemens Ag | Vorrichtung zum Justieren und Fixieren einer Kugellinse sowie Verfahren zum Betrieb der Vorrichtung. |
| US4867524A (en) * | 1988-09-08 | 1989-09-19 | United Technologies Corporation | Metallic bond for mounting of optical fibers to integrated optical chips |
| US5016971A (en) * | 1989-10-20 | 1991-05-21 | Hughes Aircraft Company | Automated laser fusion system for high strength optical fiber splicing |
| DE4004544C2 (de) * | 1990-02-14 | 1998-07-30 | Siemens Ag | Laser-Schweißeinrichtung |
| US5073002A (en) * | 1990-11-30 | 1991-12-17 | Hockaday Bruce D | Self aligning pigtail |
| GB9100680D0 (en) * | 1991-01-11 | 1991-02-27 | Gen Electric Co Plc | Optical fibre interface |
| DE4140283A1 (de) * | 1991-12-06 | 1993-06-17 | Bundesrep Deutschland | Verfahren zur fixierung eines lichtwellenleiters |
| GB2268813B (en) * | 1992-07-13 | 1995-04-19 | Integrated Optical Components | Packaged optical devices |
| JP2565279B2 (ja) * | 1992-09-25 | 1996-12-18 | 日本電気株式会社 | 光結合構造 |
| DE4320194A1 (de) * | 1993-06-18 | 1994-12-22 | Sel Alcatel Ag | Vorrichtung zur justagefreien Ankopplung einer Mehrzahl von Lichtwellenleitern an ein Laserarray |
| US5367140A (en) * | 1993-12-27 | 1994-11-22 | At&T Bell Laboratories | Method for laser welding of optical packages |
| US5432877A (en) * | 1994-06-03 | 1995-07-11 | Photonic Integration Research, Inc. | Integrated optical circuit having a waveguide end of lens geometry, and method for making same |
-
1995
- 1995-12-13 DE DE19546443A patent/DE19546443A1/de not_active Withdrawn
-
1996
- 1996-09-13 NO NO963827A patent/NO963827L/no unknown
- 1996-11-28 EP EP96119053A patent/EP0779526A3/fr not_active Ceased
- 1996-12-12 US US08/764,000 patent/US6181855B1/en not_active Expired - Fee Related
- 1996-12-12 CA CA002192781A patent/CA2192781A1/fr not_active Abandoned
-
2000
- 2000-10-25 US US09/696,457 patent/US6282346B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE19546443A1 (de) | 1997-06-19 |
| CA2192781A1 (fr) | 1997-06-14 |
| US6282346B1 (en) | 2001-08-28 |
| EP0779526A3 (fr) | 1997-10-29 |
| EP0779526A2 (fr) | 1997-06-18 |
| US6181855B1 (en) | 2001-01-30 |
| NO963827D0 (no) | 1996-09-13 |
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