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NL1020341C2 - Chip etching comprises use of chip holder comprising elastic material - Google Patents

Chip etching comprises use of chip holder comprising elastic material Download PDF

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Publication number
NL1020341C2
NL1020341C2 NL1020341A NL1020341A NL1020341C2 NL 1020341 C2 NL1020341 C2 NL 1020341C2 NL 1020341 A NL1020341 A NL 1020341A NL 1020341 A NL1020341 A NL 1020341A NL 1020341 C2 NL1020341 C2 NL 1020341C2
Authority
NL
Netherlands
Prior art keywords
chip
elastic material
chips
holder
comprises use
Prior art date
Application number
NL1020341A
Other languages
Dutch (nl)
Inventor
Gleb Vdovine
Serhat Sakarya
Patrick James French
Original Assignee
Stichting Tech Wetenschapp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stichting Tech Wetenschapp filed Critical Stichting Tech Wetenschapp
Priority to NL1020341A priority Critical patent/NL1020341C2/en
Application granted granted Critical
Publication of NL1020341C2 publication Critical patent/NL1020341C2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

A holder for a chip comprises an elastic material. An independent claim is included for etching treatment on at least one chip comprising introducing the chip into a suitable etching environment using a holder comprising an elastic material.

Description

Werkwijze voor het uitvoeren van een etsbewerkingMethod for performing an etching operation

De uitvinding heeft betrekking op een werkwijze voor het uitvoeren van een etsbewerking op ten minste een chip of dergelijke, waarbij de ten minste ene chip in een voor etsen geschikte omgeving wordt gebracht.The invention relates to a method for performing an etching operation on at least one chip or the like, wherein the at least one chip is brought into an environment suitable for etching.

5 Een dergelijke werkwijze is bekend uit de praktijk en wordt toegepast voor het plaatselijk etsen van de chip in het kader van verdere bewerkingen die de chip geschikt moeten maken voor bepaalde toepassingen. Het kan daarbij gaan om toepassing van de chips voor druksensoren, accelerometers, 10 optische chips, RF-chips en vele andere mogelijkheden.Such a method is known from practice and is used for locally etching the chip in the context of further operations which must make the chip suitable for certain applications. This may involve the use of chips for pressure sensors, accelerometers, 10 optical chips, RF chips and many other options.

In de praktijk wordt het plaatselijk etsen van chips uitgevoerd door voor ieder specifiek geval een statische houder te ontwerpen die vervaardigd is uit Teflon of metaal, waarin de chip wordt gevat. Door middel van druk op tevens 15 daarbij toegepaste rubberen ringen worden vervolgens de voorafbepaalde plaatsen van de chip geïsoleerd, zodat het toe te passen etsmiddel op die plaatsen niet werkzaam kan zijn. Een nadeel van de bekende werkwijze is dat deze leidt tot een relatief hoge druk op de te bewerken chips, waarbij deze druk 20 bovendien ongelijk verdeeld is over de chip. Een belangrijk nadeel is voorts dat voor ieder ontwerp een nieuwe houder dient te worden ontwikkeld, hetgeen tijd kost en relatief kostbaar is.In practice, the local etching of chips is performed by designing for each specific case a static container made of Teflon or metal in which the chip is contained. The predetermined locations are subsequently isolated from the chip by means of pressure on rubber rings which are also used thereby, so that the etchant to be used cannot be effective at those locations. A drawback of the known method is that it leads to a relatively high pressure on the chips to be processed, wherein this pressure is moreover unevenly distributed over the chip. A major drawback is furthermore that a new holder must be developed for each design, which takes time and is relatively expensive.

Met de uitvinding is nu beoogd om voor deze proble-25 men een oplossing te bieden, zodat het mogelijk wordt om snel en flexibel op chips van verschillende afmetingen plaatselijk gewenste etsbewerkingen uit te voeren. Tevens is een doelstelling hierbij om de op de chips uit te oefenen druk tegen te gaan, teneinde het uitvalpercentage van de bewerkte chips 30 ten opzichte van de stand van de techniek terug te brengen.The invention now has for its object to provide a solution for these problems, so that it becomes possible to perform locally desired etching operations on chips of different sizes quickly and flexibly. It is also an objective here to counteract the pressure to be exerted on the chips in order to reduce the failure rate of the processed chips 30 relative to the prior art.

Volgens de uitvinding wordt daartoe een werkwijze voorgesteld, die erdoor gekenmerkt is dat voor de houder een elastisch materiaal wordt gebruikt. Door de toepassing van een dergelijk elastisch materiaal wordt volledig voorkomen 35 dat druk op de te bewerken chips wordt uitgeoefend, zodat ook het uitvalpercentage van de bewerkte chips relatief laag ge- 3 f.According to the invention, a method is proposed for this purpose, which is characterized in that an elastic material is used for the holder. The use of such an elastic material completely prevents pressure being exerted on the chips to be processed, so that the failure percentage of the processed chips is also relatively low.

2 houden kan worden.2 can be hold.

De werkwijze volgens de uitvinding laat zich geschikt zo realiseren dat voor de houder een siliconenelastomeer materiaal wordt gebruikt. Een siliconen-elastomeer 5 materiaal dat hiervoor gebruikt kan worden is bijvoorbeeld het door Dow Corning Corporation op de markt gebrachte SYLGARD 184 silicone elastomer (SYLGARD is een handelsmerk van Dow Corning Corporation).The method according to the invention can conveniently be realized such that a silicone elastomeric material is used for the container. A silicone elastomeric material that can be used for this is, for example, the SYLGARD 184 silicone elastomer marketed by Dow Corning Corporation (SYLGARD is a trademark of Dow Corning Corporation).

In een eerste voorkeursuitvoeringsvorm van de door 10 de uitvinding voorgestelde werkwijze wordt de ten minste ene chip ingegoten in het elastisch materiaal, waarna op een voorafbepaalde plaats of plaatsen in het elastisch materiaal een uitsparing of uitsparingen worden aangebracht.In a first preferred embodiment of the method proposed by the invention, the at least one chip is molded into the elastic material, whereafter a recess or recesses are provided at a predetermined location or locations in the elastic material.

In een tweede voorkeursuitvoeringsvorm van de werk-15 wijze volgens de uitvinding wordt de ten minste ene chip ingegoten in het elastisch materiaal, terwijl op een voorafbepaalde plaats of plaatsen op de ten minste ene chip een vorm-stuk of vormstukken zijn geplaatst die na uitharden van het elastisch materiaal worden verwijderd.In a second preferred embodiment of the method according to the invention, the at least one chip is molded into the elastic material, while at a predetermined place or places on the at least one chip a molded part or moldings are placed which after curing of the elastic material are removed.

20 Door het ingieten van de chips in het elastisch ma teriaal zijn deze aan alle kanten beschermd en kan naar keuze een van de beide hiervoor genoemde voorkeursuitvoeringsvormen van de uitgevonden werkwijze gehanteerd worden voor het vrijgeven van de voorafbepaalde plaatsen van de ten minste ene 25 chip die de etsbewerking moet ondergaan. De methode van het ingieten in het elastisch materiaal is niet alleen eenvoudig, maar biedt ook een eenvoudige mogelijkheid om nadat de etsbewerking is uitgevoerd, de houder van het elastisch materiaal geheel te verwijderen.By pouring the chips into the elastic material, they are protected on all sides and, optionally, one of the two aforementioned preferred embodiments of the invented method can be used for releasing the predetermined locations of the at least one chip which must undergo the etching operation. The method of pouring into the elastic material is not only simple, but also offers a simple possibility to completely remove the holder of the elastic material after the etching operation has been carried out.

30 Het heeft verder de voorkeur dat alvorens het elas tisch materiaal van de houder wordt aangebracht, de ten minste ene chip wordt voorzien van een hechtlaag. Dit bevordert effectief de afsluiting van de gebieden van de ten minste ene chip die aan de etsbewerking dienen te worden onttrokken. Een 35 geschikt materiaal dat voor de hechtlaag kan worden toegepast, is de door Dow Corning Corporation op de markt gebrachte SYLGARD 527 Primerless Silicone Dielectric Gel.It is further preferred that before the elastic material of the container is applied, the at least one chip is provided with an adhesive layer. This effectively promotes the closure of the areas of the at least one chip to be withdrawn from the etching operation. A suitable material that can be used for the adhesive layer is the SYLGARD 527 Primerless Silicone Dielectric Gel marketed by Dow Corning Corporation.

De uitvinding zal hierna verder worden toegelicht — ^ Lt 3The invention will be explained in more detail below

aan de hand van een niet-beperkend uitvoeringsvoorbeeld. VOORBEELDon the basis of a non-limiting exemplary embodiment. EXAMPLE

5 In een container is een laag van circa 1 mm dikte aangebracht van het materiaal SYLGARD 184 silicone elastomer. Het aanbrengen is uitgevoerd door dit materiaal in de container te gieten en vervolgens enigszins te verwarmen teneinde een geringe mate van uitharding te verkrijgen. Op de matig 10 uitgeharde laag van siliconen-elastomeer zijn vervolgens diverse chips geplaatst met een onderlinge afstand in de orde van grootte van 5 mm. Vervolgens is een geringe hoeveelheid SYLGARD 527 Primerless Silicone Dielectric Gel over de chips gegoten ter bevordering van de hechting met het daarna aan te 15 brengen siliconen-elastomeer materiaal.A layer of approximately 1 mm thickness of the material SYLGARD 184 silicone elastomer is provided in a container. The application is carried out by pouring this material into the container and then heating it slightly in order to obtain a small degree of curing. Various chips are then placed on the moderately cured layer of silicone elastomer with a mutual distance in the order of magnitude of 5 mm. Subsequently, a small amount of SYLGARD 527 Primerless Silicone Dielectric Gel was poured over the chips to promote adhesion with the silicone elastomeric material to be applied thereafter.

Na het aanbrengen van de hechtlaag is circa 2 mm vloeibaar elastisch materiaal in de vorm van SYLGARD 184 silicone elastomer uitgegoten over de chips, teneinde deze volledig te omgeven. Vervolgens is een en ander door verwarming 20 uitgehard. Na het uitharden zijn op voorafbepaalde plaatsen delen van het elastisch materiaal weggesneden ter vrijgave van geselecteerde oppervlakken van de chips. Na deze bewerking zijn de chips vervolgens aan een etsbewerking onderworpen.After applying the adhesive layer, approximately 2 mm of liquid elastic material in the form of SYLGARD 184 silicone elastomer is poured over the chips in order to completely surround them. Subsequently, this is cured by heating. After curing, parts of the elastic material are cut away at predetermined locations to release selected surfaces of the chips. After this operation, the chips are then subjected to an etching operation.

,i, i

Claims (5)

1. Werkwijze voor het uitvoeren van een etsbewerking op ten minste een chip of dergelijke, waarbij de ten minste ene chip in een voor etsen geschikte omgeving wordt gebracht, met het kenmerk, dat voor de houder een elastisch materiaal 5 wordt gebruikt.Method for performing an etching operation on at least one chip or the like, wherein the at least one chip is brought into an environment suitable for etching, characterized in that an elastic material is used for the holder. 2. Werkwijze volgens conclusie 1, met het kenmerk, dat voor de houder een siliconen-elastomeer materiaal wordt gebruikt.Method according to claim 1, characterized in that a silicone-elastomeric material is used for the container. 3. Werkwijze volgens conclusie 1 of 2, met het ken-10 merk, dat de ten minste ene chip wordt ingegoten in het elastisch materiaal, waarna op een voorafbepaalde plaats of plaatsen in het elastisch materiaal een uitsparing of uitsparingen worden aangebracht·3. Method as claimed in claim 1 or 2, characterized in that the at least one chip is cast in the elastic material, whereafter a recess or recesses are arranged at a predetermined place or places in the elastic material. 4. Werkwijze volgens conclusie 1 of 2, met het ken-15 merk, dat de ten minste ene chip wordt ingegoten in het elastisch materiaal, terwijl op een voorafbepaalde plaats of plaatsen op de ten minste ene chip een vormstuk of vormstuk-ken zijn geplaatst die na uitharden van het elastisch materiaal worden verwijderd.4. Method as claimed in claim 1 or 2, characterized in that the at least one chip is molded into the elastic material, while at a predetermined place or places on the at least one chip a molding or moldings are placed which are removed after hardening of the elastic material. 5. Werkwijze volgens een der voorgaande conclusies, met het kenmerk, dat alvorens het elastisch materiaal van de houder wordt aangebracht, de ten minste ene chip wordt voorzien van een hechtlaag. - - - \5. Method as claimed in any of the foregoing claims, characterized in that before the elastic material of the holder is applied, the at least one chip is provided with an adhesive layer. - - - \
NL1020341A 2002-04-09 2002-04-09 Chip etching comprises use of chip holder comprising elastic material NL1020341C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
NL1020341A NL1020341C2 (en) 2002-04-09 2002-04-09 Chip etching comprises use of chip holder comprising elastic material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1020341 2002-04-09
NL1020341A NL1020341C2 (en) 2002-04-09 2002-04-09 Chip etching comprises use of chip holder comprising elastic material

Publications (1)

Publication Number Publication Date
NL1020341C2 true NL1020341C2 (en) 2003-10-13

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2813782A (en) * 1956-02-07 1957-11-19 Spanos John Method of masking during semiconductor etching
FR1469209A (en) * 1965-12-31 1967-02-10 Comp Generale Electricite Method of masking a semiconductor device, making it possible to produce by chemical or electrolytic attack the flush of the junctions of said device
DE1521793A1 (en) * 1965-05-22 1969-10-23 Itt Ind Gmbh Deutsche Method for masking a semiconductor body or a layer on a semiconductor body against etching attack
DE1816427A1 (en) * 1968-12-21 1970-06-25 Semikron Gleichrichterbau Semiconductor element having protective - lacquer film
DE3137592A1 (en) * 1981-09-22 1983-04-07 Draloric Electronic GmbH, 8672 Selb Method of fabricating electrical capacitors and device for carrying out the method
EP0311774A1 (en) * 1987-10-14 1989-04-19 DeSoto Aerospace Coatings Inc Method of coating a metal part with a pealable mask
WO1999054786A1 (en) * 1998-04-21 1999-10-28 President And Fellows Of Harvard College Elastomeric mask and use in fabrication of devices, inlcuding pixelated electroluminescent displays

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2813782A (en) * 1956-02-07 1957-11-19 Spanos John Method of masking during semiconductor etching
DE1521793A1 (en) * 1965-05-22 1969-10-23 Itt Ind Gmbh Deutsche Method for masking a semiconductor body or a layer on a semiconductor body against etching attack
FR1469209A (en) * 1965-12-31 1967-02-10 Comp Generale Electricite Method of masking a semiconductor device, making it possible to produce by chemical or electrolytic attack the flush of the junctions of said device
DE1816427A1 (en) * 1968-12-21 1970-06-25 Semikron Gleichrichterbau Semiconductor element having protective - lacquer film
DE3137592A1 (en) * 1981-09-22 1983-04-07 Draloric Electronic GmbH, 8672 Selb Method of fabricating electrical capacitors and device for carrying out the method
EP0311774A1 (en) * 1987-10-14 1989-04-19 DeSoto Aerospace Coatings Inc Method of coating a metal part with a pealable mask
WO1999054786A1 (en) * 1998-04-21 1999-10-28 President And Fellows Of Harvard College Elastomeric mask and use in fabrication of devices, inlcuding pixelated electroluminescent displays

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Effective date: 20061101