Chen et al., 2001 - Google Patents
A smart machine vision system for PCB inspectionChen et al., 2001
View PDF- Document ID
- 17739938327620724412
- Author
- Chen T
- Zhang J
- Zhou Y
- Murphey Y
- Publication year
- Publication venue
- Engineering of Intelligent Systems: 14th International Conference on Industrial and Engineering Applications of Artificial Intelligence and Expert Systems, IEA/AIE 2001 Budapest, Hungary, June 4–7, 2001 Proceedings 14
External Links
Snippet
In this paper, we present a smart machine vision (SMV) system for printed circuit board (PCB) inspection. It has advantages over the traditional manual inspection by its higher efficiency and accuracy. This SMV system consists of two modules, LIF (Learning Inspection …
- 238000007689 inspection 0 title abstract description 43
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06K—RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K9/00—Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
- G06K9/36—Image preprocessing, i.e. processing the image information without deciding about the identity of the image
- G06K9/46—Extraction of features or characteristics of the image
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108627457B (en) | Automatic optical inspection system and method of operation thereof | |
Li et al. | Automatic industry PCB board DIP process defect detection with deep ensemble method | |
CN106501272B (en) | Machine vision soldering tin positioning detection system | |
Chen et al. | A smart machine vision system for PCB inspection | |
KR101144749B1 (en) | Method for inspecting joint error of an element formed on a printed circuit board | |
KR100557526B1 (en) | System for analyzing the surface of PCB using RGB color and method thereof | |
KR101622628B1 (en) | Method and apparatus of inspecting a substrate with electronic devices mounted thereon | |
CN111899248A (en) | Automatic PCB soldering paste defect detection method based on machine learning | |
KR100819803B1 (en) | Method of inspecting solder paste | |
JP6387620B2 (en) | Quality control system | |
US7747066B2 (en) | Z-axis optical detection of mechanical feature height | |
KR101133641B1 (en) | Method of inspecting three-dimensional shape | |
Lu et al. | Machine vision systems using machine learning for industrial product inspection | |
JPH038400A (en) | Positional correction of printed substrate | |
KR101126759B1 (en) | Method of teaching for electronic parts information in chip mounter | |
TWI773035B (en) | System and method for image recognition | |
Brunelle et al. | Line scan vision system | |
JPH01100409A (en) | Apparatus for inspecting positional shift of chip component | |
JP2658594B2 (en) | Surface mount IC lead displacement inspection equipment | |
JPH0851131A (en) | X-ray inspecting method | |
Taguchi et al. | Appearance inspection of wire harness using RGB-D sensor | |
KR19990087848A (en) | Inspection Region Preparing Method and Visual Inspection Method | |
JP2000011174A (en) | Measurement method by image recognition and device therefor and record medium | |
JPH04279808A (en) | Paste solder printing condition inspection device | |
JPH0333983A (en) | Object position detecting method |