Carasi et al., 2023 - Google Patents
Wire bonding: a thorough numerical methodologyCarasi et al., 2023
View PDF- Document ID
- 17281364706122284095
- Author
- Carasi B
- Guarino L
- Zullino L
- Cecchetto L
- Publication year
- Publication venue
- Comsol Conference
External Links
Snippet
The semiconductor industry is always looking for early anticipation of manufacturing risks, pushing the development of Computer Aided Engineering (CAE) modeling of processes. Robust Chip-Package Interaction (CPI) design requires a deep understanding of thermo …
- 238000000034 method 0 title abstract description 19
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/50—Computer-aided design
- G06F17/5009—Computer-aided design using simulation
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