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Geissbühler et al., 2014 - Google Patents

Silicon heterojunction solar cells with copper-plated grid electrodes: status and comparison with silver thick-film techniques

Geissbühler et al., 2014

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Document ID
14377508427671557556
Author
Geissbühler J
De Wolf S
Faes A
Badel N
Jeangros Q
Tomasi A
Barraud L
Descoeudres A
Despeisse M
Ballif C
Publication year
Publication venue
IEEE Journal of Photovoltaics

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Snippet

Copper electroplating is investigated and compared with common silver printing techniques for the front metallization of silicon heterojunction solar cells. We achieve smaller feature sizes by electroplating, significantly reducing optical shadowing losses and improving cell …
Continue reading at www.academia.edu (PDF) (other versions)

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