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Oh et al., 2019 - Google Patents

Thermal-aware 3D symmetrical buffered clock tree synthesis

Oh et al., 2019

Document ID
13767599364081018657
Author
Oh D
Choi M
Kim J
Publication year
Publication venue
ACM Transactions on Design Automation of Electronic Systems (TODAES)

External Links

Snippet

The semiconductor industry has accepted three-dimensional integrated circuits (3D ICs) as a possible solution to address speed and power management problems. In addition, 3D ICs have recently demonstrated a huge potential in reducing wire length and increasing the …
Continue reading at dl.acm.org (other versions)

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