[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Avalos et al., 2022 - Google Patents

Air Cooling Server Conversion to Two Phase Immersion Cooling and Thermal Performance Results

Avalos et al., 2022

Document ID
12879140134082210039
Author
Avalos J
Del Rio O
Farias O
Publication year
Publication venue
2022 38th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

External Links

Snippet

The Thermal Design Power (TDP) in microelectronics as well as the power density in servers, have become substantially high for traditional air cooling, especially those designed for high performance computing. Therefore, other alternative cooling technologies with …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F1/00Details of data-processing equipment not covered by groups G06F3/00 - G06F13/00, e.g. cooling, packaging or power supply specially adapted for computer application
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F1/00Details of data-processing equipment not covered by groups G06F3/00 - G06F13/00, e.g. cooling, packaging or power supply specially adapted for computer application
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks

Similar Documents

Publication Publication Date Title
Skach et al. Thermal time shifting: Leveraging phase change materials to reduce cooling costs in warehouse-scale computers
JP6790855B2 (en) Immersion cooling system, immersion cooling system and electronic device cooling method
Moore et al. Making Scheduling" Cool": Temperature-Aware Workload Placement in Data Centers.
Samson et al. Interface Material Selection and a Thermal Management Technique in Second-Generation Platforms Built on Intel® Centrino™ Mobile Technology.
Huang et al. Natural and forced convection heat transfer characteristics of single-phase immersion cooling systems for data centers
Eiland et al. Thermal performance and efficiency of a mineral oil immersed server over varied environmental operating conditions
US11567548B2 (en) Disaggregated computer systems
Shrigondekar et al. Investigations on performance of single-phase immersion cooling system
Hnayno et al. Performance analysis of new liquid cooling topology and its impact on data centres
Avalos et al. Air Cooling Server Conversion to Two Phase Immersion Cooling and Thermal Performance Results
Etminan et al. On the performance of an innovative electronic chipset thermal management module based on energy storage unit concept utilizing nano-additive phase change material (NPCM)
JP5672099B2 (en) Device equipped with electronic device, cooling program for device equipped with electronic device, and method for cooling device equipped with electronic device
Sarangi et al. Single-phase immersion cooling performance in intel servers with immersion influenced heatsink design
Alkharabsheh et al. Failure analysis of direct liquid cooling system in data centers
Kulkarni et al. Experimental study of two-phase cooling to enable large-scale system computing performance
Masaaki et al. Temperature leveling of electronic chips by solid-solid phase change materials compared to solid-liquid phase change materials
Shalom Simon et al. CFD analysis of Heat capture ratio in a hybrid cooled server
Shahi et al. Assessment of Pump Power Savings at Rack level for Dynamic Direct-to-Chip Liquid Cooling Using a Novel Flow Control Device
US20150271908A1 (en) Computing device with phase change material thermal management
Heydari et al. Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks
Khalili et al. An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads
Haywood et al. Investigating a relationship among CPU and system temperatures, thermal power, and CPU tasking levels
Singh et al. Data center energy conservation by heat pipe based pre-cooler system
Nordlund et al. Viability of Cryogenic Cooling to Reduce Processor Power Consumption
Heydari et al. L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning