Gnecco et al., 2007 - Google Patents
Wetting behaviour and reactivity of lead free Au–In–Sn and Bi–In–Sn alloys on copper substratesGnecco et al., 2007
- Document ID
- 11083178993503400075
- Author
- Gnecco F
- Ricci E
- Amore S
- Giuranno D
- Borzone G
- Zanicchi G
- Novakovic R
- Publication year
- Publication venue
- International Journal of Adhesion and Adhesives
External Links
Snippet
The main objective of this work is to determine the wetting behaviour of lead-free solders on copper substrates in view of their applications in electronic industry. The wetting behaviour of X–In–Sn (X= Au, Bi) ternary molten alloys in contact with copper has been studied and …
- 239000000758 substrate 0 title abstract description 43
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Gnecco et al. | Wetting behaviour and reactivity of lead free Au–In–Sn and Bi–In–Sn alloys on copper substrates | |
Subramanian et al. | Phase diagrams of Pb-free solders and their related materials systems | |
Giuranno et al. | Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems | |
Anderson et al. | Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength | |
Amore et al. | Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates | |
Kim et al. | Interfacial reaction and die attach properties of Zn-Sn high-temperature solders | |
Noor et al. | Wettability and strength of In–Bi–Sn lead-free solder alloy on copper substrate | |
Yoon et al. | Investigation of interfacial reactions between Sn–5Bi solder and Cu substrate | |
Yoon et al. | Growth kinetics of Ni3Sn4 and Ni3P layer between Sn–3.5 Ag solder and electroless Ni–P substrate | |
Novakovic et al. | Interfacial reactions in the Sb–Sn/(Cu, Ni) systems: wetting experiments | |
Amore et al. | Surface tension and wetting behaviour of molten Cu–Sn alloys | |
Zang et al. | Wettability of molten Sn–Bi–Cu solder on Cu substrate | |
Gain et al. | Effect of Ag nanoparticles on microstructure, damping property and hardness of low melting point eutectic tin–bismuth solder | |
Kamaruzzaman et al. | Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review | |
Gain et al. | Effect of thin gold/nickel coating on the microstructure, wettability and hardness of lead-free tin–bismuth–silver solder | |
Fouzder et al. | Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin–silver–copper (Sn–Ag–Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates | |
Mayappan et al. | Effect of sample perimeter and temperature on Sn–Zn based lead-free solders | |
Huang et al. | Interfacial microstructure and mechanical properties of In–Bi–Sn lead-free solder | |
da Silva Leal et al. | Effects of Indium on Wetting and Interfacial Features of a Sn-40Bi Alloy in a Copper Substrate | |
Rashidi et al. | The influence of chromium addition on the metallurgical, mechanical and fracture aspects of Sn–Cu–Bi/Cu solder joint | |
Yen et al. | Interfacial reactions in the Au/Sn-xZn/Cu sandwich couples | |
Cho et al. | Interfacial Reactions and Microstructures of Sn-0.7 Cu-x Zn Solders with Ni-P UBM During Thermal Aging | |
Fowler et al. | Sb additions in near-eutectic Sn-Bi solder decrease planar slip | |
Fima et al. | Wetting of Cu by Bi–Ag based alloys with Sn and Zn additions | |
Liu et al. | Thermal behavior and microstructure of the intermetallic compounds formed at the Sn–3Ag–0.5 Cu/Cu interface after soldering and isothermal aging |