[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Heinke et al., 2021 - Google Patents

Dry etching of monocrystalline silicon using a laser-induced reactive micro plasma

Heinke et al., 2021

View HTML
Document ID
95736531026919321
Author
Heinke R
Ehrhardt M
Lorenz P
Zimmer K
Publication year
Publication venue
Applied Surface Science Advances

External Links

Snippet

Dry etching is a prevalent technique for pattern transfer and material removal in microelectronics, optics and photonics due to its high precision material removal with low surface and subsurface damage. These processes, including reactive ion etching (RIE) and …
Continue reading at www.sciencedirect.com (HTML) (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching

Similar Documents

Publication Publication Date Title
Her et al. Microstructuring of silicon with femtosecond laser pulses
Heinke et al. Dry etching of monocrystalline silicon using a laser-induced reactive micro plasma
EP2283960B1 (en) Gas-assisted laser ablation
Shirk et al. A review of ultrashort pulsed laser ablation of materials
Lee et al. Femtosecond laser micromilling of Si wafers
KR100896549B1 (en) Plasma treatment method and plasma etching method
JP5756584B2 (en) Charged particle beam masking for laser ablation micromachining
Samad et al. Ultrashort laser pulses machining
CN102856191B (en) Plasma processing method
Zimmer et al. Laser etching of fused silica using an adsorbed toluene layer
Shirk et al. Ultra-short pulsed laser ablation of highly oriented pyrolytic graphite
JP2004518527A (en) Atmospheric pressure reactive atomic plasma processing apparatus and method for surface modification
Jin et al. The morphology and chemistry evolution of fused silica surface after Ar/CF4 atmospheric pressure plasma processing
Gerhard et al. Polishing of optical media by dielectric barrier discharge inert gas plasma at atmospheric pressure
Ehrhardt et al. Laser-induced reactive microplasma for etching of fused silica
Ehrhardt et al. Dry etching of germanium with laser induced reactive micro plasma
Böhme et al. Low roughness laser etching of fused silica using an adsorbed layer
Heinke et al. Low surface damage laser processing of silicon by laser-induced plasma etching (LIPE)
Kazemi et al. Combined reactive plasma jet-laser etching method for technical optical glass containing metal oxides
Liu et al. Highly efficient finishing of large-sized single crystal diamond substrates by combining nanosecond pulsed laser trimming and plasma-assisted polishing
Ashkenasi et al. Laser ablation and structuring of transparent materials with ultrashort laser pulses
Böhme et al. Ultra-short laser processing of transparent material at the interface to liquid
Crunteanu et al. Comparative study on methods to structure sapphire
Liang et al. Smoothing of fused silica with less damage by a hybrid plasma process combining isotropic etching and atom-migration
Ehrhardt et al. Ultraprecise Surface Processing by Etching with Laser-Induced Plasmas