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Chopra et al., 2017 - Google Patents

A method to accelerate creation of plasma etch recipes using physics and Bayesian statistics

Chopra et al., 2017

Document ID
4929441099888838333
Author
Chopra M
Verma R
Lane A
Willson C
Bonnecaze R
Publication year
Publication venue
Advanced Etch Technology for Nanopatterning VI

External Links

Snippet

Next generation semiconductor technologies like high density memory storage require precise 2D and 3D nanopatterns. Plasma etching processes are essential to achieving the nanoscale precision required for these structures. Current plasma process development …
Continue reading at www.spiedigitallibrary.org (other versions)

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Exposure apparatus for microlithography
    • G03F7/70483—Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management and control, including software
    • G03F7/705—Modelling and simulation from physical phenomena up to complete wafer process or whole workflow in wafer fabrication

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