Lai et al., 2023 - Google Patents
Dynamic model and machining mechanism of wire sawingLai et al., 2023
View PDF- Document ID
- 4701624648611288550
- Author
- Lai Z
- Huang H
- Hu Z
- Liao X
- Publication year
- Publication venue
- Journal of Materials Processing Technology
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Snippet
During the wire sawing process, the wire usually undergoes large deformation, which leads to changes in the sawing force and the contact state between wire and workpiece, and in turn affects the material removal rate (MRR) and the workpiece quality. This paper presents …
- 238000003754 machining 0 title description 10
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