[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Wang et al., 2014 - Google Patents

Advanced FOUP purge using diffusers for FOUP door-off application

Wang et al., 2014

Document ID
4705797628536358212
Author
Wang H
Kim S
Liu B
Publication year
Publication venue
25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014)

External Links

Snippet

In a number of key IC fabrication steps in-process wafers are sensitive to moisture, oxygen and other airborne molecular contaminants in the air. Nitrogen purge of closed Front Opening Unified Pods (FOUP) have been implemented in many fabs to minimize wafer's …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L2021/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
    • H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
    • H01L2021/60097—Applying energy, e.g. for the soldering or alloying process
    • H01L2021/60172—Applying energy, e.g. for the soldering or alloying process using static pressure
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices

Similar Documents

Publication Publication Date Title
US9579697B2 (en) System and method of cleaning FOUP
TWI771427B (en) Equipment front end module gas recirculation
JP6916633B2 (en) Processing liquid supply equipment, substrate processing equipment, and processing liquid supply method
US11139181B2 (en) Substrate processing apparatus having processing block including liquid processing unit, drying unit, and supply unit adjacent to the transport block
KR200482352Y1 (en) Gaseous diffusion apparatus for wafer cassette
JP7407262B2 (en) Substrate processing equipment and substrate processing method
JP2022160598A (en) EFEM system and gas supply method in EFEM system
KR102257733B1 (en) Inspection apparatus and cleaning method of inspection apparatus
TWI755624B (en) Wafer cleaning method and cleaning chamber
US20240087935A1 (en) Interface tool
JP2007067059A (en) Coat forming device
Wang et al. Advanced FOUP purge using diffusers for FOUP door-off application
TWI757473B (en) Wafer Inspection Device
JP6887836B2 (en) Processing liquid supply equipment, substrate processing equipment, and processing liquid supply method
Lin et al. Flow analysis and relative humidity (RH) measurement in the horizontal plane of a front opening unified pod (FOUP)
US11442096B2 (en) Testing apparatus
Benalcazar et al. A Numerical Study on the Effects of Purge and Air Curtain Flow Rates on Humidity Invasion Into a Front Opening Unified Pod (FOUP)
TWM527792U (en) Cleaning system and wafer box thereof
KR102478750B1 (en) Substrate processing apparatus
TW202204806A (en) Load port device, gas gate and gas-providing method
KR101985754B1 (en) Air conditioner and apparatus for treating substrate the same
TW201412624A (en) Front Opening Unified Pod with air inlet/outlet hole arrangement
TWI823134B (en) Load port and methods of operation
KR100978128B1 (en) Apparatus for treating substrate
TWI851972B (en) Method and laminar gas flow filter apparatus for supporting environmental control in semiconductor wafer processing space and apparatus for producing laminar gas flow