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PredictNcool: Leakage Aware Thermal Management for 3D Memories Using a Lightweight Temperature Predictor

Authors:

Preeti Ranjan PandaAuthors Info & Claims

ACM Transactions on Embedded Computing Systems (TECS), Volume 18, Issue 5s

Article No.: 64, Pages 1 - 22

https://doi.org/10.1145/3358208

Published: 08 October 2019 Publication History

Abstract

Recent research on mitigating thermal problems in 3D memories has covered reactive strategies that reduce memory power consumption, and thereby, performance, when the memory temperature reaches the maximum operating limit. Such techniques could benefit from temperature prediction and avoid unnecessary invocations and state transitions of the thermal management strategy. We develop an accurate steady state temperature predictor for thermal management of 3D memories. We utilize the symmetries in the floorplan, along with other design insights, to reduce the predictor’s model parameters, making it lightweight and suitable for runtime thermal management. Using the temperature prediction, we introduce PredictNcool, a proactive thermal management strategy to reduce application runtime and memory energy. We compare PredictNcool with two recent thermal management strategies and our experiments show that the proposed optimization results in performance improvements of 28% and 5%, and memory subsystem energy reductions of 38% and 12% (on average).

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Cited By

Pandey SPanda P(2024)NeuroTAP: Thermal and Memory Access Pattern-Aware Data Mapping on 3D DRAM for Maximizing DNN PerformanceACM Transactions on Embedded Computing Systems10.1145/367717823:6(1-30)Online publication date: 11-Sep-2024
https://dl.acm.org/doi/10.1145/3677178
Huang DCostero LAtienza D(2024)An Evaluation Framework for Dynamic Thermal Management Strategies in 3D MultiProcessor System-on-Chip Co-DesignIEEE Transactions on Parallel and Distributed Systems10.1109/TPDS.2024.345941435:11(2161-2176)Online publication date: 1-Nov-2024
https://dl.acm.org/doi/10.1109/TPDS.2024.3459414
Pandey SSiddhu LPanda P(2023)NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized PrefetchingACM Transactions on Design Automation of Electronic Systems10.1145/363001229:1(1-35)Online publication date: 18-Dec-2023
https://dl.acm.org/doi/10.1145/3630012
Show More Cited By

Index Terms

PredictNcool: Leakage Aware Thermal Management for 3D Memories Using a Lightweight Temperature Predictor
1. Hardware
  1. Integrated circuits
    1. 3D integrated circuits
  2. Power and energy
    1. Thermal issues
      1. Temperature control
      2. Temperature simulation and estimation

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Published In

cover image ACM Transactions on Embedded Computing Systems

ACM Transactions on Embedded Computing Systems Volume 18, Issue 5s

Special Issue ESWEEK 2019, CASES 2019, CODES+ISSS 2019 and EMSOFT 2019

October 2019

1423 pages

ISSN:1539-9087

EISSN:1558-3465

DOI:10.1145/3365919

Editor:
Sandeep K. Shukla
Indian Institute of Technology, India

Issue’s Table of Contents

Copyright © 2019 ACM.

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Association for Computing Machinery

New York, NY, United States

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ACM Journals for the Design of Smart and Connected Systems

Publication History

Published: 08 October 2019

Accepted: 01 July 2019

Revised: 01 June 2019

Received: 01 April 2019

Published in TECS Volume 18, Issue 5s

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Cited By

Pandey SPanda P(2024)NeuroTAP: Thermal and Memory Access Pattern-Aware Data Mapping on 3D DRAM for Maximizing DNN PerformanceACM Transactions on Embedded Computing Systems10.1145/367717823:6(1-30)Online publication date: 11-Sep-2024
https://dl.acm.org/doi/10.1145/3677178
Huang DCostero LAtienza D(2024)An Evaluation Framework for Dynamic Thermal Management Strategies in 3D MultiProcessor System-on-Chip Co-DesignIEEE Transactions on Parallel and Distributed Systems10.1109/TPDS.2024.345941435:11(2161-2176)Online publication date: 1-Nov-2024
https://dl.acm.org/doi/10.1109/TPDS.2024.3459414
Pandey SSiddhu LPanda P(2023)NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized PrefetchingACM Transactions on Design Automation of Electronic Systems10.1145/363001229:1(1-35)Online publication date: 18-Dec-2023
https://dl.acm.org/doi/10.1145/3630012
Siddhu LBagchi AKedia RAhmad IPandey SPanda P(2023)Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel ClosureACM Transactions on Embedded Computing Systems10.1145/362458122:6(1-27)Online publication date: 9-Nov-2023
https://dl.acm.org/doi/10.1145/3624581
Siddhu LKedia RPandey SRapp MPathania AHenkel JPanda P(2022)CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory SystemsACM Transactions on Architecture and Code Optimization10.1145/353218519:3(1-25)Online publication date: 22-Aug-2022
https://dl.acm.org/doi/10.1145/3532185
Pandey SPanda P(2022)NeuroMap: Efficient Task Mapping of Deep Neural Networks for Dynamic Thermal Management in High-Bandwidth MemoryIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2022.319769841:11(3602-3613)Online publication date: 1-Nov-2022
https://dl.acm.org/doi/10.1109/TCAD.2022.3197698
Sultan HSarangi S(2021)Variability-Aware Thermal Simulation using CNNs2021 34th International Conference on VLSI Design and 2021 20th International Conference on Embedded Systems (VLSID)10.1109/VLSID51830.2021.00016(65-70)Online publication date: Feb-2021
https://doi.org/10.1109/VLSID51830.2021.00016
Siddhu LKedia RPanda P(2020)Leakage-Aware Dynamic Thermal Management of 3D MemoriesACM Transactions on Design Automation of Electronic Systems10.1145/341946826:2(1-31)Online publication date: 23-Oct-2020
https://dl.acm.org/doi/10.1145/3419468

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